ETC CSX750FB

PAGE
DATE
NO.
1/10
2000.9.18
S-SC0006
Messrs.
SPECIFICATION
PRODUCT NAME:
CRYSTAL CLOCK OSCILLATOR
CSX-750FB? (?= B,C,F)
TYPE:
FREQUENCY:
2.500 ~ 32.000 MHz
PARTS NO.:
CITIZEN WATCH CO., LTD.
1-12, Honcho 6-chome, Tanashi-shi,
Tokyo 188-8511 Japan
Oscillator Technical section
Crystal Devices Div.
Telephone: 0424-68-4572
Fax : 0424-68-4666
PRODUCTS MARKETING GROUP
Telephone: 0424-67-6214
Telex:2822-471/ Fax: 0424-67-8503
APPROVED
CHECKED
PREPARED
T.Kuratomi
SPECIFICATION
NO.
S-SC0006
DATE 2000.9.18
PAGE
2/10
1. SCOPE
This specification relates to the crystal clock oscillator to be supplied by
CITIZEN WATCH CO., LTD. (following as CITIZEN) to
.
NOTICE
1.If something that is ambiguously defined or undefined in this specification happened,
customer and CITIZEN would discuss and take necessary steps by mutual consent.
2.Product test data can't be attached to this specification.
3.This product is not authorized for use as critical component in life support devices
or systems.
2. SPECIFICATION
1. ABSOLUTE MAXIMUM RATING
Parameter
Conditions
Unit
-0.5 ~ +7.0
V
-55 ~ +125
°C
25
-0.5 ~ VDD +0.5
mA
V
Supply Voltage VMAX
Storage Temperature TSTG
See 8.
Output Current IOUT
Input Voltage
VIN_M
Solder Heat Resistance
{ MAX.260°C, MAX.10 seconds , 2times } or
Of The Outer Lead TSOL
{ MAX.230°C, MAX.3 minutes }
2. OPERATING RANGE
Parameter
Conditions
Supply Voltage
Temperature
VDD
TOPR
Input Voltage VIN
Output Load
Unit
FBC,FBB
FBF
Min.
Typ.
Max.
3.0
-20
-40
3.3
3.6
70
85
V
°C
°C
VDD
V
30
pF
0
CL
3. FREQUENCY CHARACTERISTICS
Parameter
Frequency
Frequency Stability
Conditions
f0
df
Unit
See Section 2.
2.500 ~ 32.000
See Section 2.
FBB:±50 FBC, FBF:±100
MHz
ppm
note) Frequency Stability includes initial tolerance, temperature characteristics, voltage
characteristics, load characteristics and aging(25°C , first year).
SPECIFICATION
NO.
S-SC0006
DATE 2000.9.18
PAGE
3/10
4. ELECTRICAL CHARACTERISTICS
(V=3.3V Ta = 25°C load=30pF)
Parameter
Conditions
Unit
Min.
Start Up Time
Typ.
tOSC
Max.
10
ms
Power Supply Current IDD No Load
15
mA
Disable Current IINH
OE=GND
5
mA
Rise Time
tr
CMOS load : 20%VDD to 80%VDD
8
ns
Fall Time
tf
CMOS load : 80%VDD to 20%VDD
8
ns
CMOS load : 50%VDD
55
%
Duty Cycle
DUTY
45
Output HIGH Voltage VOH IOH= -4mA
2.2
V
Output LOW Voltage VOL IOL= 4mA
Input HIGH Voltage VIH
OE
Input LOW Voltage
OE
VIL
0.4
2.0
V
V
0.4
V
Output Disable Time
tPXZ
See 5.
100
ns
Output Enable Time
tPZX
See 5.
100
ns
5. THREE STATE OUTPUT OPERATION
OE Input
Clock Output
Internal quartz oscillator
HIGH or OPEN
Active
: enable
LOW
High impedance
Propagation delay time between
tPXZ : OE(HIGH to LOW) and
OUTPUT(active level
to high impedance)
tPXZ
Clock
Output
Active
: disable
Active
tPZX : OE(LOW to HIGH) and
OUTPUT(high impedance
to active level)
tPZX
high impedance
OE
input
HIGH or
OPEN
LOW
NOTE: The phase of clock output does not synchronize with OE signal edges.
SPECIFICATION
NO.
DATE
S-SC0006
2000.9.18
PAGE
4/10
6. TEST CIRCUIT
[CMOS LOAD] (30pF)
VDD
[SUPPLY CURRENT ]
VDD
Test Point
4
.01~
0.1µF
3
VDD
OUT
OE
GND
1
4
VDD
CL=
30pF
.01~
0.1µF
OE
2
GND
1
GND
GND
[MEASUREMENT CONDITION]
1.Osilloscope
Impedance:No less than 1M ohm
Capacitance:No more than 5pF
Band width:No less than 500MHz
The length of GND lead of the probe should be as short as possible.
2.The CL includes the probe capacitance.
3.Grounding should be single point grounding.
4.Supply impedance should be as low as possible.
0V to 90%VDD rise time is no less than 150µs
5.Use the ammeter that internal impedance is small.
7. OUTPUT WAVEFORM
[CMOS LOAD] (30pF)
tf
tr
80%VDD
50%VDD
20%VDD
Th
T
DUTY=Th/T
3
OUT
2
SPECIFICATION
NO.
DATE
S-SC0006
2000.9.18
PAGE
5/10
8. ENVIRONMENTAL AND MECHANICAL CHARACTERISTICS
The following are our reliability test conditions.
Item
Temperature
Cycle
Test Method
Frequency *1
Shift after Test Electrical
-55 ~ 125°C(NO BIAS)
(15min. , 100cycles)
±20 ppm
High Temp.
Storage
+125°C , NO BIAS , 1000hours
±50 ppm
Low Temp.
Storage
-55°C , NO BIAS , 1000hours
±20 ppm
Vibration
Drop
Resistance to
Soldering Heat
Electrical
Characterristics
satisfy
the spec.4.
20Hz ~ 2000Hz, 1.5mm p-p or 196m/s²
20Hz ~ 2000Hz ~ 20Hz 4 min./cycle
±10 ppm
3 direction , 4 cycles for each direction
Free drop from 75cm height on a
hard wooden board for 3 times.
±20 ppm
Into solder bath +260°C±5°C
for 20 sec.
±10 ppm
Solderability
Dip into solder bath +230°C
for 5 sec.
90% of the dipped terminal
is soldered.
Seal
Helium leak detector
1E-9 Pa m³/s max.
Each test is independentlly examined.
*1 The value of after test is measured after putting in room temperature
for 2 ~ 24hours.
SPECIFICATION
NO.
DATE
S-SC0006
2000.9.18
3. DIMENSIONS AND MARKING
[Dimensions]
(UNIT mm)
[Marking]
Manufucturer's Name
Frequency
CTZ
FB?
12 . 3456
906105
Type
Production Lot
Number
PAGE
6/10
SPECIFICATION
NO.
DATE
S-SC0006
2000.9.18
PAGE
7/10
4. TAPE AND REEL PACKAGING
1. TAPING SPECIFICATION
Subject to EIA 481A & JIS C 0806
(1) Tape Dimensions
Material of the Carrier Tape : PA-PET conductive coat
Material of the Cover Tape : PE A-PET conducutive coat
(2) Reel Dimensions
Material of the Reel : PS
Symbol
Dimension(mm)
A
254±2
N
100±1
W1
17.5±1.0
W2
21.5±1.0
SPECIFICATION
NO.
DATE
S-SC0006
2000.9.18
(3) Packing
Item
Cover Tape
Empty Pockets
Tape Trailer
Cover Tape
Empty Pockets
Tape Leader
2. INNER CARTON
Empty Space
Min. 500 mm
Min. 20 Pockets
Min. 0 mm
Min. 40 mm
PAGE
8/10
SPECIFICATION
NO.
DATE
S-SC0006
2000.9.18
PAGE
9/10
3. OUTER CARTON
4. MARKING
(1) Marking Labels are affixed to reel , inner carton and outer carton.
Reel Marking is consist of:
(2) Each label contains the following information.
* Parts name or type
* Frequency
* Quantity
* Manufucturing Date or symbol
* Manufucturer's name or symbol
* Others(if necessary)
5. QUANTITY
2000 pcs/reel
6. STORAGE ENVIRONMENT
* Storage the reel at normal temperature and humidity
* Open the packing just before using.
* Do not expose the sun.
* Do not storage with some erosive chemicals.
* Nothing is allowed to put on the reel or carton to prevent mechanical damage.
7. HANDLING
* Handle with care to prevent the damege of tape, reel and products.
SPECIFICATION
NO.
S-SC0006
DATE 2000.9.18
PAGE
10/10
5. NOTES
1. HANDLING
(ELECTROSTATIC DISCHARGES)
This device is made with CMOS circuitry. Please take precautions
to prevent damage due to electrical static discharge.
(SHOCK RELIABILITY)
This device contains a quartz crystal, so please do not give too much shock or vibration.
An automatic insersion is available, however, the internal quartz crystal might be damaged in
case that too much shock or vibration is given by machine condition. Be sure to check your
machine condition in advance.
(CLEANING)
Since, depending on the cleaning conditions,there is a possibility of damage being caused to
the Crystal Osillator,do not fail to test and confirm the results beforehand,using your
company's cleaning conditions.
(TEMPERATURE AND HUMIDITY)
We recommend to store and use device under normal temperature and humidity.
When this device is used in high humidity applications, there is a potential problem with
condensation.
As with other IC's, please take precautions to prevent condensation.
2. CIRCUIT DESIGNS
(POWER LINES)
We recommend placing a 0.01 ~ 0.1µF capacitor between VDD and GND to obtain stable
operation and protect against power line ripple .
VDD and GND pattern should be as wide as possible.
(OE INPUT LINE)
When OE pin is not used, please connect it to VDD.
(OUTPUT LINE)
As a long output line may cause irregular output, please take care to design that output line is
as short as possible, and also keep high level signal source away from this device.