NTE NTE6810

NTE6810
Integrated Circuit
128 x 8–Bit Static Random Access Memory (SRAM)
Description:
The NTE6810 is a byte–orgainzed memory in a 24–Lead DIP type package designed for use in bus–
organized systems. It is fabricated with N–channel silicon–gate technology. For ease of use, this
device operates from a single power supply, has compatibility with TTL and DTL, and needs no clocks
or refreshing because of static operation.
The memory is compatible with the 6800 Microcomputer Family, providing random storage in byte
increments. Memory expansion is provided through multiple Chip Select inputs.
Features:
D Organized as 128 Bytes of 8–Bits
D Static Operation
D Bidirectional Three–State Data Input/Output
D Six Chip Select Inputs (Four Active Low, Two Active High)
D Single 5V Power Supply
D TTL Compatible
D Maximum Access Time: 450ns
Absolute Maximum Ratings:
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to +7V
Input Voltage, Vin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to +7V
Operating Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0° to +70°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +150°C
Thermal Resistance, Junction to Ambient, RΘJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +120°C/W
Note 1. This device contains circuitry to protect the inputs against damage due to high static voltages
or electric fields; however, it is advised that normal precautions be taken to avoid application
of any voltage higher than maximum rated voltages to this high impedance circuit. Reliability
of operation is enhanced if unused inputs are tied to an appropriate logic voltage (e.g., either
VSS or VCC).
DC Electrical Characteristics: (VCC = 5V ±5%, VSS = 0, TA = 0° to +70°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Max
Unit
VCC
V
Input High Voltage
VIH
VSS +2.0
Input Low Voltage
VIL
VSS –0.3 VSS +0.8
Input Current
(An, R/W, CSn)
Iin
Vin = 0 to 5.25V
V
–
2.5
µA
2.4
–
V
Output High Voltage
VOH
IOH = –205µA
Output Low Voltage
VOL
IOL = 1.6mA
–
0.4
V
Output Leakage Current
(Three–State)
ITSI
CS = 0.8V or CS = 2V,
Vout = 0.4V to 2.4V
–
10
µA
Supply Current
ICC
VCC = 5.25V, All other pins grounded
–
80
mA
Input Capacitance
(An, R/W, CSn, CSn)
Cin
Vin = 0, TA = +25°C, f = 1MHz
–
7.5
pF
Output Capacitance (Dn)
Cout
Vout = 0, TA = +25°C, f = 1MHz, CSO = 0
–
12.5
pF
Min
Max
Unit
tcyc(R)
450
–
ns
Access Time
tacc
–
450
ns
Address Setup Time
tAS
20
–
ns
Address Hold Time
tAH
0
–
ns
Data Delay Time (Read)
tDDR
–
230
ns
Read to Select Delay Time
tRCS
0
–
ns
Data Hold from Address
tDHA
10
–
ns
tH
10
–
ns
Data Hold from Read
tDHR
10
80
ns
Read Hold from Chip Select
tRH
0
–
ns
tcyc(W)
450
–
ns
Address Setup Time
tAS
20
–
ns
Address Hold Time
tAH
0
–
ns
Chip Select Pulse Width
tCS
300
–
ns
Write to Chip Select Delay Time
tWCS
0
–
ns
Data Setup Time (Write)
tDSW
190
–
ns
tH
10
–
ns
tWH
0
–
ns
AC Operating Conditions and Characteristics:
Parameter
Symbol
Read Cycle (VCC = 5V ±5%, VSS = 0, TA = 0° to +70° unless otherwise specified)
Read Cycle Time
Output Hold Time
Write Cycle (VCC = 5V ±5%, VSS = 0, TA = 0° to +70° unless otherwise specified)
Write Cycle Time
Input Hold Time
Write Hold Time from Chip Select
Read Cycle Timing
tcyc(R)
tacc
Address
tAS
tAH
CS
tDDR
CS
tRH
tRCS
R/W
tDHA
tDHR
tH
Data Valid
Data In
= Don’t Care
Note 1. Voltage levels shown are VL ≤ 0.4V, VH ≥ 2.4V, unless otherwise specified.
Note 2. Measurement pointas shown are 0.8V and 2.0V, unless otherwise specified.
Note 3. CS and CS have same timing.
Write Cycle Timing
tcyc(W)
Address
tAS
tCS
tAH
CS
CS
tWH
tWCS
R/W
tDSW
Data In
tH
Data in Stable
= Don’t Care
Note 1. Voltage levels shown are VL ≤ 0.4V, VH ≥ 2.4V, unless otherwise specified.
Note 2. Measurement pointas shown are 0.8V and 2.0V, unless otherwise specified.
Note 3. CS and CS have same timing.
Pin Connection Diagram
GND
1
24 VCC
D0
2
23 A0
D1
3
22 A1
D2
4
21 A2
D3
5
20 A3
D4
6
19 A4
D5
7
18 A5
D6
8
17 A6
D7
9
16 R/W
CS0 10
15 CS5
CS1
11
14 CS4
CS2
12
13 CS3
24
13
1
12
.520
(13.2)
1.300 (33.02)
Max
.225
(5.73)
Max
.100 (2.54)
1.100 (27.94)
.126
(3.22)
Min
.600
(15.24)