TI UC3846QTR

PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
5962-86806012A
ACTIVE
LCCC
FK
20
1
TBD
5962-8680601EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Purchase Samples
UC1846J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Contact TI Distributor
or Sales Office
UC1846J/80257
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
Samples Not Available
UC1846J/80364
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
Samples Not Available
UC1846J/80619
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
Samples Not Available
UC1846J883B
ACTIVE
CDIP
J
16
1
TBD
A42
UC1846L883B
ACTIVE
LCCC
FK
20
1
TBD
UC1847J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
Replaced by UC1846J
UC1847J883B
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
Replaced by UC1846J883B
UC1847L
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
Samples Not Available
UC1847L883B
OBSOLETE
LCCC
FK
20
Call TI
Call TI
Replaced by UC1846L883B
UC2846DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
UC2846DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
UC2846DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
TBD
POST-PLATE N / A for Pkg Type
Purchase Samples
N / A for Pkg Type
Contact TI Distributor
or Sales Office
POST-PLATE N / A for Pkg Type
Contact TI Distributor
or Sales Office
UC2846DWTR/81265
OBSOLETE
SOIC
DW
16
TBD
Call TI
Call TI
Samples Not Available
UC2846DWTR/81265G4
OBSOLETE
SOIC
DW
16
TBD
Call TI
Call TI
Samples Not Available
UC2846DWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
UC2846J
ACTIVE
CDIP
J
16
1
TBD
UC2846N
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Request Free Samples
UC2846NG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Request Free Samples
Addendum-Page 1
CU NIPDAU Level-2-260C-1 YEAR
A42
N / A for Pkg Type
Purchase Samples
Contact TI Distributor
or Sales Office
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2010
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
UC2846QTR
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Purchase Samples
UC2846QTRG3
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Purchase Samples
UC2847DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
UC2847DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
UC2847N
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Purchase Samples
UC2847NG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Purchase Samples
UC3846DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
UC3846DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
UC3846DWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
UC3846DWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
UC3846J
ACTIVE
CDIP
J
16
1
TBD
UC3846N
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Request Free Samples
UC3846NG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Request Free Samples
UC3846Q
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Purchase Samples
UC3846QG3
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Purchase Samples
UC3846QTR
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Purchase Samples
UC3846QTRG3
ACTIVE
PLCC
FN
20
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Purchase Samples
UC3847DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
Addendum-Page 2
A42
N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
Contact TI Distributor
or Sales Office
Request Free Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2010
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
UC3847DWG4
ACTIVE
SOIC
DW
16
UC3847DWTR
ACTIVE
SOIC
DW
UC3847DWTRG4
ACTIVE
SOIC
Package Qty
40
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
16
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
DW
16
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Purchase Samples
UC3847J
OBSOLETE
CDIP
J
16
UC3847N
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
TBD
CU NIPDAU N / A for Pkg Type
Call TI
Call TI
Request Free Samples
Samples Not Available
UC3847NG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Request Free Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jul-2010
OTHER QUALIFIED VERSIONS OF UC1846, UC1847, UC2846, UC2846M, UC3846, UC3846M, UC3847 :
• Catalog: UC3846, UC3847, UC2846, UC3846M, UC3846
• Enhanced Product: UC1846-EP, UC1846-EP
• Military: UC2846M, UC1846, UC1847
• Space: UC1846-SP, UC1846-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
UC2846DWTR
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DW
16
2000
330.0
16.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.85
10.8
2.7
12.0
16.0
Q1
UC2846QTR
PLCC
FN
20
1000
330.0
16.4
10.3
10.3
4.9
12.0
16.0
Q1
UC3846DWTR
SOIC
DW
16
2000
330.0
16.4
10.85
10.8
2.7
12.0
16.0
Q1
UC3846QTR
PLCC
FN
20
1000
330.0
16.4
10.3
10.3
4.9
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC2846DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
UC2846QTR
PLCC
FN
20
1000
346.0
346.0
33.0
UC3846DWTR
SOIC
DW
16
2000
346.0
346.0
33.0
UC3846QTR
PLCC
FN
20
1000
346.0
346.0
33.0
Pack Materials-Page 2
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