ETC NJL6163R-1

NJL6163R/6163R-1
HIGH SPEED PIN PHOTO DIODE
■ OUTLINE (typ.) Unit : mm
The NJL6163R/6163R-1 are the PIN photo
Active area: 1.0 mm square
NJL6163R
➀
diode, which attain high speed (fc : 200MHz)
2.5
and high sensitivity (S : 0.65A/W).
1.16
0.5
1.0
0.3
0.3
■ GENERAL DESCRIPTION
1.0
(2x)R0.3
2.5
Active area
4.9
volume compared with lead frame type.
1.35
Package), and attain under half package
0.7
It shrinks the outline by COBP(Chip on Board
1.35
■ FEATURES
➀ anode
➁ cathode
➁
Active area: 1.0 mm square
NJL6163R-1
■ APPLICATIONS
➀
• Laser monitor for CD-R/RW etc.
• Reading the signal for optical communication
etc.
1.0
1.16
1.8
0.5
0.3
• High speed, high sensitivity
• Super miniature, super thin type
NJL6163R (2.5mmX4.9mmX1.16mm)
NJL6163R-1 (1.8mmX3.6mmX1.16mm)
0.3
0.95
3.6
0.3
1.8
0.95
Active area
(2
➀ anode
➁ cathode
1.0
➁
×
)R
0
.3
■ ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
PARAMETER
Reverse Voltage
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
SYMBOL
VR
Topr
Tstg
Tsol
RATINGS
35
-30 to +85
-40 to +100
260 (10sec.)
UNIT
V
°C
°C
°C
■ ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C)
PARAMETER
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
Cut off Frequency
SYMBOL
ID
VF
Ct
λP
S
fc
(-3dB)
TEST CONDITION
VR=10V
IF=1mA
VR=2.0V, f=1MHz
—
VR=2.0V, λ=780nm (note)
VR=0.7V, λ=780nm, RL=50Ω
VR=2.0V, λ=780nm, RL=50Ω
MIN
—
—
—
—
0.50
—
—
TYP
0.1
—
MAX
2.0
1.0
10
800
0.65
150
200
—
—
—
—
—
UNIT
nA
V
pF
nm
A/W
MHz
MHz
(note) in the case of illuminating all over the package
-1-
NJL6163R/6163R-1
■ TYPICAL CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25°C)
Spectral Response (Ta=25°C)
1.00E-02
100%
VR=2.0V, λ=780nm
80%
Relative Sensitivity (%)
Light Current IL (A)
1.00E-03
1.00E-04
1.00E-05
1.00E-06
60%
40%
20%
1.00E-07
1.00E-08
0.01
0.1
1
10
Illuninance (mW/cm 2)
0%
500
100
Dark Current vs. Temperature
700 800 900 1000 1100
Wavelength λ (nm)
Relative Sensitivity vs. Temperature
1.0E-08
150%
VR=2.0V
140%
1.0E-09
VR=2.0V, λ=780nm
130%
Relative Sensitivity (%)
Dark Current D
I (A)
600
1.0E-10
1.0E-11
1.0E-12
120%
110%
100%
90%
80%
70%
60%
1.0E-13
-40 -20
0
20
40
60
80 100
50%
-40
-20
Ambient Temperature Ta (°C)
Rise Time vs. Reverse Voltage (Ta=25°C)
40
60
80
100
20
λ=780nm, RL=50Ω
λ=780nm, RL=50Ω
15
Fall Time tf (ns)
15
Rise Time tr (ns)
20
Fall Time vs. Reverse Voltage (Ta=25°C)
20
10
10
5
5
0
0
0
-2-
0
Ambient Temperature Ta(°C)
1
2
3
4
Reverse Voltage VR (V)
5
0
1
2
3
4
Reverse Voltage VR (V)
5
NJL6163R/6163R-1
Capacitance vs. Reverse Voltage (Ta=25°C)
0
15
-1
14
Capasitance Cj (pF)
Relative Sensitivity (dB)
Relative Sensitivity vs. Frequency (Ta=25°C)
-2
-3
-4
VR=2.0V, λ=780nm,
RL=50Ω
-5
13
12
11
10
9
8
-6
1
10
100
0
1000
Frequency f (MHz)
1
2
3
4
Reverse Voltage VR (V)
5
■ MEASURING CIRCUIT FOR RESPONSE TIME
OSC
P.G.
Input
Laser
50Ω
90%
NJL6163R
10%
Output
tr
tf
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NJL6163R/6163R-1
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 240°C of maximum surface temperature, less than 30 seconds of time kept higher than 200°C.
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
➀ Preparatory heating condition
: 120 to 150°C about 60 sec.
➁ Recommended soldering temperature : 230 to 240°C about 3 to 5 sec.
➂ Slowly cool down right after soldering.
➃ Soldering to be done within twice under this condition.
(°C)
250
3 to 5 sec.
240°C max.
200
150
Preparatory heating
60 to 120 sec.
Less than
30 sec.
100
50
0
Time
2) Reflow Method (In case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
-4-
NJL6163R/6163R-1
NJL6163R Taping Specification
(TE1)
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic.
2) Cover tape is used with electro statistically prevention treated Polyester type tape.
3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing.
Pull out direction of tape
φ 1.5
0.3
12.0
5.4
5.5
1.75
4.0
2.0
2.9
1.5
4.0
Carrier tape
Cover tape
2. Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15°, and the peeling-off
strength is to be within the power of 20 to 70g.
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
2-1) Start Rolling : Carrier tape open space more than 20 Pieces.
2-2) End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity : 2,000 Pieces
4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags).
13
φ 180
φ 60
φ 13
Label
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NJL6163R/6163R-1
MEMO
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
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