ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER Description Features The ICS309 is a versatile serially-programmable, triple PLL with spread spectrum clock source. The ICS309 can generate any frequency from 250kHz to 200 MHz, and up to 6 different output frequencies simultaneously. The outputs can be reprogrammed on-the-fly, and will lock to a new frequency in 10 ms or less. • Packaged in 20-pin SSOP (QSOP) • Highly accurate frequency generation • M/N Multiplier PLL: M = 1..2048, N = 1..1024 • Serially programmable: user determines the output To reduce system EMI emissions, spread spectrum is available that supports modulation frequencies of 31 kHz and 120 kHz, as well as modulation amplitudes of +/-0.25% to +/-2.0%. Both center and down-spread options are available. • Spread Spectrum frequency modulation for reduced The device includes a PDTS pin which tri-states the output clocks and powers down the entire chip. The ICS309 default for non-programmed start-up are buffered reference clock outputs on all clock output pins. ICS’ VersaClockTM programming software allows the user to configure up to 9 outputs with target frequencies, spread spectrum capabilities or buffered reference clock outputs. The VersaClockTM software automatically configures the PLLs for optimal overall performance. frequency via a 3-wire interface system EMI • Center or Down Spread up to 4% total • Selectable 32 kHz and 120 kHz modulation • • • • • • • • Eliminates need for custom quartz oscillators Input crystal frequency of 5 - 27 MHz Input clock frequency of 3 - 50 MHz Output clock frequencies up to 200 MHz Operating voltage of 3.3 V Up to 9 reference clock outputs Power down tri-state mode Very low jitter Block Diagram V DD 3 CLK1 P LL1 w ith S pread S pectrum STROBE SCLK CLK3 Divide Logic and Output Enable Control DATA P LL2 C rystal or clock input CLK2 CLK4 CLK5 CLK6 CLK7 P LL3 CLK8 X 1/IC LK C rystal O scillator CLK9 X2 E xternal capacitors are required w ith a crystal input. GND 2 P D TS 1 MDS 309 G I n t e gra te d C i r c u i t S y s t e m s ● 5 25 Race Stre et, San Jo se, CA 9 5126 Revision 122704 ● te l (40 8) 2 97-12 01 ● w w w. i c st . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER Pin Assignment D AT A 1 20 ST R O BE X2 2 19 SC LK X1/IC LK 3 18 PD T S C LK9 4 17 VD D VDD 5 16 VD D GND 6 15 GND C LK1 7 14 C LK5 C LK2 8 13 C LK6 C LK3 9 12 C LK7 C LK4 10 11 C LK8 20 pin (150 m il) SSOP (QSOP) Pin Descriptions Pin Number Pin Name Pin Type 1 DATA Input 2 X2 XO Crystal Output. Connect this pin to a crystal. Float for clock input. 3 X1/ICLK XI Connect this pin to a crystal or external clock input. 4 CLK9 Output Output clock 9. Default of Reference frequency output when unprogrammed. 5 VDD Power Connect to +3.3V. 6 GND Power Connect to Ground. 7 CLK1 Output Output clock 1. Default of Reference frequency output when unprogrammed. 8 CLK2 Output Output clock 2. Default of Reference frequency output when unprogrammed. 9 CLK3 Output Output clock 3. Default of Reference frequency output when unprogrammed. 10 CLK4 Output Output clock 4. Default of Reference frequency output when unprogrammed. 11 CLK8 Output Output clock 8. Default of Reference frequency output when unprogrammed. 12 CLK7 Output Output clock 7. Default of Reference frequency output when unprogrammed. 13 CLK6 Output Output clock 6. Default of Reference frequency output when unprogrammed. 14 CLK5 Output Output clock 5. Default of Reference frequency output when unprogrammed. 15 GND Power Connect to Ground. 16 VDD Power Connect to +3.3 V. 17 VDD Power Connect to +3.3 V. 18 PDTS Input Powers down entire chip, tri-states all outputs when low. Internal pull-up. 19 SCLK Input Serial Shift register clock. See timing diagram. 20 STROBE Input Strobe to load data. See timing diagram. Use external 250 kOhm pull-up. Serial data input. 2 MDS 309 G In te grated Circuit Systems Pin Description ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER Configuring the ICS309 Initial State: The ICS309 may be configured to have up to 9 frequency outputs, utilizing the 4 on-board PLLs and spread spectrum circuitry. Unprogrammed, the part has the following outputs, related to the reference input clock: Default Outputs Output Frequency Clocks 1 - 9 (Pins 4, 7-14) Reference Output The STROBE pin must have an external 250 kOhm pull-up resistor to acheive the Initial State. The input crystal range for the ICS309 is 5 MHz to 27 MHz. The ICS309 can be programmed to set the output functions and frequencies. 160 data bits generated by the VersaClockTM software are written in DATA pin in this order: MSB (left most bit) first. As show in Figure 2, after these 160 bits are clocked into the ICS309, taking STROBE high will send this data to the internal latch and the CLK output will lock within 10 ms. Note: STROBE utilizes a transparent latch that is latched when in the high state. If STROBE is in the high state and SCLK is pulsed, DATA is clocked directly to the internal latch and the output conditions will change accordingly. Although this will not damage the ICS309, it is recommended that STROBE be kept low while DATA is being clocked into the ICS309 in order to avoid unintended changes on the output clocks. All outputs may be turned off during initialization by bringing the PDTS pin to Ground. When PDTS is brought high, after the Strobe pin in brought high, the programmed output frequencies will be available. AC Parameters for Writing to the ICS309 Parameter Condition Min. tSETUP Setup time 10 ns tHOLD Hold time after SCLK 10 ns tW Data wait time 10 ns tS Strobe pulse width 40 ns SCLK Frequency DATA Bit160 t setup Bit159 Bit158 Bit3 Bit2 Max. Units 30 MHz Bit1 t hold SCLK tw ts STROBE Figure 2. Tim ing Diagram for Program m ing the ICS309 3 MDS 309 G In te grated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER External Components Series Termination Resistor Clock output traces over one inch should use series termination. To series terminate a 50Ω trace (a commonly used trace impedance), place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. STROBE Pull-up Resistor In order for the device to start up in the default state, a 250 kOhm pull-up resistor is required. Decoupling Capacitors trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead they should be separated and away from other traces. 3) To minimize EMI, the 33Ω series termination resistor (if needed) should be placed close to each clock output. 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers. As with any high-performance mixed-signal IC, the ICS309 must be isolated from system power supply noise to perform optimally. ICS309 Configuration Capabilities Decoupling capacitors of 0.01µF must be connected between each VDD and the PCB ground plane. The architecture of the ICS309 allows the user to easily configure the device to a wide range of output frequencies, for a given input reference frequency. Crystal Load Capacitors The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) been the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be 20 pF [(16-6) x 2] = 20. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) Each 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB The ICS309 also provides separate output divide values, from 2 through 20, to allow the two output clock banks to support widely differing frequency values from the same PLL. Each output frequency can be represented as: Output Freq. = (Ref. Freq)*(M/N)/Output Divide ICS VersaClock Software ICS applies years of PLL optimization experience into a user friendly software that accepts the user’s target reference clock and output frequencies and generates the lowest jitter, lowest power configuration, with only a press of a button. The user does not need to have prior PLL experience or determine the optimal VCO frequency to support multiple output frequencies. VersaClock software quickly evaluates accessible VCO frequencies with available output divide values and provides an easy to understand, bar code rating for the target output frequencies. The user may evaluate output accuracy, performance trade-off scenarios in seconds. 4 MDS 309 G In te grated Circuit Systems The frequency multiplier PLL provides a high degree of precision. The M/N values (the multiplier/divide values available to generate the target VCO frequency) can be set within the range of M = 1 to 2048 and N = 1 to 1024. ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER Spread Spectrum Modulation The ICS309 utilizes frequency modulation (FM) to distribute energy over a range of frequencies. By modulating the output clock frequencies, the device effectively lowers energy across a broader range of frequencies; thus, lowering a system’s electro-magnetic interference (EMI). The modulation rate is the time from transitioning from a minimum frequency to a maximum frequency and then back to the minimum. Spread Spectrum Modulation can be applied as either “center spread” or “down spread”. During center spread modulation, the deviation from the target frequency is equal in the positive and negative directions. The effective average frequency is equal to the target frequency. In applications where the clock is driving a component with a maximum frequency rating, down spread should be applied. In this case, the maximum frequency, including modulation, is the target frequency. The effective average frequency is less than the target frequency. The ICS309 operates in both center spread and down spread modes. For center spread, the frequency can be modulated between ±0.125% to ±2.0%. For down spread, the frequency can be modulated between -0.25% to -4.0%. Both output frequency banks will utilize identical spread spectrum percentage deviations and modulation rates, if a common VCO frequency can be identified. Spread Spectrum Modulation Rate The spread spectrum modulation frequency applied to the output clock frequency may occur at a variety of rates. For applications requiring the driving of “down-circuit” PLLs, Zero Delay Buffers, or those adhering to PCI standards, the spread spectrum modulation rate should be set to 30-33 kHz. For other applications, a 120 kHz modulation option is available. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS309. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Parameter Condition Min. Supply Voltage, VDD Referenced to GND Inputs Referenced to GND Clock Outputs Referenced to GND Storage Temperature Soldering Temperature Typ. Max. Units 7 V -0.5 VDD+ 0.5 V -0.5 VDD+ 0.5 V -65 150 °C 260 °C Max 10 seconds Recommended Operation Conditions Parameter Min. Max. Units 0 +70 °C Ambient Operating Temperature (ICS309RI) -40 +85 °C Power Supply Voltage (measured in respect to GND) +3.0 +3.6 V 4 ms Ambient Operating Temperature Typ. Power Supply Ramp Time 5 MDS 309 G In te grated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER DC Electrical Characteristics VDD=3.3 V ±10%, Ambient temperature -40 to +85°C, unless stated otherwise Parameter Symbol Operating Voltage VDD Operating Supply Current Input High Voltage IDD Conditions Typ. 3.00 Max. Units 3.60 V mA Configuration Dependent - See VersaClockTM Estimates Ex. 25 MHz crystal, VDD=3.3V, No load, 9 - 33.3333 MHz outs, PDTS = 1 25 mA PDTS = 0 X1/ICLK only X1/ICLK only 20 µA V V V Input High Voltage Input Low Voltage Input High Voltage VIH VIL VIH Input Low Voltage VIL PDTS, SCLK, DATA, STROBE Output High Voltage VOH IOH = -8 mA Output Low Voltage VOL IOL = 8 mA Output High Voltage, CMOS level VOH IOH = -4 mA Short Circuit Current Min. (VDD/2)+1 (VDD/2)-1 VDD-0.5 0.8 2.4 V V 0.4 VDD-0.4 V V CLK outputs +70 mA 4 pF Input Capacitance CIN PDTS pin Internal pull-down resistor RPD CLK outputs 525 kΩ Internal Pull-up Resistor RPU PDTS pin 250 kΩ AC Electrical Characteristics VDD = 3.3 V ±10%, Ambient Temperature -40 to +85° C, unless stated otherwise Parameter Input Frequency Symbol FIN Conditions Min. Fundamental crystal Input Clock VDD=3.3 V Output Frequency Typ. Max. Units 5 27 MHz 2 0.25 50 200 MHz MHz Output Clock Rise Time tOR 20% to 80%, Note 1 0.8 ns Output Clock Fall Time tOF 80% to 20%, Note 1 0.8 ns Output Clock Duty Cycle 40 49-51 6 MDS 309 G In te grated Circuit Systems Note 2 ● 525 Ra ce Street, San Jose, CA 9512 6 60 % Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER Parameter Symbol Power-up time Conditions Min. Typ. Max. Units PDTS goes high until stable CLK output 4 10 ms PDTS goes high until stable CLK out, Spread Spectrum off .2 2 ms PDTS goes high until stable CLK out, Spread Spectrum On 4 7 ms Maximum Output Jitter, short term tj Reference Clock ±300 ps Maximum Output Jitter, short term tj All other clocks, CL=15 pF Configuration ±200 ps Pin-to-Pin Skew Low Skew Outputs -250 250 ps Note 1: Measured with 15 pF load. Note 2: Duty Cycle is configuration dependent. Most configurations are min 45% / max 55% Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Conditions Min. Typ. Max. Units θJA Still air 135 °C/W θJA 1 m/s air flow 93 °C/W θJA 3 m/s air flow 78 °C/W 60 °C/W θJC 7 MDS 309 G In te grated Circuit Systems Symbol ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m ICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTHESIZER Package Outline and Package Dimensions (20-pin SSOP, 150 Mil. Wide Body) Package dimensions are kept current with JEDEC Publication No. 95 20 Millimeters Symbol E1 Min A A1 A2 b c D E E1 e L α aaa E INDEX AREA 1 2 D Inches Max Min 1.35 1.75 0.10 0.25 -1.50 0.20 0.30 0.18 0.25 8.55 8.75 5.80 6.20 3.80 4.00 .635 Basic 0.40 1.27 0° 8° -0.10 Max 0.053 0.069 0.004 0.010 -0.059 0.008 0.012 0.007 0.010 0.337 0.344 0.228 0.244 0.150 0.157 .025 Basic 0.016 0.050 0° 8° -0.004 A A2 A1 c -Ce SEATING PLANE b L aaa C Ordering Information Part / Order Number Marking Shipping packaging Package Temperature ICS309R ICS309RT ICS309RI ICS309RIT ICS309R (top line) YYWW (2nd line) Tubes Tape and Reel Tubes Tape and Reel 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 0 to +70° C 0 to +70° C -40 to +85° C -40 to +85° C ICS309RI (top line) YYWW (2nd line) While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. 8 MDS 309 G In te grated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 Revision 122704 ● tel (4 08) 297 -1 201 ● w w w. i c s t . c o m