TI SN74LVC3G07DCUT

SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCES365H – AUGUST 2001 – REVISED JUNE 2005
FEATURES
•
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DCT OR DCU PACKAGE
(TOP VIEW)
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V VCC Operation
Max tpd of 3.7 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Input and Open-Drain Output Accepts
Voltages up to 5.5 V
Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
1A
3Y
2A
GND
1
8
2
7
3
6
4
5
VCC
1Y
3A
2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND
2A
3Y
1A
4 5
3 6
2 7
1 8
2Y
3A
1Y
VCC
DESCRIPTION/ORDERING INFORMATION
This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
–40°C to 85°C
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC3G07YEAR
SN74LVC3G07YZAR
Reel of 3000
VSSOP – DCU
(1)
(2)
_ _ _CV_
SN74LVC3G07YEPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
TOP-SIDE MARKING (2)
SN74LVC3G07YZPR
Reel of 3000
SN74LVC3G07DCTR
Reel of 3000
SN74LVC3G07DCUR
Reel of 250
SN74LVC3G07DCUT
C07_ _ _
C07_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2005, Texas Instruments Incorporated
SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCES365H – AUGUST 2001 – REVISED JUNE 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
1A
2A
3A
1
7
3
5
6
2
1Y
2Y
3Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
state (2) (3)
–0.5
UNIT
VO
Voltage range applied to any output in the high or low
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DCT package
220
DCU package
227
YEA/YZA package
140
YEP/YZP package
(1)
(2)
(3)
(4)
2
°C/W
102
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCES365H – AUGUST 2001 – REVISED JUNE 2005
Recommended Operating Conditions
VCC
(1)
Operating
Supply voltage
Data retention only
1.65
5.5
1.7
VCC = 3 V to 3.6 V
0.7 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
V
V
2
VCC = 4.5 V to 5.5 V
VIL
UNIT
0.65 × VCC
VCC = 2.3 V to 2.7 V
High-level input voltage
MAX
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
V
0.3 × VCC
VI
Input voltage
0
5.5
V
VO
Output voltage
0
5.5
V
VCC = 1.65 V
4
VCC = 2.3 V
IOL
Low-level output current
∆t/∆v
8
16
VCC = 3 V
Input transition rise or fall rate
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
TA
(1)
mA
24
ns/V
5
Operating free-air temperature
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 µA
VOL
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
0.4
3V
IOL = 32 mA
VI = 5.5 V or GND
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND,
IO = 0
∆ICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
UNIT
V
0.55
4.5 V
Ioff
(1)
MAX
IOL = 4 mA
IOL = 24 mA
A inputs
MIN TYP (1)
0.1
IOL = 16 mA
II
VCC
1.65 V to 5.5 V
0.55
0 to 5.5 V
±5
µA
0
±10
µA
1.65 V to 5.5 V
10
µA
3 V to 5.5 V
500
µA
3.3 V
3.5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
3
SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCES365H – AUGUST 2001 – REVISED JUNE 2005
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.5
7.8
1
4.3
1.1
3.7
1
2.9
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance
TEST CONDITIONS
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
3
3
4
5
UNIT
pF
SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCES365H – AUGUST 2001 – REVISED JUNE 2005
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
VLOAD
RL
From Output
Under Test
S1
Open
TEST
GND
CL
(see Note A)
RL
S1
tPZL (see Notes E and F)
VLOAD
tPLZ (see Notes E and G)
VLOAD
tPHZ/tPZH
VLOAD
LOAD CIRCUIT
INPUT
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VM
tr/tf
VI
≤ 2 ns
≤ 2 ns
≤ 2.5 ns
≤ 2.5 ns
VCC
VCC
3V
VCC
VCC/2
VCC/2
1.5 V
VCC/2
VLOAD
CL
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
RL
V∆
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
th
VI
VM
Input
VM
VM
VM
Data Input
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
tPHL
tPLH
VOH
VM
Output
VM
VOL
tPHL
tPLH
VOH
Output
VM
VI
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VI
Output
Control
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at VLOAD
(see Note B)
VM
VM
0V
tPZL
tPLZ
VLOAD/2
VM
tPZH
VOL + V∆
VOL
tPHZ
VM
VLOAD/2
VLOAD/2 − V∆
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVC3G07DCTR
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC3G07DCUR
ACTIVE
US8
DCU
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC3G07DCURE4
ACTIVE
US8
DCU
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC3G07DCUT
ACTIVE
US8
DCU
8
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC3G07DCUTE4
ACTIVE
US8
DCU
8
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC3G07YEAR
ACTIVE
WCSP
YEA
8
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74LVC3G07YEPR
ACTIVE
WCSP
YEP
8
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74LVC3G07YZAR
ACTIVE
WCSP
YZA
8
3000
Pb-Free
(RoHS)
SNAGCU
Level-1-260C-UNLIM
SN74LVC3G07YZPR
ACTIVE
WCSP
YZP
8
3000
Pb-Free
(RoHS)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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