User's Guide SLVU383A – October 2010 – Revised November 2010 TPS8267xEVM This user’s guide describes the characteristics, operation, and use of the TPS8267xEVM-646 evaluation module (EVM). The TPS8267xEVM-646 is a fully assembled and tested platform for evaluating the performance of the TPS82671 and TPS82675 high-frequency, synchronous, step-down dc-dc converters optimized for battery-powered portable applications. This document includes schematic diagrams, a printed circuit board (PCB) layout, bill of materials, and test data. Throughout this document, the abbreviations EVM and TPS8267xEVM and the term evaluation module are synonymous with the TPS8267xEVM-646 unless otherwise noted. 1 2 3 4 5 6 7 8 Contents Introduction .................................................................................................................. 2 1.1 Features ............................................................................................................. 2 1.2 Applications ......................................................................................................... 2 1.3 EVM Ordering Options ............................................................................................ 2 TPS8267xEVM Schematic ................................................................................................. 3 Connector and Test Point Descriptions .................................................................................. 3 3.1 Input / Output Connectors: TPS8267xEVM .................................................................... 3 3.2 Jumpers and Switches ............................................................................................ 4 Test Configuration .......................................................................................................... 5 4.1 Hardware Setup .................................................................................................... 5 4.2 Procedure ........................................................................................................... 5 TPS8267xEVM Test Data ................................................................................................. 6 5.1 Thermal Performance ............................................................................................. 6 TPS8267xEVM Assembly Drawings and Layout ....................................................................... 8 Bill of Materials ............................................................................................................. 11 Marking Information ....................................................................................................... 11 List of Figures 1 TPS8267xEVM Schematic ................................................................................................. 3 2 Hardware Board Connection .............................................................................................. 5 3 Top Side Thermal Measurement .......................................................................................... 6 4 Bottom Side Thermal Measurement ...................................................................................... 7 5 TPS8267xEVM Component Placement (Top View) .................................................................... 8 6 TPS8267xEVM Top-Side Copper (Top View) ........................................................................... 9 7 TPS8267xEVM Bottom-Side Copper (Bottom View) ................................................................. 10 Bluetooth is a registered trademark of Bluetooth SIG. All other trademarks are the property of their respective owners. SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM 1 Introduction 1 www.ti.com Introduction The TPS82671 and TPS82675 devices are series of high-frequency, synchronous, step-down dc-dc converters optimized for battery-powered portable applications. Intended for low-power applications, the TPS8267x support up to 600-mA load current, and allow the use of low-cost chip inductors and capacitors. With a wide input voltage range of 2.3 V to 4.8 V, the devices support applications powered by lithium-ion (Li-Ion) batteries with extended voltage ranges. Different fixed voltage output versions of the TPS8267x are available. These converters operate at a regulated 5.5-MHz switching frequency and enter a power-save mode operation under light load currents in order to maintain high efficiency over the entire load current range. A PFM mode extends the battery life by reducing the quiescent current to 17 µA (typ) during light load operation. 1.1 Features • • • • • • 1.2 Applications • • • • 1.3 Input voltage range: 2.3 V up to 4.8 V Fixed output voltages Up to 600-mA output current 5.5-MHz regulated frequency operation Output capacitor discharge (optional) Total solution size: < 6.7 mm2 Cell phones, smart phones WLAN, GPS, and Bluetooth® applications DTV tuners Point-of-Load (PoL) applications EVM Ordering Options Table 1 provides the ordering information for the various EVM options. Table 1. Ordering Information 2 Orderable EVM Number Device Part Number Output Voltage Maximum Output Current TPS82671EVM-646 TPS82671 1.8 V 600 mA TPS82675EVM-646 TPS82675 1.2 V 600 mA TPS8267xEVM SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM Schematic www.ti.com 2 TPS8267xEVM Schematic Figure 1 illustrates the TPS8267xEVM-646 schematic. + NOTE: For reference only; see Table 2 for specific values. Figure 1. TPS8267xEVM Schematic 3 Connector and Test Point Descriptions 3.1 Input / Output Connectors: TPS8267xEVM 3.1.1 J1 VIN This header is the positive connection to the input power supply. The power supply must be connected between J1 and J3 (GND). The leads to the input supply should be twisted and kept as short as possible. The input voltage must be between 2.3 V and 5.5 V. 3.1.2 J2 S+/S– J2 S+/S– are the sense connection for the input of the converter. Connect a voltmeter, sense connection of a power supply, or oscilloscope to this header. 3.1.3 J3 GND This header is the return connection to the input power supply. Connect the power supply between J3 and J1 (VIN). The leads to the input supply should be twisted and kept as short as possible. The input voltage must be between 2.3 V and 4.8 V. Capacitor C3 compensates for parasitic inductance as a result of the wires from the dc power supply to the EVM. It is not required in an actual application circuit. SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM 3 Connector and Test Point Descriptions 3.1.4 www.ti.com J4 VOUT This header is the positive output of the step-down converter. The output voltage of the devices in the TPS8267x families have fixed output voltages; refer to the specific device data sheet for detailed information on the device output voltage. 3.1.5 J5 S+/S– J5 S+/S– are the sense connection for the output of the converter. Connect a voltmeter, sense connection of an electronic load, or oscilloscope to this header. 3.1.6 J6 GND J6 is the return connection of the converter. A load can be connected between J6 and J4 (VOUT). 3.2 3.2.1 Jumpers and Switches JP1 ENABLE This jumper enables/disables the converter on the EVM. Placing a shorting bar between ENABLE and ON turns on the converter. Placing a shorting bar between ENABLE and OFF disables the converter. 3.2.2 JP2 MODE This jumper enables/disables the power-saving mode under light loads. Placing a shorting bar between MODE and PWM disables the power-saving mode. If the power-save mode is disabled, the converter operates in forced PWM mode over the entire load current range. Placing a shorting bar between MODE and PSM enables the power-saving mode. The device operates in power-saving mode under light load conditions. See the specific device data sheet for detailed information. 4 TPS8267xEVM SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Test Configuration www.ti.com 4 Test Configuration 4.1 Hardware Setup Figure 2 illustrates a typical hardware test configuration. J2 S- S+ TPS826xxEVM-646 S+ GND EN ON JP1 OFF MODE PWM PSM JP2 Load J6 VIN S- J5 J1 VOUT GND J4 -+ DC Power Supply +- J3 Oscilloscope J7 Figure 2. Hardware Board Connection 4.2 Procedure Follow these procedures when configuring the EVM for testing. CAUTION Many of the components on the TPS8267xEVM-646 are susceptible to damage by electrostatic discharge (ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling the EVM, including the use of a grounded wrist strap, bootstraps, or mats at an approved ESD workstation. An electrostatic smock and safety glasses should also be worn. 1. Work at an ESD workstation. Make sure that any wrist straps, bootstraps, or mats are connected and reference the user to earth ground before power is applied to the EVM. Electrostatic smocks and safety glasses should also be worn. 2. Connect a dc power supply between J1 and J2 on the TPS8267xEVM. Note that the input voltage should range from 2.3 V to 5.5 V. Keep the wires from the input power supply to EVM as short as possible and twisted. 3. Connect a dc voltmeter or oscilloscope to the output sense connection of the EVM. 4. A load can be connected between J4 and J6 on the TPS8267xEVM. 5. To enable the converter, connect the shorting bar on JP1 between ENABLE and ON on the TPS8267xEVM. 6. The TPS8267xEVM has a feature that allows users to switch between Power-Save Mode under light loads and forced PWM mode, with jumper JP2. SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM 5 TPS8267xEVM Test Data 5 www.ti.com TPS8267xEVM Test Data This section presents typical performance data for the TPS8267xEVM. Actual performance data can be affected by measurement techniques and environmental variables; therefore, these results are presented for reference and may differ from actual results obtained by some users. 5.1 Thermal Performance Figure 3 and Figure 4 show the typical thermal performance for the TPS8267x for both the top side and the bottom side, respectively. 5.1.1 Top Side Figure 3. Top Side Thermal Measurement 6 TPS8267xEVM SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM Test Data www.ti.com 5.1.2 Bottom Side Figure 4. Bottom Side Thermal Measurement SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM 7 TPS8267xEVM Assembly Drawings and Layout 6 www.ti.com TPS8267xEVM Assembly Drawings and Layout Figure 5 through Figure 7 show the design of the show the design of the TPS6261x/2x/6xEVM-646 printed circuit boards. The EVM has been designed using a two-layer, 1-ounce copper-clad PCB with all components in an active area on the top side of the board. Moving components to both sides of the PCB or using additional internal layers can offer additional size reduction for space-constrained systems. NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out; they are not intended to be used for manufacturing TPS6261x/2x/6xEVM-646 PCBs. Note the connection of the TPS8267x feedback (FB) pin. It is recommended to connect the FB pin directly to the inductor, not directly on the VOUT connection of the output capacitor. The connection to the inductor is recommended because it provides better transient response performance. Figure 5. TPS8267xEVM Component Placement (Top View) 8 TPS8267xEVM SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM Assembly Drawings and Layout www.ti.com Figure 6. TPS8267xEVM Top-Side Copper (Top View) SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM 9 TPS8267xEVM Assembly Drawings and Layout www.ti.com Figure 7. TPS8267xEVM Bottom-Side Copper (Bottom View) 10 TPS8267xEVM SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Bill of Materials www.ti.com 7 Bill of Materials Table 2 lists the bill of materials for the TPS8267xEVM. Table 2. TPS8267xEVM-646 Bill of Materials EVM Device Option: Count -001 -002 RefDes Value Description Size Part Number 0 0 C1, C2 Open Capacitor, Ceramic 0603 Std Std 1 1 C3 150 µF Capacitor, Tantalum, 6.3V, 25mΩ, 20% 3528(B) T520B157M006ATE025 Kemet 0 0 J7 Open Connector, SMA , Straight, PC mount 0.210 in2 901-144-8RFX AMP TPS82671SIP IC, 600-mA, High-Freq µModule Step-Down Converter SIP-8 TPS82671SIP TI TPS82675SIP IC, 600-mA, High-Freq µModule Step-Down Converter SIP-8 TPS82675SIP TI 1 0 8 0 1 U1 U1 Mfr Marking Information Table 3 provides the marking information for this EVM. Table 3. Marking Information Assembly Number Marking Text HPA646-001 TPS82671EVM-646 HPA646-002 TPS82675EVM-646 SLVU383A – October 2010 – Revised November 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated TPS8267xEVM 11 Evaluation Board/Kit Important Notice Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. FCC Warning This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. EVM Warnings and Restrictions It is important to operate this EVM within the input voltage range of 1.8 V to 4.8 V and the output voltage range of 1.2 V to 1.8 V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than +60°C. The EVM is designed to operate properly with certain components above +60°C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. 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