SCES576A – JUNE 2004 – REVISED APRIL 2005
D I/Os Are 4.6-V Tolerant
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
D
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 8000-V Human-Body Model (A114-A)
− 150-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
VCCA
1DIR
2DIR
1A1
1A2
2A1
2A2
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCCB
1OE
2OE
1B1
1B2
2B1
2B2
GND
RGY PACKAGE
(TOP VIEW)
1DIR
2DIR
1A1
1A2
2A1
2A2
VCCB
D, DGV, OR PW PACKAGE
(TOP VIEW)
1
16
15 1OE
14 2OE
2
3
13 1B1
12 1B2
4
5
11 2B1
10 2B2
6
7
GND
8
9
GND
D
Referenced to VCCA Voltage
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
VCCA
D Control Inputs VIH/VIL Levels are
description/ordering information
This 4-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. The SN74AVC4T245 is optimized to operate with
VCCA/VCCB set at 1.4 V to 3.6 V. It is operational with VCCA/VCCB as low as 1.2 V. This allows for universal
low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVC4T245 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the outputs so the buses are
effectively isolated.
The SN74AVC4T245 is designed so that the control pins (1DIR, 2DIR, 1OE, and 2OE) are supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCES576A – JUNE 2004 – REVISED APRIL 2005
ORDERING INFORMATION
TA
ORDERABLE
PART NUMBER
PACKAGE†
QFN − RGY
SOIC − D
−40°C to 85°C
TSSOP − PW
Tape and reel
SN74AVC4T245RGYR
Tube
SN74AVC4T245D
Tape and reel
SN74AVC4T245DR
Tube
SN74AVC4T245PW
Tape and reel
SN74AVC4T245PWR
TOP-SIDE
MARKING
WT245
AVC4T245
WT245
TVSOP − DGV
Tape and reel SN74AVC4T245DGVR
WT245
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES576A – JUNE 2004 – REVISED APRIL 2005
description/ordering information (continued)
The VCC isolation feature ensures that if either VCC input is at GND, then both ports are in the high-impedance
state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 4-bit section)
INPUTS
OPERATION
OE
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
All output Hi-Z
logic diagram (positive logic)
2
3
1DIR
2DIR
15
14
1OE
1A1
4
2A1
13
1A2
2OE
11
1B1
5
2A2
12
6
7
10
1B2
POST OFFICE BOX 655303
2B1
• DALLAS, TEXAS 75265
2B2
3
SCES576A – JUNE 2004 – REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCCA and VCCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1): I/O ports (A port) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
I/O ports (B port) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Control inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1): (A port) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
(B port) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2): (A port) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCCA + 0.5 V
(B port) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCCB + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCCA, VCCB, or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES576A – JUNE 2004 – REVISED APRIL 2005
recommended operating conditions (see Notes 5 through 7)
VCCI
VCCA
VCCB
VCCO
MIN
MAX
Supply voltage
1.2
3.6
V
Supply voltage
1.2
3.6
V
VCCI × 0.65
1.6
1.2 V to 1.95 V
VIH
High-level input
voltage
Data inputs
(see Note 8)
1.95 V to 2.7 V
2.7 V to 3.6 V
VIL
Data inputs
(see Note 8)
VCCI × 0.35
0.7
1.95 V to 2.7 V
2.7 V to 3.6 V
VIH
VIL
VI
VO
IOH
IOL
∆t/∆v
DIR
(referenced to VCCA)
(see Note 9)
High-level input
voltage
DIR
(referenced to VCCA)
(see Note 9)
Low-level input
voltage
V
0.8
VCCA × 0.65
1.6
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
V
2
VCCA × 0.35
0.7
1.2 V to 1.95 V
1.95 V to 2.7 V
2.7 V to 3.6 V
V
0.8
Input voltage
Output voltage
V
2
1.2 V to 1.95 V
Low-level input
voltage
UNIT
0
3.6
V
Active state
0
3-state
0
VCCO
3.6
V
High-level output current
Low-level output current
1.1 V to 1.2 V
−3
1.4 V to 1.6 V
−6
1.65 V to 1.95 V
−8
2.3 V to 2.7 V
−9
3 V to 3.6 V
−12
1.1 V to 1.2 V
3
1.4 V to 1.6 V
6
1.65 V to 1.95 V
8
2.3 V to 2.7 V
9
3 V to 3.6 V
12
Input transition rise or fall rate
5
mA
mA
ns/V
TA
Operating free-air temperature
−40
85
°C
NOTES: 5. VCCI is the VCC associated with the data input port.
6. VCCO is the VCC associated with the output port.
7. All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
8. For VCCI values not specified in the data sheet, VIH(min) = VCCI x 0.7 V, VIL(max) = VCCI x 0.3 V.
9. For VCCI values not specified in the data sheet, VIH(min) = VCCA x 0.7 V, VIL(max) = VCCA x 0.3 V.
POST OFFICE BOX 655303
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5
SCES576A – JUNE 2004 – REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Notes 10 and 11)
PARAMETER
TEST CONDITIONS
1.2 V to 3.6 V
1.2 V to 3.6 V
1.2 V
1.2 V
1.4 V
1.4 V
1.05
1.65 V
1.65 V
1.2
IOH = −9 mA
IOH = −12 mA
2.3 V
2.3 V
1.75
3V
3V
2.3
IOL = 100 µA
IOL = 3 mA
1.2 V to 3.6 V
1.2 V to 3.6 V
1.2 V
1.2 V
IOH = −6 mA
IOH = −8 mA
IOL = 6 mA
IOL = 8 mA
VOL
VI = VIH
VI = VIL
IOL = 9 mA
IOL = 12 mA
2.3 V
0.55
3V
3V
0.7
0V
VI or VO= 0 to 3.6 V
0 to 3.6 V
IOZ†
A or B
port
VO = VCCO or
GND,
OE = VIH
VI = VCCI or GND
±0.025
±0.25
±1
0 to 3.6 V
±0.1
±1
±5
0V
±0.1
±1
±5
3.6 V
3.6 V
±0.5
±2.5
±5
1.2 V to 3.6 V
1.2 V to 3.6 V
8
0V
3.6 V
-2
3.6 V
0V
8
1.2 V to 3.6 V
1.2 V to 3.6 V
8
V
µA
µA
A
µA
µA
µA
0V
3.6 V
8
3.6 V
0V
-2
1.2 V to 3.6 V
1.2 V to 3.6 V
16
µA
VI = 3.3 V or GND
3.3 V
3.3 V
3.5
4.5
pF
VO = 3.3 V or GND
3.3 V
3.3 V
6
7
pF
VI = VCCI or GND IO = 0
VI = VCCI or GND IO = 0
NOTES: 10. VCCO is the VCC associated with the output port.
11. VCCI is the VCC associated with the input port.
6
0.2
0.25
2.3 V
A or B
port
A or B
ports
V
0.45
Ioff
Cio
VCCO − 0.2 V
0.35
1.2 V to 3.6 V
UNIT
0.95
1.4 V
1.2 V to 3.6 V
ICCA ICCB
Control
Ci
inputs
MAX
1.65 V
VI = VCCA or GND
ICCB
MIN
1.4 V
II
VI = VCCI or GND IO = 0
MIN
1.65 V
Control
inputs
ICCA
−40°C to 85°C
VCCB
IOH = −100 µA
IOH = −3 mA
VOH
TA = 25°C
TYP
MAX
VCCA
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES576A – JUNE 2004 – REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCCA = 1.2 V (see Figure 11)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
B
tPLH
tPHL
B
A
tPZH
tPZL
OE
A
tPZH
tPZL
OE
B
tPHZ
tPLZ
OE
A
tPHZ
tPLZ
OE
B
PARAMETER
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
TYP
TYP
TYP
TYP
TYP
3.4
2.9
2.7
2.6
2.8
3.4
2.9
2.7
2.6
2.8
3.6
3.1
2.8
2.6
2.6
3.6
3.1
2.8
2.6
2.6
5.6
4.7
4.3
3.9
3.7
5.6
4.7
4.3
3.9
3.7
5
4.3
3.9
3.6
3.6
5
4.3
3.9
3.6
3.6
6.2
5.2
5.2
4.3
4.8
6.2
5.2
5.2
4.3
4.8
5.9
5.1
5
4.7
5.5
5.9
5.1
5
4.7
5.5
UNIT
ns
ns
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range,
VCCA = 1.5 V ± 0.1 V (see Figure 11)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
B
tPLH
tPHL
B
A
tPZH
tPZL
OE
A
tPZH
tPZL
OE
B
tPHZ
tPLZ
OE
A
tPHZ
tPLZ
OE
B
PARAMETER
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
3.2
0.3
6.3
0.3
5.2
0.4
4.2
0.4
4.2
3.2
0.3
6.3
0.3
5.2
0.4
4.2
0.4
4.2
3.3
0.7
6.3
0.5
6
0.4
5.7
0.3
5.6
3.3
0.7
6.3
0.5
6
0.4
5.7
0.3
5.6
4.9
1.4
9.6
1.1
9.5
0.7
9.4
0.4
9.4
4.9
1.4
9.6
1.1
9.5
0.7
9.4
0.4
9.4
4.5
1.4
9.6
1.1
7.7
0.9
5.8
0.9
5.6
4.5
1.4
9.6
1.1
7.7
0.9
5.8
0.9
5.6
5.6
1.8
10.2
1.5
10.2
1.3
10.2
1.6
10.2
5.6
1.8
10.2
1.5
10.2
1.3
10.2
1.6
10.2
5.2
1.9
10.3
1.9
9.1
1.4
7.4
1.2
7.6
5.2
1.9
10.3
1.9
9.1
1.4
7.4
1.2
7.6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
ns
ns
7
SCES576A – JUNE 2004 – REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCCA = 1.8 V ± 0.15 V (see Figure 11)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
B
tPLH
tPHL
B
A
tPZH
tPZL
OE
A
tPZH
tPZL
OE
B
tPHZ
tPLZ
OE
A
tPHZ
tPLZ
OE
B
PARAMETER
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.9
0.1
6
0.1
4.9
0.1
3.9
0.3
3.9
2.9
0.1
6
0.1
4.9
0.1
3.9
0.3
3.9
3
0.6
5.3
0.5
4.9
0.3
4.6
0.3
4.5
3
0.6
5.3
0.5
4.9
0.3
4.6
0.3
4.5
4.4
1
7.4
1
7.3
0.6
7.3
0.4
7.2
4.4
1
7.4
1
7.3
0.6
7.3
0.4
7.2
4.1
1.2
9.2
1
7.4
0.8
5.3
0.8
4.6
4.1
1.2
9.2
1
7.4
0.8
5.3
0.8
4.6
5.4
1.6
8.6
1.8
8.7
1.3
8.7
1.6
8.7
5.4
1.6
8.6
1.8
8.7
1.3
8.7
1.6
8.7
5
1.7
9.9
1.6
8.7
1.2
6.9
1
6.9
5
1.7
9.9
1.6
8.7
1.2
6.9
1
6.9
UNIT
ns
ns
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range,
VCCA = 2.5 V ± 0.2 V (see Figure 11)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
B
tPLH
tPHL
B
A
tPZH
tPZL
OE
A
tPZH
tPZL
OE
B
tPHZ
tPLZ
OE
A
tPHZ
tPLZ
OE
B
PARAMETER
8
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.8
0.1
5.7
0.1
4.6
0.2
3.5
0.1
3.6
2.8
0.1
5.7
0.1
4.6
0.2
3.5
0.1
3.6
2.7
0.6
4.2
0.4
3.9
0.2
3.4
0.2
3.3
2.7
0.6
4.2
0.4
3.9
0.2
3.4
0.2
3.3
4
0.7
6.5
0.7
5.2
0.6
4.8
0.4
4.8
4
0.7
6.5
0.7
5.2
0.6
4.8
0.4
4.8
3.8
0.9
8.8
0.8
7
0.6
4.8
0.6
4
3.8
0.9
8.8
0.8
7
0.6
4.8
0.6
4
4.7
1
8.4
1
8.4
1
6.2
1
6.6
4.7
1
8.4
1
8.4
1
6.2
1
6.6
4.5
1.5
9.4
1.3
8.2
1.1
6.2
0.9
5.2
4.5
1.5
9.4
1.3
8.2
1.1
6.2
0.9
5.2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
ns
ns
SCES576A – JUNE 2004 – REVISED APRIL 2005
switching characteristics over recommended operating free-air temperature range,
VCCA = 3.3 V ± 0.3 V (see Figure 11)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
B
tPLH
tPHL
B
A
tPZH
tPZL
OE
A
tPZH
tPZL
OE
B
tPHZ
tPLZ
OE
A
tPHZ
tPLZ
OE
B
PARAMETER
VCCB = 1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.9
0.1
5.6
0.1
4.5
0.1
3.3
0.1
2.9
2.9
0.1
5.6
0.1
4.5
0.1
3.3
0.1
2.9
2.6
0.6
4.2
0.4
3.4
0.2
3
0.1
2.8
2.6
0.6
4.2
0.4
3.4
0.2
3
0.1
2.8
3.8
0.6
8.7
0.6
5.2
0.6
3.8
0.4
3.8
3.8
0.6
8.7
0.6
5.2
0.6
3.8
0.4
3.8
3.7
0.8
8.7
0.6
6.8
0.5
4.7
0.5
3.8
3.7
0.8
8.7
0.6
6.8
0.5
4.7
0.5
3.8
4.8
0.7
9.3
0.7
8.3
0.7
5.6
0.7
6.6
4.8
0.7
9.3
0.7
8.3
0.7
5.6
0.7
6.6
5.3
1.4
9.3
1.2
8.1
1
6.4
0.8
6.2
5.3
1.4
9.3
1.2
8.1
1
6.4
0.8
6.2
UNIT
ns
ns
ns
ns
ns
ns
operating characteristics, TA = 25°C
VCCA =
VCCB = 1.2 V
VCCA =
VCCB = 1.5 V
VCCA =
VCCB = 1.8 V
VCCA =
VCCB = 2.5 V
VCCA =
VCCB = 3.3 V
TYP
TYP
TYP
TYP
TYP
1
1
1
1.5
2
1
1
1
1
1
12
12.5
13
14
15
Outputs
Disabled
1
1
1
1
1
Outputs
Enabled
12
12.5
13
14
15
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
PARAMETER
TEST
CONDITIONS
Outputs
Enabled
A to B
CpdA†
Outputs
Disabled
Outputs
Enabled
B to A
A to B
CpdB†
Outputs
Disabled
Outputs
Enabled
B to A
CL = 0,
f = 10 MHz,
tr = tf =1 ns
CL = 0,
f = 10 MHz,
tr = tf =1 ns
Outputs
Disabled
UNIT
pF
pF
† Power dissipation capacitance per transceiver
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SCES576A – JUNE 2004 – REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCCO
GND
RL
tw
LOAD CIRCUIT
VCCI
VCCI/2
Input
VCCO
1.2 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
CL
RL
15 pF
15 pF
15 pF
15 pF
15 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
VTP
0.1 V
0.1 V
0.15 V
0.15 V
0.3 V
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VOH
VCCO/2
VOL
VCCO/2
VCCA/2
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
VCCO/2
VOL
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + VTP
VCCO/2
VOH − VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns,
dv/dt ≥1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
Figure 1. Load Circuit and Voltage Waveforms
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74AVC4T245DGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AVC4T245RGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74AVC4T245D
ACTIVE
SOIC
D
16
40
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DBR
PREVIEW
SSOP
DB
16
2000
TBD
Call TI
SN74AVC4T245DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245RGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
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Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74AVC4T245DGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AVC4T245RGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74AVC4T245D
ACTIVE
SOIC
D
16
40
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DBR
PREVIEW
SSOP
DB
16
2000
TBD
Call TI
SN74AVC4T245DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AVC4T245RGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265