NJL7502R Ambient Light Sensor GENERAL DESCRIPTION The NJL7502R is the photo transistor which spectral response is similar to human eye. FEATURES 1. Peak wavelength 590 nm 2. COBP Package size : 1.6 x 1.3 x 0.65 mm 3. Lead-free package APPLICATIONS Cellular phone, PDA, Note PC, TV, PDP, Clock, Refrigerator, Camera, Toy, Room light, etc. to adjust the luminance of display to control ON/OFF Replacement of CdS ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Collector - Emitter Voltage Emitter - Collector Voltage Photocurrent Power Dissipation Operating Temperature Storage Temperature Soldering Temperature SYMBOL VCEO VECO IC PD Topr Tstg Tsol RATINGS 20 5 10 100 −40 to +85 −40 to +100 260 ELECTRO-OPTICAL CHARACTERISTICS PARAMETER Photocurrent 1 Photocurrent 2 Dark Current Peak Wavelength Collector - Emitter Saturation Current Half Angle Rise Time Fall Time SYMBOL IC1 IC2 ICEO λP ICE (sat) Θ1/2 tr tf UNIT V V mA mW °C °C °C (Ta=25°C) TEST CONDITION VCE=5V, Ev=1,000Lux, Light source A MIN TYP 130 MAX UNIT µA VCE=5V, Ev=1,000Lux, White LED 11 45 79 µA VCE=20V 590 0.1 µA nm 3 µA ±60 10 10 deg. µs µs VCE =0.24V, Ev=1,000Lux White LED VCE=5V, IC=1mA, RL=100Ω VCE=5V, IC=1mA, RL=100Ω Ver.2014-12-02 -1- NJL7502R TEST CIRCUIT Photocurrent 1 IC1 VCE = 5V Collector - Emitter Saturation Current VCE = 0.24V ICE (sat) IC1 1000Lux 1000Lux Light source A White LED Half Angle Photocurrent 2 IC2 ICE(sat) Θ1/2 VCE = 5V VCE = 5V IC2 Ic 1000Lux White LED Rise Time Dark Current ICEO Fall Time tr tf VCE = 20V VCE = 5V ICEO IC = 1mA 0Lux Vout RL = 100Ω Peak Wavelength 100mV 90% λP VCE = 5V IC OV 10% tr tf Light -2- Ver.2014-12-02 NJL7502R UNIT : mm 1.1 Active area(□0.6mm) (0.075) 1.3 ①Collector (0.1) 0.3 ②Emitter 0.65 1.1 0.55 (0.075) 0.35 (0.05) 1.6 0.4 0.5 (0.47) (0.54) 0.6 1.15 0.65 Unit:mm tolerance ±0.1mm Unspecified Torerance:±0.1mm Dimensions in parenthesis are shown for reference. 0.3 OUTLINE (TYP.) PCB pattern TYPICAL CHARACTERISTICS Power Dissipation vs. Temperature 160 Power Dissipation P(mW) 140 120 100 80 60 40 20 0 0 20 40 60 80 100 Ambient Temperature Ta(°C) Ver.2014-12-02 -3- NJL7502R Spectral Response (Ta=25°C) 20° Relative Response (%) 120 10° 0° 10° 20° 30° 30° 40° 40° 100 50° 50° 80 60° 60° 60 70° 40 70° 80° 80° 20 0 300 400 500 600 700 800 900 1000 1100 90° 100% 80% 60% 40% 20% 0% 20% 40% 60% 90° 100% 80% Wavelength (nm) Human eye NJL7502R Photocurrent vs. Illuminance (Light source A, Ta = 25°C) Photocurrent vs. Illuminance (VCE=5.0V, Ta = 25°C) 1.E+04 1.E+04 Photocurrent (µA) Photocurrent (µA) 1.E+03 1.E+02 1.E+01 1.E+03 1.E+00 1.E-01 10 100 1000 10000 100000 1.E+02 1000 10000 Illuminance (Lux) Fluorescent light VCE=1.0V Light source A VCE=5.0V 1.0E+00 150 Light source A Dark Current Iceo (µA) Relative Photocurrent (%) VCE=2.5V Dark Current vs. Temperature Vce=5.0V Photocurrent vs Temperature Vce=5.0V 140 100000 Illuminance (Lux) 130 120 White LED 110 100 90 80 70 1.0E-01 1.0E-02 1.0E-03 1.0E-04 1.0E-05 1.0E-06 1.0E-07 60 50 1.0E-08 -40 -20 0 20 40 60 Ambient Temperature (°C) -4- 80 100 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Ver.2014-12-02 NJL7502R Vce Light NJL7502R Vout RL Fig1 Application Circuit Vce=5.0V NJL7502R White LED NJL7502R White LED Vce=3.0V 10 1 1 0.1 0.1 Vout (V) Vout (V) 10 0.01 0.01 1kΩ 50kΩ 100kΩ 500kΩ 0.001 1kΩ 50kΩ RL 0.001 100kΩ 500kΩ 0.0001 0.0001 1 10 100 1000 10000 1 100000 10 100 1000 100000 NJL7502R Light source A Vce=5.0V NJL7502R Light source A Vce=3.0V 10 1 1 Vout (V) 10 0.1 0.1 1kΩ 0.01 10000 Ev (LX) Ev (LX) Vout (V) RL 50kΩ 100kΩ RL 1kΩ 0.01 50kΩ 100kΩ 500kΩ 0.001 500kΩ 0.001 1 10 100 1000 Ev (Lx) 10000 100000 1 10 100 1000 10000 100000 Ev (Lx) Ver.2014-12-02 -5- RL NJL7502R MOUNTING METHOD (note) ・Mounting was evaluated with the following profiles in our company, so there was no problem. However, confirm mounting by the condition of your company beforehand. ・The exposure of device under higher temperature may affect to the reliability of the products, it is recommended to complete soldering in the shortest time possible. ・Mounting : twice soldering is allowed. INFRARED REFLOW SOLDERING METHOD * Recommended reflow soldering procedure f 260°C e 230°C 220°C d 180°C 150°C a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 220°C or higher time e : 230°C or higher time f : Peak temperature : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : Shorter than 60s : Shorter than 40s g : Temperature ramping rate : 1 to 6°C /s : Lower than 260°C The temperature indicates at the surface of mold package Room Temp. a b c g (1) Using reflow furnace with short wave infrared radiation heater such halogen lamp regarding temperature profile. Please refer to those of reflow furnace. In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of Black colored mold resin. Therefore, please avoid form direct exposure to mold resin. (2) Other method such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply. (3) The resin gets softened right after soldered, so the following care has to be taken. Not to contact the lens surface to anything.. Not to dip the device into water or any solvents. FLOW SOLDERING METHOD * Flow soldering is not possible. IRON SOLDERING METHOD * Iron soldering is not possible. CLEANING CONDITIONS Please refrain from cleaning immediately after reflow of this device. -6- Ver.2014-12-02 NJL7502R IC STORAGE CONDITIONS AND ITS DURATION (1) Temperature and humidity ranges Pack Sealing Temperature: 5 to 40 [°C] Humidity: 40 to 80 [%] Pack Opening Temperature: 5 to 30 [°C] Humidity: 40 to 70 [%] After opening the bag, solder products within 48h. Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge. Store the products in the place where it does not create dew with the products due to a sudden change in temperature. (2) When baking, place the reel vertically to avoid load to the side. (3) Do not store the devices in corrosive-gas atmosphere. (4) Do not store the devices in a dusty place. (5) Do not expose the devices to direct rays of the sun. (6) Do not allow external forces or loads to be applied to IC’s. (7) Be careful because affixed label on the reel might be peeled off when baking. (8) The product is recommended to do the baking before using for the stability of the quality. BAKING In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape) Baking method: Ta=60°C, 48 to 72h, Three times baking is allowed Ta=100°C, 2 to 6h, Three times baking is allowed STORAGE DURATION Within a year after delivering this device. For the products stored longer than a year, confirm their terminals and solderability before they are used. MOISTURE SENSITIVITY LEVELS JEDEC : Level 5 Ver.2014-12-02 -7- NJL7502R PACKING SPECIFICATION PACKING DIMENTIONS UNIT : mm Drawing direction Insert direction P2 SIMBOL A φ D0 P0 T B D0 D1 E E F W P1 P2 B W1 (TE1) F P0 T0 T1 W0 P1 T1 φ D1 A W1 DIMENSION 1.50 1.80 1.50 0.60 1.75 3.50 4.00 4.00 2.00 0.20 0.90 8.00 5.40 REMARKS ±0.10 ±0.10 BOTOM DIMENSION BOTOM DIMENSION +0.10 -0.0 ±0.05 ±0.10 ±0.05 ±0.10 ±0.10 ±0.05 ±0.05 ±0.10 ±0.10 ±0.10 THICKNESS 0.1MAX * Carrier tape material : Polycarbonate(antistatic) Cover tape material : Polyester(antistatic) Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off strength is to be within the power of 20 to 40g. Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start rolling : Carrier tape open space more than 20 Pieces. 2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a damp proof bag with silica gel. SYMBOL E W0 W1 A B φD φC A B C D E W0 W1 DIMENSION φ180 φ60 φ13 φ21 ±1.0 ±1.0 ±0.2 ±0.8 2.0 ±0.5 9.5 ±1.0 13.1 ±1.0 * Reel material : PPE(antistatic) [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. -8- Ver.2014-12-02