T10XB Series (SIP) 10-AMPERE SILICON BRIDGE RECTIFIER Mechanical Data FEATURES • • • • • • Low Reverse Leakage Current Surge Overload Rating to 120A Peak Ideal for Printed Circuit Board Applications Epoxy Material – UL Recognition Flammability Classification 94V-0 • Case: Molded Epoxy Resin Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 Polarity: Molded on Body 2542 Highlander Way ! Carrollton, TX 75006 UNIT: mm Maximum Ratings & Characteristics SYMBOL T10XB40 T10XB60 T10XB80 UNIT VRRM 400 600 800 V VR(RMS) 280 420 560 V Peak Repetitive Reverse Voltage RMS Reverse Voltage Io 10.0 A Average Rectified Output Current @ Ta = 25ºC w/o cooling fin Io 2.7 A Non-Repetitive Peak Forward Surge Current 10 mS single half sine-wave superimposed on rated load IFSM 120 A Maximum Forward Voltage per Element, IF = 5.0 A VF 1.05 V Peak Reverse Current per element at VR = VRRM IR 10 µA TJ ,Tstg -40 to +150 °C Operating and Storage Temperature Range Reference Table for Heat-Sink Size Average Rectified Output Current in Amps 2 Cooling Fin Single-face Area S1 (cm ) 2 Cooling Fin Single-face Area S2 (cm ) 3.0 4 8 5.0 75 65 7.5 180 100 9 500 310 11 900 490 Note: Vertical Mounting at Ta = 40ºC. HS Material: S1 = 1.5mm-Thick Aluminum, S2 = 3.0mm-Thick Copper Manufactured by Tianjin Zhong – Huan Semiconductor Co., Ltd. Rev 0, Sep 2002 www.collmer.com Average Rectified Output Current @ TC = 108ºC w/ cooling fin 972-248-2888 Single Phase, 60 Hz, Resistive or Inductive Load Ta = 25ºC Unless Otherwise Specified CHARACTERISTIC T10XB Series (SIP) P - Io Curve Forward Voltage 12 14 10 12 P (W) IF (A) 10 TJ=150C TJ=25C 8 6 8 6 4 4 2 2 0 0 0.4 0.5 0.6 0.7 0.8 VF (V) 0.9 1 0 1.1 1 3 Io (A) 4 5 6 Current Derating Surge Forward Current 130 120 10 110 Without HS: Tc at PCB Pad (5 mm) With HS: Tc Next to HS Mounting 8 100 90 80 70 W/O HS W/ HS Io (A) IFSM (A) 2 6 4 2 60 50 0 1 10 Cycles 100 0 25 50 75 100 Tc (C) 125 150 175 In order to avoid damaging devices, please observe the following precautions: 1. When using automated soldering equipment, use 60/40 (Sn/Pb) solder (melting point of 180ºC) with a neutral flux similar to rosin. Preheat time should be limited to 1 – 2 minutes at 150ºC. 2. When using a soldering iron, use a tip temperature of less than 300ºC (or a soldering iron power of less than 60W). Keep the soldering time below 5 seconds. 3. After soldering, remove any flux residue to avoid corrosion. 4. Because over-voltage or over-current testing may cause permanent damage to the devices, be sure to check the test equipment for proper voltage, current and ground connection prior to beginning the test. 5. If the devices are to be encapsulated, they should be cleaned and dried at 120º ± 5ºC for at least 24 hours prior to encapsulation. Test for compatibility between the device package and the encapsulation material.