TI MSP430FE4252IPMR

MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
D Low Supply-Voltage Range, 2.7 V to 3.6 V
D Ultra-Low-Power Consumption:
D
D
D
D
D
D
D
D
D
− Active Mode: 400 µA at 1 MHz, 3.0 V
− Standby Mode: 1.6 µA
− Off Mode (RAM Retention): 0.1 µA
Five Power-Saving Modes
Wake-Up From Standby Mode in Less
Than 6 µs
Frequency-Locked Loop, FLL+
16-Bit RISC Architecture, 125-ns
Instruction Cycle Time
Embedded Signal Processing for
Single-Phase Energy Metering With
Integrated Analog Front-End and
Temperature Sensor (ESP430CE1B)
16-Bit Timer_A With Three
Capture/Compare Registers
Integrated LCD Driver for 128 Segments
Serial Communication Interface (USART),
Asynchronous UART, or Synchronous SPI
Selectable by Software
Brownout Detector
D Supply Voltage Supervisor/Monitor With
Programmable Level Detection
D Serial Onboard Programming,
D
D
D
D
No External Programming Voltage Needed,
Programmable Code Protection by Security
Fuse
Bootstrap Loader in Flash Devices
Family Members Include:
− MSP430FE4232
8KB + 256B Flash Memory,
256B RAM
− MSP430FE4242
12KB + 256B Flash Memory,
512B RAM
− MSP430FE4252
16KB + 256B Flash Memory,
512B RAM
− MSP430FE4272
32KB + 256B Flash Memory,
1KB RAM
Available in 64-Pin Quad Flat Pack (QFP)
For Complete Module Descriptions,
See the MSP430x4xx Family User’s Guide,
Literature Number SLAU056
description
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less
than 6 µs.
The MSP430FE42x2 devices are microcontroller configurations with two independent 16-bit sigma-delta
analog-to-digital (A/D) converters and embedded signal processor core used to measure and calculate
single-phase energy in both 2-wire and 3-wire configurations. Also included is a built-in 16-bit timer, 128 LCD
segment drive capability, and 14 I/O pins.
Typical applications include 2-wire and 3-wire single-phase metering.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited
built-in ESD protection.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2008 Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
PLASTIC 64-PIN QFP
(PM)
−40°C to 85°C
MSP430FE4232IPM
MSP430FE4242IPM
MSP430FE4252IPM
MSP430FE4272IPM
AVCC
DVSS
AVSS
P2.3/SVSIN
P2.4/UTXD0
P2.5/URXD0
RST/NMI
TCK
TMS
TDI/TCLK
TDO/TDI
P1.0/TA0
P1.1/TA0/MCLK
P1.2/TA1/S31
P1.3/SVSOUT/S30
P1.4/S29
pin designation
DVCC
I1+
I1−
NC
NC
V1+
V1−
XIN
XOUT
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
9
40
VREF
10
39
P2.2/STE0
S0
S1
S2
S3
S4
11
38
12
37
13
36
14
35
15
34
8
MSP430FE42x2
41
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
2
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P1.5/TACLK/ACLK/S28
P1.6/SIMO0/S27
P1.7/SOMI0/S26
P2.0/TA2/S25
P2.1/UCLK0/S24
R33
R23
R13
R03
COM3
COM2
COM1
COM0
S23
S22
S21
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
functional block diagram
DVCC
XIN XOUT
DVSS
AVCC
AVSS
P2
P1
8
6
ACLK
Oscillators
FLL+
SMCLK
MCLK
8 MHz
CPU
incl. 16
Registers
Emulation
Module
Flash
RAM
Timer_A3
Port 1
Port 2
USART0
32KB
16KB
12KB
8KB
1KB
512B
512B
256B
3 CC Reg
8 I/O
Interrupt
Capability
6 I/O
Interrupt
Capability
UART or
SPI
Function
POR/
SVS/
Brownout
Watchdog
WDT+
ESP430CE1B
Embedded
Signal
Processing,
Analog
Front-End
MAB
MDB
15/16-Bit
JTAG
Interface
Basic
Timer 1
1 Interrupt
Vector
LCD
128
Segments
1,2,3,4 MUX
fLCD
RST/NMI
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
DVCC
1
I1+
2
I
Digital supply voltage, positive terminal
Current 1 positive analog input. Internal connection to SD16 Channel 0 A0+. (see Note 1)
I1−
3
I
Current 1 negative analog input. Internal connection to SD16 Channel 0 A0−. (see Note 1)
NC
4
I
Not connected. Connection to analog ground (AVSS) recommended.
NC
5
I
Not connected. Connection to analog ground (AVSS) recommended.
V1+
6
I
Voltage 1 positive analog input. Internal connection to SD16 Channel 1 A0+. (see Note 1)
V1−
7
I
Voltage 1 negative analog input. Internal connection to SD16 Channel 1 A0−. (see Note 1)
XIN
8
I
Input port for crystal oscillator XT1. Standard or watch crystals can be connected.
XOUT
9
O
Output terminal of crystal oscillator XT1
VREF
10
I/O
Input for an external reference voltage / Internal reference voltage output (can be used as mid-voltage)
P2.2/STE0
11
I/O
General-purpose digital I/O / Slave transmit enable—USART0/SPI mode
S0
12
O
LCD segment output 0
S1
13
O
LCD segment output 1
S2
14
O
LCD segment output 2
S3
15
O
LCD segment output 3
S4
16
O
LCD segment output 4
S5
17
O
LCD segment output 5
S6
18
O
LCD segment output 6
S7
19
O
LCD segment output 7
S8
20
O
LCD segment output 8
S9
21
O
LCD segment output 9
S10
22
O
LCD segment output 10
S11
23
O
LCD segment output 11
S12
24
O
LCD segment output 12
S13
25
O
LCD segment output 13
S14
26
O
LCD segment output 14
S15
27
O
LCD segment output 15
S16
28
O
LCD segment output 16
S17
29
O
LCD segment output 17
S18
30
O
LCD segment output 18
S19
31
O
LCD segment output 19
S20
32
O
LCD segment output 20
S21
33
O
LCD segment output 21
S22
34
O
LCD segment output 22
S23
35
O
LCD segment output 23
COM0
36
O
Common output, COM0−3 are used for LCD backplanes.
COM1
37
O
Common output, COM0−3 are used for LCD backplanes.
COM2
38
O
Common output, COM0−3 are used for LCD backplanes.
COM3
39
O
Common output, COM0−3 are used for LCD backplanes.
R03
40
I
Input port of fourth positive (lowest) analog LCD level (V5)
NOTE 1: It is recommended to short unused analog input pairs and connect them to analog ground (AVSS).
4
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
Terminal Functions (Continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
R13
41
I
Input port of third most positive analog LCD level (V4 or V3)
R23
42
I
Input port of second most positive analog LCD level (V2)
R33
43
O
Output port of most positive analog LCD level (V1)
P2.1/UCLK0/S24
44
I/O
General-purpose digital I/O / External clock input-USART0/UART or SPI mode, clock output—USART0/SPI
mode / LCD segment output 24 (See Note 1)
P2.0/TA2/S25
45
I/O
General-purpose digital I/O / Timer_A Capture: CCI2A input, Compare: Out2 output / LCD segment output
25 (See Note 1)
P1.7/SOMI0/S26
46
I/O
General-purpose digital I/O / Slave out/master in of USART0/SPI mode / LCD segment output 26
(See Note 1)
P1.6/SIMO0/S27
47
I/O
General-purpose digital I/O / Slave in/master out of USART0/SPI mode / LCD segment output 27
(See Note 1)
P1.5/TACLK/
ACLK/S28
48
I/O
General-purpose digital I/O / Timer_A and SD16 clock signal TACLK input / ACLK output
(divided by 1, 2, 4, or 8) / LCD segment output 28 (See Note 1)
P1.4/S29
49
I/O
General-purpose digital I/O / LCD segment output 29 (See Note 1)
P1.3/SVSOUT/
S30
50
I/O
General-purpose digital I/O / SVS: output of SVS comparator / LCD segment output 30 (See Note 1)
P1.2/TA1/S31
51
I/O
General-purpose digital I/O / Timer_A, Capture: CCI1A, CCI1B input, Compare: Out1 output / LCD segment
output 31 (See Note 1)
P1.1/TA0/MCLK
52
I/O
General-purpose digital I/O / Timer_A, Capture: CCI0B input / MCLK output.
Note: TA0 is only an input on this pin / BSL receive
P1.0/TA0
53
I/O
General-purpose digital I/O / Timer_A, Capture: CCI0A input, Compare: Out0 output / BSL transmit
TDO/TDI
54
I/O
Test data output port. TDO/TDI data output or programming data input terminal.
TDI/TCLK
55
I
Test data input or test clock input. The device protection fuse is connected to TDI.
TMS
56
I
Test mode select. TMS is used as an input port for device programming and test.
TCK
57
I
Test clock. TCK is the clock input port for device programming and test.
RST/NMI
58
I
Reset input or nonmaskable interrupt input port
P2.5/URXD0
59
I/O
General-purpose digital I/O / Receive data in—USART0/UART mode
P2.4/UTXD0
60
I/O
General-purpose digital I/O / Transmit data out—USART0/UART mode
P2.3/SVSIN
61
I/O
General-purpose digital I/O / Analog input to brownout, supply voltage supervisor
AVSS
62
Analog supply voltage, negative terminal. Supplies SD16, SVS, brownout, oscillator, and LCD resistive
divider circuitry.
DVSS
63
Digital supply voltage, negative terminal.
AVCC
64
Analog supply voltage, positive terminal. Supplies SD16, SVS, brownout, oscillator, and LCD resistive
divider circuitry; must not power up prior to DVCC.
NOTE 1: LCD function selected automatically when applicable LCD module control bits are set, not with PxSEL bits.
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
short-form description
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
are performed as register operations in
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
SR/CG1/R2
Status Register
Constant Generator
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
and constant generator respectively. The
remaining registers are general-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; the address modes are listed
in Table 2.
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Table 1. Instruction Word Formats
Dual operands, source-destination
e.g., ADD R4,R5
R4 + R5 −−−> R5
Single operands, destination only
e.g., CALL
PC −−>(TOS), R8−−> PC
Relative jump, un/conditional
e.g., JNE
R8
Jump-on-equal bit = 0
Table 2. Address Mode Descriptions
ADDRESS MODE
S D
Indirect
D
D
D
D
D
Indirect
autoincrement
Immediate
Register
Indexed
Symbolic (PC relative)
Absolute
D
D
D
D
SYNTAX
EXAMPLE
MOV Rs,Rd
MOV R10,R11
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
MOV EDE,TONI
R10
−−> R11
M(2+R5)−−> M(6+R6)
M(EDE) −−> M(TONI)
MOV &MEM,&TCDAT
M(MEM) −−> M(TCDAT)
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) −−> M(Tab+R6)
D
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) −−> R11
R10 + 2−−> R10
D
MOV #X,TONI
MOV #45,TONI
NOTE: S = source, D = destination
6
OPERATION
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#45
−−> M(TONI)
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
operating modes
The MSP430 has one active mode and five software-selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request, and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
D Active mode (AM)
−
All clocks are active.
D Low-power mode 0 (LPM0)
−
−
−
CPU is disabled.
ACLK and SMCLK remain active, MCLK is available to modules.
FLL+ loop control remains active.
D Low-power mode 1 (LPM1)
−
−
−
CPU is disabled.
ACLK and SMCLK remain active, MCLK is available to modules.
FLL+ loop control is disabled.
D Low-power mode 2 (LPM2)
−
−
−
−
CPU is disabled.
MCLK, FLL+ loop control, and DCOCLK are disabled.
DCO’s dc generator remains enabled.
ACLK remains active.
D Low-power mode 3 (LPM3)
−
−
−
−
CPU is disabled.
MCLK, FLL+ loop control, and DCOCLK are disabled.
DCO’s dc generator is disabled.
ACLK remains active.
D Low-power mode 4 (LPM4)
−
−
−
−
−
CPU is disabled.
ACLK is disabled.
MCLK, FLL+ loop control, and DCOCLK are disabled.
DCO’s dc generator is disabled.
Crystal oscillator is stopped.
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the address range of 0FFFFh to 0FFE0h.
The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
Power-up
External reset
Watchdog
Flash memory
PC out-of-range (see Note 4)
WDTIFG
KEYV
(see Note 1)
Reset
0FFFEh
15, highest
NMI
Oscillator fault
Flash memory access violation
NMIIFG (see Notes 1 and 3)
OFIFG (see Notes 1 and 3)
ACCVIFG (see Notes 1 and 3)
(Non)maskable
(Non)maskable
(Non)maskable
0FFFCh
14
ESP430
MBCTL_OUTxIFG,
MBCTL_INxIFG
(see Notes 1 and 2)
Maskable
0FFFAh
13
SD16
SD16CCTLx SD16OVIFG,
SD16CCTLx SD16IFG
(see Notes 1 and 2)
Maskable
0FFF8h
12
0FFF6h
11
Watchdog timer
WDTIFG
Maskable
0FFF4h
10
USART0 receive
URXIFG0
Maskable
0FFF2h
9
USART0 transmit
UTXIFG0
Maskable
8
7
Timer_A3
TACCR0 CCIFG (see Note 2)
Maskable
0FFECh
6
Timer_A3
TACCR1 and TACCR2
CCIFGs, and TACTL TAIFG
(see Notes 1 and 2)
Maskable
0FFEAh
5
I/O port P1 (eight flags)
P1IFG.0 to P1IFG.7
(see Notes 1 and 2)
Maskable
0FFE8h
4
0FFE6h
3
0FFE4h
2
I/O port P2 (eight flags)
P2IFG.0 to P2IFG.7
(see Notes 1 and 2)
Maskable
0FFE2h
1
Basic timer1
BTIFG
Maskable
0FFE0h
0, lowest
NOTES: 1.
2.
3.
4.
8
0FFF0h
0FFEEh
Multiple source flags
Interrupt flags are located in the module.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt-enable cannot.
A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h to 01FFh) or
from within unused address ranges (from 0600h to 0BFFh).
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
special function registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
that are not allocated to a functional purpose are not physically present in the device. Simple software access
is provided with this arrangement.
interrupt enable 1 and 2
7
Address
0h
6
UTXIE0
rw–0
URXIE0
rw–0
5
4
ACCVIE
NMIIE
3
2
OFIE
1
WDTIE
0
rw–0
rw–0
rw–0
rw–0
WDTIE:
Watchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog timer
is configured in interval timer mode.
OFIE:
Oscillator-fault-interrupt enable
NMIIE:
Nonmaskable-interrupt enable
ACCVIE:
Flash access violation interrupt enable
URXIE0:
USART0: UART and SPI receive-interrupt enable
UTXIE0:
USART0: UART and SPI transmit-interrupt enable
7
Address
1h
6
5
4
3
2
1
4
3
2
1
0
BTIE
rw-0
BTIE:
Basic Timer1 interrupt enable
interrupt flag register 1 and 2
7
Address
02h
6
5
UTXIFG0
URXIFG0
NMIIFG
rw–1
rw–0
rw–0
OFIFG
rw–1
0
WDTIFG
rw–(0)
WDTIFG:
Set on watchdog timer overflow (in watchdog mode) or security key violation. Reset on VCC
power up or a reset condition at the RST/NMI pin in reset mode.
OFIFG:
Flag set on oscillator fault
NMIIFG:
Set via RST/NMI pin
URXIFG0:
USART0: UART and SPI receive flag
UTXIFG0:
USART0: UART and SPI transmit flag
Address
3h
7
6
5
4
3
2
1
0
BTIFG
rw-0
BTIFG:
Basic Timer1 interrupt flag
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
module enable registers 1 and 2
Address
04h
7
UTXE0
6
URXE0
USPIE0
rw–0
rw–0
5
4
3
URXE0:
USART0: UART mode receive enable
UTXE0:
USART0: UART mode transmit enable
USPIE0:
USART0: SPI mode transmit and receive enable
Address
7
6
5
4
3
05h
Legend: rw−0,1:
rw−(0,1):
10
Bit Can Be Read and Written. It Is Reset or Set by PUC.
Bit Can Be Read and Written. It Is Reset or Set by POR.
SFR Bit Not Present in Device.
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2
1
2
1
0
0
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
memory organization
MSP430FE4232
MSP430FE4242
MSP430FE4252
MSP430FE4272
Size
Flash
Flash
8KB
0FFFFh to 0FFE0h
0FFFFh to 0E000h
12KB
0FFFFh to 0FFE0h
0FFFFh to 0D000h
16KB
0FFFFh to 0FFE0h
0FFFFh to 0C000h
32KB
0FFFFh to 0FFE0h
0FFFFh to 08000h
Information memory
Size
256 Byte
010FFh to 01000h
256 Byte
010FFh to 01000h
256 Byte
010FFh to 01000h
256 Byte
010FFh to 01000h
Boot memory
Size
1kB
0FFFh to 0C00h
1kB
0FFFh to 0C00h
1kB
0FFFh to 0C00h
1kB
0FFFh to 0C00h
Size
256 Byte
02FFh to 0200h
512 Byte
03FFh to 0200h
512 Byte
03FFh to 0200h
1KB
05FFh − 0200h
16 bit
8 bit
8-bit SFR
01FFh to 0100h
0FFh to 010h
0Fh to 00h
01FFh to 0100h
0FFh to 010h
0Fh to 00h
01FFh to 0100h
0FFh to 010h
0Fh to 00h
01FFh to 0100h
0FFh to 010h
0Fh to 00h
Memory
Interrupt vector
Code memory
RAM
Peripherals
bootstrap loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial
interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete
description of the features of the BSL and its implementation, see the application report Features of the MSP430
Bootstrap Loader, literature number SLAA089.
BSL Function
PM Package Pins
Data Transmit
53 - P1.0
Data Receive
52 - P1.1
flash memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
D Flash memory has n segments of main memory and two segments of information memory (A and B) of
128 bytes each. Each segment in main memory is 512 bytes in size.
D Segments 0 to n may be erased in one step, or each segment may be individually erased.
D Segments A and B can be erased individually, or as a group with segments 0 to n.
Segments A and B are also called information memory.
D New devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory prior to the first use.
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x4xx Family User’s Guide, literature number
SLAU056.
oscillator and system clock
The clock system in the MSP430FE42x2 family of devices is supported by the FLL+ module, which includes
support for a 32768-Hz watch crystal oscillator, an internal digitally-controlled oscillator (DCO), and a
high-frequency crystal oscillator. The FLL+ clock module is designed to meet the requirements of both low
system cost and low power consumption. The FLL+ features a digital frequency-locked loop (FLL) hardware
that, in conjunction with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the
watch-crystal frequency. The internal DCO provides a fast turn-on clock source and stabilizes in less than 6 µs.
The FLL+ module provides the following clock signals:
D
D
D
D
Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high-frequency crystal.
Main clock (MCLK), the system clock used by the CPU.
Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules.
ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, or ACLK/8.
brownout, supply voltage supervisor (SVS)
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on
and power off. The SVS circuitry detects if the supply voltage drops below a user-selectable level and supports
both supply-voltage supervision (the device is automatically reset) and supply-voltage monitoring (SVM) (the
device is not automatically reset).
The CPU begins code execution after the brownout circuit releases the device reset. However, VCC may not
have ramped to VCC(min) at that time. The user must ensure that the default FLL+ settings are not changed until
VCC reaches VCC(min). If desired, the SVS circuit can be used to determine when VCC reaches VCC(min).
digital I/O
There are two 8-bit I/O ports implemented—ports P1 and P2 (only six P2 I/O signals are available on external
pins).
D
D
D
D
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Edge-selectable interrupt input capability for all the eight bits of port P1 and six bits of P2.
Read/write access to port-control registers is supported by all instructions.
NOTE:
Only six bits of port P2 (P2.0 to P2.5) are available on external pins, but all control and data bits
for port P2 are implemented.
Basic Timer1
The Basic Timer1 has two independent 8-bit timers that can be cascaded to form a 16-bit timer/counter. Both
timers can be read and written by software. The Basic Timer1 can be used to generate periodic interrupts and
clock for the LCD module.
LCD drive
The LCD driver generates the segment and common signals required to drive an LCD display. The LCD
controller has dedicated data memory to hold segment drive information. Common and segment signals are
generated as defined by the mode. Static, 2-MUX, 3-MUX, and 4-MUX LCDs are supported by this peripheral.
12
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
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watchdog timer (WDT+)
The primary function of the WDT+ module is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed
in an application, the module can be configured as an interval timer and can generate interrupts at selected time
intervals.
Timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
TIMER_A3 SIGNAL CONNECTIONS
INPUT PIN
NUMBER
DEVICE INPUT
SIGNAL
MODULE INPUT
NAME
48 - P1.5
TACLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
48 - P1.5
TACLK
INCLK
53 - P1.0
TA0
CCI0A
52 - P1.1
TA0
CCI0B
DVSS
GND
DVCC
VCC
51 - P1.2
TA1
CCI1A
51 - P1.2
TA1
CCI1B
DVSS
GND
45 - P2.0
DVCC
VCC
TA2
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN
NUMBER
53 - P1.0
CCR0
TA0
51 - P1.2
CCR1
TA1
45 - P2.0
CCR2
TA2
universal synchronous/asynchronous receive transmit (USART0)
The MSP430FE42x2 devices have one hardware USART0 peripheral module that is used for serial data
communication. The USART supports synchronous SPI (3-pin or 4-pin) and asynchronous UART
communication protocols, using double-buffered transmit and receive channels.
ESP430CE1B
The ESP430CE1B module integrates a hardware multiplier, two independent 16-bit sigma-delta A/D converters
(SD16) and an embedded signal processor (ESP430). The ESP430CE1B module measures 2 or 3-wire,
single-phase energy and automatically calculates parameters which are made available to the MSP430 CPU.
The module can be calibrated and initialized to accurately calculate energy, power factor, etc., for a wide range
of metering sensor configurations.
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13
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
peripheral file map
PERIPHERALS WITH WORD ACCESS
Watchdog
Watchdog timer control
WDTCTL
0120h
Timer_A3
_
Timer_A interrupt vector
TAIV
012Eh
Timer_A control
TACTL
0160h
Capture/compare control 0
TACCTL0
0162h
Capture/compare control 1
TACCTL1
0164h
Capture/compare control 2
TACCTL2
0166h
Reserved
0168h
Reserved
016Ah
Reserved
016Ch
Reserved
016Eh
Timer_A register
TAR
0170h
Capture/compare register 0
TACCR0
0172h
Capture/compare register 1
TACCR1
0174h
Capture/compare register 2
TACCR2
0176h
Reserved
0178h
Reserved
017Ah
Reserved
017Ch
Reserved
Hardware Multiplier
p
(see Note 1)
Flash
SD16 (see
(
Note 1))
(see also: Peripherals
with Byte Access)
017Eh
Sum extend
SUMEXT
013Eh
Result high word
RESHI
013Ch
Result low word
RESLO
013Ah
Second operand
OP2
0138h
Multiply signed + accumulate/operand1
MACS
0136h
Multiply + accumulate/operand1
MAC
0134h
Multiply signed/operand1
MPYS
0132h
Multiply unsigned/operand1
MPY
0130h
Flash control 3
FCTL3
012Ch
Flash control 2
FCTL2
012Ah
Flash control 1
FCTL1
0128h
General control
SD16CTL
0100h
Channel 0 control
SD16CCTL0
0102h
Reserved
0104h
Channel 2 control
SD16CCTL2
0106h
Reserved
0108h
Reserved
010Ah
Reserved
010Ch
Reserved
010Eh
Interrupt vector word register
SD16IV
0110h
Channel 0 conversion memory
SD16MEM0
0112h
NOTE 1: Module is contained within ESP430CE1B. Registers not accessible when ESP430 is active. ESP430 must be disabled or suspended
to allow CPU access to these modules.
14
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
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PERIPHERALS WITH WORD ACCESS
SD16
(continued, see Note 1)
Reserved
0114h
Channel 2 conversion memory
SD16MEM2
0118h
Reserved
011Ah
Reserved
011Ch
Reserved
ESP430 (ESP430CE1B)
(
)
0116h
Reserved
011Eh
ESP430 control
ESPCTL
0150h
Mailbox control
MBCTL
0152h
Mailbox in 0
MBIN0
0154h
Mailbox in 1
MBIN1
0156h
Mailbox out 0
MBOUT0
0158h
Mailbox out 1
MBOUT1
015Ah
ESP430 return value 0
RET0
01C0h
:
:
:
RET31
01FEh
SD16INCTL0
0B0h
ESP430 return value 31
PERIPHERALS WITH BYTE ACCESS
SD16 (see
(
Note 1))
(see also, Peripherals
With Word Access)
Channel 0 input control
Reserved
0B1h
Channel 2 input control
SD16INCTL2
Reserved
0B3h
Reserved
0B4h
Reserved
0B5h
Reserved
0B6h
Reserved
0B7h
Channel 0 preload
SD16PRE0
Reserved
0B8h
0B9h
Channel 2 preload
SD16PRE2
0BAh
Reserved
0BBh
Reserved
0BCh
Reserved
0BDh
Reserved
0BEh
Reserved
LCD
0B2h
0BFh
LCD memory 20
LCDM20
0A4h
:
:
:
LCD memory 16
LCDM16
0A0h
LCD memory 15
LCDM15
09Fh
:
:
:
LCD memory 1
LCDM1
091h
LCD control and mode
LCDCTL
090h
NOTE 1: Module is contained within ESP430CE1B. Registers not accessible when ESP430 is active. ESP430 must be disabled or suspended
to allow CPU access to these modules.
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15
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
peripheral file map (continued)
PERIPHERALS WITH BYTE ACCESS (CONTINUED)
USART0
Transmit buffer
U0TXBUF
077h
Receive buffer
U0RXBUF
076h
Baud rate
U0BR1
075h
Baud rate
U0BR0
074h
Modulation control
U0MCTL
073h
Receive control
U0RCTL
072h
Transmit control
U0TCTL
071h
USART control
U0CTL
070h
Brownout, SVS
SVS control register
SVSCTL
056h
FLL+ Clock
FLL+ control 1
FLL_CTL1
054h
FLL+ control 0
FLL_CTL0
053h
System clock frequency control
SCFQCTL
052h
System clock frequency integrator
SCFI1
051h
System clock frequency integrator
SCFI0
050h
BT counter 2
BTCNT2
047h
BT counter 1
BTCNT1
046h
BT control
BTCTL
040h
Port P2 selection
P2SEL
02Eh
Port P2 interrupt enable
P2IE
02Dh
Port P2 interrupt-edge select
P2IES
02Ch
Port P2 interrupt flag
P2IFG
02Bh
Port P2 direction
P2DIR
02Ah
Port P2 output
P2OUT
029h
Port P2 input
P2IN
028h
Port P1 selection
P1SEL
026h
Port P1 interrupt enable
P1IE
025h
Port P1 interrupt-edge select
P1IES
024h
Port P1 interrupt flag
P1IFG
023h
Port P1 direction
P1DIR
022h
Port P1 output
P1OUT
021h
Port P1 input
P1IN
020h
SFR module enable 2
ME2
005h
SFR module enable 1
ME1
004h
SFR interrupt flag 2
IFG2
003h
SFR interrupt flag 1
IFG1
002h
SFR interrupt enable 2
IE2
001h
SFR interrupt enable 1
IE1
000h
Basic Timer1
Port P2
Port P1
Special
p
Functions
16
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
absolute maximum ratings†
Voltage applied at VCC to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to + 4.1 V
Voltage applied to any pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 mA
Storage temperature (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Storage temperature (programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TDI/TCLK pin when blowing the JTAG fuse.
recommended operating conditions (see Note 1)
PARAMETER
MIN
NOM
MAX
UNITS
Supply voltage during program execution; ESP430 and SD16 disabled,
VCC (AVCC = DVCC = VCC) (see Note 1)
1.8
3.6
V
Supply voltage during program execution; SVS enabled, PORON = 1, ESP430 and SD16 disabled,
VCC (AVCC = DVCC = VCC) (see Note 1 and Note 2)
2.0
3.6
V
Supply voltage during program execution; ESP430 or SD16 enabled or during programming of
flash memory, VCC (AVCC = DVCC = VCC) (see Note 1)
2.7
3.6
V
Supply voltage (see Note 1), VSS (AVSS = DVSS = VSS)
Operating free-air temperature range, TA
LFXT1 crystal frequency, f(LFXT1) (see Note 3)
LF selected, XTS_FLL=0
Watch crystal
XT1 selected, XTS_FLL=1
Ceramic resonator
XT1 selected, XTS_FLL=1
Crystal
Processor frequency (signal MCLK),
MCLK) f(System) (see Note 4)
0
0
V
−40
85
°C
32768
Hz
450
8000
kHz
1000
8000
kHz
VCC = 2.7 V
dc
8.4
VCC = 3.6 V
dc
8.4
MHz
NOTES: 1. It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can
be tolerated during power up and operation.
2. The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing supply voltage.
POR is going inactive when the supply voltage is raised above minimum supply voltage plus the hysteresis of the SVS circuitry.
3. The LFXT1 oscillator in LF-mode requires a watch crystal.
4. For frequencies above 8 MHz, MCLK is sourced by the built-in oscillator (DCO and FLL+).
POST OFFICE BOX 655303
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17
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted)
supply current into AVCC + DVCC excluding external current (see Note 1)
PARAMETER
TEST CONDITIONS
TYP
MAX
UNIT
VCC = 3 V
400
500
µA
TA = −40°C to 85°C
VCC = 3 V
130
150
µA
TA = −40°C to 85°C
VCC = 3 V
µA
I(AM)
Active mode,
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32,768 Hz, XTS_FLL = 0
(program executes in flash)
TA = −40°C to 85°C
I(LPM0)
Low-power mode, (LPM0/LPM1)
f(MCLK) = f(SMCLK) = f(DCO) = 1 MHz,
f(ACLK) = 32,768 Hz, XTS_FLL = 0
FN_8 = FN_4 = FN_3 = FN_2 = 0 (see Note 2)
I(LPM2)
Low-power mode, (LPM2) (see Note 2)
MIN
TA = −40°C
I(LPM3)
TA = 25°C
Low power mode,
Low-power
mode (LPM3) (see Note 2)
VCC = 3 V
TA = 60°C
TA = 85°C
TA = −40°C
I(LPM4)
TA = 25°C
Low-power
Low
power mode, (LPM4) (see Note 2)
VCC = 3 V
TA = 85°C
10
22
1.5
2.0
1.6
2.1
1.7
2.2
2.0
3.5
0.1
0.5
0.1
0.5
0.8
2.5
NOTES: 1. All inputs are tied to 0 V or VCC. Outputs do not source or sink any current.
The current consumption in LPM2, LPM3, and LPM4 are measured with active Basic Timer1 and LCD (ACLK selected).
The current consumption of the ESP430CE1B and the SVS module are specified in their respective sections.
LPMx currents measured with WDT+ disabled.
The currents are characterized with a KDS Daishinku DT−38 (6 pF) crystal.
2. Current for brownout included.
current consumption of active mode versus system frequency
I(AM) = I(AM) [1 MHz] × f(System) [MHz]
current consumption of active mode versus supply voltage
fSystem − Maximum Processor Frequency − MHz
I(AM) = I(AM) [3 V] + 170 µA/V × (VCC – 3 V)
f (MHz)
Supply voltage range with
ESP430 or SD16 enabled and during
programming of the flash memory
8.4 MHz
Supply voltage range
during program
execution
6 MHz
4.15 MHz
1.8 V
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
2.7 V
3V
3.6 V
VCC − Supply Voltage − V
Figure 1. Frequency vs Supply Voltage
18
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
µA
A
µA
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
Schmitt-trigger inputs − Ports P1 and P2, RST/NMI, JTAG: TCK, TMS, TDI/TCLK, TDO/TDI
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
1.5
1.98
V
VCC = 3 V
0.9
1.3
V
VCC = 3 V
0.45
1
V
MAX
VIT+
Positive-going input threshold voltage
VCC = 3 V
VIT−
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ − VIT−)
inputs − Px.x, TAx
PARAMETER
TEST CONDITIONS
VCC
MIN
UNIT
t(int)
External interrupt timing
Port P1, P2: P1.x to P2.x, External trigger signal
for the interrupt flag (see Note 1)
3V
1.5
cycle
3V
50
ns
t(cap)
Timer_A, capture timing
TAx
3V
50
ns
f(TAext)
Timer_A clock frequency externally
applied to pin
TACLK, INCLK t(H) = t(L)
3V
10
MHz
f(TAint)
Timer_A clock frequency
SMCLK or ACLK signal selected
3V
10
MHz
NOTES: 1. The external signal sets the interrupt flag every time the minimum t(int) cycle and time parameters are met. It may be set even with
trigger signals shorter than t(int). Both the cycle and timing specifications must be met to ensure the flag is set. t(int) is measured in
MCLK cycles.
leakage current (see Note 1)
PARAMETER
Ilkg(P1.x)
Ilkg(P2.x)
Leakage current
MAX
UNIT
Port P1
Port 1: V(P1.x) (see Note 2)
TEST CONDITIONS
VCC = 3 V
MIN
±50
nA
Port P2
Port 2: V(P2.x) (see Note 2)
VCC = 3 V
±50
nA
NOTES: 1. The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
2. The port pin must be selected as an input.
outputs − Ports P1 and P2
PARAMETER
VOH
High level output voltage
High-level
VOL
Low level output voltage
Low-level
MIN
MAX
IOH(max) = −1.5 mA,
TEST CONDITIONS
VCC = 3 V,
See Note 1
VCC−0.25
VCC
IOH(max) = −6 mA,
VCC = 3 V,
See Note 2
VCC−0.6
VCC
IOL(max) = 1.5 mA,
VCC = 3 V,
See Note 1
VSS
VSS+0.25
IOL(max) = 6 mA,
VCC = 3 V,
See Note 2
VSS
VSS+0.6
UNIT
V
V
NOTES: 1. The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±12 mA to satisfy the
maximum specified voltage drop.
2. The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±48 mA to satisfy the
maximum specified voltage drop.
output frequency
PARAMETER
TEST CONDITIONS
MIN
fPx.y
(1 ≤ x ≤ 2, 0 ≤ y ≤ 7)
CL = 20 pF,
IL = ± 1.5mA
VCC = 3 V
fACLK,
fMCLK,
fSMCLK
P1.1/TA0/MCLK,
P1.5/TACLK/ACLK/S28
CL = 20 pF
VCC = 3 V
P1.5/TACLK/ACLK/S28,
CL = 20 pF
VCC = 3 V
fACLK = fLFXT1 = fXT1
40%
fACLK = fLFXT1 = fLF
30%
tXdc
Duty cycle of output frequency
P1.1/TA0/MCLK,
CL = 20 pF,
VCC = 3 V
POST OFFICE BOX 655303
dc
fACLK = fLFXT1
fMCLK = fDCOCLK
• DALLAS, TEXAS 75265
TYP
MAX
UNIT
12
MHz
12
MHz
60%
70%
50%
50% −
15 ns
50%
50% +
15 ns
19
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
outputs − Ports P1 and P2 (continued)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
30
I OL − Typical Low-level Output Current − mA
I OL − Typical Low-level Output Current − mA
50
VCC = 2.2 V
P2.1
TA = 25°C
25
TA = 85°C
20
15
10
5
0
0.0
0.5
1.0
1.5
2.0
VCC = 3 V
P2.1
40
TA = 85°C
30
20
10
0
0.0
2.5
TA = 25°C
0.5
VOL − Low-Level Output Voltage − V
1.0
I OL − Typical High-level Output Current − mA
I OL − Typical High-level Output Current − mA
−5
−10
−15
TA = 85°C
TA = 25°C
1.0
1.5
2.0
2.5
VCC = 3 V
P2.1
−10
−20
−30
TA = 85°C
−40
TA = 25°C
−50
0.0
VOH − High-Level Output Voltage − V
20
0.5
1.0
1.5
Figure 5
One output loaded at a time
POST OFFICE BOX 655303
2.0
2.5
3.0
VOH − High-Level Output Voltage − V
Figure 4
NOTE:
3.5
0
VCC = 2.2 V
P2.1
0.5
3.0
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
−30
0.0
2.5
Figure 3
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
−25
2.0
VOL − Low-Level Output Voltage − V
Figure 2
−20
1.5
• DALLAS, TEXAS 75265
3.5
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
wake-up LPM3
PARAMETER
TEST CONDITIONS
MIN
f = 1 MHz
td(LPM3)
UNIT
6
f = 2 MHz
Delay time
MAX
6
VCC = 3 V
f = 3 MHz
µs
6
RAM (see Note 1)
PARAMETER
TEST CONDITIONS
VRAMh
MIN
CPU halted (see Note 1)
MAX
1.6
UNIT
V
NOTE 1: This parameter defines the minimum supply voltage when the data in the program memory RAM remain unchanged. No program
execution should take place during this supply voltage condition.
LCD
PARAMETER
TEST CONDITIONS
V(33)
Voltage at R33
V(23)
Voltage at R23
Analog voltage
Voltage at R13
V(33) − V(03)
Voltage at R33/R03
I(R03)
R03 = VSS
I(R13)
R13 = VCC/3
V(Sxx2)
Segment line
voltage
(V33−V03) ×
2/3 + V03
UNIT
V
(V(33)−V(03)) ×
1/3 + V(03)
2.5
VCC +0.2
N lload
d att allll segmentt and
d
No
common lines
lines, VCC = 3 V
V(Sxx0)
V(Sxx1)
MAX
VCC + 0.2
±20
R23 = 2 × VCC/3
I(R23)
TYP
2.5
VCC = 3 V
V(13)
Input leakage
MIN
I(Sxx) = −3
3 µA,
A VCC = 3 V
V(Sxx3)
±20
nA
±20
V(03)
V(03) − 0.1
V(13)
V(13) − 0.1
V(23)
V(23) − 0.1
V(33)
V(33) + 0.1
V
USART0 (see Note 1)
PARAMETER
t(τ)
USART0: deglitch time
TEST CONDITIONS
VCC = 3 V, SYNC = 0, UART mode
MIN
150
TYP
MAX
280
500
UNIT
ns
NOTE 1: The signal applied to the USART0 receive signal/terminal (URXD0) should meet the timing requirements of t(τ) to ensure that the URXS
flip-flop is set. The URXS flip-flop is set with negative pulses meeting the minimum-timing condition of t(τ). The operating conditions to
set the flag must be met independently from this timing constraint. The deglitch circuitry is active only on negative transitions on the
URXD0 line.
POST OFFICE BOX 655303
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21
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
POR brownout, reset (see Notes 1 and 2)
PARAMETER
TEST CONDITIONS
MIN
TYP
td(BOR)
V(B_IT−)
Brownout
UNIT
2000
µs
0.7 ×
dVCC/dt ≤ 3 V/s (see Figure 6)
VCC(start)
MAX
V
V(B_IT−)
dVCC/dt ≤ 3 V/s (see Figure 6, Figure 7, Figure 8)
Vhys(B_IT−)
dVCC/dt ≤ 3 V/s (see Figure 6)
t(reset)
Pulse length needed at RST/NMI pin to accepted reset internally,
VCC = 3 V
70
2
130
1.71
V
180
mV
µs
NOTES: 1. The current consumption of the brownout module is already included in the ICC current consumption data.
The voltage level V(B_IT−) + Vhys(B_IT−) is ≤ 1.8 V.
2. During power up, the CPU begins code execution following a period of td(BOR) after VCC = V(B_IT−) + Vhys(B_IT−).
The default FLL+ settings must not be changed until VCC ≥ VCC(min), where VCC(min) is the minimum supply voltage for the desired
operating frequency. See the MSP430x4xx Family User’s Guide (SLAU056) for more information on the brownout/SVS circuit.
22
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
VCC
Vhys(B_IT−)
V(B_IT−)
VCC(start)
1
0
td(BOR)
Figure 6. POR/Brownout Reset (BOR) vs Supply Voltage
VCC
2
VCC (drop) − V
tpw
3V
V cc = 3 V
Typical Conditions
1.5
1
VCC(drop)
0.5
0
0.001
1
1000
1 ns
tpw − Pulse Width − µs
1 ns
tpw − Pulse Width − µs
Figure 7. VCC(drop) Level With a Square Voltage Drop to Generate a POR/Brownout Signal
VCC
VCC (drop) − V
2
1.5
tpw
3V
V cc = 3 V
Typical Conditions
1
VCC(drop)
0.5
0
0.001
tf = tr
1
1000
tf
tr
tpw − Pulse Width − µs
tpw − Pulse Width − µs
Figure 8. VCC(drop) Level With a Triangle Voltage Drop to Generate a POR/Brownout Signal
POST OFFICE BOX 655303
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23
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
SVS (supply voltage supervisor/monitor) (see Note 1)
PARAMETER
t(SVSR)4
TEST CONDITIONS
MIN
dVCC/dt > 30 V/ms (see Figure 9)
5
MAX
150
dVCC/dt ≤ 30 V/ms
2000
td(SVSon)
SVSon, switch from VLD=0 to VLD ≠ 0, VCC = 3 V
tsettle
VLD ≠ 0‡
V(SVSstart)
VLD ≠ 0, VCC/dt ≤ 3 V/s (see Figure 9)
20
1.55
VLD = 1
VCC/dt ≤ 3 V/s (see Figure 9)
VLD = 2 to 14
Vhys(SVS_IT−)
VCC/dt ≤ 3 V/s (see Figure 9),
External voltage applied on P2.3
VCC/dt ≤ 3 V/s (see Figure 9)
V(SVS_IT−)
(SVS IT )
VCC/dt ≤ 3 V/s (see Figure 9),
External voltage applied on P2.3
ICC(SVS)
(see Note 1)
TYP
VLD = 15
70
120
µs
12
µs
1.7
V
155
mV
V(SVS_IT−)
× 0.001
V(SVS_IT−)
× 0.016
1
20
1.8
1.9
2.05
VLD = 2
1.94
2.1
2.25
VLD = 3
2.05
2.2
2.37
VLD = 4
2.14
2.3
2.48
VLD = 5
2.24
2.4
2.6
VLD = 6
2.33
2.5
2.71
VLD = 7
2.46
2.65
2.86
VLD = 8
2.58
2.8
3
VLD = 9
2.69
2.9
3.13
VLD = 10
2.83
3.05
3.29
VLD = 11
2.94
3.2
3.42
VLD = 12
3.11
3.35
3.61†
VLD = 13
3.24
3.5
3.76†
VLD = 14
3.43
3.7†
3.99†
VLD = 15
1.1
1.2
1.3
10
15
†
µs
150
VLD = 1
VLD ≠ 0, VCC = 2.2 V/3 V
UNIT
mV
V
µA
The recommended operating voltage range is limited to 3.6 V.
tsettle is the settling time that the comparator o/p needs to have a stable level after VLD is switched VLD ≠ 0 to a different VLD value somewhere
between 2 and 15. The overdrive is assumed to be > 50 mV.
NOTE 1: The current consumption of the SVS module is not included in the ICC current consumption data.
‡
24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
VCC
V
Software Sets VLD>0:
SVS is Active
Vhys(SVS_IT−)
(SVS_IT−)
V(SVSstart)
Vhys(B_IT−)
V(B_IT−)
VCC(start)
Brownout
Brownout
Region
Brownout
Region
1
0
td(BOR)
SVS out
td(BOR)
SVS Circuit is Active From VLD > to VCC < V(B_IT−)
1
0
td(SVSon)
Set POR
1
td(SVSR)
Undefined
0
Figure 9. SVS Reset (SVSR) vs Supply Voltage
VCC
tpw
3V
2
Rectangular Drop
VCC(drop) − V
1.5
VCC(drop)
Triangular Drop
1
1 ns
0.5
1 ns
VCC
tpw
3V
0
1
10
100
1000
tpw − Pulse Width − µs
VCC(drop)
tf = tr
tf
tr
t − Pulse Width − µs
Figure 10. VCC(drop) With a Square Voltage Drop and a Triangle Voltage Drop to Generate an SVS Signal
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
25
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
DCO
PARAMETER
VCC
MIN
TYP
MAX
UNIT
f(DCOCLK)
N(DCO) = 01Eh, FN_8 = FN_4 = FN_3 = FN_2 = 0, D = 2,
DCOPLUS= 0, fCrystal = 32.768 kHz
3V
f(DCO=2)
FN_8 = FN_4 = FN_3 = FN_2 = 0, DCOPLUS = 1
3V
0.3
0.7
1.3
MHz
f(DCO=27)
FN_8 = FN_4 = FN_3 = FN_2 = 0, DCOPLUS = 1
3V
2.7
6.1
11.3
MHz
f(DCO=2)
FN_8 = FN_4 = FN_3 = 0, FN_2 = 1, DCOPLUS = 1
3V
0.8
1.5
2.5
MHz
f(DCO=27)
FN_8 = FN_4 = FN_3 = 0, FN_2 = 1, DCOPLUS = 1
3V
6.5
12.1
20
MHz
f(DCO=2)
FN_8 = FN_4 = 0, FN_3 = 1, FN_2 = x, DCOPLUS = 1
3V
1.3
2.2
3.5
MHz
f(DCO=27)
FN_8 = FN_4 = 0, FN_3 = 1, FN_2 = x, DCOPLUS = 1
3V
10.3
17.9
28.5
MHz
f(DCO=2)
FN_8 = 0, FN_4 = 1, FN_3 = FN_2 = x, DCOPLUS = 1
3V
2.1
3.4
5.2
MHz
f(DCO=27)
FN_8 = 0, FN_4 = 1, FN_3 = FN_2 = x, DCOPLUS = 1
3V
16
26.6
41
MHz
f(DCO=2)
FN_8 = 1, FN_4 = FN_3 = FN_2 = x, DCOPLUS = 1
3V
4.2
6.3
9.2
MHz
f(DCO=27)
FN_8 = 1,FN_4 = FN_3 = FN_2 = x, DCOPLUS = 1
3V
30
46
70
MHz
Sn
Step size between adjacent DCO taps:
Sn = fDCO(Tap n+1) / fDCO(Tap n), (see Figure 12 for taps 21 to 27)
Dt
Temperature drift, N(DCO) = 01Eh, FN_8 = FN_4 = FN_3 = FN_2 = 0,
D = 2, DCOPLUS = 0
DV
Drift with VCC variation, N(DCO) = 01Eh,
FN_8 = FN_4 = FN_3 = FN_2 = 0, D = 2, DCOPLUS = 0
f
f
TEST CONDITIONS
f
(DCO)
f
(DCO3V)
1
1 < TAP ≤ 20
1.06
1.11
TAP = 27
1.07
1.17
3V
–0.2
–0.3
–0.4
%/_C
0
5
15
%/V
(DCO)
(DCO205C)
1.0
1.0
0
1.8
2.4
3.0
3.6
VCC − V
−40
−20
0
20
40
60
Figure 11. DCO Frequency vs Supply Voltage VCC and vs Ambient Temperature
26
MHz
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
85
TA − °C
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
Sn - Stepsize Ratio between DCO Taps
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
1.17
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ
Max
1.11
1.07
1.06
Min
1
20
27
DCO Tap
Figure 12. DCO Tap Step Size
f(DCO)
Legend
Tolerance at Tap 27
DCO Frequency
Adjusted by Bits
29 to 25 in SCFI1 {N{DCO}}
Tolerance at Tap 2
Overlapping DCO Ranges:
Uninterrupted Frequency Range
FN_2=0
FN_3=0
FN_4=0
FN_8=0
FN_2=1
FN_3=0
FN_4=0
FN_8=0
FN_2=x
FN_3=1
FN_4=0
FN_8=0
FN_2=x
FN_3=x
FN_4=1
FN_8=0
FN_2=x
FN_3=x
FN_4=x
FN_8=1
Figure 13. Five Overlapping DCO Ranges Controlled by FN_x Bits
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27
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
crystal oscillator, LFXT1 oscillator (see Notes 1 and 2)
PARAMETER
CXIN
Integrated input capacitance
((see Note 4))
CXOUT
Integrated output capacitance
(see Note 4)
VIL
Low-level input voltage at XIN
VIH
High-level input voltage at XIN
TEST CONDITIONS
VCC
OSCCAPx = 0h
3V
0
OSCCAPx = 1h
3V
10
OSCCAPx = 2h
3V
14
OSCCAPx = 3h
3V
18
OSCCAPx = 0h
3V
0
OSCCAPx = 1h
3V
10
OSCCAPx = 2h
3V
14
OSCCAPx = 3h
3V
See Note 3
2 2 V/3 V
2.2
MIN
TYP
MAX
UNIT
pF
pF
18
VSS
0.8×VCC
0.2×VCC
V
VCC
V
NOTES: 1. The parasitic capacitance from the package and board may be estimated to be 2pF. The effective load capacitor for the crystal is
(CXIN x CXOUT) / (CXIN + CXOUT). It is independent of XTS_FLL .
2. To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines must be
observed:
• Keep the trace between the MSP430FE42x2 and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to XIN an XOUT pins.
• Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
• Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation.
This signal is no longer required for the serial programming adapter.
3. Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.
4. External capacitance is recommended for precision real-time clock applications (OSCCAPx = 0h).
28
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
ESP430CE1B, SD16 and ESP430 power supply and recommended operating conditions
PARAMETER
AVCC
IESP430
ISD16
Analog supply
voltage
Total digital and
analog supply
current when
ESP430 and SD16
active
i
(IAVCC + IDVCC)
Analog supply
current: one active
SD16 channel
including internal
reference (ESP430
disabled)
fMAINS
Mains frequency
range
fSD16
Analog front-end
input clock
frequency
TEST CONDITIONS
VCC
AVCC = DVCC
AVSS = DVSS = 0V
MIN
TYP
2.7
MAX
3.6
SD16LP = 0,
fMCLK = 4MHz,
/4
fSD16 = fMCLK/4,
SD16REFON = 1,
SD16VMIDON = 0
GAIN(V): 1, GAIN(I1): 1, I2: off
3V
2.0
2.6
GAIN(V): 1, GAIN(I1): 32, I2: off
3V
2.4
3.3
GAIN(V): 1, GAIN(I1): 1, GAIN(I2): 1
3V
2.7
3.6
GAIN(V): 1, GAIN(I1): 32, GAIN(I2): 32
3V
3.4
4.9
SD16LP = 1,
fMCLK = 2 MHz,
fSD16 = fMCLK/4,
/4
SD16REFON = 1,
SD16VMIDON = 0
GAIN(V): 1, GAIN(I1): 1, I2: off
3V
1.5
2.1
GAIN(V): 1, GAIN(I1): 32, I2: off
3V
1.6
2.1
GAIN(V): 1, GAIN(I1): 1, GAIN(I2): 1
3V
2.1
2.8
GAIN(V): 1, GAIN(I1): 32, GAIN(I2): 32
3V
2.2
3.0
SD16LP = 0,
fSD16 = 1 MHz,
SD16OSR = 256
GAIN: 1, 2
3V
650
950
GAIN: 4, 8, 16
3V
730
1100
GAIN: 32
3V
1050
1550
SD16LP = 1,
fSD16 = 0.5
0 5 MHz,
MHz
SD16OSR = 256
GAIN: 1
3V
620
930
GAIN: 32
3V
700
1060
33
80
SD16LP = 0 (low-power mode disabled)
3V
1
SD16LP = 1 (low-power mode enabled)
3V
0.5
UNIT
V
mA
µA
Hz
MHz
ESP430CE1B, SD16 input range (see Note 1)
PARAMETER
VID
Differential input
voltage range for
specified
performance
(see Note 2)
TEST CONDITIONS
VCC
MIN
TYP
SD16GAINx = 1, SD16REFON = 1
±500
SD16GAINx = 2, SD16REFON = 1
±250
SD16GAINx = 4, SD16REFON = 1
±125
SD16GAINx = 8, SD16REFON = 1
±62
SD16GAINx = 16, SD16REFON = 1
±31
SD16GAINx = 32, SD16REFON = 1
±15
MAX
UNIT
mV
fSD16 = 1MHz, SD16GAINx = 1
3V
200
ZI
Input impedance
(one input pin to
AVSS)
fSD16 = 1MHz, SD16GAINx = 32
3V
75
Differential input
impedance
(IN+ to IN−)
fSD16 = 1MHz, SD16GAINx = 1
3V
300
400
ZID
fSD16 = 1MHz, SD16GAINx = 32
3V
100
150
VI
Absolute input
voltage range
AVSS−
1V
AVCC
V
VIC
Common-mode
input voltage range
AVSS−
1V
AVCC
V
kΩ
kΩ
NOTES: 1. All parameters pertain to each SD16 channel.
2. The analog input range depends on the reference voltage applied to VREF. If VREF is sourced externally, the full-scale range is defined
by VFSR+ = +(VREF/2)/GAIN and VFSR− = −(VREF/2)/GAIN. The analog input range should not exceed 80% of VFSR+ or VFSR−.
POST OFFICE BOX 655303
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29
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
ESP430CE1B, SD16 performance (fSD16 = 1MHz, SD16OSRx = 256, SD16REFON = 1)
PARAMETER
Signal to noise +
Signal-to-noise
distortion ratio
SINAD
G
Nominal gain
EOS
Offset error
dEOS/dT
Offset error
temperature
coefficient
Common mode
Common-mode
rejection ratio
CMRR
AC PSRR
AC power supply
rejection ratio
XT
Crosstalk
TEST CONDITIONS
VCC
MIN
TYP
MAX
SD16GAINx = 1,Signal Amplitude = 500mV
3V
83.5
SD16GAINx = 2,Signal Amplitude = 250mV
3V
81.5
84
SD16GAINx = 4,Signal Amplitude = 125mV
3V
76
79.5
3V
73
76.5
SD16GAINx = 16,Signal Amplitude = 31mV
3V
69
73
SD16GAINx = 32,Signal Amplitude = 15mV
3V
62
69
SD16GAINx = 1
3V
0.97
1.00
1.02
SD16GAINx = 2
3V
1.90
1.96
2.02
3.96
SD16GAINx = 8,Signal Amplitude = 62mV
fIN = 50 Hz,
100 Hz
UNIT
85
dB
SD16GAINx = 4
3V
3.76
3.86
SD16GAINx = 8
3V
7.36
7.62
7.84
SD16GAINx = 16
3V
14.56
15.04
15.52
SD16GAINx = 32
3V
27.20
28.35
29.76
SD16GAINx = 1
3V
±0.2
SD16GAINx = 32
3V
±1.5
SD16GAINx = 1
3V
±4
±20
SD16GAINx = 32
3V
±20
±100
SD16GAINx = 1, Common-mode input signal:
VID = 500 mV, fIN = 50 Hz, 100 Hz
3V
>90
SD16GAINx = 32, Common-mode input signal:
VID = 16 mV, fIN = 50 Hz, 100 Hz
3V
>75
SD16GAINx = 1, VCC = 3 V ± 100 mV, fVCC = 50 Hz
3V
>80
dB
3V
<−100
dB
%FSR
ppm
FSR/_C
dB
ESP430CE1B, SD16 temperature sensor
PARAMETER
TEST CONDITIONS
VCC
MIN
TCSensor
Sensor temperature
coefficient
1.18
VOffset,sensor
Sensor offset
voltage
−100
VSensor
Sensor output
S
t t
voltage (see Note 2)
1.32
MAX
UNIT
1.46
mV/K
100
mV
Temperature sensor voltage at TA = 85°C
3V
435
475
515
Temperature sensor voltage at TA = 25°C
3V
355
395
435
Temperature sensor voltage at TA = 0°C
3V
320
360
400
NOTES: 1. The following formula can be used to calculate the temperature sensor output voltage:
VSensor,typ = TCSensor ( 273 + T [°C] ) + VOffset,sensor [mV]
2. Results based on characterization and/or production test, no TCSensor or VOffset,sensor.
30
TYP
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
mV
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
ESP430CE1B, SD16 built-in voltage reference
PARAMETER
TEST CONDITIONS
VCC
VREF
Internal reference
voltage
SD16REFON = 1, SD16VMIDON = 0
3V
IREF
Reference supply
current
SD16REFON = 1, SD16VMIDON = 0
TC
Temperature
coefficient
SD16REFON = 1, SD16VMIDON = 0 (see Note 1)
CREF
VREF load
capacitance
SD16REFON = 1, SD16VMIDON = 0 (see Note 2)
ILOAD
VREF(I) maximum
load current
SD16REFON = 0, SD16VMIDON = 0
3V
tON
Turn-on time
SD16REFON = 0 → 1, SD16VMIDON = 0, CREF = 100 nF
3V
DC PSR
DC power supply
rejection,
∆VREF/∆VCC
SD16REFON = 1, SD16VMIDON = 0, VCC = 2.5 V to 3.6 V
MIN
1.14
TYP
MAX
UNIT
1.20
1.26
V
3V
175
260
µA
3V
20
50
ppm/K
100
nF
±200
5
nA
ms
µV/V
200
NOTES: 1. Calculated using the box method: (MAX(−40...85°C) − MIN(−40...85°C)) / MIN(−40...85°C) / (85 − (−40°C))
2. There is no capacitance required on VREF. However, a capacitance of at least 100 nF is recommended to reduce any reference
voltage noise.
ESP430CE1B, SD16 reference output buffer
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
VREF,BUF
Reference buffer
output voltage
SD16REFON = 1, SD16VMIDON = 1
3V
1.2
IREF,BUF
Reference supply +
reference output
buffer quiescent
current
SD16REFON = 1, SD16VMIDON = 1
3V
385
CREF(O)
Required load
capacitance on
VREF
SD16REFON = 1, SD16VMIDON = 1
ILOAD,Max
Maximum load
current on VREF
SD16REFON = 1, SD16VMIDON = 1
3V
Maximum voltage
variation vs load
current
|ILOAD| = 0 to 1mA
3V
Turn-on time
SD16REFON = 0 → 1, SD16VMIDON = 1, CREF = 470 nF
3V
tON
MAX
UNIT
V
600
470
µA
nF
−15
±1
mA
+15
mV
µs
100
ESP430CE1B, SD16 external reference input
PARAMETER
TEST CONDITIONS
VCC
VREF(I)
Input voltage range
SD16REFON = 0
3V
IREF(I)
Input current
SD16REFON = 0
3V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
1.0
TYP
1.25
MAX
UNIT
1.5
V
50
nA
31
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
ESP430CE1B, active energy measurement test conditions and accuracy, TA = 25°C (See Note 1)
D fACLK = 32,768 Hz (watch crystal)
D fMCLK = 8.39 MHz (FLL+)
D fSD16 = fMCLK/8 = 1.049 MHz
D Single point calibration at I = 10 A, PF = 0.5 lagging
D Measurements according to IEC1036
D Input conditions (unless otherwise noted): IB = 6 A, IMAX = n × IB = 60 A, n = 10, VN = 230 V, fMAINS = 50 Hz
PARAMETER
TEST CONDITIONS
VCC
I = 0.05*IB, V = VN, PF = 1.0
I = 0.1*IB to IMAX, V = VN, PF = 1.0
V1 SD16GAINx = 1
I1 SD16GAINx = 1
I = 0.1*IB, V = VN, PF = 0.5 lagging
Maximum error
I = 0.2*IB to IMAX, V = VN, PF = 0.5 lagging
I = 0.1*IB, V = VN, PF = 0.8 leading
I = 0.2*IB to IMAX, V = VN, PF = 0.8 leading
g
See Figure
14:
R1 = 0Ω, RB = 12.4Ω
I = 0.2*IB to IMAX, V = VN, PF = 0.25 lagging
MIN
TYP
3V
±0.17
3V
±0.18
3V
±0.19
3V
±0.27
3V
±0.15
3V
±0.24
3V
±0.38
MAX
UNIT
%
D Input conditions (unless otherwise noted): IB = 10 A, IMAX = n × IB = 60 A, n = 6, VN = 230 V, fMAINS = 50 Hz
PARAMETER
TEST CONDITIONS
MIN
TYP
3V
±0.11
I = 0.1*IB to IMAX, V = VN, PF = 1.0
3V
±0.18
3V
±0.45
3V
±0.33
3V
±0.10
I = 0.2*IB to IMAX, V = VN, PF = 0.8 leading
3V
±0.18
I = 0.2*IB to IMAX, V = VN, PF = 0.25 lagging
3V
±0.51
I = 0.1*IB, V = VN, PF = 0.5 lagging
Maximum error
VCC
I = 0.05*IB, V = VN, PF = 1.0
I = 0.2*IB to IMAX, V = VN, PF = 0.5 lagging
I = 0.1*IB, V = VN, PF = 0.8 leading
V1 SD16GAINx = 1
I1 SD16GAINx = 32
MAX
UNIT
%
NOTES: 1. Measurements performed using complete hardware solution. Error shown contain temperature dependencies of all components
including the MSP430FE42x2, crystal, and discrete components.
2. I1 SD16GAIN x = 1: CT part number = T60404−E4624−X101 ( Vacuumschmelze)
I1 SD16GAINx = 32: shunt part number = BVO−M−R0002−5.0 (Isabellenhütte Heusler GmbH KG)
I
1uH
CT
R1
1uH
RB
1k
990k
I1+
33nF
1k
1.5k
I1−
33nF
1uH
1k
V1+
33nF
1k
V1−
33nF
Figure 14. Energy Measurement Test Circuitry (SD16GAINx = 1)
32
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
ESP430CE1B (I1 SD16GAINx = 1) typical characteristics (see Note 1)
MEASUREMENT ERROR AS % OF READING
(TA = 25°C)
1.00
0.75
fMAINS = 50 Hz
VLINE = 230 V
0.50
PF = 0.5 lag
Error − %
0.25
PF = 1
0.00
−0.25
PF = 0.8 lead
−0.50
−0.75
−1.00
0.01
0.10
1.00
10.00
100.00
Line Current − A
Figure 15
MEASUREMENT ERROR AS % OF READING
(TA = −40°C)
1.00
0.75
MEASUREMENT ERROR AS % OF READING
(TA = 85°C)
1.00
fMAINS = 50 Hz
VLINE = 230 V
0.75
fMAINS = 50 Hz
VLINE = 230 V
PF = 0.8 lead
0.50
0.50
PF = 0.5 lag
0.25
Error − %
Error − %
0.25
0.00
−0.25
PF = 1
0.00
PF = 0.8 lead
−0.50
−0.50
−0.75
−0.75
−1.00
0.01
PF = 0.5 lag
−0.25
PF = 1
0.10
1.00
10.00
100.00
−1.00
0.01
0.10
1.00
Line Current − A
Line Current − A
Figure 16
Figure 17
10.00
100.00
NOTE 1: Results corrected for typical phase error of CT used (−40°C to 25°C: −0.7°; 25°C to 85°C: +0.5°).
See Figure 14 for test circuitry: CT part number = T60404−E4624−X101 ( Vacuumschmelze), R1 = 0 Ω, RB = 12.4 Ω.
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33
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
flash memory
TEST
CONDITIONS
PARAMETER
VCC(PGM/
VCC
MIN
Program and erase supply voltage
TYP
2.7
MAX
UNIT
3.6
V
476
kHz
5
mA
7
mA
10
ms
ERASE)
fFTG
Flash timing generator frequency
IPGM
Supply current from DVCC during program
257
IERASE
Supply current from DVCC during erase
tCPT
Cumulative program time
See Note 1
2.7 V/ 3.6 V
tCMErase
Cumulative mass erase time
See Note 2
2.7 V/ 3.6 V
2.7 V/ 3.6 V
3
2.7 V/ 3.6 V
3
200
104
Program/erase endurance
ms
105
cycles
tRetention
Data retention duration
TJ = 25°C
100
years
tWord
Word or byte program time
See Note 3
35
tFTG
tBlock, 0
Block program time for first byte or word
See Note 3
30
tFTG
tBlock, 1-63
Block program time for each additional byte or word
See Note 3
21
tFTG
tBlock, End
Block program end-sequence wait time
See Note 3
6
tFTG
tMass Erase
Mass erase time
See Note 3
5297
tFTG
tSeg Erase
Segment erase time
See Note 3
4819
tFTG
NOTES: 1. The cumulative programming time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all
programming methods: individual word/byte write and block write modes.
2. The mass erase duration generated by the flash timing generator is at least 11.1ms ( = 5297x1/fFTG,max = 5297x1/476kHz). To
achieve the required cumulative mass erase time the Flash Controller’s mass erase operation can be repeated until this time is met.
(A worst case minimum of 19 cycles are required).
3. These values are hardwired into the Flash Controller’s state machine (tFTG = 1/fFTG).
JTAG interface
TEST
CONDITIONS
PARAMETER
fTCK
TCK input frequency
see Note 1
RInternal
Internal pull-up resistance on TMS, TCK, TDI/TCLK
see Note 2
VCC
MIN
2.2 V
3V
2.2 V/ 3 V
25
TYP
MAX
UNIT
0
5
MHz
0
10
MHz
60
90
kΩ
MIN
MAX
NOTES: 1. fTCK may be restricted to meet the timing requirements of the module selected.
2. TMS, TDI/TCLK, and TCK pull-up resistors are implemented in all versions.
JTAG fuse (see Note 1)
TEST
CONDITIONS
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
VFB
Voltage level on TDI/TCLK for fuse-blow
IFB
Supply current into TDI/TCLK during fuse-blow
tFB
Time to blow fuse
TA = 25°C
VCC
2.5
6
UNIT
V
7
V
100
mA
1
ms
NOTES: 1. Once the fuse is blown, no further access to the MSP430 JTAG/Test and emulation features is possible. The JTAG block is switched
to bypass mode.
34
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
input/output schematic
Port P1, P1.0 to P1.1, input/output with Schmitt trigger
Pad Logic
CAPD.x
P1SEL.x
0: Input
1: Output
0
P1DIR.x
Direction Control
From Module
P1OUT.x
1
0
1
Module X OUT
Bus
keeper
P1.0/TA0
P1.1/TA0/MCLK
P1IN.x
EN
D
Module X IN
P1IE.x
P1IRQ.x
P1IFG.x
Q
EN
Set
Interrupt
Edge
Select
P1IES.x
P1SEL.x
NOTE: 0 ≤ x ≤ 1.
Port Function is Active if CAPD.x = 0
†
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
CAPD.x
P1SEL.0
P1DIR.0
P1DIR.0
P1OUT.0
Out0 Sig.†
P1IN.0
CCI0A†
P1IE.0
P1IFG.0
P1IES.0
DVSS
P1SEL.1
P1DIR.1
P1DIR.1
P1OUT.1
MCLK
P1IN.1
CCI0B†
P1IE.1
P1IFG.1
P1IES.1
DVSS
Timer_A3
POST OFFICE BOX 655303
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35
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
Port P1, P1.2 to P1.7, input/output with Schmitt trigger
Pad Logic
Port/LCD
Segment xx
DVSS
P1SEL.x
0: Input
1: Output
0
P1DIR.x
Direction Control
From Module
P1OUT.x
1
0
1
Module X OUT
Bus
keeper
P1.2/TA1/S31
P1.3/SVSOUT/S30
P1.4/S29
P1.5/TACLK/ACLK/S28
P1.6/SIMO0/S27
P1.7/SOMI0/S26
P1IN.x
EN
D
Module X IN
P1IE.x
P1IRQ.x
P1IFG.x
Q
EN
Interrupt
Edge
Select
Set
P1IES.x
P1SEL.x
NOTE: 2 ≤ x ≤ 7.
Port Function is Active if Port/LCD = 0
†
‡
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P1SEL.2
P1DIR.2
P1DIR.2
P1OUT.2
Out1 Sig.†
P1IN.2
CCI1A†
P1IE.2
P1IFG.2
P1IES.2
P1SEL.3
P1DIR.3
P1DIR.3
P1OUT.3
SVSOUT
P1IN.3
unused
P1IE.3
P1IFG.3
P1IES.3
P1SEL.4
P1DIR.4
P1DIR.4
P1OUT.4
DVSS
P1IN.4
unused
P1IE.4
P1IFG.4
P1IES.4
P1SEL.5
P1DIR.5
P1DIR.5
P1OUT.5
ACLK
P1IN.5
TACLK†
P1IE.5
P1IFG.5
P1IES.5
P1SEL.6
P1DIR.6
DCM_SIMO
P1OUT.6
SIMO0(o)‡
P1IN.6
SIMO0(i)‡
P1IE.6
P1IFG.6
P1IES.6
P1SEL.7
P1DIR.7
DCM_SOMI
P1OUT.7
SOMI0(o)‡
P1IN.7
SOMI0(i)‡
P1IE.7
P1IFG.7
P1IES.7
Port/LCD
Segment
S31
0: LCDM
< 0E0h
1: LCDM
≥ 0E0h
Direction Control for SIMO0
0: LCDM
< 0C0h
1: LCDM
≥ 0C0h
36
DCM_SIMO
Direction Control for SOMI0
SYNC
MM
STC
STC
STE
STE
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
S29
S28
Timer_A3
USART0
SYNC
MM
S30
DCM_SOMI
S27
S26
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
port P2, P2.0 to P2.1, input/output with Schmitt trigger
0: Port active
1: Segment xx function active
Pad Logic
Port/LCD
Segment xx
P2SEL.x
0: Input
1: Output
0
P2DIR.x
Direction Control
From Module
1
0
P2OUT.x
1
Module X OUT
Bus
Keeper
P2.0/TA2/S25
P2.1/UCLK0/S24
P2IN.x
EN
Module X IN
D
P2IE.x
P2IRQ.x
P2IFG.x
EN
Interrupt
Edge
Select
Q
Set
NOTE: 0 ≤ x ≤ 1.
Port Function is Active if Port/LCD = 0
†
‡
P2IES.x
P2SEL.x
PnSel.x
PnDIR.x
Dir. Control
from module
PnOUT.x
Module X
OUT
PnIN.x
P2Sel.0
P2DIR.0
P2DIR.0
P2OUT.0
Out2sig.†
P2IN.0
P2Sel.1
P2DIR.1
P2OUT.1
UCLK0(o)‡
P2IN.1
DCM_UCLK
Module X IN
CCI2A
†
UCLK0(i)‡
PnIE.x
PnIFG.x
PnIES.x
Port/LCD
Segment
P2IE.0
P2IFG.0
P2IES.0
S25
P2IE.1
P2IFG.1
P2IES.1
0: LCDM
< 0E0h
1: LCDM
≥ 0E0h
S24
Timer_A3
USART0
Direction Control for UCLK0
SYNC
MM
DCM_UCLK
STC
STE
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37
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
port P2, P2.2 to P2.5, input/output with Schmitt trigger
To BrownOut/SVS for P2.3/SVSIN
Pad Logic
DVSS
DVSS
CAPD.x
P2SEL.x
0: Input
1: Output
0
P2DIR.x
Direction Control
From Module
P2OUT.x
1
0
1
Module X OUT
Bus
keeper
P2.2/STE0
P2.3/SVSIN
P2.4/UTXD0
P2.5/URXD0
P2IN.x
EN
D
Module X IN
P2IE.x
P2IRQ.x
P2IFG.x
Q
EN
Set
Interrupt
Edge
Select
P2IES.x
P2SEL.x
NOTE: 2 ≤ x ≤ 5
Port function is active if CAPD.x = 0
†
38
PnSEL.x
PnDIR.x
Direction
Control
From Module
PnOUT.x
Module X
OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
CAPD.x
P2SEL.2
P2DIR.2
DVSS
P2OUT.2
DVSS
P2IN.2
STE0†
P2IE.2
P2IFG.2
P2IES.2
DVSS
P2SEL.3
P2DIR.3
P2DIR.3
P2OUT.3
DVSS
P2IN.3
unused
P2IE.3
P2IFG.3
P2IES.3
SVSCTL VLD
= 1111b
P2SEL.4
P2DIR.4
DVCC
P2OUT.4
UTXD0†
P2IN.4
unused
P2IE.4
P2IFG.4
P2IES.4
DVSS
P2SEL.5
P2DIR.5
DVSS
P2OUT.5
DVSS
P2IN.5
URXD0†
P2IE.5
P2IFG.5
P2IES.5
DVSS
USART0
POST OFFICE BOX 655303
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MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
Port P2, unbonded GPIOs P2.6 and P2.7
P2SEL.x
0: Input
1: Output
0
P2DIR.x
1
Direction Control
From Module
0
P2OUT.x
1
Module X OUT
P2IN.x
Node Is Reset With PUC
EN
Bus Keeper
Module X IN
P2IRQ.x
D
P2IE.x
P2IFG.x
Q
PUC
Interrupt
Edge
Select
EN
Set
Interrupt
Flag
P2IES.x
P2SEL.x
NOTE: x = Bit/identifier, 6 to 7 for port P2 without external pins
P2Sel.x
P2DIR.x
DIRECTION
CONTROL
FROM MODULE
P2OUT.x
MODULE X OUT
P2IN.x
MODULE X IN
P2IE.x
P2IFG.x
P2IES.x
P2Sel.6
P2DIR.6
P2DIR.6
P2OUT.6
DVSS
P2IN.6
unused
P2IE.6
P2IFG.6
P2IES.6
P2Sel.7
P2DIR.7
P2DIR.7
P2OUT.7
DVSS
P2IN.7
unused
P2IE.7
P2IFG.7
P2IES.7
NOTE: Unbonded GPIOs 6 and 7 of port P2 can be used as interrupt flags. Only software can affect the interrupt flags. They work as software
interrupts.
POST OFFICE BOX 655303
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39
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
JTAG pins TMS, TCK, TDI/TCLK, TDO/TDI, input/output with Schmitt-trigger or output
TDO
Controlled by JTAG
Controlled by JTAG
TDO/TDI
JTAG
Controlled
by JTAG
DVCC
TDI
Burn and Test
Fuse
TDI/TCLK
Test
and
Emulation
DVCC
TMS
Module
TMS
DVCC
TCK
TCK
RST/NMI
Tau ~ 50 ns
Brownout
TCK
40
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
G
D
U
S
G
D
U
S
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
APPLICATION INFORMATION
JTAG fuse check mode
MSP430 devices that have the fuse on the TDI/TCLK terminal have a fuse-check mode that tests the continuity
of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF , of 1.8 mA at 3 V can flow from the TDI/TCLK pin to ground if the fuse is not burned. Care must be
taken to avoid accidentally activating the fuse-check mode and increasing overall system power consumption.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if the
TMS is being held low during power up. The second positive edge on the TMS pin deactivates the fuse check
mode. After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR, the
fuse-check mode has the potential to be activated.
The fuse-check current flows only when the fuse-check mode is active, and the TMS pin is in a low state (see
Figure 18). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition).
The JTAG pins are terminated internally and, therefore, do not require external termination.
Time TMS Goes Low After POR
TMS
ITDI/TCLK
ITF
Figure 18. Fuse Check Mode Current, MSP430FE42x2
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41
MSP430FE42x2
MIXED SIGNAL MICROCONTROLLER
SLAS616 − JULY 2008
Data Sheet Revision History
Literature
Number
SLAS616
Summary
Production Data release
NOTE: The referring page and figure numbers are referred to the respective document revision.
42
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MSP430FE4232IPM
ACTIVE
LQFP
PM
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4232IPMR
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4242IPM
ACTIVE
LQFP
PM
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4242IPMR
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4252IPM
ACTIVE
LQFP
PM
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4252IPMR
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4272IPM
ACTIVE
LQFP
PM
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430FE4272IPMR
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430FE4242IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
MSP430FE4252IPMR
LQFP
PM
64
1000
330.0
24.4
12.3
12.3
2.5
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430FE4242IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
MSP430FE4252IPMR
LQFP
PM
64
1000
333.2
345.9
41.3
Pack Materials-Page 2
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
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