NEC UPC2771TB

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
µPC2762TB,µPC2763TB,µPC2771TB
3 V, SUPER MINIMOLD SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
FOR MOBILE COMMUNICATIONS
DESCRIPTION
The µPC2762TB, µPC2763TB and µPC2771TB are silicon monolithic integrated circuits designed as amplifier for
mobile communications. Each of the ICs is packaged in super minimold package which is smaller than conventional
minimold. The µPC2762TB, µPC2763TB and µPC2771TB have compatible pin connections and performance to
µPC2762T, µPC2763T and µPC2771T of conventional minimold version. So, in the case of reducing your system
size, µPC2762TB, µPC2763TB and µPC2771TB are suitable to replace from µPC2762T, µPC2763T and µPC2771T.
These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
• Supply voltage
: VCC = 2.7 to 3.3 V
• Medium output power
: µPC2762TB: PO(1 dB) = +8.0 dBm TYP. @ 0.9 GHz
µPC2763TB: PO(1 dB) = +9.5 dBm TYP. @ 0.9 GHz
µPC2771TB: PO(1 dB) = +11.5 dBm TYP. @ 0.9 GHz
: µPC2762TB: GP = 13 dB TYP. @ 0.9 GHz
• Power gain
µPC2763TB: GP = 20 dB TYP. @ 0.9 GHz
µPC2771TB: GP = 21 dB TYP. @ 0.9 GHz
APPLICATIONS
• Buffer amplifiers for mobile telephones : µPC2762TB, µPC2763TB
: µPC2771TB
• PA driver for PDC800M
ORDERING INFORMATION
Part Number
Package
µPC2762TB-E3
µPC2763TB-E3
Marking
C1Z
6-pin super minimold
µPC2771TB-E3
C2A
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforation side of the tape.
Qty 3 kp/reel.
C2H
Remark To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order: µPC2762TB, µPB2763TB, µPC2771TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12710EJ2V0DS00 (2nd edition)
Date Published June 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1997, 1999
µPC2762TB, µPC2763TB, µPC2771TB
PIN CONNECTIONS
3
2
1
C1Z
(Top View)
(Bottom View)
4
4
3
5
5
2
6
6
1
Marking is an example of µPC2762TB
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP (TA = +25 °C, VCC = Vout = 3.0 V, ZL = ZS = 50 Ω)
Part No.
µPC2762T
fu
(GHz)
PO (1 dB)
(dBm)
PO (sat)
(dBm)
GP
(dB)
ICC
(mA)
2.9
+8.0
+9.0
13
26.5
6-pin minimold
6-pin super minimold
2.7
+9.5
+11.0
20
27.0
6-pin minimold
C2A
µPC2763TB
µPC2771T
6-pin super minimold
2.2
+11.5
+12.5
21
36.0
6-pin minimold
C2H
µPC2771TB
6-pin super minimold
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Notice The package size distinguishes between minimold and super minimold.
2
Marking
C1Z
µPC2762TB
µPC2763T
Package
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
SYSTEM APPLICATION EXAMPLE
Digital cellular telephone
RX
DEMO
I
Q
÷N
PLL
SW
PLL
I
0°
Phase
shifter
TX
PA
90 °
µ PC2762TB
or
µ PC2763TB
µ PC2771TB
Q
Note The insertion point is different due to the specifications of conjunct devices.
For conjunction with your devices, refer to the data sheets to confirm their conbination.
Data Sheet P12710EJ2V0DS00
3
µPC2762TB, µPC2763TB, µPC2771TB
PIN EXPLANATION
Pin
No.
1
Pin Name
INPUT
Applied
Voltage
(V)
Pin
Voltage
–
1.31
1.01
0.97
4
6
2
3
5
OUTPUT
VCC
GND
Voltage
as same
as VCC
through
external
inductor
2.7 to 3.3
0
Function and Applications
Internal Equivalent Circuit
Note
(V)
–
Signal input pin. A internal
matching circuit, configured with
resistors, enables 50 Ω
connection over a wide band.
A multi-feedback circuit is
designed to cancel the
deviations of hFE and resistance.
This pin must be coupled to
signal source with capacitor for
DC cut.
Signal output pin. The inductor
must be attached between VCC
and output pins to supply
current to the internal output
transistors.
6
4
1
*
–
–
Power supply pin, which biases
the internal input transistor.
This pin should be externally
equipped with bypass capacitor
to minimize its impedance.
Ground pin. This pin should be
connected to system ground
with minimum inductance.
Ground pattern on the board
should be formed as wide as
possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
3
GND
2
5
GND
* µ PC2762TB does not have
this capacitance.
Note Pin voltage is measured at VCC = 3.0 V. Above: µPC2762TB, Center: µPC2763TB, Below: µPC2771TB.
4
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
ABSOLUTE MAXIMUM RATINGS
Ratings
Parameter
Symbol
Conditions
Supply Voltage
VCC
TA = +25 °C, pin 4 and 6
Total Circuit Current
ICC
TA = +25 °C
Power Dissipation
PD
Mounted on double copper clad
50 × 50 × 1.6 mm epoxy glass PWB
TA = +85 °C
Operating Ambient
Temperature
µPC2762TB
µPC2763TB
µPC2771TB
3.6
Unit
V
70
77.7
mA
200
mW
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Input Power
Pin
TA = +25 °C
+10
+13
dBm
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Remark
Supply Voltage
VCC
2.7
3.0
3.3
V
Same voltage should be applied to pin
4 and 6.
Operating Ambient
Temperature
TA
−40
+25
+85
°C
−
Operating Frequency
fopt
0.8
−
1.9
GHz
Data Sheet P12710EJ2V0DS00
Only for µPC2771TB
5
µPC2762TB, µPC2763TB, µPC2771TB
ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = Vout = 3.0 V, ZL = ZS = 50 Ω)
µPC2762TB, µPC2763TB
µPC2762TB
Parameter
Symbol
µPC2763TB
Test Conditions
Unit
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
−
26.5
35.0
−
27.0
35.0
mA
Circuit Current
ICC
No signal
Power Gain
GP
f = 0.9 GHz
f = 1.9 GHz
11
11.5
13
15.5
16
17.5
18
18
20
21
23
24
dB
Noise Figure
NF
f = 0.9 GHz
f = 1.9 GHz
−
−
6.5
7.0
8.0
9.0
−
−
5.5
5.5
7.0
7.5
dB
3 dB down below
from gain at
f = 0.1 GHz
2.7
2.9
−
2.3
2.7
−
GHz
Upper Limit Operating
Frequency
fu
Isolation
ISL
f = 0.9 GHz
f = 1.9 GHz
22
20
27
25
−
−
25
24
30
29
−
−
dB
Input Return Loss
RLin
f = 0.9 GHz
f = 1.9 GHz
6.0
5.5
9.0
8.5
−
−
8.0
8.0
11.0
11.0
−
−
dB
Output Return Loss
RLout
f = 0.9 GHz
f = 1.9 GHz
8.0
9.0
11.0
12.0
−
−
5.0
6.0
7.0
9.0
−
−
dB
1 dB Gain Compression Output Level
PO (1 dB)
f = 0.9 GHz
f = 1.9 GHz
+5.5
+4.5
+8.0
+7.0
−
−
+7.0
+4.0
+9.5
+6.5
−
−
dBm
µPC2771TB
µPC2771TB
Parameter
Test Conditions
Unit
MIN.
TYP.
MAX.
Circuit Current
ICC
No signal
−
36.0
45.0
mA
Power Gain
GP
f = 0.9 GHz
f = 1.5 GHz
19
18
21
21
24
24
dB
Noise Figure
NF
f = 0.9 GHz
f = 1.5 GHz
−
−
6.0
6.0
7.5
7.5
dB
3 dB down below from gain at f = 0.1 GHz
1.8
2.2
−
GHz
Upper Limit Operating
Frequency
6
Symbol
fu
Isolation
ISL
f = 0.9 GHz
f = 1.5 GHz
25
25
30
30
−
−
dB
Input Return Loss
RLin
f = 0.9 GHz
f = 1.5 GHz
10
10
14
14
−
−
dB
Output Return Loss
RLout
f = 0.9 GHz
f = 1.5 GHz
6.5
5.5
9.0
8.5
−
−
dB
1 dB Gain CompresSion Output Level
PO (1 dB)
f = 0.9 GHz
f = 1.5 GHz
+9.0
+7.0
+11.5
+9.5
−
−
dBm
Saturated Output
Power Level
PO (sat)
f = 0.9 GHz
f = 1.5 GHz
−
−
+12.5
+11
−
−
dBm
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, VCC = Vout = 3.0 V, ZL = ZS = 50 Ω)
µPC2762TB, µPC2763TB
Reference
Parameter
Saturated
Output Power
Level
Adjacent channel
power
Symbol
PO (sat)
Padj
µPC2762TB
Test Conditions
µPC2763TB
Unit
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
−
−
+9.0
+8.5
−
−
−
−
+11.0
+8.0
−
−
dBm
∆f = ±50 kHz
∆f = ±100 kHz
−
−
−64
−64
−
−
−
−
−61
−62
−
−
dBc
2 sine wave input.
Output of each tone
f1 = 0.900 GHz
f2 = 0.902 GHz
−
−16
−
−
−27
−
dBc
PO (each) = +4 dBm
f1 = 1.900 GHz
f2 = 1.902 GHz
−
−10
−
−
−14
−
dBc
f = 0.9 GHz
f = 1.9 GHz
f = 0.9 GHz
Note
π/4 QPSK wave
PO = +4 dBm
Third order
intermodulation
IM3
distortion
µPC2771TB
Reference
Parameter
Adjacent channel
power 1
Symbol
Padj1
µPC2771TB
Test Conditions
Unit
MIN.
TYP.
MAX.
∆f = ±50 kHz
∆f = ±100 kHz
−
−
−61
−72
−
−
dBc
∆f = ±50 kHz
∆f = ±100 kHz
−
−
−59
−71
−
−
dBc
2 sine wave input.
Output of each tone
f1 = 0.900 GHz
f2 = 0.902 GHz
−
−18
−
dBc
PO (each) = +7 dBm
f1 = 1.500 GHz
f2 = 1.502 GHz
−
−12
−
dBc
f = 0.9 GHz
Note
π/4 QPSK wave
PO = +7 dBm
Adjacent channel
power 2
Padj2
f = 1.5 GHz
Note
π/4 QPSK wave
PO = +7 dBm
Third order
intermodulation
distortion
IM3
Note π/4 DQPSK modulated wave input, data rate 42 kbps, Filter roll off α = 0.5, PN 9
Data Sheet P12710EJ2V0DS00
7
µPC2762TB, µPC2763TB, µPC2771TB
TEST CIRCUIT
VCC
1 000 pF
C3
L
6
50 Ω
C1
IN
C2
4
1
50 Ω
OUT
1 000 pF
1 000 pF
2, 3, 5
COMPONENTS OF TEST CIRCUIT
EXAMPLE OF ACTUAL APPLICATION COMPONENTS
FOR MEASURING ELECTRICAL
CHARACTERISTICS
Type
Value
C1, C2
Bias Tee
1 000 pF
C3
Capacitor
1 000 pF
L
Bias Tee
1 000 nH
Type
Value
Operating Frequency
C1 to C3
Chip capacitor
1 000 pF
100 MHz or higher
L
Chip inductor
100 nH
100 MHz or higher
10 nH
2.0 GHz or higher
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor make output-port-impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
For above reason, select an inductance of 100 Ω or over impedance in the operating frequency. The gain is a
peak in the operating frequency band, and suppressed at lower frequencies.
The recommendable inductance can be chosen from example of actual application components list as shown
above.
CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors
for the input and output pins.
The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias
can be supplied against Vcc fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2πRfc).
8
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
3
Top View
1
2
IN
OUT
C
C
6
L
5
4
C
1Z
→
Mounting direction
(Marking is an example for PC2762TB)
VCC
C
COMPONENT LIST
Notes
1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.
Value
2. Back side: GND pattern
C
1 000 pF
3. Solder plated on pattern
L
Example: 10 nH
4.
: Through holes
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF
SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E).
Data Sheet P12710EJ2V0DS00
9
µPC2762TB, µPC2763TB, µPC2771TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C)
− µPC2762TB −
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
50
50
No signal
VCC = 3.0 V
No signal
40
Circuit Current ICC (mA)
Circuit Current ICC (mA)
40
30
20
10
30
20
10
1
2
3
Supply Voltage VCC (V)
0
0
–60 –40 –20
4
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
18
VCC = 3.3 V
Insertion Power Gain GP (dB)
6
Insertion Power Gain GP (dB)
Noise Figure NF (dB)
18
8
VCC = 3.0 V
16
GP
14
VCC = 2.7 V
12
10
8
6
+20 +40 +60 +80 +100
INSERTION POWER GAIN vs. FREQUENCY
20
10
0
Operating Ambient Temperature TA (°C)
NF
4
4
2
2
0.1
VCC = 3.3 V
16
TA = +85 °C
14
TA = +25 °C
12
TA = –40 °C
10
VCC = 2.7 V
VCC = 3.0 V
VCC = 3.0 V
0.3
1.0
8
0.1
3.0
Frequency f (GHz)
0.3
1.0
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
0
3.0
0
VCC = 3.0 V
VCC = 3.0 V
Input Return Loss RLin (dB)
Output Return Loss RLout (dB)
RLin
Isolation ISL (dB)
–10
–20
–30
–40
0.1
10
1.0
0.3
Frequency f (GHz)
3.0
–10
RLout
–20
–30
–40
0.1
0.3
1.0
Frequency f (GHz)
Data Sheet P12710EJ2V0DS00
3.0
µPC2762TB, µPC2763TB, µPC2771TB
− µPC2762TB −
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+15
+15
VCC = 3.0 V
f = 0.9 GHz
Output Power Pout (dBm)
Output Power Pout (dBm)
VCC = 3.3 V
+5
VCC = 2.7 V
0
–5
TA = –40 °C
+5
0
–5
–15
–10
–5
0
–10
–20
+5
–15
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
f = 1.9 GHz
VCC = 3.0 V
VCC = 3.0 V
+10
Output Power Pout (dBm)
Output Power Pout (dBm)
+5
0
OUTPUT POWER vs. INPUT POWER
+10
VCC = 3.3 V
+5
VCC = 2.7 V
0
–5
TA = +85 °C
TA = +25 °C
+5
TA = –40 °C
0
–5
–15
–10
–5
–10
–20
+5
0
Input Power Pin (dBm)
–10
–5
Input Power Pin (dBm)
SATURATED OUTPUT POWER vs.
FREQUENCY
SATURATED OUTPUT POWER vs.
FREQUENCY
+13
–15
0
+5
+13
Pin = +3 dBm
Pin = +3 dBm
Saturated Output Power PO (sat) (dBm)
VCC = 3.3 V
Saturated Output Power PO (sat) (dBm)
–5
+15
f = 1.9 GHz
+11
VCC = 3.0 V
+9
VCC = 2.7 V
+7
+5
+3
0.1
–10
Input Power Pin (dBm)
+15
–10
–20
TA = +25 °C
+10
+10
–10
–20
TA = +85 °C
f = 0.9 GHz
VCC = 3.0 V
TA = +25 °C
+11
TA = +85 °C
+9
TA = –40 °C
+7
+5
+3
1.0
0.3
Frequency f (GHz)
3.0
0.1
Data Sheet P12710EJ2V0DS00
0.3
1.0
Frequency f (GHz)
3.0
11
µPC2762TB, µPC2763TB, µPC2771TB
− µPC2762TB −
–60
f1 = 0.900 GHz
f2 = 0.902 GHz
–50
VCC = 3.3 V
–40
VCC = 3.0 V
–30
VCC = 2.7 V
–20
–10
0
–15
–10
–5
0
+5
Output Power of Each Tone PO (each) (dBm)
12
+10
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
Third Order Intermodulation Distortion IM3 (dBc)
Third Order Intermodulation Distortion IM3 (dBc)
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
–60
f1 = 1.900 GHz
f2 = 1.902 GHz
–50
VCC = 3.3 V
–40
VCC = 3.0 V
–30
VCC = 2.7 V
–20
–10
0
–15
–10
–5
0
+5
Output Power of Each Tone PO (each) (dBm)
Data Sheet P12710EJ2V0DS00
+10
µPC2762TB, µPC2763TB, µPC2771TB
S-PARAMETER (TA = +25 °C, VCC = Vout = 3.0 V)
− µPC2762TB −
S11-FREQUENCY
0.1 G
2.0 G
3.0 G
S22-FREQUENCY
3.0 G
0.1G
2.0 G
1.0 G
Data Sheet P12710EJ2V0DS00
13
µPC2762TB, µPC2763TB, µPC2771TB
TYPICAL S-PARAMETER VALUES (TA = +25 °C)
µPC2762TB
VCC = Vout = 3.0 V, ICC = 29 mA
FREQUENCY
MHz
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
200.0000
300.0000
400.0000
500.0000
600.0000
700.0000
800.0000
900.0000
1000.0000
1100.0000
1200.0000
1300.0000
1400.0000
1500.0000
1600.0000
1700.0000
1800.0000
1900.0000
2000.0000
2100.0000
2200.0000
2300.0000
2400.0000
2500.0000
2600.0000
2700.0000
2800.0000
2900.0000
3000.0000
3100.0000
0.338
0.346
0.348
0.340
0.329
0.324
0.341
0.359
0.378
0.375
0.363
0.353
0.357
0.377
0.402
0.414
0.426
0.434
0.448
0.463
0.483
0.492
0.492
0.486
0.489
0.500
0.511
0.511
0.494
0.465
0.441
−1.3
−2.0
−1.2
−1.9
−3.1
−6.2
−8.1
−7.6
−6.5
−5.1
−5.2
−6.7
−8.8
−11.7
−12.7
−13.2
−13.6
−16.1
−19.0
−21.7
−23.9
−25.8
−29.7
−34.6
−40.4
−44.6
−48.5
−50.4
−52.9
−55.9
−60.6
4.560
4.581
4.616
4.661
4.689
4.726
4.844
4.927
5.057
5.179
5.306
5.400
5.567
5.706
5.820
5.987
6.081
6.182
6.229
6.328
6.382
6.431
6.424
6.329
6.146
5.997
5.822
5.693
5.553
5.334
5.157
−3.4
−7.6
−11.3
−15.8
−19.5
−23.6
−27.4
−31.5
−35.8
−41.0
−45.9
−51.0
−56.5
−61.7
−68.0
−73.7
−80.1
−86.7
−93.2
−99.7
−106.7
−113.8
−121.2
−128.8
−136.1
−143.1
−149.9
−157.0
−163.0
−169.5
−175.5
0.039
0.039
0.039
0.040
0.040
0.041
0.042
0.043
0.044
0.045
0.047
0.047
0.048
0.049
0.052
0.052
0.055
0.056
0.057
0.057
0.058
0.058
0.060
0.060
0.062
0.061
0.064
0.066
0.065
0.065
0.066
1.0
2.7
6.8
8.1
11.6
13.7
15.8
18.1
19.3
20.3
22.1
23.7
26.1
24.5
26.7
26.8
29.0
28.2
28.5
28.0
28.5
29.0
30.1
30.2
31.1
32.1
31.4
34.0
33.8
35.5
35.5
0.310
0.311
0.302
0.296
0.290
0.292
0.291
0.292
0.284
0.280
0.285
0.288
0.288
0.285
0.282
0.285
0.288
0.291
0.286
0.282
0.282
0.282
0.278
0.268
0.260
0.251
0.248
0.237
0.222
0.203
0.189
−5.5
−9.5
−12.3
−16.2
−20.2
−24.1
−26.2
−28.3
−30.9
−35.3
−40.0
−43.4
−45.7
−47.9
−52.8
−58.1
−62.0
−66.1
−70.4
−76.2
−81.5
−86.9
−91.7
−98.4
−104.5
−111.3
−116.7
−121.5
−128.3
−134.5
−141.1
14
S11
S21
S12
Data Sheet P12710EJ2V0DS00
S22
K
2.23
2.20
2.20
2.18
2.20
2.12
2.01
1.90
1.77
1.72
1.64
1.62
1.54
1.44
1.32
1.27
1.18
1.14
1.09
1.07
1.01
0.99
0.99
1.01
1.02
1.05
1.03
1.04
1.11
1.20
1.27
µPC2762TB, µPC2763TB, µPC2771TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C)
− µPC2763TB −
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
50
50
No signal
VCC = 3.0 V
No signal
40
Circuit Current ICC (mA)
Circuit Current ICC (mA)
40
30
20
10
30
20
10
0
1
2
3
Supply Voltage VCC (V)
0
–60 –40 –20
4
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
24
TA
T
A =
=+85
+85°C
°C
22
GP
Insertion Power Gain GP (dB)
5
Insertion Power Gain GP (dB)
6
20
VCC
V
CC ==3.0
3.0V
VCC
V
CC ==2.7
2.7V
14
VCC
V
CC ==3.3
3.3V
12
10
TA
T
A =
=+25
+25°C
°C
TA
T
A =
=–40
–40°C
°C
20
TA
A =
=+25
+25°C
°C
18 T
TA
T
A =
=+85
+85°C
°C
TA
T
A =
=–40
–40°C
°C
16
14
12
10
NF
8
4
3
8
VCC
V
CC ==3.0
3.0V
6
0.1
VCC
V
CC ==2.7
2.7V
VCC = 3.0 V
6
1.0
0.3
Frequency f (GHz)
3.0
0.1
1.0
0.3
Frequency f (GHz)
0
0
VCC = 3.0 V
RLo
RL
out
Input Return Loss RLin (dB)
Output Return Loss RLout (dB)
–10
–20
–30
–40
–50
0.1
3.0
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
ISOLATION vs. FREQUENCY
Isolation ISL (dB)
Noise Figure NF (dB)
7
+80 +100
INSERTION POWER GAIN vs. FREQUENCY
VCC
V
CC ==3.3
3.3V
16
+20 +40 +60
24
22
18
0
Operating Ambient Temperature TA (°C)
0.3
1.0
3.0
VCC = 3.0 V
–10
–20
RLin
–30
–40
0.1
Frequency f (GHz)
0.3
1.0
3.0
Frequency f (GHz)
Data Sheet P12710EJ2V0DS00
15
µPC2762TB, µPC2763TB, µPC2771TB
− µPC2763TB −
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+15
+15
VCC = 3.3 V
+10
Output Power Pout (dBm)
Output Power Pout (dBm)
+10
VCC = 3.0 V
+5
VCC = 2.7 V
0
–5
–10
–25
TA = –40 °C
TA = –40 °C
+5
TA = +25 °C
0
TA = +85 °C
–5
–20
–15
–10
–5
–10
–25
0
–20
Input Power Pin (dBm)
–15
–10
–5
0
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+15
+15
f = 1.9 GHz
TA = +85 °C
f = 1.9 GHz
VCC = 3.0 V
VCC = 3.3 V
VCC = 3.0 V
+10
Output Power Pout (dBm)
+10
Output Power Pout (dBm)
TA = +85 °C
f = 0.9 GHz
VCC = 3.0 V
f = 0.9 GHz
VCC = 2.7 V
+5
0
TA = –40 °C
+5
TA = +25 °C
TA = –40 °C
0
TA = +85 °C
–5
–5
TA = +25 °C
–10
–25
–20
–15
–10
–5
Input Power Pin (dBm)
–10
–25
0
SATURATED OUTPUT POWER vs.
FREQUENCY
VCC = 3.3 V
+13
+11
VCC = 3.0 V
+9
+7
VCC = 2.7 V
+5
0.3
1.0
3.0
Saturated Output Power PO (sat) (dBm)
Saturated Output Power PO (sat) (dBm)
0
+15
Pin = –3 dBm
TA = +85 °C
Pin = –3 dBm
+13
+11
TA = +25 °C
+9
TA = –40 °C
+7
+5
+3
0.1
Frequency f (GHz)
16
–15
–10
–5
Input Power Pin (dBm)
SATURATED OUTPUT POWER vs.
FREQUENCY
+15
+3
0.1
–20
0.3
1.0
Frequency f (GHz)
Data Sheet P12710EJ2V0DS00
3.0
µPC2762TB, µPC2763TB, µPC2771TB
− µPC2763TB −
–60
f1 = 0.900 GHz
f2 = 0.902 GHz
–50
VCC = 3.3 V
VCC = 3.0 V
–40
VCC = 2.7 V
–30
–20
–10
0
–15
–10
–5
0
+5
Output Power of Each Tone PO (each) (dBm)
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
Third Order Intermodulation Distortion IM3 (dBc)
Third Order Intermodulation Distortion IM3 (dBc)
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
+10
–60
f1 = 1.900 GHz
f2 = 1.902 GHz
–50
VCC = 3.3 V
–40
VCC = 3.0 V
–30
VCC = 2.7 V
–20
–10
0
–15
–10
–5
0
+5
+10
Output Power of Each Tone PO (each) (dBm)
Data Sheet P12710EJ2V0DS00
17
µPC2762TB, µPC2763TB, µPC2771TB
S-PARAMETER (TA = +25 °C, VCC = Vout = 3.0 V)
− µPC2763TB −
S11-FREQUENCY
0.1 G
1.0 G
3.0 G
2.0 G
S22-FREQUENCY
3.0 G
0.1 G
2.0 G
1.0 G
18
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
TYPICAL S-PARAMETER VALUES (TA = +25 °C)
µPC2763TB
VCC = Vout = 3.0 V, ICC = 28 mA
FREQUENCY
MHz
MAG.
S11
ANG.
MAG.
S21
ANG.
MAG.
S12
ANG.
MAG.
ANG.
100.0000
200.0000
300.0000
400.0000
500.0000
600.0000
700.0000
800.0000
900.0000
1000.0000
1100.0000
1200.0000
1300.0000
1400.0000
1500.0000
1600.0000
1700.0000
1800.0000
1900.0000
2000.0000
2100.0000
2200.0000
2300.0000
2400.0000
2500.0000
2600.0000
2700.0000
2800.0000
2900.0000
3000.0000
3100.0000
0.231
0.242
0.250
0.245
0.242
0.241
0.263
0.291
0.316
0.322
0.318
0.309
0.322
0.344
0.371
0.380
0.388
0.378
0.378
0.375
0.369
0.351
0.331
0.306
0.300
0.294
0.290
0.270
0.248
0.219
0.198
−1.4
−0.2
2.7
2.8
2.0
−2.2
−5.3
−5.6
−5.1
−4.0
−5.4
−9.0
−14.2
−20.6
−23.7
−27.5
−30.6
−36.4
−42.1
−46.6
−50.5
−53.8
−59.8
−66.4
−73.1
−75.8
−77.1
−77.7
−78.7
−82.3
−88.7
10.210
10.305
10.464
10.655
10.863
11.093
11.544
11.843
12.291
12.676
13.066
13.311
13.661
13.845
13.824
13.890
13.634
13.236
12.724
12.290
11.707
11.130
10.524
9.824
9.152
8.583
8.029
7.610
7.240
6.827
6.516
−3.8
−8.5
−12.9
−18.2
−22.8
−28.1
−33.2
−39.0
−45.1
−52.4
−59.8
−67.3
−75.8
−83.9
−93.0
−101.5
−110.5
−119.6
−127.9
−136.1
−144.0
−151.7
−159.1
−165.9
−172.3
−178.2
176.2
170.6
166.1
161.2
156.9
0.023
0.023
0.024
0.024
0.026
0.027
0.028
0.029
0.029
0.030
0.031
0.031
0.033
0.033
0.035
0.035
0.036
0.035
0.035
0.035
0.035
0.036
0.036
0.034
0.035
0.034
0.035
0.037
0.039
0.039
0.040
2.4
7.8
9.3
13.4
16.1
19.9
22.3
22.5
23.9
25.6
24.1
27.0
28.8
28.5
30.1
28.1
29.2
29.9
30.9
32.9
33.0
35.7
36.8
38.7
40.1
43.8
46.3
47.7
51.1
53.6
55.1
0.406
0.412
0.407
0.407
0.405
0.414
0.419
0.424
0.424
0.425
0.438
0.442
0.441
0.434
0.435
0.439
0.439
0.428
0.411
0.393
0.385
0.373
0.359
0.336
0.321
0.306
0.299
0.288
0.270
0.253
0.244
−4.1
−7.5
−9.9
−13.9
−17.6
−21.6
−24.6
−27.7
−31.9
−37.1
−42.5
−47.8
−51.2
−56.0
−62.2
−68.9
−74.6
−81.3
−87.0
−93.4
−99.6
−104.9
−110.3
−117.5
−123.3
−129.4
−133.9
−138.6
−143.6
−150.1
−156.2
Data Sheet P12710EJ2V0DS00
S22
K
1.68
1.66
1.58
1.55
1.44
1.37
1.25
1.16
1.09
1.02
0.96
0.96
0.90
0.87
0.82
0.80
0.78
0.84
0.89
0.94
0.99
1.06
1.13
1.31
1.41
1.55
1.58
1.63
1.67
1.79
1.88
19
µPC2762TB, µPC2763TB, µPC2771TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C)
− µPC2771TB −
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
50
50
No signal
VCC = 3.0 V
No signal
40
Circuit Current ICC (mA)
Circuit Current ICC (mA)
40
30
20
30
20
10
10
0
1
2
0
–60 –40 –20
4
3
Supply Voltage VCC (V)
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
INSERTION POWER GAIN vs. FREQUENCY
TA = –40 °C
TA = +25 °C
20
Insertion Power Gain GP (dB)
Insertion Power Gain GP (dB)
Noise Figure NF (dB)
5
VCC = 3.3 V
VCC = 2.7 V VCC = 3.0 V
22
6
+20 +40 +60 +80 +100
24
24
7
0
Operating Ambient Temperature TA (°C)
GP
VCC = 3.3 V
18
VCC = 3.0 V
16
VCC = 2.7 V
14
VCC = 3.3 V
12
10
NF
4
8
3
6
0.1
VCC = 3.0 V
22
TA = +85 °C
20
18
16
VCC = 2.7 V
0.3
VCC = 3.0 V
1.0
14
0.1
3.0
0.3
1.0
Frequency f (GHz)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
0
0
–10
Isolation ISL (dB)
VCC = 3.0 V
Input Return Loss RLin (dB)
Outpur Return Loss RLout (dB)
VCC = 3.0 V
–20
–30
–40
0.1
RLout
–10
–20
RLin
–30
–40
0.3
1.0
3.0
0.1
Frequency f (GHz)
20
3.0
0.3
1.0
Frequency f (GHz)
Data Sheet P12710EJ2V0DS00
3.0
µPC2762TB, µPC2763TB, µPC2771TB
− µPC2771TB −
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+15
+15
VCC = 3.3 V
Output Power Pout (dBm)
Output Power Pout (dBm)
+10
VCC = 2.7 V
+5
TA = +85 °C
f = 0.9 GHz
VCC = 3.0 V
f = 0.9 GHz
VCC = 3.0 V
0
+10
TA = –40 °C
TA = +25 °C
+5
TA = +25 °C
TA = –40 °C
0
TA = +85 °C
–5
–5
–25
–20
–15
–10
–5
0
–25
–20
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
–5
0
+15
f = 1.5 GHz
VCC = 3.3 V
TA = +85 °C
f = 1.5 GHz
VCC = 3.0 V
Output Power Pout (dBm)
+10
Output Power Pout (dBm)
–10
OUTPUT POWER vs. INPUT POWER
+15
VCC = 2.7 V
+5
VCC = 3.0 V
0
TA = +25 °C
+10
TA = –40 °C
+5
TA = +25 °C
0
–5
TA = –40 °C
–10
TA = +85 °C
–5
–25
–20
–15
–10
–5
Input Power Pin (dBm)
–25
0
OUTPUT POWER vs. INPUT POWER
–20
–15
–10
–5
Input Power Pin (dBm)
0
OUTPUT POWER vs. INPUT POWER
+15
+15
f = 1.9 GHz
f = 1.9 GHz
VCC = 3.0 V
VCC = 3.3 V
+10
TA = +85 ˚C
+10
Output Power Pout (dBm)
Output Power Pout (dBm)
–15
Input Power Pin (dBm)
VCC = 3.0 V
+5
VCC = 2.7 V
0
–5
TA = +25 ˚C
TA = –40 ˚C
+5
0
–5
–10
–10
–25
–20
–15
–10
–5
Input Power Pin (dBm)
0
–25
Data Sheet P12710EJ2V0DS00
–20
–15
–10
–5
0
Input Power Pin (dBm)
21
µPC2762TB, µPC2763TB, µPC2771TB
− µPC2771TB −
SATURATED OUTPUT POWER vs.
FREQUENCY
SATURATED OUTPUT POWER vs.
FREQUENCY
+17
Pin = –3 dBm
+15
VCC = 3.3 V
+13
VCC = 3.0 V
+11
VCC = 2.7 V
+9
+7
Saturated Output Power PO (sat) (dBm)
Saturated Output Power PO (sat) (dBm)
+17
+5
0.3
+11
TA= –40 °C
+9
+7
3.0
1.0
0.1
0.3
1.0
3.0
Frequency f (GHz)
Frequency f (GHz)
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
THIRD ORDER INTERMODULATION DISTORTION vs.
OUTPUT POWER OF EACH TONE
–60
f1 = 0.900 GHz
f2 = 0.902 GHz
–50
VCC = 3.3 V
–40
–30
VCC = 3.0 V
VCC = 2.7 V
–20
–10
0
–15
+5
–10
0
–5
+10
Output Power of Each Tone PO (each) (dBm)
Third Order Intermodulation Distortion IM3 (dBc)
Third Order Intermodulation Distortion IM3 (dBc)
TA= +85 °C
+13
+5
0.1
22
Pin = –3 dBm
TA= +25 °C
+15
–60
f1 = 1.500 GHz
f2 = 1.502 GHz
–50
VCC = 3.3 V
–40
VCC = 3.0 V
VCC = 2.7 V
–30
–20
–10
0
–15
+5
–10
–5
0
+10
Output Power of Each Tone PO (each) (dBm)
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
S-PARAMETER (TA = +25 °C, VCC = Vout = 3.0 V)
− µPC2771TB −
S11-FREQUENCY
0.1 G
2.0 G
3.0 G
S22-FREQUENCY
3.0 G
0.1G
2.0 G
Data Sheet P12710EJ2V0DS00
23
µPC2762TB, µPC2763TB, µPC2771TB
TYPICAL S-PARAMETER VALUES (TA = +25 °C)
µPC2771TB
VCC = Vout = 3.0 V, ICC = 35 mA
FREQUENCY
MHz
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
200.0000
300.0000
400.0000
500.0000
600.0000
700.0000
800.0000
900.0000
1000.0000
1100.0000
1200.0000
1300.0000
1400.0000
1500.0000
1600.0000
1700.0000
1800.0000
1900.0000
2000.0000
2100.0000
2200.0000
2300.0000
2400.0000
2500.0000
2600.0000
2700.0000
2800.0000
2900.0000
3000.0000
3100.0000
0.045
0.057
0.075
0.090
0.105
0.118
0.138
0.163
0.186
0.202
0.219
0.233
0.252
0.267
0.285
0.293
0.304
0.290
0.285
0.273
0.267
0.254
0.237
0.221
0.212
0.208
0.202
0.190
0.178
0.154
0.147
19.7
37.0
41.3
43.3
42.2
40.2
34.9
32.5
29.4
26.3
21.7
15.4
8.4
−0.1
−6.8
−13.9
−20.9
−28.1
−35.3
−41.8
−47.4
−51.6
−57.1
−61.1
−68.8
−72.2
−74.1
−76.3
−76.7
−82.3
−88.0
10.570
10.638
10.775
11.004
11.275
11.586
12.041
12.367
12.844
13.300
13.771
14.082
14.365
14.336
14.142
13.929
13.428
12.722
11.966
11.232
10.500
9.815
9.168
8.570
7.967
7.507
7.004
6.667
6.336
6.003
5.772
−4.7
−9.5
−14.1
−19.4
−24.4
−30.0
−35.9
−42.1
−48.8
−56.6
−64.6
−73.5
−83.2
−92.6
−102.4
−112.0
−121.6
−131.0
−139.6
−147.5
−154.8
−161.7
−168.0
−173.7
−179.7
174.9
170.0
164.7
160.7
155.6
151.3
0.028
0.028
0.029
0.030
0.030
0.031
0.031
0.032
0.032
0.032
0.033
0.033
0.036
0.036
0.036
0.037
0.039
0.038
0.038
0.038
0.039
0.040
0.041
0.041
0.042
0.043
0.045
0.047
0.051
0.051
0.054
0.8
5.0
8.6
11.1
14.9
15.8
19.8
20.1
23.2
23.9
24.9
26.6
28.8
30.0
32.0
31.6
32.5
34.7
36.1
37.4
39.1
41.4
43.7
48.3
48.3
50.8
53.7
54.2
57.7
56.5
59.3
0.327
0.325
0.323
0.326
0.331
0.342
0.350
0.359
0.361
0.371
0.389
0.400
0.405
0.402
0.406
0.413
0.414
0.401
0.387
0.378
0.366
0.356
0.342
0.325
0.322
0.314
0.309
0.303
0.292
0.287
0.279
−6.2
−11.5
−16.2
−20.9
−26.4
−32.0
−37.3
−42.8
−49.4
−56.1
−62.5
−69.3
−75.4
−83.6
−91.6
−99.3
−105.8
−113.7
−120.8
−127.6
−133.1
−138.0
−142.8
−148.3
−152.6
−156.7
−160.1
−164.0
−167.8
−172.8
−176.4
24
S11
S21
S12
Data Sheet P12710EJ2V0DS00
S22
K
1.65
1.63
1.58
1.49
1.45
1.37
1.29
1.20
1.15
1.11
1.03
0.99
0.92
0.91
0.90
0.89
0.88
0.96
1.03
1.09
1.14
1.20
1.28
1.37
1.44
1.49
1.53
1.56
1.55
1.62
1.61
µPC2762TB, µPC2763TB, µPC2771TB
PACKAGE DIMENSIONS
6 pin super minimold (Unit: mm)
0.1 MIN.
0.15 +0.1
–0
1.25 ±0.1
2.1 ±0.1
0.2 +0.1
–0
0 to 0.1
0.65
0.65
1.3
0.7
0.9 ±0.1
2.0 ±0.2
Data Sheet P12710EJ2V0DS00
25
µPC2762TB, µPC2763TB, µPC2771TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Note
Count: 3, Exposure limit: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Note
Count: 3, Exposure limit: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Note
Count: 1, Exposure limit: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Note
Exposure limit: None
–
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
26
Data Sheet P12710EJ2V0DS00
µPC2762TB, µPC2763TB, µPC2771TB
[MEMO]
Data Sheet P12710EJ2V0DS00
27
µPC2762TB, µPC2763TB, µPC2771TB
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8