T2SBA Series (SIP) 1.5-AMPERE SILICON BRIDGE RECTIFIER Mechanical Data FEATURES • • • • • • Low Reverse Leakage Current Surge Overload Rating to 60A Peak Ideal for Printed Circuit Board Applications Epoxy Material – UL Recognition Flammability Classification 94V-0 • Case: Molded Epoxy Resin Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 Polarity: Molded on Body 2542 Highlander Way ! Carrollton, TX 75006 UNIT: mm Peak Repetitive Reverse Voltage Average Rectified Output Current @ Ta = 25ºC T2SBA40 T2SBA60 T2SBA80 UNIT VRRM 400 600 800 V VR(RMS) 280 420 560 V Io 1.5 A Non-Repetitive Peak Forward Surge Current 10 mS single half sine-wave superimposed on rated load IFSM 60 A Maximum Forward Voltage per Element, IF = 0.75 A VF 1.05 V Peak Reverse Current per element at VR = VRRM IR 10 µA TJ ,Tstg -40 to +150 °C Operating and Storage Temperature Range Manufactured by Tianjin Zhong – Huan Semiconductor Co., Ltd. Rev 0, Sep 2002 www.collmer.com RMS Reverse Voltage SYMBOL 972-248-2888 Maximum Ratings & Characteristics Single Phase, 60 Hz, Resistive or Inductive Load Ta = 25ºC Unless Otherwise Specified CHARACTERISTIC T2SBA Series (SIP) P - Io Curve Forward Voltage 3.5 3 8 7 6 5 4 3 2 1 0 TJ=150C 2.5 TJ=25C P (W) IF (A) 10 9 2 1.5 1 0.5 0 0.4 0.6 0.8 VF (V) 1 0 0.2 0.4 0.6 0.8 1.2 1 1.2 1.4 1.6 1.8 Io (A) 2 Current Derating Surge Forward Current 1.6 1.4 50 1.2 1 0.8 0.6 40 Io (A) IFSM (A) Tc at PCB Pad (3 mm) 60 30 0.4 0.2 0 20 10 1 10 Cycles 100 0 25 50 75 100 Tc (C) 125 150 175 In order to avoid damaging devices, please observe the following precautions: 1. When using automated soldering equipment, use 60/40 (Sn/Pb) solder (melting point of 180ºC) with a neutral flux similar to rosin. Preheat time should be limited to 1 – 2 minutes at 150ºC. 2. When using a soldering iron, use a tip temperature of less than 300ºC (or a soldering iron power of less than 60W). Keep the soldering time below 5 seconds. 3. After soldering, remove any flux residue to avoid corrosion. 4. Because over-voltage or over-current testing may cause permanent damage to the devices, be sure to check the test equipment for proper voltage, current and ground connection prior to beginning the test. 5. If the devices are to be encapsulated, they should be cleaned and dried at 120º ± 5ºC for at least 24 hours prior to encapsulation. Test for compatibility between the device package and the encapsulation material.