NEC PS7141C-2A

DATA SHEET
Solid State Relay
OCMOS FET
PS7141C-2A,PS7141CL-2A
8-PIN DIP, 200 mA TYP. CURRENT LIMIT TYPE
2-ch Optical Coupled MOS FET
DESCRIPTION
The PS7141C-2A and PS7141CL-2A are solid state relays containing GaAs LEDs on the light emitting side (input
side) and MOS FETs including current control circuit on the output side. Current control circuit of OCMOS FET
protects this device from thermal breakdown and output circuit.
They are suitable for analog signal control because of their low offset and high linearity.
The PS7141CL-2A has a surface mount type lead.
FEATURES
• Limit current (ILMT = 170 to 250 mA)
• 2 channel type (1 a + 1 a output)
• Low LED operating current (IF = 2 mA)
• Designed for AC/DC switching line changer
• Small package (8-pin DIP)
• Low offset voltage
• PS7141CL-2A: Surface mount type
APPLICATIONS
• Exchange equipment
• Measurement equipment
• FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13861EJ6V0DS00 (6th edition)
Date Published December 1999 NS CP(K)
Printed in Japan
The mark • shows major revised points.
©
1998, 1999
PS7141C-2A,PS7141CL-2A
PACKAGE DIMENSIONS (in millimeters)
PS7141C-2A
9.25±0.5
TOP VIEW
8
7
6
5
1
2
3
4
1.
2.
3.
4.
5.
6.
7.
8.
LED Anode
LED Cathode
LED Anode
LED Cathode
MOS FET
MOS FET
MOS FET
MOS FET
1.
2.
3.
4.
5.
6.
7.
8.
LED Anode
LED Cathode
LED Anode
LED Cathode
MOS FET
MOS FET
MOS FET
MOS FET
7.62
3.3±0.3
3.5±0.3
4.15±0.3
6.5±0.5
0 to 15˚
0.5±0.1
1.34±0.1
0.25 M
2.54
PS7141CL-2A
9.25±0.5
TOP VIEW
8
7
6
5
1
2
3
4
3.5±0.3
0.10+0.10
–0.05
6.5±0.5
1.34±0.1
0.25 M
2
0.9±0.25
2.54
9.60±0.4
Data Sheet P13861EJ6V0DS00
PS7141C-2A,PS7141CL-2A
ORDERING INFORMATION
Part Number
PS7141C-2A
Package
Application Part Number
Packing Style
8-pin DIP
Magazine case 50 pcs
*1
PS7141C-2A
PS7141CL-2A
PS7141CL-2A
PS7141CL-2A-E3
Embossed Tape 1 000 pcs/reel
PS7141CL-2A-E4
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
5.0
V
PD
50
mW/ch
IFP
1
A
Break Down Voltage
VL
400
V
Continuous Load Current
IL
120
mA
ILP
120
mA
PD
375
mW/ch
BV
1 500
Vr.m.s.
Total Power Dissipation
PT
850
mW
Operating Ambient Temperature
TA
−40 to +80
°C
Storage Temperature
Tstg
−40 to +100
°C
Diode
Power Dissipation
Peak Forward Current
MOS FET
Pulse Load Current
*1
*2
(AC/DC Connection)
Power Dissipation
Isolation Voltage
*3
*1 PW = 100 µs, Duty Cycle = 1 %
*2 PW = 100 ms, 1 shot
*3 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
RECOMMENDED OPERATING CONDITIONS (TA = 25 °C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
LED Operating Current
IF
2
10
20
mA
LED Off Voltage
VF
0
0.5
V
Data Sheet P13861EJ6V0DS00
3
PS7141C-2A,PS7141CL-2A
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Diode
MOS FET
Coupled
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Off-state Leakage Current
ILoff
VD = 400 V
Output Capacitance
Cout
VD = 0 V, f = 1 MHz
LED On-state Current
IFon
IL = 120 mA
On-state Resistance
Ron1
IF = 10 mA, IL = 10 mA
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
5.0
µA
1.0
µA
0.03
65
pF/ch
2.0
mA
26
35
Ω
Ron2
IF = 10 mA, IL = 120 mA, t ≤ 10 ms
22
30
Turn-on Time
*1
ton
IF = 10 mA, VO = 5 V, PW ≥ 10 ms
0.6
2.0
Turn-off Time
*1
toff
0.03
1.0
ms
Ω
9
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
10
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
Limit Current
ILMT
IF = 10 mA, t = 5 ms, VL = 6 V
1.1
170
200
pF/ch
250
mA/ch
*1 Test Circuit for Switching Time
IF
Pulse Input
VL
50 %
Input
0
VO = 5 V
Input monitor
90 %
VO monitor
Output
Rin
RL
10 %
ton
4
Data Sheet P13861EJ6V0DS00
toff
PS7141C-2A,PS7141CL-2A
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
300
Maximum Load Current IL (mA)
Maximum Forward Current IF (mA)
100
80
60
40
20
0
–25
0
25
75 80
50
200
100
0
–25
100
0
25
75 80
50
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
1.8
100
200
1.6
1.4
Output Capacitance Cout (pF)
Forward Voltage VF (V)
f = 1 MHz
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1 mA
1.2
1.0
0.8
–25
0
25
50
75
150
100
50
0
100
20
40
60
80
100
120
Ambient Temperature TA (˚C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs.
APPLIED VOLTAGE
LOAD CURRENT vs. LOAD VOLTAGE
IF = 10 mA,
t = 5 ms
TA = 80 ˚C
10–6
Load Current IL (mA)
Off-state Leakage Current ILoff (A)
10–5
10–7
25 ˚C
10–8
200
100
–8.0
–4.0
0
4.0
8.0
–100
–200
10–9
0
100
200
300
400
500
Load Voltage VL (V)
Applied Voltage VD (V)
Data Sheet P13861EJ6V0DS00
5
PS7141C-2A,PS7141CL-2A
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
ON-STATE RESISTANCE DISTRIBUTION
30
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
IL = 10 mA
2.5
2.0
1.5
1.0
n = 50 pcs,
IF = 10 mA,
IL = 10 mA
25
Number (pcs)
Normalized On-state Resistance Ron
3.0
20
15
10
5
0.5
0.0
–25
0
25
50
75
0
100
25
26
Ambient Temperature TA (˚C)
On-state Resistance Ron (Ω)
TURN-ON TIME vs. FORWARD CURRENT
TURN-OFF TIME vs. FORWARD CURRENT
6
0.30
VO = 5 V
VO = 5 V
0.25
Turn-off Time toff (ms)
Turn-on Time ton (ms)
5
4
3
2
0.15
0.10
0.05
1
0
0.20
5
10
15
20
25
0
30
Forward Current IF (mA)
20
25
30
n = 50 pcs,
IF = 10 mA,
VO = 5 V
25
20
15
10
n = 50 pcs,
IF = 10 mA,
VO = 5 V
25
Number (pcs)
Number (pcs)
15
TURN-OFF TIME DISTRIBUTION
TURN-ON TIME DISTRIBUTION
20
15
10
5
5
0.6
0.7
0
Turn-on Time ton (ms)
6
10
Forward Current IF (mA)
30
0
5
0.03
0.06
Turn-off Time toff (ms)
Data Sheet P13861EJ6V0DS00
30
PS7141C-2A,PS7141CL-2A
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
3.0
Normalized Turn-off Time toff
Normalized Turn-on Time ton
3.0
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
NORMALIZED LIMIT CURRENT vs.
AMBIENT TEMPERTURE
Normalized Limit Current ILMT
3.0
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
t = 5 ms, VL = 6 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet P13861EJ6V0DS00
7
PS7141C-2A,PS7141CL-2A
TAPING SPECIFICATIONS (in millimeters)
4.3±0.2
10.3±0.1
7.5±0.1
1.55±0.1
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.3
10.4±0.1
1.55±0.1
12.0±0.1
Tape Direction
PS7141CL-2A-E3
PS7141CL-2A-E4
Outline and Dimensions (Reel)
1.5
R 1.0
φ 21.0±0.8
φ 80.0±5.0
φ 330
2.0±0.5
φ 13.0±0.5
16.4 +2.0
–0.0
Packing: 1 000 pcs/reel
8
Data Sheet P13861EJ6V0DS00
PS7141C-2A,PS7141CL-2A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C (package surface temperature)
• Time of temperature higher than 210 °C
30 seconds or less
• Number of reflows
Two
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Time (s)
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Data Sheet P13861EJ6V0DS00
9
PS7141C-2A,PS7141CL-2A
[MEMO]
10
Data Sheet P13861EJ6V0DS00
PS7141C-2A,PS7141CL-2A
[MEMO]
Data Sheet P13861EJ6V0DS00
11
PS7141C-2A,PS7141CL-2A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8