TI TS5N214DBQR

TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
FEATURES
•
•
•
•
•
•
•
•
DBQ OR PW PACKAGE
(TOP VIEW)
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 3 Ω Typ)
0- to 10-V Switching on Data I/O Ports
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 20 pF Max, B Port)
VCC Operating Range From 4.75 V to 5.25 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
1OE
S1
1B4
1B3
1B2
1B1
1A
GND
1
16
2
15
3
14
4
13
5
12
6
7
11
10
8
9
VCC
2OE
S0
2B4
2B3
2B2
2B1
2A
XXXXXX
DESCRIPTION/ORDERING INFORMATION
The TS5N214 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass
transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for
minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also
features low data I/O capacitance to minimize capacitive loading and signal distorion on the data bus. Specifically
designed to support high-bandwidth applications, the TS5N214 provides an optimized interface solution ideally
suited for broadband communications, networking, and data-intensive computing systems.
The TS5N214 is a 2-bit 1-of-4 multiplexer/demultiplexer with separate output-enable (1OE, 2OE) inputs. The
select (S0, S1) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the
multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow
between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists
between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SSOP (QSOP) – DBQ
Tape and reel
TS5N214DBQR
YB214
TSSOP – PW
Tape and reel
TS5N214PWR
YB214
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
FUNCTION TABLE
(EACH MULTIPLEXER/DEMULTIPLEXER)
INPUTS
OE
S1
S0
INPUT/OUTPUT
A
FUNCTION
L
L
L
B1
A port = B1 port
L
L
H
B2
A port = B2 port
L
H
L
B3
A port = B3 port
L
H
H
B4
A port = B4 port
H
X
X
Z
Disconnect
LOGIC DIAGRAM (POSITIVE LOGIC)
7
1A
6
SW
5
SW
1B1
1B2
4
SW
1B3
3
1B4
SW
9
2A
10
2B1
SW
11
SW
2B2
12
2B3
SW
13
SW
14
S0
2
S1
1
1OE
2OE
2
15
2B4
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
VCC
Charge
Pump
EN(1)
(1)
EN is the internal enable signal applied to the switch.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
7
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage range (2) (3) (4)
–0.5
11
V
II/O
ON-state switch
current (5)
Continuous current through VCC or GND
θJA
Package thermal impedance (6)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
±100
mA
±100
mA
DBQ package
90
PW package
108
–65
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
MIN
MAX
UNIT
VCC
Supply voltage
4.75
5.25
V
VIH
High-level control input voltage
2
5.25
V
VIL
Low-level control input voltage
0
0.8
V
VI/O
Data input/output voltage
0
10
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
IIN
Control inputs
MIN
TYP (2)
MAX
µA
VIN = 0 to VCC
VCC = 5.25 V,
VO = 0 to 10 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
10
VCC = 0 V,
VO = Open,
VI = 0 to 10 V
10
VCC = 5.25 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
10
mA
VCC = 5 V,
VIN = 10 V or 0
10
pF
A port
VCC = 5 V,
Switch OFF,
VIN = VCC or GND,
VI/O = 10 V or 0
60
B port
VCC = 5 V,
Switch OFF,
VIN = VCC or GND,
VI/O = 10 V or 0
20
Cio(ON)
VCC = 5 V,
Switch ON,
VIN = VCC or GND,
VI/O = 10 V or 0
100
VCC = 4.75 V,
TYP at VCC = 5 V
VI = 0 V,
IO = 50 mA
ron (4)
VI = 8 V,
IO = –50 mA
7.5
VI = 10 V,
IO = –50 mA
12.5
IOZ (3)
ICC
Cin
Control inputs
Cio(OFF)
(1)
(2)
(3)
(4)
10
UNIT
VCC = 5.25 V,
µA
pF
3
pF
7.5
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the I/O leakage current.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
FROM
(INPUT)
TO
(OUTPUT)
tpd (1)
A or B
B or A
tpd(s)
S
S
OE
PARAMETER
ten
tdis
(1)
VCC = 5 V
± 0.25 V
MIN
UNIT
MAX
3
ns
A
200
ns
B
200
A or B
200
S
B
200
OE
A or B
200
ns
ns
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Dynamic Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 5% (unless otherwise noted)
PARAMETER
MIN TYP (1) MAX
TEST CONDITIONS
UNIT
RL = 50 Ω,
VI = 0.632 V (P-P),
See Figure 4
OFF isolation (OISO) RL = 50 Ω,
VI = 0.632 V (P-P),
f = 25 MHz,
See Figure 5
–50
dB
RL = 50 Ω,
VI = 0.632 V (P-P),
f = 25 MHz,
See Figure 6 and Figure 7
–50
dB
Bandwidth
(BW) (2)
Crosstalk (XTALK)
(1)
(2)
4
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C
Bandwidth is the frequency where the gain is –3 dB below the DC gain.
25
MHz
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
TYPICAL PERFORMANCE
ron − ON-State Resistance − Ω
6
5
TA = 25°C
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
10
VI − V
Figure 1. Typical ron vs VI, VCC - 5 V, and IO = –50 mA
0
0
−1
Phase
−20
Gain − dB
−3
−4
−30
−5
−40
−6
−50
Phase Margin − Deg
−10
Gain
−2
−7
−60
−8
−9
0.1
−70
1
10
100
500
f − Frequency − MHz
Figure 2. Frequency Response vs Bandwidth
5
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
180
160
140
120
100
80
60
40
20
0
−20
−40
−60
−80
−100
−120
−140
−160
−180
0
−20
Phase
Gain − dB
−40
−60
Gain
−80
−100
−120
0.1
1
10
100
Phase Margin − Deg
TYPICAL PERFORMANCE (continued)
500
f − Frequency − MHz
0
−20
Phase
Gain − dB
−40
−60
Gain
−80
−100
−120
0.1
1
10
100
f − Frequency − MHz
Figure 4. Frequency Response vs Crosstalk
6
180
160
140
120
100
80
60
40
20
0
−20
−40
−60
−80
−100
−120
−140
−160
−180
500
Phase Margin − Deg
Figure 3. Frequency Response vs OFF Isolation
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
2 VCC
Input Generator
VI
50 Ω
50 Ω
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)†
5 V ± 0.25 V
Open
100 Ω
VCC
35 pF
tPLZ/tPZL
5 V ± 0.25 V
2 VCC
100 Ω
GND
35 pF
0.3 V
tPHZ/tPZH
5 V ± 0.25 V
GND
100 Ω
VCC
35 pF
0.3 V
V∆
tpds is measured with Demux inputs at opposite voltage levels, i.e. VB1 = 5 V, VB2 = GND.
VCC
Output
Control
(VIN)
VCC/2
VCC
VCC/2
VCC/2
0V
tPLH
VOH
Output
VCC/2
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
VOH
VCC/2
VOL + V∆
VOL
tPZH
tPHL
VCC/2
0V
tPZL
Output
Control
(VIN)
Open
GND
VG2
†
S1
RL
VO
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VOH
VCC/2
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 25 ns, tf < 25 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 5. Test Circuit and Voltage Waveforms
7
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Network Analyzer
50 B1
Channel ON: B1 to A
A
Source
Signal
Network Analyzer Setup
B2−B4
Source Power = 0 dBM
(632-mV P-P at 50- load)
GND
DC Bias = 350 mV
50 Figure 6. Bandwidth (BW)
VCC
Network Analyzer
50 B1
Channel OFF: B2−B4 to A
A
Source
Signal
50 Network Analyzer Setup
B2−B4
Source Power = 0 dBM
(632-mV P-P at 50- load)
GND
50 DC Bias = 350 mV
Figure 7. OFF Isolation (OISO)
VCC
Network Analyzer
50 B1
Channel ON: B1 to A
A
Source
Signal
Channel OFF: B2−B4 to A
B2−B4
Network Analyzer Setup
50 50 GND
Source Power = 0 dBM
(632-mV P-P at 50- load)
DC Bias = 350 mV
Figure 8. Crosstalk (XTALK)
8
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
PARAMETER MEASUREMENT INFORMATION (continued)
V+
Network Analyzer
50 Channel ON: 1B1 to 1A,
2B1 to 2A
1B1
1A
Source
Signal
Network Analyzer Setup
2B1
50 2A
50 Source Power = 0 dBM
(632 mV P-P at 50 load)
DC Bias = 350 mV
GND
Figure 9. Adjacent Channel Crosstalk (XTALK)
9
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
MECHANICAL DATA
DBQ (R–PDSO–G**)
PLASTIC SMALL-OUTLINE PACKAGE
0.012 (0,30)
0.008 (0,20)
0.025 (0,64)
24
0.005 (0,13)
13
0.157 (3,99)
0.150 (3,81)
0.244 (6,20)
0.228 (5,80)
0.008 (0,20) NOM
Gauge Plane
1
12
A
0.010 (0,25)
0°−8°
0.035 (0,89)
0.016 (0,40)
0.069 (1,75) MAX
Seating Plane
0.010 (0,25)
0.004 (0,10)
0.004 (0,10)
PINS **
16
20
24
28
A MAX
0.197
(5,00)
0.344
(8,74)
0.344
(8,74)
0.394
(10,01)
A MIN
0.189
(4,80)
0.337
(8,56)
0.337
(8,56)
0.386
(9,80)
M0−137
VARIATION
AB
AD
AE
AF
DIM
D
4073301/F 02/2002
10
A.
All linear dimensions are in inches (millimeters).
B.
This drawing is subject ot change without notice.
C.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D.
Falls within JEDEC MO-137.
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206 – AUGUST 2005
MECHANICAL DATA (continued)
PW (R–PDSO–G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°− 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
0,10
PINS **
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
A.
All linear dimensions are in millimeters.
B.
This drawing is subject to change without notice.
C.
Body dimensions do not include mold flash or protrusion not to exceed 0, 15.
D.
Falls within JEDEC MO-153
11
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS5N214DBQR
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TS5N214DBQRE4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TS5N214DBQRG4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TS5N214PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5N214PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5N214PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5N214PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5N214PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS5N214PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS5N214PWR
Package Package Pins
Type Drawing
TSSOP
PW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS5N214PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated