MCP9700/01 Low-Power Voltage Output Temperature Sensor Features Description • Tiny Analog Temperature Sensor • Available Packages: SC70-5 • Wide Temperature Measurement Range: - -40°C to +125°C • Accuracy: ±4°C (max.), 0°C to +70°C • Optimized for Analog-to-Digital Converters (ADCs): - MCP9700: 10.0 mV/°C (typ.) - MCP9701: 19.5 mV/°C (typ.) • Wide Operating Voltage Range: - MCP9700: VDD = 2.3V to 5.5V - MCP9701: VDD = 3.1V to 5.5V • Low Operating Current: 6 µA (typ.) • Optimized to Drive Large Capacitive Loads The MCP9700/01 low-cost, low-power and tiny temperature sensor family converts temperature to an analog voltage. It provides an accuracy of ±4°C from 0°C to +70°C while consuming 6 µA (typ.) of operating current. The MCP9700/01 provides a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from 25°C, an accuracy of ±1°C (typ.) can be realized from 0°C to 70°C. This accuracy can also be achieved by applying system calibration at 25°C. Unlike resistive sensors such as thermistors, this family does not require a signal conditioning circuit. The voltage output pin can be directly connected to an ADC input of a microcontroller. The MCP9700 and MCP9701 temperature coefficients are scaled to provide a 1° C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. Typical Applications • • • • • • Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Package Type NC 1 GND 2 VOUT 3 MCP9700 MCP9701 SC70-5 5 NC 4 VDD Typical Application Circuit VDD PICmicro® Microcontroller VDD 10 kΩ VSS © 2005 Microchip Technology Inc. VDD ANI MCLR MCP9700/01 VDD Cbypass 0.1 µF VOUT GND DS21942A-page 1 MCP9700/01 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD:...................................................................... 6.0V Storage temperature: ........................ -65°C to +150°C Ambient Temp. with Power Applied:.. -40°C to +125°C †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Pin Function Junction Temperature (TJ):................................. 150°C NAME ESD Protection On All Pins: (HBM:MM):... (4 kV:200V) NC VOUT VDD GND Latch-Up Current at Each Pin: ...................... ±200 mA FUNCTION Not Connected Voltage Output Power Supply Ground DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Operating Voltage Range VDD VDD 2.3 3.1 — — 5.5 5.5 V V Operating Current IDD — 6 12 µA PSR — 0.1 — °C/V TACY TACY TACY TACY — -4.0 -4.0 -4.0 ±1 — — — — +4.0 +6.0 +6.0 °C °C °C °C MCP9700 MCP9701 V0°C V0°C — — 500 400 — — mV mV MCP9700 MCP9701 TC1 TC1 — — 10.0 19.5 — — Output Non-linearity VONL — ±0.5 — °C Output Current IOUT — — 100 µA Power Supply Power Supply Rejection MCP9700 MCP9701 MCP9700 VDD = 2.3V - 4.0V MCP9701 VDD = 3.1V - 4.0V Sensor Accuracy (Notes 1, 2) TA = +25°C TA = 0°C to +70°C TA = -40°C to +125°C TA = -10°C to +125°C Sensor Output Output Voltage: TA = 0°C TA = 0°C Temperature Coefficient Output Impedance Output Load Regulation Turn-on Time Typical Load Capacitance (Note 3) Thermal Response to 63% Note 1: 2: 3: 4: mV/°C MCP9700 mV/°C MCP9701 TA = 0°C to +70°C (Note 2) ZOUT — 20 — Ω IOUT = 100 µA, f = 500 Hz ΔVOUT/ ΔIOUT — 1 — Ω TA = 0°C to +70°C, IOUT = 100 µA tON — 800 — µs CLOAD — — 1000 pF tRES — 1.3 — s 30°C (air) to +125°C (fluid bath) (Note 4) The MCP9700 accuracy is tested with VDD = 3.3V, while the MCP9701 accuracy is tested with VDD = 5.0V. The MCP9700/01 is characterized using the first-order or linear equation, as shown in Equation 3-1. The MCP9700/01 family is characterized and production-tested with a capacitive load of 1000 pF. Thermal response with 1 x 1 inch dual-sided copper clad. DS21942A-page 2 © 2005 Microchip Technology Inc. MCP9700/01 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions TA -40 — +125 °C MCP9700 (Note 1) MCP9701 (Note 1) Temperature Ranges Specified Temperature Range TA -10 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C θJA — 331 — °C/W Thermal Package Resistances Thermal Resistance, 5L-SC70 Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). © 2005 Microchip Technology Inc. DS21942A-page 3 MCP9700/01 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. Accuracy (°C) 4.0 MCP9701 VDD= 5.0V 2.0 ' Accuracy Due to Load (°C) 6.0 Spec. Limits 0.0 -2.0 MCP9700 VDD= 3.3V -4.0 -50 -25 0 FIGURE 2-1: Temperature. 25 50 TA (°C) 75 100 0.1 0 MCP9700 VDD = 3.3V -0.1 ILOAD = 100 µA -0.2 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-4: Changes in Accuracy vs. Ambient Temperature (Due to Load). Accuracy vs. Ambient 4.0 Load Regulation 'V/'I (:) MCP9701 VDD= 5.5V VDD= 3.1V MCP9700 VDD = 5.5V VDD = 2.3V 4.0 Accuracy (°C) MCP9701 VDD = 5.0V 125 6.0 2.0 0.0 -2.0 -4.0 MCP9700/01 VDD = 3.3V 3.0 IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA 2.0 1.0 0.0 -50 -25 0 25 50 TA (°C) 75 100 125 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-5: Load Regulation vs. Ambient Temperature. FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. 12.0 1000 10.0 VDD = 5.0V IOUT = 100 µA TA = 26°C Output Impedance (:) MCP9701 8.0 IDD (µA) 0.2 6.0 MCP9700 4.0 2.0 0.0 -50 -25 FIGURE 2-3: Temperature. DS21942A-page 4 0 25 50 TA (°C) 75 100 Supply Current vs. 125 100 10 1 0.1 0.1 FIGURE 2-6: Frequency. 1 1 10 100 1K 10 100 1000 Frequency (Hz) 10K 100K 10000 100000 Output Impedance vs. © 2005 Microchip Technology Inc. MCP9700/01 Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 35% 35% 30% 15% V0°C (mV) FIGURE 2-7: (MCP9700). Output Voltage at 0°C 40% 35% 25% 20% TC1 (mV/°C) 20.0 19.9 19.8 19.7 19.6 TC1 (mV/°C) FIGURE 2-8: Occurrences vs. First-Order Temperature Coefficient (MCP9700). FIGURE 2-11: Occurrences vs. First-Order Temperature Coefficient (MCP9701). 40% 35% 20% 2 TC2 (µV/°C ) FIGURE 2-9: Occurrences vs. SecondOrder Temperature Coefficient (MCP9700). © 2005 Microchip Technology Inc. -1.3 -1.6 -1.9 -2.2 -4.3 0.3 0.0 -0.3 -0.6 -0.9 -1.2 -1.5 -1.8 -2.1 0% -2.4 5% 0% -2.7 10% 5% -2.5 15% 10% -2.8 15% 25% -3.1 20% -3.4 Occurrences 30% 25% MCP9701 VDD = 3.3V 108 samples -3.7 MCP9700 VDD = 3.3V 108 samples -4.0 40% Occurrences 19.5 19.0 10.5 10.4 10.3 10.2 10.1 10.0 9.9 9.8 0% 9.7 5% 0% 9.6 10% 5% 19.4 15% 10% 19.3 15% 30% 19.2 20% MCP9701 VDD = 5.0V 108 samples 19.1 Occurrences 25% 30% 500 45% 30% 35% 480 FIGURE 2-10: Occurrences vs. Temperature Coefficient (MCP9701). MCP9700 VDD = 3.3V 108 samples 9.5 Occurrences 35% 460 V0°C (mV) 45% 40% 440 300 600 580 560 540 520 500 480 460 0% 440 5% 0% 420 5% 420 10% 400 10% 20% 380 15% 25% 360 20% 340 Occurrences 25% MCP9701 VDD = 5.0V 108 samples 320 MCP9700 VDD = 3.3V 108 samples 400 Occurrences 30% 2 TC2 (µV/°C ) FIGURE 2-12: Occurrences vs. SecondOrder Temperature Coefficient (MCP9701). DS21942A-page 5 MCP9700/01 Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 2.5 0.20 0.15 MCP9700 VDD= 2.3V to 4.0V 0 25 50 TA (°C) 75 100 50 75 100 125 Output Voltage vs. Ambient 2.5 VDD_STEP = 5V TA = 26°C 10 1.7 IDD 6 -2.5 FIGURE 2-14: Power Supply Rejection (PSR) vs. Frequency. 1.0 0 125 0.9 100 0.8 75 0.7 25 50 TA (°C) -1.7 0.6 0 2 0.5 -25 -0.8 -0.1 -50 4 0.4 0.05 0.0 VOUT 0.3 MCP9701 VDD= 3.1V to 4.0V 0.8 0.2 VOUT (V) 8 0.00 Time (ms) FIGURE 2-17: Output vs. Time. 3.0 TA = 26°C 2.5 30.0 IDD 1.2 VDD_RAMP = 5V/ms TA = 26°C 2.0 1.0 0.8 0.6 0.4 0.2 1.0 -6.0 VOUT -18.0 0.5 -30.0 0.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 2-15: Supply. DS21942A-page 6 Output Voltage vs. Power 18.0 6.0 1.5 VOUT (V) VOUT (V) 25 12 MCP9701 VDD= 3.1V to 5.5V 0.15 1.4 0 FIGURE 2-16: Temperature. 0.20 1.6 -25 TA (°C) FIGURE 2-13: Power Supply Rejection (PSR) vs. Ambient Temperature. Normalized PSR (°C/V) -50 125 IDD (mA) -25 IDD (µA) -50 0.10 MCP9700 MCP9701 0.0 0.00 0.25 1.0 0.5 0.05 0.30 1.5 0.1 0.10 2.0 0.0 0.25 3.0 MCP9700 VDD= 2.3V to 5.5V VOUT (V) Normalized PSR (°C/V) 0.30 -42.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) FIGURE 2-18: Output vs. Time © 2005 Microchip Technology Inc. MCP9700/01 Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 130 Output (°C) 105 80 55 SC70-5 30°C (Air) to 125°C (Fluid bath) 1 in. x 1 in. copper clad 30 -2 0 FIGURE 2-19: 2 4 6 8 10 Time (s) 12 14 16 18 Thermal Response. © 2005 Microchip Technology Inc. DS21942A-page 7 MCP9700/01 3.0 FUNCTIONAL DESCRIPTION The MCP9700/01 temperature sensing element is essentially a P-N junction or a diode. The diode electrical characteristics has a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 125°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typ.) for the MCP9700 and 19.5 mV/°C (typ.) for the MCP9701. The output voltage at 0°C is also scaled to 500 mV (typ.) and 400 mV (typ.) for the MCP9700 and MCP9701, respectively. This linear scale is described in the transfer function shown in Equation 3-1. EQUATION 3-1: SENSOR TRANSFER FUNCTION V OUT = T C1 • T A + V 0°C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C TC1 = Temperature Coefficient DS21942A-page 8 © 2005 Microchip Technology Inc. MCP9700/01 4.0 APPLICATIONS INFORMATION 4.1 Improving Accuracy The MCP9700/01 accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at 25°C ambient improves the measurement accuracy to a ±0.5°C (typ.) from 0°C to 70°C, as shown in Figure 4-1. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. 4.2 Shutdown Using Microcontroller I/O Pin The MCP9700/01 low operating current of 6 µA (typ.) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled to shutdown the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/01 as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor will be necessary. Accuracy (°C) 3.0 2.0 4.3 1.0 The MCP9700/01 does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200Ω resistor with a 1 µF decoupling capacitor. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. 0.0 -1.0 VDD= 3.3V 10 Samples -2.0 -3.0 -50 -25 FIGURE 4-1: vs. Temperature. 0 25 50 TA (°C) 75 100 125 Relative Accuracy to +25°C Layout Considerations The relative change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, specified in Equation 3-1. The accuracy can be further improved by compensating for the output non-linearity. For higher accuracy, the sensor output transfer function is also derived using a second-order equation as shown in Equation 4-1. The equation describes the output non-linearity. This equation is not used to characterize the part as specified in the DC Electrical Characteristics table; however, it provides better accuracy. EQUATION 4-1: SECOND-ORDER TRANSFER FUNCTION VOUT = TC2 (TA + 10°C)(125°C – TA) + TC1 TA + V0°C = -TC2 TA2 + (TC1 + 115 TC2)TA + 1250 TC2 + V0°C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (refer to Figure 2-7 and 2-10) TC1 = Temperature Coefficient (refer to Figure 2-8 and 2-11) TC2 = Temperature Coefficient MCP9700 1.4 µV/°C2 (typ.) MCP9701 2.7 µV/°C2 (typ.) (refer to Figure 2-9 and 2-12) © 2005 Microchip Technology Inc. DS21942A-page 9 MCP9700/01 4.4 Thermal Considerations The MCP9700/01 measures temperature by monitoring the voltage of a diode located in the die. A low impedance thermal path between the die and the PCB is provided by the pins. Therefore, the MCP9700/01 effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, the PCB needs to be designed with proper thermal conduction to the sensor pins. The MCP9700/01 is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 4-2. EQUATION 4-2: EFFECT OF SELFHEATING T J – T A = θ JA ( V DD I DD + ( V DD – V OUT ) I OUT ) Where: = Junction Temperature TJ TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C. DS21942A-page 10 © 2005 Microchip Technology Inc. MCP9700/01 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SC-70 (MCP9700) Example: Device XXN (Front) YWW (Back) Code MCP9700 AUN MCP9701 AVN AU2 (Front) 548 (Back) Note: Applies to 5-Lead SC-70. 5-Lead SC-70 (MCP9701) Example: Device XXNN Code MCP9700 AUNN MCP9701 AVNN AV25 Note: Applies to 5-Lead SC-70. Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005 Microchip Technology Inc. DS21942A-page 11 MCP9700/01 5-Lead Plastic Small Outline Transistor (LT) (SC-70) E E1 D p B n 1 Q1 A2 c A A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Top of Molded Pkg to Lead Shoulder Lead Thickness Lead Width A A2 A1 E E1 D L Q1 c B MIN .031 .031 .000 .071 .045 .071 .004 .004 .004 .006 INCHES NOM 5 .026 (BSC) MAX .043 .039 .004 .094 .053 .087 .012 .016 .007 .012 MILLIMETERS* NOM 5 0.65 (BSC) 0.80 0.80 0.00 1.80 1.15 1.80 0.10 0.10 0.10 0.15 MIN MAX 1.10 1.00 0.10 2.40 1.35 2.20 0.30 0.40 0.18 0.30 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Standard: SC-70 Drawing No. C04-061 DS21942A-page 12 © 2005 Microchip Technology Inc. MCP9700/01 APPENDIX A: REVISION HISTORY Revision A (March 2005) • Original Release of this Document. © 2005 Microchip Technology Inc. DS21942A-page 11 MCP9700/01 NOTES: DS21942A-page 12 © 2005 Microchip Technology Inc. MCP9700/01 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device: – X /XX Temperature Range Package MCP9700T: Tiny Analog Temperature Sensor, Tape and Reel, Pb free MCP9701T: Tiny Analog Temperature Sensor, Tape and Reel, Pb free Examples: a) MCP9700T-E/LT: Tiny Analog Temperature Sensor, Tape and Reel, -40°C to +125°C, 5LD SC70 package. a) MCP9701T-E/LT: Tiny Analog Temperature Sensor, Tape and Reel, -40°C to +125°C, 5LD SC70 package. = -40°C to +125°C Temperature Range: E Package: LT = Plastic Small Outline Transistor, 5-lead © 2005 Microchip Technology Inc. DS21942A-page 13 MCP9700/01 NOTES: DS21942A-page 14 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. DS21942A-page 15 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 03/01/05 DS21942A-page 16 © 2005 Microchip Technology Inc.