TI TLK1221RHAR

TLK1221
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SLLS713 – FEBRUARY 2007
ETHERNET TRANSCEIVER
FEATURES
SYNCEN
PRBSEN
RXP
RXN
VDDPLL
GNDA
VDDA
TXP
GNDA
TXN
SYNC
2
29
RD0
TD1
3
28
RD1
TD2
4
27
RD2
TD3
5
26
VDD
VDD
6
25
RD3
TD4
7
24
RD4
TD5
8
23
RD5
TD6
9
22
RD6
TD7
10
21
RD7
GND
RD9
RD8
RBC1
11 12 13 14 15 16 17 18 19 20
RBC0
•
•
•
30
TD0
VDD
•
•
•
•
•
1
LOOPEN
•
40 39 38 37 36 35 34 33 32 31
ENABLE
REFCLK
•
•
•
RBCMODE
•
RHA Package
(Top View)
TD9
•
0.6- to 1.3-Gigabits Per Second (Gbps)
Serializer/Deserializer
Low Power Consumption 250 mW (typ) at 1.25
Gbps
LVPECL-Compatible Differential I/O on
High-Speed Interface
Single Monolithic PLL Design
Support For 10-Bit Interface
Receiver Differential-Input Thresholds,
200-mV Minimum
Industrial Temperature Range From –40°C to
85°C
IEEE 802.3 Gigabit Ethernet Compliant
Designed in 0.25 µm CMOS Technology
No External Filter Capacitors Required
Comprehensive Suite of Built-In Testability
2.5-V Supply Voltage for Lowest-Power
Operation
3.3-V Tolerant on LVTTL Inputs
Hot Plug Protection
40-Pin 6-mm × 6-mm QFN PowerPAD™
Package
TD8
•
DESCRIPTION
The TLK1221 gigabit Ethernet transceiver provides for high-speed full-duplex point-to-point data transmissions.
These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3
Gigabit Ethernet specification. The TLK1221 supports data rates from 0.6 Gbps through 1.3 Gbps.
The primary application of these devices is to provide building blocks for point-to-point baseband data
transmission over controlled-impedance media of 50 Ω. The transmission media can be printed-circuit board
traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon
the attenuation characteristics of the media and the noise coupling to the environment.
The TLK1221 performs the data serialization, deserialization, and clock extraction functions for a physical layer
interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over
a copper or optical media interface.
This device supports the defined 10-bit interface (TBI). In the TBI mode, the serializer/deserializer (SERDES)
accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted
differentially at PECL-compatible voltage levels. The SERDES extracts clock information from the input serial
stream and deserializes the data, outputting a parallel 10-bit data byte.
A comprehensive series of built-in tests is provided for self-test purposes, including loopback and pseudorandom
binary sequence (PRBS) generation and verification.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TLK1221
www.ti.com
SLLS713 – FEBRUARY 2007
The TLK1221 is housed in a high-performance, thermally enhanced, 40-pin QFN package. Use of this package
does not require any special considerations except to note that the pad, which is an exposed die pad on the
bottom of the device, is a metallic thermal and electrical conductor. It is required that the TLK1221 pad be
soldered to the thermal land on the board as it serves as the main ground connection for the device.
The TLK1221 is characterized for operation from –40°C to 85°C.
This device uses a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply, the chipset is very
power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps.
The TLK1221 is designed to be hot-plug capable. A power-on reset causes RBC0, RBC1, the parallel output
signal terminals, TXP, and TXN to be held in the high-impedance state.
Differences Between TLK2201B, TLK2201BI, TLK1221, and TNETE2201
The TLK1221 is the functional equivalent of the TNETE2201. There are several differences between the devices
as noted below. Refer to Figure 12 in the application information section for an example of a typical application
circuit.
• VCC is 2.5 V for the TLK2201B, TLK2201BI, TLK1221, and TLK1201A vs 3.3 V for TNETE2201.
• The PLL filter capacitors on pins 16, 17, 48, and 49 of the TNETE2201 are no longer required. The
TLK2201B, TLK2201BI, TLK1221, and TLK1201A use these pins to provide added test capabilities. The
capacitors, if present, do not affect the operation of the device.
• No pulldown resistors are required on the TXP/TXN outputs.
• The TLK1221 is a QFN version of the TLK2201B optimized for GBE-only TBI-mode operation with no JTAG
functionality.
Functional Block Diagram
PRBSEN
LOOPEN
PRBS
Generator
TD(0–9)
TXP
2:1
MUX
Parallel to
Serial
TXN
10 Bit
Registers
Clock
REFCLK
ENABLE
RBC1
RBC0
Phase Generator
Control
Logic
Interpolator
and
Clock Extraction
PRBS
Verification
Clock
SYNC/PASS
RD(0–9)
Clock
2:1
MUX
Serial to Parallel
and
Comma Detect
2:1
MUX
Data
RXP
RXN
SYNCEN
RBCMODE
2
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Detailed Description
In the TBI mode, the transmitter portion registers incoming 10-bit-wide data words (8b/10b encoded data,
TD0–TD9) on the rising edge of REFCLK. REFCLK is also used by the serializer, which multiplies the clock by a
factor of 10, providing a signal that is fed to the shift register. The 8b/10b encoded data is transmitted
sequentially, bits 0 through 9, over the differential high-speed I/O channel.
Transmission Latency
Data transmission latency is defined as the delay from the initial 10-bit word load to the serial transmission of
bit 9. The minimum latency in TBI mode is 19 bit times. The maximum latency in TBI mode is 20 bit times.
10-Bit Code
b9
TXP, TXN
td(Tx latency)
10-Bit Code
TD(0–9)
REFCLK
Figure 1. Transmitter Latency, Full-Rate Mode
Data Reception
The receiver section deserializes the differential serial data. The serial data is retimed based on an interpolated
clock generated from the reference clock. The serial data is then aligned to the 10-bit word boundaries and
presented to the protocol controller along with the receive byte clocks (RBC0, RBC1).
Receiver Clock Select Mode
The TLK1221 only supports TBI-mode operation with half-rate and full-rate clocks on RBC0 and RBC1. In TBI
mode, there are two user-selectable clock modes that are controlled by the RBCMODE terminal: 1) full-rate
clock on RBC0 and 2) half-rate clocks on RBC0 and RBC1.
Table 1. Mode Selection
RECEIVE BYTE CLOCK
RBCMODE
MODE
0
TBI half-rate
30–65 MHz
1
TBI full-rate
60–130 MHz
TLK1221
In the half-rate mode, two receive byte clocks (RBC0 and RBC1) are 180 degrees out of phase and operate at
one-half the data rate. The clocks are generated by dividing down the recovered clock. The received data is
output with respect to the two receive byte clocks (RBC0, RBC1), allowing a protocol device to clock the parallel
bytes using the RBC0 and RBC1 rising edges. For the outputs to the protocol device, byte 0 of the received data
is valid on the rising edge of RBC1. Refer to the timing diagram shown in Figure 2.
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td(S)
RBC0
td(S)
RBC1
td(H)
SYNC
td(H)
RD(0–9)
DXX.X
K28.5
DXX.X
DXX.X
K28.5
DXX.X
Figure 2. Synchronous Timing Characteristic Waveforms (TBI Half-Rate Mode)
The receiver clock interpolator can lock to the incoming data without the need for a lock-to-reference preset. The
received serial data rate (RXP and RXN) is at the same baud rate as the transmitted data stream, ±0.02% (200
PPM) for proper operation.
RBC0
td(S)
td(H)
SYNC
K28.5
RD(0–9)
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
Figure 3. Synchronous Timing Characteristic Waveforms (TBI Full-Rate Mode)
Receiver Word Alignment
These devices use the IEEE 802.3 Gigabit Ethernet defined 10-bit K28.5 character, which contains the 7-bit
comma-pattern word alignment scheme. The following sections explain how this scheme works and how it
realigns to the proper byte boundary of the data.
Comma Character on Expected Boundary
These devices provide 10-bit K28.5 character recognition and word alignment. The 10-bit word alignment is
enabled by forcing the SYNCEN terminal high. This enables the function that examines and compares serial
input data to the 7-bit synchronization pattern. The K28.5 character is defined by the 8b/10b coding scheme as a
pattern consisting of 0011 1110 10 (a negative number beginning with disparity), with the 7 MSBs (0011 111)
referred to as the comma character. The K28.5 character was implemented specifically for aligning data words.
As long as the K28.5 character falls within the expected 10-bit boundary, the received 10-bit data is properly
aligned and data realignment is not required. Figure 2 shows the timing characteristics of RBC0, RBC1, SYNC
and RD0–RD9 while synchronized. (Note: the K28.5 character is valid on the rising edge of RBC1).
Comma Character Not on Expected Boundary
If synchronization is enabled and a K28.5 character straddles the expected 10-bit word boundary, then word
realignment is necessary. Realignment or shifting the 10-bit word boundary truncates the character following the
misaligned K28.5, but the following K28.5 and all subsequent data is aligned properly as shown in Figure 4. The
RBC0 and RBC1 pulse widths are stretched or stalled in their current state during realignment. With this design,
the maximum stretch that occurs is 20 bit times. This occurs during a worst-case scenario when the K28.5 is
aligned to the falling edge of RBC1 instead of the rising edge. Figure 4 shows the timing characteristics of the
data realignment.
4
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Max Receive
Path Latency
INPUT DATA
30 Bit
Times (Max)
31 Bit
Times
K28.5
DXX.X
K28.5
DXX.X
DXX.X
DXX.X
K28.5
DXX.X
RBC0
RBC1
Worst Case
Misaligned K28.5
RD(0–9)
DXX.X
DXX.X
Corrupt Data
K28.5
DXX.X
DXX.X
Misalignment Corrected
K28.5
DXX.X
DXX.X
DXX.X
K28.5
SYNC
Figure 4. Word Realignment Timing Characteristic Waveforms
Systems that do not require framed data may disable byte alignment by tying SYNCEN low.
When a SYNC character is detected, the SYNC signal is brought high and is aligned with the K28.5 character.
The duration of the SYNC pulse is equal to the duration of the data.
Data Reception Latency
The serial-to-parallel data latency is the time from when the first bit arrives at the receiver until it is output in the
aligned parallel word with RD0 received as the first bit. The minimum latency in TBI mode is 21 bit times and the
maximum latency is 31 bit times.
10-Bit Code
RXP, RXN
td(Rx latency)
RD(0–9)
10-Bit Code
RBC0
RBC1
Figure 5. Receiver Latency, TBI Half-Rate Mode Shown
Testability
The loopback function provides for at-speed testing of the transmit/receive section of the circuitry. The enable
function allows for all circuitry to be disabled so that an Iddq test can be performed. The PRBS function also
allows for built-in self-test (BIST).
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Loopback Testing
The transceiver can provide a self-test function by enabling (LOOPEN to high level) the internal loopback path.
Enabling this function causes serial transmitted data to be routed internally to the receiver. The parallel data
output can be compared to the parallel input data for functional verification. (The external differential output is
held in a high-impedance state during the loopback testing.)
ENABLE Function
When held low, ENABLE disables all quiescent power in both analog and digital circuitry. This allows an
ultralow-power idle state when the link is not active.
PRBS Function
These devices have a built-in 27 – 1 PRBS function. When the PRBSEN control bit is set high, the PRBS test is
enabled. A PRBS is generated and fed into the 10-bit parallel transmitter input bus. Data from the normal
parallel input source is ignored during PRBS test mode. The PRBS pattern is then fed through the transmit
circuitry as if it were normal data and sent out to the transmitter. The output can be sent to a bit error rate tester
(BERT) or to the receiver of another TLK1221. Because the PRBS is not really random and is really a
predetermined sequence of ones and zeros, the data can be captured and checked for errors by a BERT. These
devices also have a built-in BERT function on the receiver side that is enabled by PRBSEN. It can receive a
PRBS pattern and check for errors, and then report the errors by forcing the SYNC/PASS terminal low. The
PRBS testing supports two modes (normal and latched), which are controlled by the SYNCEN input. When
SYNCEN is low, the result of the PRBS bit-error-rate test is passed to the SYNC/PASS terminal. When
SYNCEN is high, the result of the PRBS verification is latched on the SYNC/PASS output (i.e., a single failure
forces SYNC/PASS to remain low).
Table 2. TERMINAL FUNCTIONS
TERMINAL
NAME
I/O
NO.
DESCRIPTION
SIGNAL
TXP
TXN
38
39
PECL
O
Differential output transmit. TXP and TXN are differential serial outputs that interface to a
copper or an optical I/F module. TXP and TXN are put in a high-impedance state when
LOOPEN is high and are active when LOOPEN is low.
RXP
RXN
34
33
PECL
I
Differential input receive. RXP and RXN together are the differential serial input interface
from a copper or an optical I/F module.
REFCLK
14
I
Reference clock. REFCLK is an external input clock that synchronizes the receiver and
transmitter interface (60 MHz to 130 MHz). The transmitter uses this clock to register the
input data (TD0–TD9) for serialization.
In the TBI mode that data is registered on the rising edge of REFCLK.
TD0–TD9
2–5, 7–12
I
Transmit data. These inputs carry 10-bit parallel data output from a protocol device to the
transceiver for serialization and transmission. This 10-bit parallel data is clocked into the
transceiver on the rising edge of REFCLK and transmitted as a serial stream with TD0 sent
as the first bit.
RD0–RD9
29–27, 25–19
O
Receive data. These outputs carry 10-bit parallel data output from the transceiver to the
protocol layer. The data is referenced to terminals RBC0 and RBC1. RD0 is the first bit
received.
RBC0
RBC1
17
18
O
Receive byte clock. RBC0 and RBC1 are recovered clocks used for synchronizing the 10-bit
output data on RD0–RD9.
In the half-rate mode, the 10-bit output data words are valid on the rising edges of RBC0
and RBC1. These clocks are adjusted to half-word boundaries in conjunction with
synchronous detect. The clocks are always expanded during data realignment and never
slivered or truncated. RBC0 registers bytes 1 and 3 of received data. RBC1 registers bytes 0
and 2 of received data. In normal-rate mode, only RBC0 is valid and operates at 1/10th the
serial data rate. Data is aligned to the rising edge.
RBCMODE
13
I
P/D (1)
Receive clock mode select. When RBCMODE is low, half-rate clocks are output on RBC0
and RBC1. When RBCMODE is high, a full baud-rate clock is output on RBC0, and RBC1 is
held low.
(1)
6
P/D = Internal pulldown resistor
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Table 2. TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
I/O
NO.
SYNCEN
32
I
P/U
SYNC/PASS
30
O
(2)
DESCRIPTION
Synchronous function enable. When SYNCEN is high, the internal synchronization function
is activated. When this function is activated, the transceiver detects the comma pattern
(0011 111 negative beginning disparity) in the serial data stream and realigns data on byte
boundaries if required. When SYNCEN is low, serial input data is unframed in RD0–RD9.
Synchronous detect. The SYNC output is asserted high upon detection of the comma
pattern in the serial data path. SYNC pulses are output only when SYNCEN is activated
(asserted high). In PRBS test mode (PRBSEN = high), SYNC/PASS outputs the status of
the PRBS test results (high = pass).
TEST
LOOPEN
15
I
P/D (3)
Loop enable. When LOOPEN is high (active), the internal loopback path is activated. The
transmitted serial data is directly routed to the inputs of the receiver. This provides a self-test
capability in conjunction with the protocol device. The TXP and TXN outputs are held in a
high-impedance state during the loopback test. LOOPEN is held low during standard
operational state with external serial outputs and inputs active.
PRBSEN
31
I
P/D (3)
PRBS enable. When PRBSEN is high, the PRBS generation circuitry is enabled. The PRBS
verification circuit in the receive side is also enabled. A PRBS signal can be fed to the
receive inputs and checked for errors, which are reported by the SYNC/PASS terminal
indicating low.
ENABLE
1
I
P/D (2)
When this terminal is low, the device is disabled for Iddq testing. RD0–RD9, RBCn, TXP and
TXN are high-impedance. The pullup and pulldown resistors on any input are disabled.
When ENABLE is high, the device operates normally.
6, 16, 26
Supply
Digital logic power. Provides power for all digital circuitry and digital I/O buffers
VDDA
37
Supply
Analog power. VDDA provides power for the high-speed analog circuits, receiver, and
transmitter.
VDDPLL
36
Supply
PLL power. Provides power for the PLL circuitry. This terminal requires additional filtering.
35, 40
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
PAD
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers
POWER
VDD
GROUND
GNDA
GNDQFN
(2)
(3)
P/U = Internal pullup resistor
P/D = Internal pulldown resistor
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE (1)
UNIT
–0.3 to 3
V
V
VDD
Supply voltage (2)
VI
Input voltage range at TTL terminals
–0.5 to 4
VI
Input voltage range at other terminals
–0.3 to VDD + 0.3
V
ESD
Electrostatic discharge
CDM: 1, HBM: 2
kV
Tstg
Storage temperature
–65 to 150
°C
TA
Characterized free-air temperature range
–40 to 85
°C
(1)
(2)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATINGS
(1)
(2)
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
RHA (1) (2)
2.85 W
28 mW/°C
1.57 W
1.4 W
The thermal resistance junction to ambient of the RHA package is 35°C/W measured on a high-K board.
The thermal resistance junction-to-case (exposed pad) of the RHA package is 5°C/W.
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
VDD,
VDDA,
VDDPLL
Supply voltage
IDD, IDDA,
Total supply current
IDDPLL
Frequency = 1.25 Gbps, PRBS pattern; ENABLE
= 1, VDD , VDDPLL and VDDA = 2.7 V
PD
Total power dissipation
Frequency = 1.25 Gbps, PRBS pattern
IDDQ
Total shutdown current (IDD+IDDA +
IDDPLL )
Enable = 0; VDD , VDDPLL and VDDA = 2.7 V
PLL
Startup lock time
VDD, VDDA = 2.5 V
TA
Operating free-air temperature
MIN
NOM
MAX
2.3
2.5
2.7
V
113
mA
305
mW
1000
µA
500
µs
85
°C
235
–40
UNIT
REFERENCE CLOCK (REFCLK) TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER
f
Frequency
MIN
TYP
MAX
Minimum data rate
TEST CONDITIONS
TYP – 0.01%
60
TYP + 0.01%
Maximum data rate
TYP – 0.01%
130
TYP + 0.01%
Accuracy
DC
–100
Duty cycle
100
40%
Jitter
50%
UNIT
MHz
ppm
60%
Random plus deterministic
40
ps
TTL ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
8
TEST CONDITIONS
VOH
High-level output voltage
IOH = –400 µA
VOL
Low-level output voltage
IOL = 1 mA
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
VDD = 2.3 V, VIN = 2 V
IIL
Low-level input current
VDD = 2.3 V, VIN = 0.4 V
CIN
Input capacitance
MIN
TYP
VDD – 0.2
2.3
GND
0.25
1.7
MAX
V
0.5
V
3.6
V
0.8
V
40
µA
µA
–40
4
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UNIT
pF
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TRANSMITTER/RECEIVER CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
V(CM)
MIN
TYP
MAX
UNIT
VOD = |TxD – TxN|
Rt = 50 Ω
TEST CONDITIONS
600
850
1100
mV
Transmit common mode voltage
range
Rt = 50 Ω
1000
1250
1400
mV
1600
mV
2250
mV
Receiver input voltage requirement,
VID = |RxP – RxN|
200
Receiver common mode voltage
range, (RxP + RxN)/2
CI
1000
1250
Receiver input capacitance
t(TJ)
Serial data total jitter (peak-to-peak)
Differential output jitter, random +
deterministic, PRBS pattern,
Rω = 125 MHz
t(DJ)
Serial data deterministic jitter
(peak-to-peak)
Differential output jitter, PRBS
pattern, Rω = 125 MHz
tr, tf
Differential signal rise, fall time (20% RL = 50 Ω, CL = 5 pF, see Figure 6
to 80%)
and Figure 8
100
Serial data jitter tolerance minimum
required eye opening, (per
IEEE-802.3 specification)
0.25
Differential input jitter, random +
deterministic, Rω = 125 MHz
Receiver data acquisition lock time
from power up
Data relock time from loss of
synchronization
td(Tx
td(Rx
2
pF
0.24
UI
0.12
UI
250
ps
UI
500
µs
1024
Bit times
latency)
Tx latency
See Figure 1
20
22
UI
latency)
Rx latency
See Figure 5 and Figure 7
18
24
UI
80%
50%
20%
TX+
~ V
~ V
tf
tr
80%
50%
20%
TX–
tf
~ V
~ V
tr
~ 1V
80%
0V
VOD
20%
~ –1 V
Figure 6. Differential and Common-Mode Output Voltage Definitions
10-Bit Code
RXP, RXN
b0
b1
b2
b3
b4
b5
b6
b7
b8
b9
td(Rx latency)
RD(0–9)
10-Bit Code
RBC0
Figure 7. Receiver Latency, TBI Normal Mode Shown
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CL
5 pF
50 W
50 W
CL
5 pF
Figure 8. Transmitter Test Setup
1.4 V
CLOCK
tr
tf
80%
50%
20%
DATA
tr
2V
0.8 V
tf
Figure 9. TTL Data I/O Valid Levels for AC Measurement
LVTTL OUTPUT SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
tr(RBC)
Clock rise time
tf(RBC)
Clock fall time
tr
Data rise time
tf
Data fall time
tsu(d1)
th(d1)
Data setup time
(RD0–RD9)
Data hold time (RD0–RD9)
TEST CONDITIONS
80% to 20% output voltage, C = 5 pF (see
Figure 9)
TBI normal mode (see Figure 3), Rω = 125 MHz,
data valid prior to RBC0 rising
MIN
TYP
MAX
UNIT
0.3
1.5
ns
0.3
1.5
ns
0.3
1.5
ns
0.3
1.5
ns
2.5
ns
TBI normal mode (see Figure 3), Rω= 61.44
MHz, data valid prior to RBC0 rising
5
ns
TBI normal mode (see Figure 3), Rω = 125 MHz,
data valid after RBC0 rising
2
ns
TBI normal mode (see Figure 3), Rω = 61.44
MHz, data valid after RBC0 rising
4
ns
tsu(d3)
Data setup time
(RD0–RD9)
TBI half-rate mode, Rω = 125 MHz (see
Figure 2)
2.5
ns
th(d3)
Data hold time (RD0–RD9)
TBI half-rate mode, Rω = 125 MHz (see
Figure 2)
1.5
ns
TRANSMITTER TIMING REQUIREMENTS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
tsu(d4)
Data setup time (TD0–TD9)
1.6
th(d4)
Data hold time (TD0–TD9)
0.8
tr, tf
TD[0,9] data rise and fall time
10
See Figure 9
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TYP
MAX
UNIT
ns
ns
2
ns
TLK1221
www.ti.com
SLLS713 – FEBRUARY 2007
Table 3. AVAILABLE OPTIONS
TA
PACKAGE
QFN PLASTIC QUAD FLAT PACK (RHA)
–40°C to 85°C
TLK1221RHA
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11
TLK1221
www.ti.com
SLLS713 – FEBRUARY 2007
APPLICATION INFORMATION
8b/10b Transmission Code
The PCS maps GMII signals into ten-bit code groups and vice versa, using an 8b/10b block coding scheme. The
PCS uses the transmission code to improve the transmission characteristics of information to be transferred
across the link. The encoding defined by the transmission code ensures that sufficient transitions are present in
the PHY bit stream to make clock recovery possible in the receiver. Such encoding also greatly increases the
likelihood of detecting any single- or multiple-bit errors that may occur during transmission and reception of
information. The 8b/10b transmission code specified for use has a high transition density, is run length limited,
and is dc-balanced. The transition density of the 8b/10b symbols ranges from 3 to 8 transitions per symbol. The
definition of the 8b/10b transmission code is specified in IEEE 802.3 Gigabit Ethernet and ANSI X3.230-1994
(FC-PH), clause 11.
8b/10b transmission code uses letter notation describing the bits of an unencoded information octet. The bit
notation of A, B, C, D, E, F, G, H for an unencoded information octet is used in the description of the 8b/10b
transmission code-groups, where A is the LSB. Each valid code group has been given a name using the
following convention: /Dx.y/ for the 256 valid data code-groups and /Kx.y/ for the special control code-groups,
where y is the decimal value of bits EDCBA and x is the decimal value of bits HGF (noted as K<HGF.EDCBA>).
Thus, an octet value of FE representing a code-group value of K30.7 would be represented in bit notation as
111 11110.
12
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TLK1221
www.ti.com
SLLS713 – FEBRUARY 2007
APPLICATION INFORMATION (continued)
VDD
TXP
5 kW
RXP
Z0
7.5 kW
Z0
GND
+
_
VDD
Z0
5 kW
TXN
Z0
RXN
7.5 kW
GND
Transmitter
Media
Receiver
Figure 10. High-Speed I/O Directly Coupled Mode
VDD
TXP
5 kW
RXP
Z0
7.5 kW
Z0
GND
+
_
VDD
Z0
5 kW
TXN
Z0
RXN
7.5 kW
GND
Transmitter
Media
Receiver
Figure 11. High-Speed I/O AC-Coupled Mode
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13
TLK1221
www.ti.com
SLLS713 – FEBRUARY 2007
APPLICATION INFORMATION (continued)
5 W at 100 MHz
2.5 V
2.5 V
40
VDD
VDDA
GNDQFN
0.01 µF
VDDPLL
GNDA
GNDA
TLK1221
10
TD0–TD9
TXP
38
Controlled-Impedance
Transmission Line
39
Controlled-Impedance
Transmission Line
34
Controlled-Impedance
Transmission Line
14
REFCLK
31
PRBSEN
15
LOOPEN
32
SYNCEN
Host
Protocol
Device
30
TXN
SYNC/PASS
10
RD0–RD9
2
RBC0–RBC1
1
ENABLE
13
RXP
RCBMODE
RXN
Rt
50 W
Rt
50 W
33
Figure 12. Typical Application Circuit (AC Mode)
14
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Controlled-Impedance
Transmission Line
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLK1221RHAR
ACTIVE
QFN
RHA
40
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1221RHARG4
ACTIVE
QFN
RHA
40
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1221RHAT
ACTIVE
QFN
RHA
40
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1221RHATG4
ACTIVE
QFN
RHA
40
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLK1221RHAR
ACTIVE
QFN
RHA
40
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1221RHARG4
ACTIVE
QFN
RHA
40
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1221RHAT
ACTIVE
QFN
RHA
40
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TLK1221RHATG4
ACTIVE
QFN
RHA
40
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1