NJL6163R HIGH SPEED PIN PHOTO DIODE ■ GENERAL DESCRIPTION ■ OUTLINE (typ.) Unit : mm ① sensitivity (S : 0.65A/W). 2.5 1.16 0.5 1.0 (2x)R0.3 2 .5 Package), and attain under half package 0 .7 It shrinks the outline by COBP(Chip on Board 1.0 0.3 4 .9 volume compared with lead frame type. 1.3 5 attain high speed (fc : 200MHz) and high 0.3 The NJL6163R is the PIN photo diode, which 1 .35 ■ FEATURES • High speed, high sensitivity • Super miniature, super thin type (2.5mmX4.9mmX1.16mm) ② ① anode ② cathode ■ APPLICATIONS • Laser monitor for CD-R/RW etc. • Reading the signal for optical communication etc. ■ ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature SYMBOL VR Topr Tstg Tsol RATINGS 35 -30 ~ +85 -40 ~ +100 260 (10sec.) UNIT V °C °C °C ■ ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Dark Current Forward Voltage Capacitance Peak Wavelength Sensitivity Cut off Frequency SYMBOL ID VF Ct λP S fc (-3dB) TEST CONDITION VR=10V IF=1mA VR=2.0V, f=1MHz — VR=2.0V, λ=780nm VR=0.7V, λ=780nm, RL=50Ω VR=2.0V, λ=780nm, RL=50Ω MIN — — — — 0.50 — — TYP 0.1 — MAX 2.0 1.0 10 800 0.65 150 200 — — — — — UNIT nA V pF nm A/W MHz MHz -1- NJL6163R ■ TYPICAL CHARACTERISTICS Relative Sensitivity vs. Illuminance (Ta=25°C) Spectral Response (Ta=25°C) 1.00E-02 100% VR=2.0V, λ=780nm 80% Relative Sensitivity (%) Light Current IL (A) 1.00E-03 1.00E-04 1.00E-05 1.00E-06 60% 40% 20% 1.00E-07 1.00E-08 0.01 0.1 1 10 Illuninance (mW/cm 2) 0% 500 100 Dark Current vs. Temperature 700 800 900 1000 1100 Wavelength λ (nm) Relative Sensitivity vs. Temperature 110% 1.0E-08 108% VR=2.0V VR=2.0V, λ=780nm 106% Relative Sensitivity (%) 1.0E-09 Dark Current D I (A) 600 1.0E-10 1.0E-11 104% 102% 100% 98% 96% 94% 1.0E-12 92% 1.0E-13 -40 -20 90% 0 20 40 60 -40 -20 80 100 Rise Time vs. Reverse Voltage (Ta=25°C) 40 60 80 100 Fall Time vs. Reverse Voltage (Ta=25°C) 20 20 λ=780nm, RL=50Ω λ=780nm, RL=50Ω 15 Fall Time tf (ns) 15 Rise Time tr (ns) 20 Ambient Temperature Ta (°C) Ambient Temperature Ta (°C) 10 10 5 5 0 0 0 -2- 0 1 2 3 4 Reverse Voltage VR (V) 5 0 1 2 3 4 Reverse Voltage VR (V) 5 NJL6163R Capacitance vs. Reverse Voltage (Ta=25°C) 0 15 -1 14 Capasitance Cj (pF) Relative Sensitivity (dB) Relative Sensitivity vs. Frequency (Ta=25°C) -2 -3 -4 VR=2.0V, λ=780nm, RL=50Ω -5 13 12 11 10 9 8 -6 1 10 100 0 1000 Frequency f (MHz) 1 2 3 4 Reverse Voltage VR (V) 5 ■ MEASURING CIRCUIT FOR RESPONSE TIME OSC P.G. Input Laser 50Ω 90% NJL6163R 10% Output tr tf -3- NJL6163R PRECAUTION FOR HANDLING 1. Soldering to actual circuit board Soldering condition - Heated condition of plastic package. Lower than 240°C of maximum surface temperature, less than 30 seconds of time kept higher than 200°C. Soldering Method 1) Reflow Method Recommended temperature profile of its method. ① Preparatory heating condition : 120 ~ 150°C about 60 sec. ② Recommended soldering temperature : 230 ~ 240°C about 3 ~ 5 sec. ③ Slowly cool down right after soldering. ④ Soldering to be done within twice under this condition. (°C) 250 3 ~ 5 sec. 240°C max. 200 150 Preparatory heating 60 ~ 120 sec. Less than 30 sec. 100 50 0 Time 2) Reflow Method (In case of infrared heating) - Temperature profile : Same to the above - Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface temperature will be higher than lead itself. 3) The other method Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS). If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability. It is necessary to solder in short time as soon as possible. 2. Cleaning Avoid washing of the device after soldering by reflow method. 3. Attention in handling 1) Treat not to touch the lens surface. 2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface. 3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object. 4. Storage In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in dampproof packaging. So that mount the device as short as possible after opening the envelope. -4- NJL6163R NJL6163R Taping Specification (TE1) 1. Taping Size 1) Carrier tape is used with Styrene type Carbonated Plastic. 2) Cover tape is used with electro statistically prevention treated Polyester type tape. 3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing. Pull out direction of tape φ 1.5 0.3 12.0 5.4 5.5 1.75 4.0 2.0 2.9 1.5 4.0 Carrier tape Cover tape 2. Taping Strength Pullup the cover tape from the carrier tape, and when the opening angle comes around 10 ~ 15°, and the peeling-off strength is to be within the power of 20 ~ 70g. 3. Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification ① Start Rolling : Carrier tape open space more than 20 Pieces. ② End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags). 13 φ 180 φ 60 φ 13 Label -5- NJL6163R MEMO [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. -6-