HI-8783, HI-8784, HI-8785 January 2001 PIN CONFIGURATIONS DESCRIPTION The HI-8783, HI-8784, and HI-8785 are system components for interfacing 8 bit parallel data to an ARINC 429 bus. The HI-8783 is a logic device only and requires a separate line driver circuit, such as the HI-8382 or HI-8585. The HI-8784 and HI-8785 combine logic and line driver on one chip. The HI-8784 has an output resistance of 37.5 ohms, and the HI-8785 has an output resistance of 10 ohms to facilitate external lightning protection cicuitry. The technology is analog/digital CMOS. VCC 1 20 561 DATA 561 SYNC 2 19 DATA ZERO D0 3 18 DATA ONE D1 4 17 PARITY ENB D2 5 16 XMT READY D3 6 15 XMIT CLK D4 7 14 RESET D5 8 13 WRITE D6 9 12 A0 D7 10 11 GND The HI-8783 is available in a 22 pin DIP format as a second source replacement for the Micrel / California Devices DLS-111BV. The products offer high speed data bus data transactions to a buffer register. After loading 4 bytes, data is automatically transferred and transmitted. The data rate is equal to the clock rate. Parity can be enabled in the 32nd bit. Reset is used to initialize the logic upon startup. Word gaps are transmitted automatically. HI-8783PSI & HI-8783PST 20-Pin Plastic SOIC - WB package The HI-8784 and HI-8785 require +/- 10 volt supplies in addition to the 5 volt supply. FEATURES l l l Automatically converts 8 bit parallel data to ARINC 429 or 561 data High speed data bus interface On-chip line driver option l SOIC packages available l Military processing options VCC 1 24 V+ 561 SYNC 2 23 561 DATA D0 3 22 TXBOUT D1 4 21 TXAOUT D2 5 20 V- D3 6 19 PARITY ENB D4 7 18 XMT READY D5 8 17 XMIT CLK D6 9 16 RESET NC 10 15 WRITE D7 11 14 SLP1.5 GND 12 13 A0 HI-8784PSI HI-8784PST HI-8785PSI & HI-8785PST 24-Pin Plastic SOIC - WB package (See page 7 for additional pin configurations) (DS8783 Rev. B) HOLT INTEGRATED CIRCUITS 1 01/01 HI-8783, HI-8784, HI-8785 PIN DESCRIPTIONS PIN PIN PIN HI-8783 HI-8783 HI-8784 (20-pin) (22-pin) HI-8785 SYMBOL FUNCTION DESCRIPTION 1 22 1 VCC 2 1 2 561 SYNC digital output power supply +5 volt rail, ARINC 561 Sync signal 3-10 2-8,10 3-9,11 Dn digital inputs Parallel 8 bit Data Input 11 11 12 GND 12 12 13 A0 power supply Ground digital input Byte address, A0=1 for 1st byte, A0=0 for 2nd, 3rd & 4th bytes - - 14 SLP1.5 digital input Selects the slope of the line driver. High = 1.5us 13 14 15 WRITE digital input Write strobe, loads data on rising edge 14 15 16 RESET digital input Registers and sequencing logic initialized when low 15 16 17 XMIT CLK digital input Clock input for the transmitter 16 17 18 XMT RDY digital output Goes high if the buffer register is empty 17 18 19 - - 20 18 19 - 19 20 - - - 21 PARITY ENB digital input V- When high the 32nd bit output is odd parity power supply -10 volt rail DATA ONE digital output DATA ZERO digital output TXAOUT Goes high for each ARINC bit output that is a “one” Goes high for each ARINC bit output that is a “zero” analog output Line driver ouptut - A side - - 22 TXBOUT analog output Line driver output - B side 20 21 23 561 DATA digital output - - 24 V+ Serial output for ARINC 561 data power supply +10 volt rail FUNCTIONAL DESCRIPTION The HI-8783 is a parallel to serial converter, which when loaded with four eight bit parallel bytes, outputs the data as a 32 bit serial word. Timing circuitry inserts a 4 bit gap at the end of each 32 bit word. An input buffer register allows load operations to take place while the previously loaded word is being transmitted. If the PARITY ENB pin is high, the 32nd bit will be a parity bit, inserted so as to make the 32 bit word have odd parity. If the PARITY ENB pin is low, the 32nd bit will be the D7 bit of the 4th byte. Outputs are provided for both ARINC 429/575 (DATA ONE and DATA ZERO pins), and ARINC 561 (561 DATA and 561 SYNC pins) type data. A low signal applied to the RESET pin resets the HI-8783’s internal logic so that spurious transmission does not take place during power-up. The registers are cleared so that a continuous gap will be transmitted until the first word is loaded into the transmitter. Input data can be loaded when the XMT RDY signal is high, which indicates the input buffer register is empty. The first 8 bit byte is the label byte and is loaded with the A0 input high, which initializes the internal byte counter. The remaining three bytes are loaded with A0 in the low state. Each 8 bit byte is loaded into the input buffer register by a low pulse on the WRITE input. (See figure 1). After the fourth byte is loaded, the XMT RDY output goes low. The contents of the input buffer register are transferred to the output register during the fourth bit period of the gap. If the fourth gap bit period of the previous word has already been transmitted, the contents of the input buffer register will be transferred to the output shift register during the first bit period after the loading of the fourth byte, and the XMT RDY output goes high. After the output shift register is loaded, the data is shifted out to the output logic in the order shown in figure 2. The 561 SYNC output pulses low when the XMT CLK is low during the 8th bit of the ARINC transmission. The XMIT CLK is the same as the data rate. HOLT INTEGRATED CIRCUITS 2 HI-8783, HI-8784, HI-8785 XMIT CLK WRITE XMT RDY status & control logic byte counter A0 SLP1.5 TXAOUT line driver TXBOUT word gap counter HI-8784, HI8785 DATA BUS 8 to 32 bit mux 8 32 32 bit buffer register 32 32 bit shift register DATA ONE DATA ZERO bit counter output logic HI-8783 561 SYNC 561 DATA PARITY ENB Figure 1. Block Diagram FUNCTIONAL DESCRIPTION (Cont.) The HI-8784 and HI-8785 have the same digital logic function as the HI-8783, but include an on-chip line driver designed to directly drive the ARINC 429 bus. The two ARINC outputs (TXAOUT and TXBOUT) provide a differential voltage to produce a +10 volt One, a -10 volt Zero, and a 0 volt Null. The slope of the ARINC outputs is controlled by the SLP1.5 pin. If SLP1.5 is high, the output rise and fall time is nominally 1.5us. If SLP1.5 is set low, the rise and fall times are 10us. DATA ONE and DATA ZERO outputs are not provided for the HI-8784 and HI-8785. A0 Byte Data Bus ARINC Bits 1 Byte 1 D0 - D7 ARINC 1 - ARINC 8 0 Byte 2 D0 - D7 ARINC 9 - ARINC 16 0 Byte 3 D0 - D7 ARINC 17 - ARINC 24 0 Byte 4 D0 - D7 ARINC 25 - ARINC 32 Figure 2. Order of transmitted bytes The HI-8784 has 37.5 ohms in series with each line driver output. The HI-8785 has 10.0 ohms in series. The HI-8785 is for applications where external series resistance is needed, typically for lightning protection devices. HOLT INTEGRATED CIRCUITS 3 HI-8783, HI-8784, HI-8785 35 36 1 2 3 4 5 31 32 33 XMIT CLK DATA ONE DATA ZERO 561 DATA 561 SYNC LOW DURING CLK 8 XMT CLK t phlx t plhx t plhx 5V 0V DATA ONE t phlx 5V 0V DATA ZERO t rx t rx 10V 0V -10V 90% 10% 10% 90% 10% t fx t fx HOLT INTEGRATED CIRCUITS 4 34 35 36 HI-8783, HI-8784, HI-8785 RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS Supply Voltages V+.......................................+10V... ±5% V-........................................ -10V... ±5% VCC....................................... 5V... ±5% Voltages referenced to Ground Supply voltages V+.................................................12.5V V-.................................................-12.5V VCC.................................................. 7V Temperature Range Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C Military Screening..........-55°C to +125°C DC current per input pin................ +10ma Power dissipation at 25° plastic DIL............1.0W, derate 10mW/°C ceramic DIL..........0.5W, derate 7mW/°C NOTE: Stresses above absolute maximum ratings or outside recommended operating conditions may cause permanent damage to the device. These are stress ratings only. Operation at the limits is not recommended. Solder Temperature ........275°C for 10 sec Storage Temperature........-65°C to +150°C VCC = 5.0V, VSS = 0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Operating Voltage SYMBOL MIN TYP MAX UNITS VCC CONDITION 4.75 5 5.25 V 2.0 1.4 Min. Input Voltage (HI) VIH Max. Input Voltage (LO) VIL Min. Input Current (HI) IIH Max. Input Current (LO) IIL VIL = 0.1V -1 µA Min. Output Voltage (HI) VOH IOUT = -1.6mA 2.7 V Max. Output Voltage (LO) 1.4 VIH = 4.9V VIH IOUT = 1.6mA Operating Current Drain ICC f = 100khz Input Capacitance CIN Not tested 0.8 V 0.8 V 1 µA 0.4 V 2.8 mA 20 pF VCC = 5.0V, VSS = 0V, V+ = 10V, V- = -10V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER Operating Voltage SYMBOL CONDITION V+ Operating Voltage V- Operating Current Drain (V+) IDD no load, f = 100khz Operating Current Drain (V-) IEE no load, f = 100khz MIN TYP MAX UNITS 9.5 10 10.5 V -9.5 -10 10.5 V 6 20 mA -20 -6 mA Line Driver Output Levels (Ref. To GND) ONE no load, VCC = 5.0V 4.5 5.0 5.5 V NULL “ -0.25 0 0.25 V ZERO “ -5.55 -5.0 -4.5 V ONE no load, VCC = 5.0V 9.0 10.0 11.0 V NULL “ -0.5 0 0.5 V ZERO “ -11.0 -10.0 -9.0 V momentary magnitude 80 Line Driver Output Levels (Differential) Minimum Short Circuit Sink or Source Current IOUT HOLT INTEGRATED CIRCUITS 5 mA HI-8783, HI-8784, HI-8785 (HI-8783, HI-8784 and HI-8785) VCC = 5.0V, VSS = 0V, TA =Operating Temperature Range (unless otherwise specified). PARAMETER SYMBOL MIN TYP MAX UNITS tSET tHLD tAH tWPW tAPW tXD 20 ns 0 ns DATA BUS TIMING Setup Data Bus to WRITE Hold WRITE to Data Bus Hold A0 to WRITE Pulse width WRITE Pulse width A0 Delay last WRITE to XMT RDY HOLT INTEGRATED CIRCUITS 6 0 ns 40 ns 40 ns 40 ns HI-8783, HI-8784, HI-8785 ADDITIONAL HI-8783 PIN CONFIGURATION 561 SYNC 1 22 VCC D0 2 21 561 DATA D1 3 20 DATA ZERO 19 DATA ONE 18 PARITY ENB HI-8783PDI & HI-8783PDT D2 4 D3 5 D4 6 17 XMT READY D5 7 16 XMIT CLK D6 8 15 RESET NC 9 14 WRITE D7 10 13 NC GND 11 12 A0 22 Pin Plastic DIP package (See page 1 for additional pin configurations) ORDERING INFORMATION PART NUMBER INCLUDES LINE DRIVER OUTPUT RESISTOR PACKAGE DESCRIPTION TEMPERATURE RANGE PROCESS FLOW LEAD FINISH HI-8783PDI NO 22 Pin Plastic DIP -40°C TO +85°C I SOLDER HI-8783PDT NO 22 Pin Plastic DIP -55°C TO +125°C T SOLDER HI-8783PSI NO 20 Pin Plastic SOIC - WB -40°C TO +85°C I SOLDER HI-8783PST NO 20 Pin Plastic SOIC - WB -55°C TO +125°C T SOLDER HI-8784PSI YES 37.5 ohm 24 Pin Plastic SOIC - WB -40°C TO +85°C I SOLDER HI-8784PST YES 37.5 ohm 24 Pin Plastic SOIC - WB -55°C TO +125°C T SOLDER HI-8785PSI YES 10.0 ohm 24 Pin Plastic SOIC - WB -40°C TO +85°C I SOLDER HI-8785PST YES 10.0 ohm 24 Pin Plastic SOIC - WB -55°C TO +125°C T SOLDER Legend: WB - Wide Body HOLT INTEGRATED CIRCUITS 7 HI-8783, HI-8784, HI-8785 PACKAGE DIMENSIONS inches (millimeters) 20-PIN PLASTIC SMALL OUTLINE (SOIC) - WB (Wide Body) Package Type: 20HW .5035 ± .0075 (12.789 ± .191) .0105 ± .0015 (.2667 ± .0381) .4065 ± .0125 (10.325 ± .318) .296 ± .003 (7.518 ± .076) SEE DETAIL A .018 TYP (.457) .090 ± .010 (2.286 ± .254) 0° to 8° .050 TYP (1.27) .033 ± .017 (.838 ± .432) DETAIL A .0075 ± .0035 (.191 ± .089) 22-PIN PLASTIC DIP Package Type: 22P 1.105 ± .015 (28.067 ± .381) .350 ± .010 (8.89 ± .254) .400 ± .010 (10.160 ± .254) .135 ± .015 (3.429 ± .381) .025 ± .010 (.635 ± .254) 0 - 15o .1375 ± .0125 (3.4925 ± .3175) .019 ± .004 (.483 ± .102) 0.100 TYP. .053 ± .013 (1.346 ± .330) HOLT INTEGRATED CIRCUITS 8 .435 ± .035 (11.049 ± .889) HI-8783, HI-8784, HI-8785 PACKAGE DIMENSIONS inches (millimeters) 24-PIN PLASTIC SMALL OUTLINE (SOIC) - WB (Wide Body) Package Type: 24HW .606 ± .004 (15.392 ± .102) .0105 ± .0015 (.2667 ± .0381) .2955 ± .0035 (7.506 ± .089) .4065 ± .0125 (10.325 ± .318) SEE DETAIL A .018 TYP (.457) .095 ± .005 (2.413 ± .127) 0° to 8° .050 TYP (1.27) .033 ± .017 (.838 ± .432) DETAIL A HOLT INTEGRATED CIRCUITS 9 .0075 ± .0035 (.191 ± .089)