IDT 843301BGI

PRELIMINARY
ICS843301I-108
FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL
75MHZ FREQUENCY SYNTHESIZER W/SSC
GENERAL DESCRIPTION
FEATURES
The ICS843301I-108 is a 75MHz Frequency
ICS
Generator and a member of the HiPerClocks TM
HiPerClockS™
family of high perfor mance devices from IDT.
The ICS843301I-108 uses a 20MHz crystal to
synthesize 75MHz output. The device supports
0.5% downspread spread spectrum clocking. The ICS843301I108 has excellent <1ps phase jitter performance, over an
integration range of 900kHz - 7.5MHz. The device is packaged
in a small 8-pin TSSOP, making it ideal for use in systems with
limited board space.
• One differential 3.3V or 2.5V LVPECL output
• Crystal oscillator interface designed for 20MHz,
18pF parallel resonant crystal
• Output frequency: 75MHz
• Supports SSC, 0.5% downspread
• RMS phase jitter @ 75MHz, using a 20MHz crystal
(900kHz - 7.5MHz): 0.73ps (typical)
• Full 3.3V or 2.5V operating supply
• -40°C to 85°C ambient operating temperature
• Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
SSC FUNCTION TABLE
Input
Mode
SSC
0 (default)
SSC Off
1
0.5% Downspread
BLOCK DIAGRAM
PIN ASSIGNMENT
20MHz
PLL
XTAL_IN
OSC
XTAL_OUT
SSC
Pulldown
Phase
Detector
VCO
600MHz
Q
N Div
÷8
nQ
VCCA
VEE
XTAL_OUT
XTAL_IN
1
2
3
4
8
7
6
5
VCC
Q
nQ
SSC
ICS843301I-108
8-Lead TSSOP
4.40mm x 3.0mm x 0.925mm package body
G Package
Top View
M Div
÷30
The Preliminary Information presented herein represents a product in pre-production. The noted characteristics are based on initial product characterization
and/or qualification. Integrated Device Technology, Incorporated (IDT) reserves the right to change any circuitry or specifications without notice.
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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ICS843301BGI-108 REV. A OCTOBER 9, 2007
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
PRELIMINARY
TABLE 1. PIN DESCRIPTIONS
Number
Name
1
VCCA
Power
2
Power
5
VEE
XTAL_OUT,
XTAL_IN
SSC
6, 7
nQ, Q
Output
Differential clock outputs. LVPECL interface levels.
8
VCC
Power
Core and output supply pin.
3, 4
Type
Input
Input
Description
Analog supply pin.
Negative supply pin.
Crystal oscillator interface. XTAL_IN is the input,
XTAL_OUT is the output.
Pulldown SSC control pin. LVCMOS/LVTTL interface levels.
NOTE: Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Pin Capacitance
Test Conditions
4
pF
RPULLDOWN
Input Pulldown Resistor
51
kΩ
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
2
Minimum
Typical
Maximum
Units
ICS843301BGI-108 REV. A OCTOBER 9, 2007
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
PRELIMINARY
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause per manent damage to the
device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Package Thermal Impedance, θJA 101.7°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VCC = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VCC
Core Supply Voltage
VCCA
Analog Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3. 3
3.465
V
VCC – 0.10
3. 3
VCC
V
ICCA
Analog Supply Current
10
mA
IEE
Power Supply Current
106
mA
TABLE 3B. POWER SUPPLY DC CHARACTERISTICS, VCC = 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VCC
Core Supply Voltage
VCCA
Analog Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
2.375
2.5
2.625
V
VCC – 0.09
2. 5
VCC
V
ICCA
Analog Supply Current
9
mA
IEE
Power Supply Current
100
mA
TABLE 3C. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = 3.3V±5% OR 2.5V±5%, TA = -40°C TO 85°C
Symbol
VIH
Parameter
Input High Voltage
Test Conditions
Minimum
VCC = 3.3V
Typical
Maximum
Units
2
VCC + 0.3
V
VCC = 2.5V
1.7
VCC + 0.3
V
VCC = 3.3V
-0.3
0. 8
V
VCC = 2.5V
-0.3
VIL
Input Low Voltage
IIH
Input High Current
VCC = VIN = 3.465V or 2.625V
IIL
Input Low Current
VCC = 3.465V or 2.625V, VIN = 0V
0.7
V
15 0
µA
-5
µA
TABLE 3D. LVPECL DC CHARACTERISTICS, VCC = 3.3V±5% OR 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
Output High Voltage; NOTE 1
VCC - 1.4
VCC - 0.9
V
VOL
Output Low Voltage; NOTE 1
VCC - 2.0
VCC - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1.0
V
NOTE 1: Outputs terminated with 50Ω to VCC - 2V.
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
PRELIMINARY
TABLE 4. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical
Maximum
Units
Fundamental
Frequency
20
MHz
Equivalent Series Resistance (ESR)
90
Ω
Shunt Capacitance
7
pF
300
µW
Drive Level
TABLE 5A. AC CHARACTERISTICS, VCC = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter
fOUT
SSCred
Output Frequency
RMS Phase Jitter,
(Random); NOTE 1, 2
SSC Modulation Frequency;
NOTE 3
SSC Modulation Factor;
NOTE 3
Spectral Reduction; NOTE 3
t R / tF
Output Rise/Fall Time
tjit(Ø)
FM
FMF
Test Conditions
Minimum
75MHz
(Integration Range: 900kHz - 7.5MHz)
FOUT = 75MHz
Typical
Maximum
MHz
0.73
ps
29
33.33
FOUT = 75MHz
Units
75
kHz
0.5
%
FOUT = 75MHz
8
dB
20% to 80%
475
ps
50
%
odc
Output Duty Cycle
NOTE 1: Please refer to the Phase Noise Plot.
NOTE 2: Spread Spectrum clocking disabled.
NOTE 3: Spread Spectrum clocking enabled.
TABLE 5B. AC CHARACTERISTICS, VCC = 2.5V±5%, TA = -40°C TO 85°C
Symbol Parameter
fOUT
SSCred
Output Frequency
RMS Phase Jitter,
(Random); NOTE 1, 2
SSC Modulation Frequency;
NOTE 3
SSC Modulation Factor;
NOTE 3
Spectral Reduction; NOTE 3
t R / tF
Output Rise/Fall Time
tjit(Ø)
FM
FMF
Test Conditions
Minimum
75MHz
(Integration Range: 900kHz - 7.5MHz)
FOUT = 75MHz
Typical
Maximum
Units
75
MHz
0.72
ps
29
33.33
kHz
FOUT = 75MHz
0.4
%
FOUT = 75MHz
7.5
dB
20% to 80%
450
ps
50
%
odc
Output Duty Cycle
NOTE 1: Please refer to the Phase Noise Plot.
NOTE 2: Spread Spectrum clocking disabled.
NOTE 3: Spread Spectrum clocking enabled.
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
PRELIMINARY
PARAMETER MEASUREMENT INFORMATION
2V
2V
2V
2V
VCC
Qx
SCOPE
VCC
VCCA
Qx
SCOPE
VCCA
LVPECL
LVPECL
nQx
nQx
VEE
VEE
-1.3V ± 0.165V
-0.5V ± 0.125V
3.3V OUTPUT LOAD AC TEST CIRCUIT
2.5V OUTPUT LOAD AC TEST CIRCUIT
VOH
VREF
80%
80%
VSW I N G
VOL
1σ contains 68.26% of all measurements
2σ contains 95.4% of all measurements
3σ contains 99.73% of all measurements
4σ contains 99.99366% of all measurements
6σ contains (100-1.973x10-7)% of all measurements
Clock
Outputs
20%
20%
tR
tF
Histogram
Reference Point
Mean Period
(Trigger Edge)
(First edge after trigger)
OUTPUT RISE/FALL TIME
PERIOD JITTER
nQ
Q
t PW
t
odc =
PERIOD
t PW
x 100%
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
PRELIMINARY
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS843301I-108 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC and VCCA should
be individually connected to the power supply plane through
vias, and bypass capacitors should be used for each pin. To
achieve optimum jitter performance, power supply isolation is
required. Figure 1 illustrates how a 10Ω resistor along with a
10μF and a 0.01μF bypass capacitor should be connected to
each VCCA pin.
3.3V or 2.5V
VCC
.01μF
10Ω
VCCA
.01μF
10μF
FIGURE 1. POWER SUPPLY FILTERING
CRYSTAL INPUT INTERFACE
resonant crystal and were chosen to minimize the ppm error. The
optimum C1 and C2 values can be slightly adjusted for different
board layouts.
The ICS843301I-108 has been characterized with 18pF parallel
resonant crystals. The capacitor values, C1 and C2, shown in
Figure 2 below were determined using a 20MHz, 18pF parallel
XTAL_IN
C1
X1
Crystal
XTAL_OUT
C2
FIGURE 2. CRYSTAL INPUt INTERFACE
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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PRELIMINARY
LVCMOS TO XTAL INTERFACE
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be
done in one of two ways. First, R1 and R2 in parallel should equal
the transmission line impedance. For most 50Ω applications, R1
and R2 can be 100Ω. This can also be accomplished by removing
R1 and making R2 50Ω.
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 3. The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to
half swing in order to prevent signal interference with the power
rail and to reduce noise. This configuration requires that the output
VDD
VDD
R1
Ro
.1uf
Rs
Zo = 50
Zo = Ro + Rs
XTAL_IN
R2
XTAL_OUT
FIGURE 3. GENERAL DIAGRAM FOR LVCMOS DRIVER
TO
XTAL INPUT INTERFACE
SPREAD SPECTRUM
Spread-spectrum clocking is a frequency modulation technique
for EMI reduction. When spread-spectrum is enabled, a 32kHz
triangle waveform is used with 0.5% down-spread (+0.0% /
TBD%) from the nominal 75MHz clock frequency. An example
of a triangle frequency modulation profile is shown in Figure
4A below.
quency (+0.0% / TBD%). An example of the amount of down
spread relative to the nominal clock frequency can be seen in
the frequency domain, as shown in Figure 4B. The ratio of this
difference to the fundamental frequency is typically 0.5%, and
will not exceed TBD%. The resulting spectral reduction will be
greater than 7dB, as shown in Figure 4B. It is important to note
the ICS843301I-108 7dB minimum spectral reduction is the
component-specific EMI reduction, and will not necessarily be
the same as the system EMI reduction.
The ICS843301I-108 triangle modulation frequency deviation
will not exceed TBD% down-spread from the nominal clock fre-
➤
Δ − 8 dBm
Fnom
B
(1 - δ) Fnom
A
δ = 0.5% ➤
➤
➤
0.5/fm
1/fm
FIGURE 4A. TRIANGLE FREQUENCY MODULATION
FIGURE 4B. 75MHZ CLOCK OUTPUT IN FREQUENCY DOMAIN
(A) S PREAD -SPECTRUM OFF
(B) SPREAD -S PECTRUM ON
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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PRELIMINARY
TERMINATION FOR 3.3V LVPECL OUTPUT
50Ω transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion. Figures 5A and 5B show two different layouts which
are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
3.3V
Zo = 50Ω
125Ω
FOUT
125Ω
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 5A. LVPECL OUTPUT TERMINATION
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
84Ω
FIGURE 5B. LVPECL OUTPUT TERMINATION
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PRELIMINARY
TERMINATION FOR 2.5V LVPECL OUTPUT
Figure 6A and Figure 6B show examples of termination for 2.5V
LVPECL driver. These terminations are equivalent to terminating
50Ω to VCC - 2V. For VCC = 2.5V, the VCC - 2V is very close to ground
level. The R3 in Figure 6B can be eliminated and the termination
is shown in Figure 6C.
2.5V
VCC=2.5V
2.5V
2.5V
VCC=2.5V
R1
250
Zo = 50 Ohm
R3
250
+
Zo = 50 Ohm
+
Zo = 50 Ohm
-
Zo = 50 Ohm
2,5V LVPECL
Driv er
-
R1
50
2,5V LVPECL
Driv er
R2
62.5
R2
50
R4
62.5
R3
18
FIGURE 6B. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
FIGURE 6A. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
2.5V
VCC=2.5V
Zo = 50 Ohm
+
Zo = 50 Ohm
2,5V LVPECL
Driv er
R1
50
R2
50
FIGURE 6C. 2.5V LVPECL TERMINATION EXAMPLE
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843301I-108.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843301I-108 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 106mA = 367.29mW
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.465V, with all outputs switching) = 370.75mW + 30mW = 397.29mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming air
flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.397W * 90.5°C/W = 120.9°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE θJA
FOR
8-PIN TSSOP, FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
0
1
2.5
101.7°C/W
90.5°C/W
89.8°C/W
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PRELIMINARY
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 7.
VCC
Q1
VOUT
RL
50Ω
VCC - 2V
FIGURE 7. LVPECL DRIVER CIRCUIT
AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CC
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCC_MAX - VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCC_MAX – 1.7V
(VCC_MAX - VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCC_MAX - 2V))/R ] * (VCC_MAX - VOH_MAX) = [(2V - (VCC_MAX - VOH_MAX))/R ] * (VCC_MAX - VOH_MAX) =
L
L
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCC_MAX - 2V))/R ] * (VCC_MAX - VOL_MAX) = [(2V - (VCC_MAX - VOL_MAX))/R ] * (VCC_MAX - VOL_MAX) =
L
L
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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PRELIMINARY
RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE
FOR
8 LEAD TSSOP
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
101.7°C/W
90.5°C/W
89.8°C/W
TRANSISTOR COUNT
The transistor count for ICS843301I-108 is: 3792
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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PRELIMINARY
PACKAGE OUTLINE - G SUFFIX 8 LEAD TSSOP
TABLE 8. PACKAGE DIMENSIONS
SYMBOL
Millimeters
Minimum
N
Maximum
8
A
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
2.90
E
E1
3.10
6.40 BASIC
4.30
e
4.50
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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PRELIMINARY
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
843301BGI-108
BI108
8 lead TSSOP
tube
-40°C to 85°C
843301BGI-108T
BI108
8 lead TSSOP
2500 tape & reel
-40°C to 85°C
843301BGI-108LF
B108L
8 lead "Lead-Free" TSSOP
tube
-40°C to 85°C
843301BGI-108LFT
BI08L
8 lead "Lead-Free" TSSOP
2500 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and
industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT
reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT ™ / ICS™ 3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER W/SSC
PRELIMINARY
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For Tech Support
800-345-7015
408-284-8200
Fax: 408-284-2775
[email protected]
480-763-2056
Corporate Headquarters
Asia Pacific and Japan
Europe
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road
San Jose, CA 95138
United States
800 345 7015
+408 284 8200 (outside U.S.)
Integrated Device Technology
Singapore (1997) Pte. Ltd.
Reg. No. 199707558G
435 Orchard Road
#20-03 Wisma Atria
Singapore 238877
+65 6 887 5505
IDT Europe, Limited
321 Kingston Road
Leatherhead, Surrey
KT22 7TU
England
+44 (0) 1372 363 339
Fax: +44 (0) 1372 378851
© 2007 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, the IDT logo, ICS and HiPerClockS are trademarks
of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be
trademarks or registered trademarks used to identify products or services of their respective owners.
Printed in USA