NEC UPC29M33A

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC29M33A,µPC29M05A
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
DESCRIPTION
The µPC29M33A, µPC29M05A of low dropout voltage three terminal positive regulators is constructed with PNP output
transistor. The µPC29M33A, µPC29M05A feature the ability to source 0.5 A of output current with a low dropout voltage
of typically 0.5 V.
The power dissipation of the µPC29M33A, µPC29M05A can be drastically reduced compared with the conventional
three terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to
the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators ( µPC24M00A series).
FEATURES
• Output current in excess of 0.5 A
• Low dropout voltage VDIF = 0.5 V TYP. (at IO = 0.5 A)
• On-chip overcurrent and thermal protection circuit
• On-chip output transistor safe area protection circuit
PIN CONFIGURATION (Marking Side)
µPC29M33AHF, µPC29M05AHF: MP-45G
µPC29M33AHB, µPC29M05AHB: MP-3
µPC29M33A, µPC29M05AT: MP-3Z
4
1
2
1
3
1: INPUT
2: GND
3: OUTPUT
2
3
1:
2:
3:
4:
INPUT
GND
OUTPUT
GND (Fin)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G15368EJ1V0DS00 (1st edition)
Date Published May 2001 NS CP(K)
Printed in Japan
©
2001
µPC29M33A,µPC29M05A
BLOCK DIAGRAM
INPUT
Safe operating
area protection
Start-up
circuit
Reference
voltage
Error
amp.
Saturation
protection
Drive
circuit
OUTPUT
Thermal
shut down
Over current
protection
GND
2
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
ORDERING INFORMATION
Part Number
Package
Output Voltage
Marking
MP-45G
3.3 V
29M33A
• Packed in envelope
MP-3 (SC-64)
3.3 V
29M33A
• Packed in envelope
µ PC29M33AT
MP-3Z (SC-63)
3.3 V
29M33A
• Packed in envelope
µ PC29M33AT-E1
MP-3Z (SC-63)
3.3 V
29M33A
• 16 mm wide embossed taping
µ PC29M33AHF
Package Type
(Isolated TO-220)
µ PC29M33AHB
• Pin 1 on drawout side
• 2000 pcs/reel
µ PC29M33AT -E2
MP-3Z (SC-63)
3.3 V
29M33A
• 16 mm width embossed taping
• Pin 1 at takeup side
• 2000 pcs/reel
µ PC29M33AT -T1
MP-3Z (SC-63)
3.3 V
29M33A
• 32 mm wide adhesive taping
• Pin 1 at drawout side
• 1500 pcs/reel
µ PC29M33AT -T2
MP-3Z (SC-63)
3.3 V
29M33A
• 32 mm wide adhesive taping
• Pin 1 at takeup side
• 1500 pcs/reel
µ PC29M05AHF
5.0 V
29M05A
• Packed in envelope
MP-3 (SC-64)
5.0 V
29M05A
• Packed in envelope
µ PC29M05AT
MP-3Z (SC-63)
5.0 V
29M05A
• Packed in envelope
µ PC2905AT-E1
MP-3Z (SC-63)
5.0 V
29M05A
• 16 mm wide embossed taping
MP-45G
(Isolated TO-220)
µ PC29M05AHB
• Pin 1 at drawout side
• 2000 pcs/reel
µ PC2905AT-E2
MP-3Z (SC-63)
5.0 V
29M05A
• 16 mm wide embossed taping
• Pin 1 at takeup side
• 2000 pcs/reel
µ PC2905AT-T1
MP-3Z (SC-63)
5.0 V
29M05A
• 32 mm wide adhesive taping
• Pin 1 at drawout side
• 1500 pcs/reel
µ PC2905AT-T2
MP-3Z (SC-63)
5.0 V
29M05A
• 32 mm wide adhesive taping
• Pin 1 at takeup side
• 1500 pcs/reel
Data Sheet G15368EJ1V0DS
3
µPC29M33A,µPC29M05A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Rating
Parameter
Symbol
Input Voltage
µ PC29M33AHF,
µPC29M33AHB, µPC29M05AHB
µ PC29M05AHF
µPC29M33AT, µPC29M05AT
VIN
Internal Power Dissipation
Note
(TC = 25°C)
20
PT
Unit
V
15
10
W
Operating Ambient Temperature
TA
–30 to +85
°C
Operating Junction Temperature
TJ
–30 to +150
°C
Storage Temperature
Tstg
–55 to +150
°C
Thermal Resistance (junction to case)
Rth(J-C)
7
12.5
°C/W
Thermal Resistance (junction to ambient)
Rth(J-A)
65
125
°C/W
Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the
output voltage.
Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the
quality of the product may be degraded. In other words, absolute maximum ratings specify the
values exceeding which the product may be physically damaged. Be sure to use the product with
these ratings never exceeded.
STANDARD CONNECTION
D1
PC29M33A, PC29M05A
INPUT
OUTPUT
+
CIN
COUT
D2
CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure
to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and
temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure
that CIN is 0.1 µF or higher for the voltage and temperature range to be used.
COUT: 47 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place
CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
4
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Type Number
MIN.
TYP.
MAX.
Unit
V
µ PC29M33A
4.3
16
µ PC29M05A
6
16
IO
All
0
0.5
A
Operating Ambient Temperature TA
All
–30
+85
°C
Operating Junction Temperature TJ
All
–30
+125
°C
Input Voltage
Output Current
VIN
ELECTRICAL CHARACTERISTICS
µPC29M33A (TJ = 25°°C, VIN = 5 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 350 mA
MIN.
TYP.
MAX.
Unit
3.18
3.3
3.42
V
3.14
3.46
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A
Line Regulation
REGIN
4.3 V ≤ VIN ≤ 16 V
8
33
Load Regulation
REGL
0 A ≤ IO ≤ 0.5 A
10
33
Quiescent Current
IBIAS
IO = 0 A
1.8
3.0
IO = 0.5 A
15
20
VIN = 3.1 V, IO = 0 A
9
20
Startup Quiescent Current
IBIAS (s)
VIN = 3.1 V, IO = 0.5 A
mV
mA
mA
50
Quiescent Current Change
∆IBIAS
0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V
2.9
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
56
µ Vr.m.s.
Ripple Rejection
R•R
4.3 V ≤ VIN ≤ 16 V, f = 120 Hz
64
dB
Dropout Voltage
VDIF
0°C ≤ TJ ≤ 125°C, IO = 0.5 A
Short Circuit Current
IOpeak
VIN = 4.5 V
48
0.7
VIN = 16 V
Peak Output Current
Temperature Coefficient of
Output Voltage
IOpeak
∆VO /∆T
15
0.5
1.0
V
1.1
1.5
A
A
0.6
VIN = 4.5 V
0.7
1.2
1.5
VIN = 16 V
0.6
1.0
1.5
0°C ≤ TJ ≤ 125°C, IO = 5 mA
Data Sheet G15368EJ1V0DS
mA
–0.4
mV/°C
5
µPC29M33A,µPC29M05A
µPC29M05A (TJ = 25°°C, VIN = 8 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 350 mA
MIN.
TYP.
MAX.
Unit
4.83
5.0
5.18
V
4.75
5.25
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A
Line Regulation
REGIN
6 V ≤ VIN ≤ 16 V
26
50
mV
Load Regulation
REGL
0 A ≤ IO ≤ 0.5 A
17
50
mV
Quiescent Current
IBIAS
IO = 0 A
1.9
4.0
mA
IO = 0.5 A
15
20
VIN = 4.5 V, IO = 0 A
10
20
Startup Quiescent Current
IBIAS (s)
VIN = 4.5 V, IO = 0.5 A
mA
50
Quiescent Current Change
∆IBIAS
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V
2.4
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
87
µ Vr.m.s.
Ripple Rejection
R•R
6 V ≤ VIN ≤ 16 V, f = 120 Hz
60
dB
Dropout Voltage
VDIF
0°C ≤ TJ ≤ 125°C, IO = 0.5 A
Short Circuit Current
IOpeak
VIN = 6.5 V
46
0.65
VIN = 16 V
Peak Output Current
Temperature Coefficient of
Output Voltage
6
IOpeak
∆VO /∆T
15
0.5
1.0
V
1.1
1.5
A
A
0.6
VIN = 6.5 V
0.7
1.2
1.5
VIN = 16 V
0.6
1.1
1.5
0°C ≤ TJ ≤ 125°C, IO = 5 mA
Data Sheet G15368EJ1V0DS
mA
0.7
mV/°C
µPC29M33A,µPC29M05A
TYPICAL CHARACTERISTICS (Reference Values)
∆VO vs TJ
Pd vs. TA
150
Solid line:
µPC29M33AHF, µPC29M05AHF
Broken line:
µPC29M33AHB , µPC29M05AHB
µPC29M33AT , µPC29M05AT
15
∆ VO - Output Voltage Deviation - mV
Pd - Total Power Dissipation - W
20
With infinite heatsink
10
5
Without
0
heatsink
100
50
µ PC29M05A
0
µ PC29M33A
–50
–100
–150
IO = 5 mA
25
0
50
75
100
125
–200
–50
150
TA - Operating Ambient Temperature - ˚C
50
0
100
TJ - Operating Junction Temperature - ˚C
VO vs. VIN (µPC29M05A)
VO vs. VIN (µPC29M33A)
8
4.0
TJ = 25˚C
TJ = 25˚C
I O = 5 mA
7
3.5
I O = 0.5 A
6
3.0
VO - Output Voltage - V
VO - Output Voltage - V
I O = 0.35 A
I O = 0.5 A
2.5
2.0
1.5
1.0
I O = 0.35 A
5
I O = 5 mA
4
3
2
1
0.5
0
0
0
1
2
3
4
5
6
VIN - Input Voltage - V
7
0
8
1
IBIAS (IBIAS(s)) vs. VIN ( µ PC29M33A)
7
8
T = 25˚C
IBIAS - Quiescent Current - mA
40
30
20
I O = 0.5 A
I O = 0.35 A
40
30
20
I O = 0.5 A
I O = 0.35 A
10
IO= 0 A
0
3
4
5
6
VIN - Input Voltage - V
50
TJ = 25˚C
10
2
IBIAS (IBIAS(s)) vs. VIN (µPC29M05A)
50
IBIAS - Quiescent Current - mA
150
O
=0A
0
0
2
4
6
8
10
12
14
16
18
20
0
2
VIN - Input Voltage - V
Data Sheet G15368EJ1V0DS
4
6
8
10 12 14
VIN - Input Voltage - V
16
18
20
7
µPC29M33A,µPC29M05A
IOpeak vs. VDIF (µPC29M33A)
VDIF vs. TJ
1.5
IOpeak - Peak Output Current - A
VDIF - Dropout Voltage - V
1.0
0.8
0.6
µ PC29M05A
µPC29M33A
0.4
0.2
1.0
TJ = 0˚C
TJ = 25˚C
TJ = 125˚C
0.5
I O = 0.5 A
0
-25
0
25
50
75
100
125
0.0
150
0
TJ - Operating Junction Temperature - ˚C
5
10
15
VDIF - Dropout Voltage - V
IOpeak vs. VDIF (µPC2905A)
R·R vs f
80
R·R - Ripple Rejection - dB
1.5
IOpeak - Peak Output Current - A
20
TJ = 0˚C
1.0
TJ = 25˚C
0.5
TJ = 125˚C
70
µ PC29M33A
60
µ PC29M05A
50
40
30
TJ = 25˚C, IO = 0.5 A
4.3 V ≤ VIN ≤ 16 V µ PC29M33A
6 V≤ VIN ≤ 16 V µ PC29M05A
20
0
0.0
5
0
10
15
10
20
100
1k
10 k
100 k
f - Frequency - Hz
VDIF - Dropout Voltage - V
.
VDIF vs. IO
R R vs. IO
80
1.0
40
VDIF - Dropout Voltage - V
. R - Ripple Rejection - dB
70
R
TJ = 25˚C
µ PC29M33A
60
µ PC29M05A
50
TJ = 25˚C, f = 120 Hz
4.3 V ≤ VIN ≤ 16 V µ PC29M33A
6 V≤ VIN ≤ 16 V µ PC29M05A
0.8
0.6
µPC29M33A
0.4
µ PC29M05A
0.2
30
0
0
0.1
0.2
0.3
0.4
0.5
0
8
0.1
0.2
0.3
IO - Output Current - A
IO - Output Current - A
Data Sheet G15368EJ1V0DS
0.4
0.5
µPC29M33A,µPC29M05A
VO vs. IO (µPC29M05A)
VO vs. IO ( µ PC29M33A)
6
6
TJ = 25˚C
TJ = 25˚C
5
VO - Output Voltage - V
VO - Output Voltage - V
5
4
V =5V
3
2
VIN = 16 V
4
3
VIN = 16 V
2
VIN = 6 V
1
1
0
VIN =
8V
VIN = 4.3 V
0.2
0.4
0.6
0.8
1.0
1.2
0
IO - Output Current - A
Data Sheet G15368EJ1V0DS
0.2
0.4
0.6
0.8
IO - Output Current - A
1.0
1.2
9
µPC29M33A,µPC29M05A
PACKAGE DRAWINGS
µPC29M33AHF, µPC29M05AHF
3PIN PLASTIC SIP (MP-45G)
A
N
E
P
B
I
L
M
D
1
2
3
K
Y
V
J
H
U
Z
C
F
G
M
NOTE
ITEM
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
MILLIMETERS
A
10.0±0.2
B
7.0±0.2
C
1.50±0.2
D
E
17.0±0.3
φ 3.3±0.2
F
0.75±0.10
G
0.25
H
2.54 (T.P.)
I
5.0±0.3
J
K
2.46±0.2
5.0±0.2
L
8.5±0.2
M
8.5±0.2
N
4.5±0.2
P
U
V
2.8±0.2
2.4±0.5
0.65±0.10
Y
Z
8.9±0.7
1.30±0.2
P3HF-254B-4
10
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
µPC29M33AHB, µPC29M05AHB
MP-3 (SC-64) (Unit: mm)
2.3±0.2
0. 2
1.5 +–0.
1
6.5±0.2
5.0±0.2
0.5±0.1
2
3
7.0 MIN.
1
13.7 MIN.
1.6±0.2
5.5±0.2
4
1.1±0.1
0.2
0.5 +–0.1
2.3
0.75
2.3
0.2
0.5 +–0.1
µPC29M33AT, µPC29M05AT
MP-3Z (SC-63) (Unit: mm )
2.3±0.2
1.5 –0.1
+0.2
6.5±0.2
5.0±0.2
0.5±0.1
3
1.0 MIN.
1.5 TYP.
2
1.1±0.2
0.9 MAX.
2.3
2.3
Data Sheet G15368EJ1V0DS
0.8 MAX.
0.5
0.8
2.0 MIN.
1
10.0 MAX.
5.5±0.2
4.3 MAX.
4
0.8
11
µPC29M33A,µPC29M05A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface Mount Device
µPC29M33AT, µPC29M05AT: MP-3Z (SC-63)
Process
Infrared Ray Reflow
Conditions
Peak temperature: 235°C or below (Package surface temperature),
Symbol
IR35-00-2
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 2 times or less.
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
VP15-00-2
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 2 times or less.
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Through-hole devices
µPC29M33AHF, µPC29M05AHF: MP-45G
µPC29M33AHB, µPC29M05AHB: MP-3
Process
Conditions
Wave soldering
Solder temperature: 260°C or below,
(only to leads)
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
12
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
NOTES ON USE
When the µPC29M33A, µPC29M05A are used with an input voltage that is lower than the value indicated in the
recommended operating conditions, a large quiescent current flows through the device due to saturation of the transistor
of
the
output
stage.
(Refer
to
the
IBIAS
(IBIAS(S))
vs.
VIN
curves
in
TYPICAL
CHARACTERISTICS).
These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the
power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts
up.
REFERENCE DOCUMENTS
Document Name
Document No.
QUALITY GRADE ON NEC SEMICONDUCTOR DEVICES
C11531E
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
C10535E
VOLTAGE REGULATOR OF SMD
G11872E
SEMICONDUCTOR SELECTION GUIDE – PRODUCTS AND PACKAGES
X13769E
Data Sheet G15368EJ1V0DS
13
µPC29M33A,µPC29M05A
[MEMO]
14
Data Sheet G15368EJ1V0DS
µPC29M33A,µPC29M05A
[MEMO]
Data Sheet G15368EJ1V0DS
15
µPC29M33A,µPC29M05A
• The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4