ECP053 The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier • Single Positive Supply (+5V) • Available in SOIC-8 or 16pin 4mm QFN package Applications • • • • W-LAN RFID DMB Fixed Wireless The ECP053 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECP053 to maintain high linearity over temperature and operate directly off a single +5V supply. This combination makes the device an excellent candidate for driver amplifier stages in wireless-LAN, digital multimedia broadcast, or fixed wireless applications. The device can also be used in next generation RFID readers. N/C N/C 15 14 13 12 N/C N/C 2 11 RF OUT RF IN 3 10 RF OUT 9 N/C N/C 4 5 6 7 8 N/C • 13 dB Gain @ 2450 MHz 16 Vref 1 N/C • +43 dBm Output IP3 Vbias • +28 dBm P1dB The ECP053 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance for various narrowband-tuned application circuits with up to +43 dBm OIP3 and +28 dBm of compressed 1dB power. It is housed in an industry standard SOIC-8 or 16-pin 4x4mm QFN SMT package. All devices are 100% RF and DC tested. N/C • 2300 – 2700 MHz Functional Diagram N/C Product Description N/C Product Features Product Information ECP053D Vref 1 8 Vbias N/C 2 7 RF OUT RF IN 3 6 RF OUT N/C 4 5 N/C ECP053G Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Operating Current Range, Icc (3) Device Voltage, Vcc Units Min MHz MHz dB dB dB dBm dBm dB MHz dB dB dB dBm dBm mA V Typ 2300 200 Max 2700 2450 13 20 8 +27 +42 5.3 2600 12 23 8 +27 +42 250 +5 300 Test conditions unless otherwise noted. 1. T = 25ºC, Vsupply = +5 V, Frequency = 2650 MHz, in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.) Absolute Maximum Rating Parameters Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Device Power Rating -40 to +85 °C -65 to +150 °C +28 dBm +8 V 400 mA 2W Ordering Information Part No. Description ECP053D ECP053G ECP053D-PCB2450 ECP053D-PCB2600 ECP053G-PCB2450 ECP053G-PCB2600 ½ Watt InGaP HBT Amplifier (16p 4mm Pkg) ½ Watt InGaP HBT Amplifier (Soic-8 Pkg) 2450 MHz Evaluation Board 2600 MHz Evaluation Board 2450 MHz Evaluation Board 2600 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECP053 The Communications Edge TM 1/2 Watt, High Linearity InGaP HBT Amplifier Product Information ECP053G (SOIC-8 Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “ECP053G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Land Pattern 1 8 2 7 3 6 4 5 Function Vref Input Output Vbias GND N/C or GND Pin No. 1 3 6, 7 8 Backside Paddle 2, 4, 5 Mounting Config. Notes 1. Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 62° C / W 162° C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. 2. MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Thermal Specifications 3. 4. 10000 5. 1000 6. 7. 8 100 60 70 80 90 100 110 A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degree 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECP053 The Communications Edge TM 1/2 Watt, High Linearity InGaP HBT Amplifier Product Information ECP053D (16-pin 4x4mm Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “ECP053D” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: DEVICE GROUND PAD 2.0mm X 2.0mm RECOMMENDED PAD 0.76mm X 0.34mm Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function of the voltage at pins 10 and 11 and the current applied to pins 10, 11, and 16 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. 13 12 N/C N/C 2 11 RF OUT RF IN 3 10 RF OUT 9 N/C 7 8 N/C 6 N/C 5 Pin No. 1 3 10, 11 16 Backside Paddle 2, 4-9, 12-15 MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Rating -40 to +85° C 62° C / W 162° C 14 Function Vref RF Input RF Output Vbias GND N/C or GND 16L 4.0mm X 4.0mm PACKAGE Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) 15 N/C SOLDERMASK SWELL TO BE 0.5mm FROM OUTSIDE EDGE OF ALL PADS Parameter 16 Vref 1 N/C 4 TYP. 4.00mm Thermal Specifications N/C GROUND PLANE AREA FOR VIAS 2.23mm X 2.23mm N/C Functional Diagram N/C 0.65mm TYP. MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Vbias 0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO BOTTOM, AND INTERNAL GROUIND PLANES IN ORDE MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MA VIA BARREL PLATTING TO BE MIN. 0.0014 THICK. VIA PLUGGED WITH EITHER CONDUCTIVE OR NON-COND EPOXY TO PREVENT SOLDER. DRAINS THROUGH VI REFLOW PROCESS N/C Land Pattern Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 Mounting Config. Notes 10000 1. 2. 1000 3. 100 60 70 80 90 100 110 120 4. Tab Temperature (°C) 5. 6. 7. 8 A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004