ETC SI4136-BT

Si4136
I SM RF S Y N T H E S I Z E R W I T H I N T E G R A T E D VCO S
FOR WIRELESS COMMUNICATIONS
Features
!
Dual-Band RF Synthesizers
!
RF1: 2300 MHz to 2500 MHz
RF2: 2025 MHz to 2300 MHz
!
"
"
!
IF Synthesizer
"
!
!
Minimal External Components
Required
Low Phase Noise
5 µA Standby Current
25.7 mA Typical Supply Current
3.0 V to 3.6 V Operation
Package: 24-pin TSSOP
!
Dual-Band Communications
!
!
62.5 MHz to 1000 MHz
Integrated VCOs, Loop Filters,
Varactors, and Resonators
!
Ordering Information:
See page 28.
Applications
!
!
Pin Assignments
ISM Band Communications
Wireless LAN and WAN
Description
The Si4136 is a monolithic integrated circuit that performs both IF and RF
synthesis for wireless communications applications. The Si4136 includes
three VCOs, loop filters, reference and VCO dividers, and phase detectors.
Divider and power down settings are programmable through a three-wire
serial interface.
Functional Block Diagram
X IN
P W D NB
S DA TA
S CLK
S EN B
A UX O U T
R eference
A m plifier
÷1/÷2
÷ RRF1
P hase
D etect
R F1
P ow er
D ow n
C ontrol
S erial
Interface
÷ NRF1
÷ RRF2
SCLK
1
24
SENB
SDATA
2
23
VDDI
GNDR
3
22
IFOUT
GNDR
4
21
GNDI
NC
5
20
IFLB
GNDR
6
19
IFLA
NC
7
18
GNDD
GNDR
8
17
VDDD
GNDR
9
16
GNDD
GNDR
10
15
XIN
RFOUT
11
14
PWDNB
VDDR
12
13
AUXOUT
R FO U T
P hase
D etect
R F2
22-bit
D ata
R egister
Test
Mux
÷2
Si4136
÷ NRF2
÷ R IF
Patents pending
÷2
P hase
D etect
IFD IV
IFO U T
IF
÷ N IF
Rev. 1.0 12/00
IFLA
IFLB
Copyright © 2000 by Silicon Laboratories
Si4136-DS10
S i4 13 6
2
Rev. 1.0
Si4136
TA B L E O F C O N T E N T S
Section
Page
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Setting the VCO Center Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Self-Tuning Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PLL Loop Dynamics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF and IF Outputs (RFOUT and IFOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reference Frequency Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Down Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Auxiliary Output (AUXOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Descriptions: Si4136 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Rev. 1.0
4
16
16
16
17
17
18
18
19
19
20
21
27
28
29
30
3
S i4 13 6
Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Ambient Temperature
TA
–40
25
85
°C
Supply Voltage
VDD
3.0
3.3
3.6
V
Supply Voltages Difference
V∆
–0.3
—
0.3
V
(VDDR – VDDD),
(VDDI – VDDD)
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25°C unless otherwise stated.
Table 2. Absolute Maximum Ratings1,2
Parameter
Symbol
Value
Unit
VDD
–0.5 to 4.0
V
Input Current3
IIN
±10
mA
Input Voltage3
VIN
–0.3 to VDD+0.3
V
TSTG
–55 to 150
DC Supply Voltage
Storage Temperature Range
o
C
Notes:
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. This device is a high performance RF integrated circuit with an ESD rating of < 2 kV. Handling and assembly of
this device should only be done at ESD-protected workstations.
3. For signals SCLK, SDATA, SENB, PWDNB and XIN.
4
Rev. 1.0
Si4136
Table 3. DC Characteristics
(VDD = 3.0 to 3.6 V, TA = –40 to 85°C)
Parameter
Test Condition
Min
Typ
Max
Unit
RF1 and IF operating
—
25.7
35
mA
RF1 Mode Supply Current1
—
15.7
20
mA
RF2 Mode Supply Current1
—
15.4
20
mA
IF Mode Supply Current1
—
10
15
mA
—
1
—
µA
Total Supply Current
Symbol
1
Standby Current
PWDNB = 0
High Level Input Voltage2
VIH
0.7 VDD
—
—
V
Low Level Input Voltage2
VIL
—
—
0.3 VDD
V
High Level Input Current2
IIH
VIH = 3.6 V,
VDD = 3.6 V
–10
—
10
µA
Low Level Input Current2
IIL
VIL = 0 V,
VDD= 3.6 V
–10
—
10
µA
High Level Output Voltage3
VOH
IOH = –500 µA
VDD–0.4
—
—
V
Low Level Output Voltage3
VOL
IOH = 500 µA
—
—
0.4
V
Notes:
1. RF1 = 2.4 GHz, RF2 = 2.1 GHz, IFOUT = 800 MHz, LPWR = 0.
2. For signals SCLK, SDATA, SENB, and PWDNB.
3. For signal AUXOUT.
Rev. 1.0
5
S i4 13 6
Table 4. Serial Interface Timing
(VDD = 3.0 to 3.6 V, TA = –40 to 85°C)
Symbol
Test Condition
Min
Typ
Max
Unit
SCLK Cycle Time
tclk
Figure 1
40
—
—
ns
SCLK Rise Time
tr
Figure 1
—
—
50
ns
SCLK Fall Time
tf
Figure 1
—
—
50
ns
SCLK High Time
th
Figure 1
10
—
—
ns
SCLK Low Time
tl
Figure 1
10
—
—
ns
SDATA Setup Time to SCLK↑2
tsu
Figure 2
5
—
—
ns
SDATA Hold Time from SCLK↑2
Parameter1
thold
Figure 2
0
—
—
ns
2
SENB↓ to SCLK↑ Delay Time
ten1
Figure 2
10
—
—
ns
SCLK↑ to SENB↑ Delay Time2
ten2
Figure 2
12
—
—
ns
SENB↑ to SCLK↑ Delay Time2
ten3
Figure 2
12
—
—
ns
tw
Figure 2
10
—
—
ns
SENB Pulse Width
Notes:
1. All timing is referenced to the 50% level of the waveform, unless otherwise noted.
2. Timing is not referenced to 50% level of the waveform. See Figure 2.
tr
tf
80%
SCLK
50%
20%
th
tclk
tl
Figure 1. SCLK Timing Diagram
6
Rev. 1.0
Si4136
A
A
Figure 2. Serial Interface Timing Diagram
First bit
clocked in
Last bit
clocked in
D D D D D D D D D D D D D D D D D D A A A A
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 3 2 1 0
data
field
address
field
Figure 3. Serial Word Format
Rev. 1.0
7
S i4 13 6
Table 5. RF and IF Synthesizer Characteristics
(VDD = 3.0 to 3.6 V, TA = –40 to 85°C)
Symbol
Test Condition
Min
Typ
Max
Unit
XIN Input Frequency
fREF
XINDIV2 = 0
2
—
25
MHz
XIN Input Frequency
fREF
XINDIV2 = 1
25
—
50
MHz
Reference Amplifier Sensitivity
VREF
0.5
—
VDD
+0.3 V
VPP
0.010
—
1.0
MHz
RF1 VCO Tuning Range2
2300
—
2500
MHz
RF2 VCO Tuning Range2
2025
—
2300
MHz
526
—
952
MHz
with IFDIV
62.5
—
1000
MHz
Note: L ±10%
–5
—
5
%
Open loop
—
0.75
—
MHz/V
RF2 VCO Pushing
—
0.65
—
MHz/V
IF VCO Pushing
—
0.10
—
MHz/V
—
0.250
—
MHz p-p
—
0.100
—
MHz p-p
—
0.025
—
MHz p-p
1 MHz offset
—
–130
—
dBc/Hz
100 Hz to 100 kHz
—
1.2
—
degrees
rms
1 MHz offset
—
–131
—
dBc/Hz
RF2 Integrated Phase Error
100 Hz to 100 kHz
—
1.0
—
degrees
rms
IF Phase Noise at 800 MHz
100 kHz offset
—
–104
—
dBc/Hz
100 Hz to 100 kHz
—
0.4
—
degrees
rms
Parameter1
Phase Detector Update Frequency
IF VCO Center Frequency Range
IFOUT Tuning Range from fCEN
IFOUT VCO Tuning Range from fCEN
RF1 VCO Pushing
RF1 VCO Pulling
RF2 VCO Pulling
fφ
fφ = fREF/R for
XINDIV2 = 0
fφ = fREF/2R for
XINDIV2 = 1
fCEN
VSWR = 2:1, all
phases, open loop
IF VCO Pulling
RF1 Phase Noise
RF1 Integrated Phase Error
RF2 Phase Noise
IF Integrated Phase Error
Notes:
1. fφ(RF) = 1 MHz, fφ(IF) = 1 MHz, RF1 = 2.4 GHz, RF2 = 2.1 GHz, IFOUT = 800 MHz, LPWR = 0, for all parameters
unless otherwise noted.
2. RF VCO tuning range limits are fixed by inductance of internally bonded wires.
3. From power up request (PWDNB↑ or SENB↑ during a write of 1 to bits PDIB and PDRB in Register 2) to RF and IF
synthesizers ready (settled to within 0.1 ppm frequency error).
4. From power down request (PWDNB↓, or SENB↑ during a write of 0 to bits PDIB and PDRB in Register 2) to supply
current equal to IPWDN.
8
Rev. 1.0
Si4136
Table 5. RF and IF Synthesizer Characteristics (Continued)
(VDD = 3.0 to 3.6 V, TA = –40 to 85°C)
Test Condition
Min
Typ
Max
Unit
Second Harmonic
—
–28
–20
dBc
RF2 Harmonic Suppression
—
–23
–20
dBc
IF Harmonic Suppression
—
–26
–20
dBc
Parameter1
Symbol
RF1 Harmonic Suppression
RFOUT Power Level
ZL = 50 Ω, RF1 active
–15
–7
0
dBm
RFOUT Power Level
ZL = 50 Ω, RF2 active
–15
–9
0
dBm
IFOUT Power Level
ZL = 50 Ω
–7
–3
1
dBm
Offset = 1 MHz
—
–63
—
dBc
Offset = 2 MHz
—
–68
—
dBc
Offset = 3 MHz
—
–70
—
dBc
Offset = 1 MHz
—
–63
—
dBc
Offset = 2 MHz
—
–68
—
dBc
Offset = 3 MHz
—
–70
—
dBc
µs
RF1 Output Reference Spurs
RF2 Output Reference Spurs
Power Up Request to Synthesizer
Ready3 Time
tpup
Figures 4, 5
fφ > 500 kHz
—
80
100
Power Up Request to Synthesizer
Ready3 Time
tpup
Figures 4, 5
fφ ≤ 500 kHz
—
40/fφ
50/fφ
Power Down Request to Synthesizer
Off4 Time
tpdn
Figures 4, 5
—
—
100
ns
Notes:
1. fφ(RF) = 1 MHz, fφ(IF) = 1 MHz, RF1 = 2.4 GHz, RF2 = 2.1 GHz, IFOUT = 800 MHz, LPWR = 0, for all parameters
unless otherwise noted.
2. RF VCO tuning range limits are fixed by inductance of internally bonded wires.
3. From power up request (PWDNB↑ or SENB↑ during a write of 1 to bits PDIB and PDRB in Register 2) to RF and IF
synthesizers ready (settled to within 0.1 ppm frequency error).
4. From power down request (PWDNB↓, or SENB↑ during a write of 0 to bits PDIB and PDRB in Register 2) to supply
current equal to IPWDN.
Rev. 1.0
9
S i4 13 6
Figure 4. Software Power Management
Timing Diagram
10
Figure 5. Hardware Power Management
Timing Diagram
Rev. 1.0
Si4136
Figure 6. Typical Transient Response RF1 at 2.4 GHz
with 1 MHz Phase Detector Update Frequency
Rev. 1.0
11
S i4 13 6
-60
-70
Phase Noise (dBc/Hz)
-80
-90
-100
-110
-120
-130
-140
1.E+02
1.E+03
1.E+04
1.E+05
Offset Frequency (Hz)
Typical RF1 Phase Noise at 2.4 GHz
Figure 7. Typical RF1 Phase Noise at 2.4 GHz
with 1 MHz Phase Detector Update Frequency
Figure 8. Typical RF1 Spurious Response at 2.4 GHz
with 1 MHz Phase Detector Update Frequency
12
Rev. 1.0
1.E+06
Si4136
s
-60
-70
Phase Noise (dBc/Hz)
-80
-90
-100
-110
-120
-130
-140
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
Offset Frequency (Hz)
Typical RF2 Phase Noise at 2.1 GHz
Figure 9. Typical RF2 Phase Noise at 2.1 GHz
with 1 MHz Phase Detector Update Frequency
Figure 10. Typical RF2 Spurious Response at 2.1 GHz
with 1 MHz Phase Detector Update Frequency
Rev. 1.0
13
S i4 13 6
-60
-70
Phase Noise (dBc/Hz)
-80
-90
-100
-110
-120
-130
-140
1.E+02
1.E+03
1.E+04
1.E+05
Offset Frequency (Hz)
Typical IF Phase Noise at 800 MHz
Figure 11. Typical IF Phase Noise at 800 MHz
with 1 MHz Phase Detector Update Frequency
Figure 12. IF Spurious Response at 800 MHz
with 1 MHz Phase Detector Update Frequency
14
Rev. 1.0
1.E+06
Si4136
V DD
S i4136
F ro m
1
S ys te m
SCLK
SENB
30 Ω ∗
24
0.0 22 µ F
C o n tro ller
2
VDDI
S D ATA
3
4
5
G NDR
IF O U T
G NDR
G NDI
NC
IF L B
G NDR
IF L A
6
7
NC
G NDD
G NDR
VDDD
G NDR
G NDD
G NDR
X IN
23
L M A TC H
22
IF O U T
21
P rin ted Trace
In d u c to r o r
C h ip In d u cto r
20
19
18
V DD
8
9
56 0 pF
0.0 22 µ F
17
16
56 0 pF
10
15
E xtern a l C lo ck
56 0 pF
11
RFOUT
RFOUT
0.0 22 µ F
PW DNB
14
PDW NB
V DD
12
VDDR
AUXO UT
13
AUXO UT
*A dd 30 Ω se ries resistor if using IF outp u t divid e valu es 2 , 4, or 8 and f C E N < 600 M H z.
Figure 13. Typical Application Circuit: Si4136-BT
Rev. 1.0
15
S i4 13 6
Functional Description
The Si4136 is a monolithic integrated circuit that
performs IF and dual-band RF synthesis for many
wireless communications applications. This integrated
circuit (IC), along with a minimum number of external
components, is all that is necessary to implement the
frequency synthesis function in applications like W-LAN
using the IEEE 802.11 standard.
The Si4136 has three complete phase-locked loops
(PLLs), with integrated voltage-controlled oscillators
(VCOs). The low phase noise of the VCOs makes the
Si4136 suitable for use in demanding wireless
communications applications. Also integrated are phase
detectors, loop filters, and reference and output
frequency dividers. The IC is programmed through a
three-wire serial interface.
Two PLLs are provided for RF synthesis. These RF
PLLs are multiplexed so that only one PLL is active at a
given time (as determined by the setting of an internal
register). The active PLL is the last one written. The
center frequency of the VCO in each PLL is set by the
internal bond wire inductance within the package.
Inaccuracies in these inductances are compensated for
by the self-tuning algorithm. The algorithm is run
following power-up or following a change in the
programmed output frequency.
The RF PLLs contain a divide-by-2 circuit before the Ndivider. As a result, the phase detector frequency (fφ) is
equal to half the desired channel spacing. For example,
for a 200 kHz channel spacing, fφ would equal 100 kHz.
The IF PLL does not contain the divide-by-2 circuit
before the N-divider. In this case, fφ is equal to the
desired channel spacing. Each RF VCO is optimized for
a particular frequency range. The RF1 VCO is
optimized to operate from 2.3 GHz to 2.5 GHz, while the
RF2 VCO is optimized to operate between 2.025 GHz
and 2.3 GHz.
One PLL is provided for IF synthesis. The center
frequency of this circuit’s VCO is set by an external
inductance. The PLL can adjust the IF output frequency
by ±5% of the VCO center frequency. Inaccuracies in
the value of the external inductance are compensated
for by the Si4136’s proprietary self-tuning algorithm.
This algorithm is initiated each time the PLL is poweredup (by either the PWDNB pin or by software) and/or
each time a new output frequency is programmed. The
IF VCO can have its center frequency set as low as
526 MHz and as high as 952 MHz. An IF output divider
is provided to divide down the IF output frequencies, if
needed. The divider is programmable, capable of
dividing by 1, 2, 4, or 8.
16
In order to accommodate designs running at XIN
frequencies greater than 25 MHz, the Si4136 includes a
programmable divide-by-2 option (XINDIV2 in
Register 0, D6) on the XIN input. By enabling this
option, the Si4136 can accept a range of TCXO
frequencies from 25 MHz to 50 MHz. This feature
makes the Si4136 ideal for W-LAN radio designs
operating at an XIN of 44 MHz.
The unique PLL architecture used in the Si4136
produces settling (lock) times that are comparable in
speed to fractional-N architectures without suffering the
high phase noise or spurious modulation effects often
associated with those designs.
Serial Interface
A timing diagram for the serial interface is shown in
Figure 2 on page 7. Figure 3 on page 7 shows the
format of the serial word.
The Si4136 is programmed serially with 22-bit words
comprised of 18-bit data fields and 4-bit address fields.
When the serial interface is enabled (i.e., when SENB is
low) data and address bits on the SDATA pin are
clocked into an internal shift register on the rising edge
of SCLK. Data in the shift register is then transferred on
the rising edge of SENB into the internal data register
addressed in the address field. The serial interface is
disabled when SENB is high.
Table 11 on page 21 summarizes the data register
functions and addresses. It is not necessary (although it
is permissible) to clock into the internal shift register any
leading bits that are “don’t cares.”
Setting the IF VCO Center Frequencies
The IF PLL can adjust its output frequency ±5% from
the center frequency as established by the value of an
external inductance connected to the VCO. The RF1
and RF2 PLLs have fixed operating ranges due to the
inductance set by the internal bond wires. Each center
frequency is established by the value of the total
inductance (internal and/or external) connected to the
respective VCO. Manufacturing tolerance of ±10% for
the external inductor is acceptable for the IF VCO. The
Si4136 will compensate for inaccuracies by executing a
self-tuning algorithm following PLL power-up or
following a change in the programmed output
frequency.
Because the total tank inductance is in the low nH
range, the inductance of the package needs to be
considered in determining the correct external
inductance. The total inductance (LTOT) presented to
the IF VCO is the sum of the external inductance (LEXT)
Rev. 1.0
Si4136
and the package inductance (LPKG). The IF VCO has a
nominal capacitance (CNOM) in parallel with the total
inductance, and the center frequency is as follows:
1
1
fCEN = --------------------------------------------- = ---------------------------------------------------------------------2π ( L PKG + L EXT ) ⋅ C NOM
2π L TOT ⋅ C NOM
Table 6 summarizes the characteristics of the IF VCO.
Table 6. Si4136-BT VCO Characteristics
VCO
IF
Fcen Range Cnom
(MHz)
(pF)
Min
Max
526
952
6.5
Lpkg
(nH)
2.1
Lext Range
(nH)
Min
Max
2.2
12.0
IFLA
The Si4136’s self-tuning algorithm will compensate for
component value errors at any temperature within the
specified temperature range. However, the ability of the
PLL to compensate for drift in component values that
occur after self-tuning is limited. For external
inductances with temperature coefficients around ±150
ppm/°C, the PLL will be able to maintain lock for
changes in temperature of approximately ±30°C.
2
L EXT
L PKG
The self-tuning algorithm is initiated immediately
following power-up of a PLL or, if the PLL is already
powered, following a change in its programmed output
frequency. This algorithm attempts to tune the VCO so
that its free-running frequency is near the desired output
frequency. In so doing, the algorithm will compensate
for manufacturing tolerance errors in the value of the
external inductance connected to the IF VCO. It will also
reduce the frequency error for which the PLL must
correct to get the precise desired output frequency. The
self-tuning algorithm will leave the VCO oscillating at a
frequency in error by somewhat less than 1% of the
desired output frequency.
After self-tuning, the PLL controls the VCO oscillation
frequency. The PLL will complete frequency locking,
eliminating any remaining frequency error. Thereafter, it
will maintain frequency-lock, compensating for effects
caused by temperature and supply voltage variations.
Si4136
L PKG
Self-Tuning Algorithm
IFLB
2
As a design example, suppose synthesizing
frequencies in a 30 MHz band between 735 MHz and
765 MHz is desired. The center frequency should be
defined as midway between the two extremes, or
750 MHz. The PLL will be able to adjust the VCO output
frequency ±5% of the center frequency, or ±37.5 MHz of
750 MHz (i.e., from approximately 713 MHz to
788 MHz). The IF VCO has a CNOM of 6.5 pF, and a
6.9 nH inductance (correct to two digits) in parallel with
this capacitance will yield the desired center frequency.
An external inductance of 4.8 nH should be connected
between IFLA and IFLB, as shown in Figure 14. This, in
addition to 2.1 nH of package inductance, will present
the correct total inductance to the VCO. In
manufacturing, the external inductance can vary ±10%
of its nominal value and the Si4136 will correct for the
variation with the self-tuning algorithm.
Applications where the PLL is regularly powered-down
or the frequency is periodically reprogrammed minimize
or eliminate the potential effects of temperature drift
because the VCO is re-tuned in either case. In
applications where the ambient temperature can drift
substantially after self-tuning, it may be necessary to
monitor the lock-detect bar (LDETB) signal on the
AUXOUT pin to determine whether a PLL is about to
run out of locking capability. (See “Auxiliary Output
(AUXOUT)” for how to select LDETB.) The LDETB
signal will be low after self-tuning has completed but will
rise when either the IF or RF PLL nears the limit of its
compensation range. (LDETB will also be high when
either PLL is executing the self-tuning algorithm.) The
output frequency will still be locked when LDETB goes
high, but the PLL will eventually lose lock if the
temperature continues to drift in the same direction.
Therefore, if LDETB goes high both the IF and RF PLLs
should promptly be re-tuned by initiating the self-tuning
algorithm.
For more information on designing the external trace
inductor, please refer to Application Note 31.
Output Frequencies
Figure 14. Example of IF External Inductor
The IF and RF output frequencies are set by
programming the R- and N-Divider registers. Each PLL
has its own R and N registers so that each can be
Rev. 1.0
17
S i4 13 6
programmed independently. Programming either the Ror N-Divider register for RF1 or RF2 automatically
selects the associated output.
transient until the point at which stability begins to be
compromised. The optimal gain depends on N. Table 8
lists recommended settings for different values of N.
When XINDIV2 = 0, the reference frequency on the XIN
pin is divided by R and this signal is the input to the
PLL’s phase detector. The other input to the phase
detector is the PLL’s VCO output frequency divided by
2N for the RF PLLs or N for the IF PLL. After an initial
transient
Table 8. Optimal KP Settings
N
RF1
KP1<1:0>
RF2
KP2<1:0>
IF
KPI<1:0>
≤2047
00
00
00
2048 to 4095
00
01
01
4096 to 8191
01
10
10
8192 to 16383
10
11
11
≥16384
11
11
11
fOUT = (2N/R) " fREF (for the RF PLLs)
fOUT = (N/R) " fREF (for the IF PLL).
The integers R are set by programming the RF1 RDivider register (Register 6), the RF2 R-Divider register
(Register 7) and the IF R-Divider register (Register 8).
The integers N are set by programming the RF1 NDivider register (register 3), the RF2 N-Divider register
(Register 4), and the IF N-Divider register (Register 5).
If the optional divide-by-2 circuit on the XIN pin is
enabled (XINDIV2 = 1) then after an initial transient
fOUT = (N/R) " fREF (for the RF PLLs)
fOUT/N = (N/2R) " fREF (for the IF PLL).
Each N-Divider is implemented as a conventional high
speed divider. That is, it consists of a dual-modulus
prescaler, a swallow counter, and a lower speed
synchronous counter. However, the control of these
sub-circuits is handled automatically. Only the
appropriate N value should be programmed.
PLL Loop Dynamics
The transient response for each PLL is determined by
its phase detector update rate fφ (equal to fREF/R) and
the phase detector gain programmed for each RF1,
RF2, or IF synthesizer. (See Register 1.) Four different
settings for the phase detector gain are available for
each PLL. The highest gain is programmed by setting
the two phase detector gain bits to 00, and the lowest by
setting the bits to 11. The values of the available gains,
relative to the highest gain, are listed in Table 7.
Table 7. Gain Values (Register 1)
KP Bits
Relative P.D.
Gain
00
1
01
1/2
10
1/4
11
1/8
The settling time for each PLL is directly proportional to
its phase detector update period Tφ (Tφ equals 1/fφ).
During the first 13 update periods the Si4136 executes
the self-tuning algorithm. Thereafter the PLL controls
the output frequency. Because of the unique
architecture of the Si4136 PLLs, the time required to
settle the output frequency to 0.1 ppm error is only
about 25 update periods. Thus, the total time after
power-up or a change in programmed frequency until
the synthesized frequency is well settled—including
time for self-tuning—is around 40 update periods.
Note: This settling time analysis holds for fφ ≤ 500 kHz. For
fφ > 500 kHz, the settling time can be a maximum of
100 µs as specified in Table 5.
RF and IF Outputs (RFOUT and IFOUT)
The RFOUT and IFOUT pins are driven by amplifiers
that buffer the RF VCOs and IF VCO, respectively. The
RF output amplifier receives its input from either the
RF1 or RF2 VCO, depending upon which R- or NDivider register was last written. For example,
programming the N-Divider register for RF1
automatically selects the RF1 VCO output.
Figure 13 on page 15 shows an application diagram for
the Si4136. The RF output signal must be AC coupled
to its load through a capacitor.
In general, a higher phase detector gain will decrease
in-band phase noise and increase the speed of the PLL
18
The VCO gain and loop filter characteristics are not
programmable.
The IFOUT pin must also be AC coupled to its load
through a capacitor. The IF output level is dependent
upon the load. Figure 17 displays the output level
versus load resistance. For resistive loads greater than
500 Ω the output level saturates and the bias currents in
the IF output amplifier are higher than they need to be.
The LPWR bit in the Main Configuration register
Rev. 1.0
Si4136
(Register 0) can be set to 1 to reduce the bias currents
and therefore reduce the power dissipated by the IF
amplifier. For loads less than 500 Ω, LPWR should be
set to 0 to maximize the output level.
450
400
350
LPWR=1
LPWR=0
300
Output Voltage (mVrms)
For IF frequencies greater than 500 MHz, a matching
network is required in order to drive a 50 Ω load. See
Figure 15 below. The value of LMATCH can be
determined by Table 9.
250
200
150
Typical values range between 8 nH and 40 nH.
100
50
>500 pF
0
IFOUT
0
200
400
600
800
1000
1200
Ω)
Load Resistance (Ω
L MATCH
Figure 17. Typical IF Output Voltage vs.
Load Resistance at 550 MHz
50 Ω
Reference Frequency Amplifier
The Si4136 provides a reference frequency amplifier. If
the driving signal has CMOS levels, it can be connected
directly to the XIN pin. Otherwise, the reference
frequency signal should be AC coupled to the XIN pin
through a 560 pF capacitor.
Figure 15. IF Frequencies > 500 MHz
Table 9. LMATCH Values
Frequency
LMATCH
500–600 MHz
40 nH
600–800 MHz
27 nH
800–1 GHz
18 nH
Power Down Modes
For frequencies less than 500 MHz, the IF output buffer
can directly drive a 200 Ω resistive load or higher. For
resistive loads greater than 500 Ω (f < 500 MHz) the
LPWR bit can be set to reduce the power consumed by
the IF output buffer. See Figure 16 below.
>500 pF
IFOUT
>200 Ω
Table 10 summarizes the power down functionality. The
Si4136 can be powered down by taking the PWDNB pin
low or by setting bits in the Power Down register
(Register 2). When the PWDNB pin is low, the Si4136
will be powered down regardless of the Power Down
register settings. When the PWDNB pin is high, power
management is under control of the Power Down
register bits.
The IF and RF sections of the Si4136 circuitry can be
individually powered down by setting the Power Down
register bits PDIB and PDRB low. The reference
frequency amplifier will also be powered up if either the
PDRB and PDIB bits are high. Also, setting the
AUTOPDB bit to 1 in the Main Configuration register
(Register 0) is equivalent to setting both bits in the
Power Down register to 1.
The serial interface remains available and can be
written in all power-down modes.
Figure 16. IF Frequencies < 500 MHz
Auxiliary Output (AUXOUT)
The signal appearing on AUXOUT is selected by setting
the AUXSEL bits in the Main Configuration register
(Register 0).
The LDETB signal can be selected by setting the
AUXSEL bits to 011. This signal can be used to indicate
that the IF or RF PLL is about to lose lock due to
excessive ambient temperature drift and should be retuned.
Rev. 1.0
19
S i4 13 6
Table 10. Power Down Configuration
PWDNB Pin
AUTOPDB
PDIB
PDRB
IF Circuitry
RF
Circuitry
PWDNB = 0
x
x
x
OFF
OFF
0
0
0
OFF
OFF
0
0
1
OFF
ON
0
1
0
ON
OFF
0
1
1
ON
ON
1
x
x
ON
ON
PWDNB = 1
Note: x = don’t care.
20
Rev. 1.0
Si4136
Control Registers
Table 11. Register Summary
Register Name
Bit Bit Bit Bit
17 16 15 14
Bit
13
Bit
12
AUXSEL
Bit
11
Bit Bit Bit Bit
10 9
8
7
Bit
6
Bit
5
0
Main
Configuration
0
0
0
0
1
Phase
Detector
Gain
0
0
0
0
0
2
Power
Down
0
0
0
0
0
3
RF1 N
Divider
4
RF2 N
Divider
0
5
IF N Divider
0
0
6
RF1 R
Divider
0
0
0
0
0
RRF1
7
RF2 R
Divider
0
0
0
0
0
RRF2
8
IF R Divider
0
0
0
0
0
RIF
9
Reserved
IFDIV
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
XIN LPWR
DIV2
Bit
4
Bit
3
Bit
2
Bit
1
Bit
0
0
AUTO
PDB
0
0
0
KPI
0
KP2
0
0
KP1
0
PDIB
PDRB
NRF1
NRF2
NIF
.
.
.
15
Reserved
Note: Registers 9–15 are reserved. Writes to these registers may result in unpredictable behavior.
Rev. 1.0
21
S i4 13 6
Register 0. Main Configuration Address Field = A[3:0] = 0000
Bit
D17 D16 D15 D14 D13 D12 D11 D10 D9
Name
22
0
0
0
0
AUXSEL
IFDIV
0
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
XIN
DIV2
LPWR
0
AUTO
PDB
0
0
0
Bit
Name
Function
17:14
Reserved
Program to zero.
13:12
AUXSEL
Auxiliary Output Pin Definition.
00 = Reserved.
01 = Force output low.
11 = Lock Detect (LDETB).
11:10
IFDIV
IF Output Divider
00 = IFOUT = IFVCO Frequency
01 = IFOUT= IFVCO Frequency/2
10 = IFOUT = IFVCO Frequency/4
11 = IFOUT = IFVCO Frequency/8
9:7
Reserved
Program to zero.
6
XINDIV2
XIN Divide-By-2 Mode.
0 = XIN not divided by 2.
1 = XIN divided by 2.
5
LPWR
4
Reserved
Program to zero.
3
AUTOPDB
Auto Power Down
0 = Software powerdown is controlled by Register 2.
1 = Equivalent to setting all bits in Register 2 = 1.
2:0
Reserved
Program to zero.
Output Power-Level Settings for IF Synthesizer Circuit.
0 = RLOAD < 500 Ω—normal power mode.
1 = RLOAD ≥ 500 Ω—low power mode.
Rev. 1.0
Si4136
Register 1. Phase Detector Gain Address Field (A[3:0]) = 0001
Bit
Name
D17 D16 D15 D14 D13 D12 D11 D10
0
0
0
0
0
0
0
D9
D8
D7
D6
0
0
0
0
0
Bit
Name
17:6
Reserved
5:4
KPI
IF Phase Detector Gain Constant.
N Value
KPI
<2048
= 00
2048–4095
= 01
4096–8191
= 10
>8191
= 11
3:2
KP2
RF2 Phase Detector Gain Constant.
N Value
KP2
<2048
= 00
2048–4095
= 01
4096–8191
= 10
>8191
= 11
1:0
KP1
RF1 Phase Detector Gain Constant.
N Value
KP1
<4096
= 00
4096–8191
= 01
8192–16383
= 10
>16383
= 11
D5
D4
KPI
D3
D2
KP2
D1
D0
KP1
Function
Program to zero.
Rev. 1.0
23
S i4 13 6
Register 2. Power Down Address Field (A[3:0]) = 0010
Bit
D17 D16 D15 D14 D13 D12 D11 D10 D9
Name
0
0
0
0
0
0
0
0
D8
D7
D6
D5
D4
D3
D2
0
0
0
0
0
0
0
0
Bit
Name
17:2
Reserved
1
PDIB
Power Down IF Synthesizer.
0 = IF synthesizer powered down.
1 = IF synthesizer on.
0
PDRB
Power Down RF Synthesizer.
0 = RF synthesizer powered down.
1 = RF synthesizer on.
D1
D0
PDIB PDRB
Function
Program to zero.
Register 3. RF1 N Divider Address Field (A[3:0]) = 0011
Bit
D17 D16 D15 D14 D13 D12 D11 D10
D9
Name
D8
D7
D6
D5
D4
D3
D2
D1
D0
D5
D4
D3
D2
D1
D0
NRF1
Bit
Name
17:0
NRF1
Function
N Divider for RF1 Synthesizer.
NRF1 ≥ 992.
Register 4. RF2 N Divider Address Field = A[3:0] = 0100
Bit
Name
24
D17 D16 D15 D14 D13 D12 D11 D10
D9
0
D8
D7
D6
NRF2
Bit
Name
17
Reserved
16:0
NRF2
Function
Program to zero.
N Divider for RF2 Synthesizer.
NRF2 ≥ 240.
Rev. 1.0
Si4136
Register 5. IF N Divider Address Field (A[3:0]) = 0101
Bit
D17 D16 D15 D14 D13 D12 D11 D10
Name
0
D9
D8
0
D7
D6
D5
D4
D3
D2
D1
D0
D4
D3
D2
D1
D0
D4
D3
D2
D1
D0
NIF
Bit
Name
17:16
Reserved
15:0
NIF
Function
Program to zero.
N Divider for IF Synthesizer.
NIF ≥ 56.
Register 6. RF1 R Divider Address Field (A[3:0]) = 0110
Bit
Name
D17 D16 D15 D14 D13 D12 D11 D10
0
0
0
0
D9
D8
0
Reserved
12:0
RRF1
D6
D5
RRF1
Name
17:13
D7
Function
Program to zero.
R Divider for RF1 Synthesizer.
RRF1 can be any value from 7 to 8189 if KP1 = 00
8 to 8189 if KP1 = 01
10 to 8189 if KP1 = 10
14 to 8189 if KP1 = 11
Register 7. RF2 R Divider Address Field (A[3:0]) = 0111
Bit
Name
D17 D16 D15 D14 D13 D12 D11 D10
0
0
0
Bit
Name
17:13
Reserved
12:0
RRF2
0
D9
0
D8
D7
D6
D5
RRF2
Function
Program to zero.
R Divider for RF2 Synthesizer.
RRF2 can be any value from 7 to 8189 if KP2 = 00
8 to 8189 if KP2 = 01
10 to 8189 if KP2 = 10
14 to 8189 if KP2 = 11
Rev. 1.0
25
S i4 13 6
Register 8. IF R Divider Address Field (A[3:0]) = 1000
Bit
Name
26
D17 D16 D15 D14 D13 D12 D11 D10
0
0
0
Bit
Name
17:13
Reserved
12:0
RIF
0
D9
0
D8
D7
D6
D5
RIF
Function
Program to zero.
R Divider for IF Synthesizer.
RIF can be any value from 7 to 8189 if KP1 = 00
8 to 8189 if KP1 = 01
10 to 8189 if KP1 = 10
14 to 8189 if KP1 = 11
Rev. 1.0
D4
D3
D2
D1
D0
Si4136
Pin Descriptions: Si4136
SCLK
1
24
SENB
SDATA
2
23
VDDI
GNDR
3
22
IFOUT
GNDR
4
21
GNDI
NC
5
20
IFLB
GNDR
6
19
IFLA
NC
7
18
GNDD
GNDR
8
17
VDDD
GNDR
9
16
GNDD
GNDR
10
15
XIN
RFOUT
11
14
PWDNB
VDDR
12
13
AUXOUT
Pin Number(s) Name
Description
1
SCLK
Serial clock input
2
SDATA
Serial data input
3, 4, 6, 8–10
GNDR
Common ground for RF analog circuitry
5, 7
NC
No connect
11
RFOUT
Radio frequency (RF) output of the selected RF VCO
12
VDDR
Supply voltage for the RF analog circuitry
13
AUXOUT
Auxiliary output
14
PWDNB
Power down input pin
15
XIN
Reference frequency amplifier input
16, 18
GNDD
Common ground for digital circuitry
17
VDDD
Supply voltage for digital circuitry
19, 20
IFLA, IFLB
Pins for inductor connection to IF VCO
21
GNDI
Common ground for IF analog circuitry
22
IFOUT
Intermediate frequency (IF) output of the IF VCO
23
VDDI
Supply voltage for IF analog circuitry
24
SENB
Enable serial port input
Rev. 1.0
27
S i4 13 6
Ordering Guide
28
Ordering Part
Number
Description
Temperature
Si4136-BT
2.5 GHz/2.3 GHz/IF OUT
–40 to 85oC
Rev. 1.0
Si4136
Package Outline
Figure 18 illustrates the package details for the Si4136. Table 12 lists the values for the dimensions shown in the
illustration.
E1
θ2
E
S
R1
R
θ1
L
e
L1
θ3
D
A2
c
A
b
A1
Figure 18. 24-pin Thin Small Shrink Outline Package (TSSOP)
Table 12. Package Diagram Dimensions
Symbol
A
A1
A2
b
c
D
e
E
E1
L
L1
R
R1
S
θ1
θ2
θ3
Min
—
0.05
0.80
0.19
0.09
4.85
4.30
0.45
0.09
0.09
0.20
0
Millimeters
Nom
1.10
—
1.00
—
—
5.00
0.65 BSC
6.40 BSC
4.40
0.60
1.00 REF
—
—
—
—
12 REF
12 REF
Rev. 1.0
Max
1.20
0.15
1.05
0.30
0.20
5.15
4.50
0.75
—
—
—
8
29
S i4 13 6
Contact Information
Silicon Laboratories Inc.
4635 Boston Lane
Austin, TX 78735
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Email: [email protected]
Internet: www.silabs.com
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
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the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to
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30
Rev. 1.0