DATA SHEET SHEET DATA BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1652G SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT WIDE BAND AMPLIFIER DESCRIPTION PIN CONNECTIONS The µPC1652G is a silicon monolithic integrated circuit especially designed as a wide band amplifier convering HF band through UHF band. FEATURES • Excellent frequency response : 1 200 MHz TYP. @ 3 dB down INPUT 1 8 GND GND 2 7 VCC GND 3 6 VCC GND 4 5 OUTPUT • High power gain : 18 dB TYP. @ f = 500 MHz • Low voltage operation : VCC = 5 V • SOP package ABSOLUTE MAXIMUM RATINGS (TA = +25 °C) Supply Voltage VCC 7 V Total Power dissipation PD 440 mW Operating Ambient Temperature TA −20 to +75 °C Storage Temperature Tstg −40 to +125 °C ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 5 V) EQUIVALENT CIRCUIT VCC OUT IN CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS Circuit Current ICC 15 20 25 mA No signals Power Gain GP 16 18 20 dB f = 500 MHz Noise Figure NF 5.5 6.5 dB f = 500 MHz Band Width BW Isolation ISO 23 26 dB f = 500 MHz Input Return Loss S11 17 20 dB f = 500 MHz Output Return Loss S22 12 15 dB f = 500 MHz PO 3 5 Maximum Output Level 1000 1200 MHz 3 dB down below flat gain dBm f = 500 MHz GND NEC cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12443EJ5V0DS00 (5th edition) Date Published November 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1983, 1999 µPC1652G TYPICAL CHARACTERISTICS (TA = +25 °C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE INPUT POWER vs. OUTPUT POWER VCC = 5 V f = 500 MHz +5 PO-Output Power-dBm ICC-Circuit Current-mA 20 10 0 −5 0 1 2 3 4 VCC-Supply Voltage-V 5 6 −20 8 6 4 VCC = 5V 25 20 GP 15 NF 10 2 5 0 0 50 100 200 500 1000 f-Frequency-MHz 2000 ISOLATION vs. FREQUENCY VCC = 5V |S12|-Isolation-dB 0 −10 −20 −30 −40 50 2 100 200 500 1000 f-Frequency-MHz −10 INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY |S11|-Input Return Loss-dB |S22|-Output Return Loss-dB 10 GP-Power Gain-dB NF-Noise Figure-dB NOISE FIGURE AND POWER GAIN vs. FREQUENCY −15 Pin-Input Power-dBm 2000 Data Sheet P12443EJ5V0DS00 VCC = 5V 0 −10 |S11| −20 |S12| −30 −40 50 100 200 500 1000 f-Frequency-MHz 2000 µPC1652G PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (UNIT: mm) 8 5 detail of lead end +7˚ 3˚–3˚ 4 1 5.2 ± 0.2 6.5 ± 0.3 1.57 ± 0.2 4.4 ± 0.15 1.49 0.85 MAX. 1.27 +0.08 0.42 –0.07 1.1 ± 0.2 0.6 ± 0.2 +0.08 0.17 –0.07 0.10 0.12 M 0.1 ± 0.1 NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. Data Sheet P12443EJ5V0DS00 3 µPC1652G NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) The bypass capacitor should be attached to the VCC pin. (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPC1652G Soldering Method Soldering Conditions Recommended Condition Symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. Note (more than 210 °C), Time: 3 times, Limited days: no. IR35-00-3 VPS Package peak temperature: 215 °C, Hour: within 40 s. Note (more than 200 °C), Time: 3 times, Limited days: no. VP15-00-3 Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s. Note Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s/pin. Note Limited days: no. Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 4 Data Sheet P12443EJ5V0DS00 µPC1652G [MEMO] Data Sheet P12443EJ5V0DS00 5 µPC1652G [MEMO] 6 Data Sheet P12443EJ5V0DS00 µPC1652G [MEMO] Data Sheet P12443EJ5V0DS00 7 µPC1652G • The information in this document is subject to change without notice. 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Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8