DATA SHEET Solid State Relay OCMOS FET PS7112-1A,PS7112L-1A 6-PIN DIP, 200 mA CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET DESCRIPTION The PS7112-1A and PS7112L-1A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7112L-1A has a surface mount type lead. FEATURES • 1 channel type (1 a output) • Low LED operating current (IF = 2 mA) • Designed for AC/DC switching line changer • Small package (6-pin DIP) • Low offset voltage • PS7112L-1A: Surface mount type • UL approved: File No. E72422 (S) • BSI approved: No. 8245/8246 • CSA approved: No. CA 101391 APPLICATIONS • Exchange equipment • Measurement equipment • FA/OA equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P11552EJ7V0DS00 (7th edition) Date Published October 1999 NS CP(K) Printed in Japan The mark • shows major revised points. © 1996, 1999 PS7112-1A,PS7112L-1A PACKAGE DIMENSIONS (in millimeters) PS7112-1A 9.25±0.5 TOP VIEW 6 5 4 1 2 3 1. 2. 3. 4. 5. 6. LED Anode LED Cathode NC MOS FET Drain MOS FET Source MOS FET Drain 7.62 3.5±0.3 3.3±0.3 4.15±0.3 6.5±0.5 0.5±0.1 1.34±0.1 0.25 M 0 to 15˚ 2.54 PS7112L-1A 9.25±0.5 TOP VIEW 6 5 4 1 2 3 1. 2. 3. 4. 5. 6. LED Anode LED Cathode NC MOS FET Drain MOS FET Source MOS FET Drain 3.5±0.3 0.10+0.10 –0.05 6.5±0.5 1.34±0.1 0.25 M 2 0.9±0.25 2.54 9.60±0.4 Data Sheet P11552EJ7V0DS00 PS7112-1A,PS7112L-1A ORDERING INFORMATION Part Number PS7112-1A Package 6-pin DIP Packing Style Magazine case 50 pcs PS7112L-1A PS7112L-1A-E3 Application Part Number *1 PS7112-1A PS7112L-1A Embossed Tape 1 000 pcs/reel PS7112L-1A-E4 *1 For the application of the Safety Standard, following part number should be used. Data Sheet P11552EJ7V0DS00 3 PS7112-1A,PS7112L-1A ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified) Diode Parameter Symbol Ratings Unit Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V PD 50 mW IFP 1 A VL 100 V IL 200 mA Power Dissipation Peak Forward Current MOS FET *1 Break Down Voltage Continuous Load Current Connection A *2 Pulse Load Current Connection B 250 Connection C 400 *3 ILP 400 mA PD 560 mW BV 1 500 Vr.m.s. Total Power Dissipation PT 610 mW Operating Ambient Temperature TA −40 to +80 °C Storage Temperature Tstg −40 to +100 °C (AC/DC Connection) Power Dissipation Isolation Voltage *4 *1 PW = 100 µs, Duty Cycle = 1 % *2 Conditions: IF ≥ 2 mA. The following types of load connections are available. Connection A Connection B Connection C 1 2 3 1 2 3 1 2 3 1 2 3 6 5 4 6 5 IL IL VL (AC/DC) L L + VL (DC) – 4 6 5 4 6 5 IL 4 IL IL L L IL + IL – + VL (DC) + VL (DC) – *3 PW = 100 ms, 1 shot *4 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output 4 Data Sheet P11552EJ7V0DS00 PS7112-1A,PS7112L-1A RECOMMENDED OPERATING CONDITIONS (TA = 25 °C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 2 10 20 mA LED Off Voltage VF 0 0.5 V ELECTRICAL CHARACTERISTICS (TA = 25 °C) Parameter Diode MOS FET Coupled Symbol Conditions Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V Off-state Leakage Current ILoff VD = 100 V Output Capacitance Cout VD = 0 V, f = 1 MHz LED On-state Current IFon IL = 200 mA On-state Resistance Ron1 IF = 10 mA, IL = 10 mA MIN. IF = 10 mA, IL = 200 mA, t ≤ 10 ms Turn-on Time ton IF = 10 mA, VO = 5 V, PW ≥ 10 ms Turn-off Time *1 toff VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz Unit 1.2 1.4 V 5.0 µA 1.0 µA 57 Ron2 RI-O MAX. 0.03 *1 Isolation Resistance TYP. pF 2.0 mA 3.0 6.0 Ω 0.1 0.4 ms 0.03 0.2 Ω 9 10 1.1 pF *1 Test Circuit for Switching Time IF Pulse Input VL 50 % Input 0 VO = 5 V Input monitor 90 % VO monitor Output Rin RL 10 % ton Data Sheet P11552EJ7V0DS00 toff 5 PS7112-1A,PS7112L-1A TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 300 Maximum Load Current IL (mA) Maximum Forward Current IF (mA) 100 80 60 40 20 0 –25 0 25 7580 50 250 200 150 100 50 0 –25 100 0 25 7580 50 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 100 250 1.6 1.4 1.2 1.0 0.8 –25 0 25 50 75 Output Capacitance Cout (pF) Forward Voltage VF (V) f = 1 MHz IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA 200 150 100 50 0 100 20 40 100 120 Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE LOAD CURRENT vs. LOAD VOLTAGE 300 IF = 10 mA –4 10 200 10–5 Load Current IL (mA) Off-state Leakage Current ILoff (A) 80 Ambient Temperature TA (˚C) 10–3 TA = 80 ˚C 10–6 –7 10 25 ˚C 100 –1.5 10–8 10–9 0 –1.0 0 –0.5 0.5 –100 –200 20 40 60 80 100 120 –300 Load Voltage VL (V) Applied Voltage VD (V) 6 60 Data Sheet P11552EJ7V0DS00 1.0 1.5 PS7112-1A,PS7112L-1A NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 30 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, IL = 10 mA 2.5 2.0 1.5 1.0 0.5 0 –25 n = 50 pcs, IF = 10 mA, IL = 10 mA 25 Number (pcs) Normalized On-state Resistance Ron 3.0 20 15 10 5 0 25 50 0 100 75 2.8 2.9 3.0 Ambient Temperature TA (˚C) On-state Resistance Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT TURN-OFF TIME vs. FORWARD CURRENT 8.0 0.5 6.0 4.0 2.0 10 20 30 0.3 0.2 40 0 10 30 20 Forward Current IF (mA) Forward Current IF (mA) TURN-ON TIME DISTRIBUTION TURN-OFF TIME DISTRIBUTION 30 30 n = 50 pcs, IF = 10 mA, VO = 5 V 25 15 10 40 n = 50 pcs, IF = 10 mA, VO = 5 V 25 Number (pcs) 20 20 15 10 5 5 0 0.4 0.1 0 Number (pcs) VO = 5 V Turn-off Time toff (ms) Turn-on Time ton (ms) VO = 5 V 0.05 0.10 0.15 0 0.02 0.06 Turn-off Time toff (ms) Turn-on Time ton (ms) Data Sheet P11552EJ7V0DS00 7 PS7112-1A,PS7112L-1A NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V 2.5 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 100 3.0 Normalized Turn-off Time toff Normalized Turn-on Time ton 3.0 2.5 2.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. 8 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V Data Sheet P11552EJ7V0DS00 100 PS7112-1A,PS7112L-1A TAPING SPECIFICATIONS (in millimeters) 4.3±0.2 10.3±0.1 7.5±0.1 1.55±0.1 16.0±0.3 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 0.3 10.4±0.1 1.55±0.1 12.0±0.1 Tape Direction PS7112L-1A-E3 PS7112L-1A-E4 Outline and Dimensions (Reel) 1.5 R 1.0 φ 21.0±0.8 φ 80.0±5.0 φ 330 2.0±0.5 φ 13.0±0.5 16.4 +2.0 –0.0 Packing: 1 000 pcs/reel Data Sheet P11552EJ7V0DS00 9 PS7112-1A,PS7112L-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 235 °C (package surface temperature) • Time of temperature higher than 210 °C 30 seconds or less • Number of reflows Two • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 235 ˚C (peak temperature) 210 ˚C to 30 s 100 to 160 ˚C 60 to 120 s (preheating) Time (s) (2) Dip soldering • Temperature 260 °C or below (molten solder temperature) • Time 10 seconds or less • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet P11552EJ7V0DS00 PS7112-1A,PS7112L-1A [MEMO] Data Sheet P11552EJ7V0DS00 11 PS7112-1A,PS7112L-1A CAUTION Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8