TI LMR14206XMKX

LMR14206
LMR14206 SIMPLE SWITCHER ® 42Vin, 0.6A Step-Down Voltage Regulator in
SOT-23
Literature Number: SNVS733B
LMR14206
SIMPLE SWITCHER® 42Vin, 0.6A Step-Down Voltage
Regulator in SOT-23
Features
Applications
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Input voltage range of 4.5V to 42V
Output voltage range of 0.765V to 34V
Output current up to 0.6A
1.25 MHz switching frequency
Low shutdown Iq, 16 µA typical
Short circuit protected
Internally compensated
Soft-start function
Thin SOT23-6 package (2.97 x 1.65 x 1mm)
Fully enabled for WEBENCH® Power Designer
Point-of-Load Conversions from 5V, 12V, and 24V Rails
Space Constrained Applications
Battery Powered Equipment
Industrial Distributed Power Applications
Power Meters
Portable Hand-Held Instruments
Performance Benefits
■ Tight accuracy for powering digital ICs
■ Extremely easy to use
■ Tiny overall solution reduces system cost
System Performance
Efficiency vs Load Current
VIN = 24V, VOUT = 1.2V and 3.3V
100
100
90
90
80
80
70
70
EFFICIENCY (%)
EFFICIENCY (%)
Efficiency vs Load Current
VIN = 12V, VOUT = 1.2V and 3.3V
60
50
40
30
20
50
40
30
20
10
10
1.2Vout
3.3Vout
0
0.0
60
0.1
0.2
0.3
0.4
0.5
LOAD CURRENT (A)
1.2Vout
3.3Vout
0
0.6
0.0
0.1
0.2
0.3
0.4
0.5
LOAD CURRENT (A)
30167173
0.6
30167174
30167102
© 2011 Texas Instruments Incorporated
301671
www.ti.com
LMR14206 SIMPLE SWITCHER® 42Vin, 0.3A Step-Down Voltage Regulator in SOT-23
November 1, 2011
LMR14206
Connection Diagram
Top View
30167104
TSOT 6 Lead
NS Package Number MK06A
Ordering Information
Order Number
Spec.
Package Type
NSC
Package
Drawing
Top Mark
Supplied As
NOPB
TSOT-6
MKA06A
SJ2B
1000 Units, Tape and Reel
LMR14206XMKE
250 Units, Tape ad Reel
LMR14206XMK
LMR14206XMKX
3000 Units, Tape and Reel
Pin Descriptions
Pin
Name
1
CB
2
GND
3
FB
4
SHDN
Function
SW FET gate bias voltage. Connect CBOOT cap between CB and SW.
Ground connection.
Feedback pin: Set feedback voltage divider ratio with VOUT = VFB (1+(R1/R2)). Resistors should
be in the 100-10K range to avoid input bias errors.
Logic level shutdown input. Pull to GND to disable the device and pull high to enable the device.
If this function is not used tie to VIN or leave open.
5
VIN
Power input voltage pin: 4.5V to 42V normal operating range.
6
SW
Power FET output: Connect to inductor, diode, and CBOOT cap.
www.ti.com
2
If Military/Aerospace specified devices are required,
please contact the Texas Instruments Sales Office/
Distributors for availability and specifications.
VIN
SHDN
SW Voltage
CB Voltage above SW Voltage
FB Voltage
Maximum Junction
Temperature
Power Dissipation(Note 2)
Lead Temperature
Vapor Phase (60 sec.)
-0.3V to +45V
-0.3V to (VIN+0.3V)
SHDN=VIN at 45V max
-0.3V to +45V
7V
-0.3V to +5V
150°C
Operating Conditions
Operating Junction
Temperature Range (Note 4)
Storage Temperature
Input Voltage VIN
SW Voltage
Internally Limited
300°C
215°C
−40°C to +125°C
−65°C to +150°C
4.5V to 42V
Up to 42V
Electrical Characteristics
Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature
Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical
values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise
stated the following conditions apply: VIN = 12V.
Symbol
IQ
Min (Note 4) Typ (Note 5) Max (Note 4)
Units
16
40
µA
Device On, Not Switching
1.30
1.75
Device On, No Load
1.35
1.85
Parameter
Quiescent current
Conditions
SHDN = 0V
mA
RDSON
Switch ON resistance
(Note 6)
0.9
1.6
Ω
ILSW
Switch leakage current
VIN = 42V
0.0
0.5
µA
ICL
Switch current limit
(Note 7)
1.15
IFB
Feedback pin bias current
(Note 8)
VFB
FB Pin reference voltage
tMIN
Minimum ON time
fSW
Switching frequency
1.0
µA
0.765
0.782
V
0.95
1.25
VFB = 0V
Maximum duty cycle
VUVP
Undervoltage lockout
thresholds
On threshold
Shutdown threshold
Device on
ns
1.50
0.35
81
87
4.4
3.7
Off threshold
3.5
2.3
Device off
ISHDN
0.1
0.747
100
VFB = 0.5V
DMAX
VSHDN
A
Shutdown pin input bias current VSHDN = 2.3V (Note 8)
VSHDN = 0V
MHz
%
3.25
1.0
0.9
0.3
0.05
1.5
0.02
1.5
V
V
µA
THERMAL SPECIFICATIONS
RθJA
Junction-to-Ambient Thermal (Note 9)
Resistance, TSOT-6L Package
121
3
°C/W
www.ti.com
LMR14206
Infrared (15 sec.)
220°C
For soldering specifications: see product folder at
www.national.com and www.national.com/ms/MS/MSSOLDERING.pdf
ESD Susceptibility
(Note 3)
Human Body Model
1.5 kV
Absolute Maximum Ratings (Note 1)
LMR14206
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance,
θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/
θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=175°C (typ.) and disengages at TJ=155°C (typ).
Note 3: Human Body Model, applicable std. JESD22-A114-C.
Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used
to calculate Average Outgoing Quality Level (AOQL).
Note 5: Typical numbers are at 25°C and represent the most likely norm.
Note 6: Includes the bond wires, RDSON from VIN pin to SW pin.
Note 7: Current limit at 0% duty cycle.
Note 8: Bias currents flow into pin.
Note 9: All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards.
Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient
temperature, and air flow.
www.ti.com
4
LMR14206
Typical Performance Characteristics
Input UVLO vs. Temperature
SHDN Pin Current vs. SHDN Pin Voltage
30167167
30167169
Switching Node and Output Voltage Waveforms
Load Transient Waveforms
30167170
VIN = 12V, VOUT = 3.3V, IOUT = 200 mA
Top trace: VOUT, 10 mV/div, AC Coupled
Bottom trace: SW, 5V/div, DC Coupled
T = 1 µs/div
30167171
VIN = 12V, VOUT = 3.3V, IOUT = 300 mA to 200 mA to 300 mA
Top trace: VOUT, 20 mV/div, AC Coupled
Bottom trace: IOUT, 100 mA/div, DC Coupled
T = 200 µs/div
Start-Up Waveform
Switch Current Limit vs. SHDN Pin Voltage
(Soft-Start Implementation)
30167172
VIN = 12V, VOUT = 3.3V, IOUT = 50 mA
Top trace: VOUT, 1V/div, DC Coupled
Bottom trace: SHDN, 2V/div, DC Coupled
T = 40 µs/div
30167121
5
www.ti.com
LMR14206
Block Diagram
30167103
output voltage. In continuous conduction mode (when the inductor current never reaches zero at steady state), the buck
regulator operates in two cycles. The power switch is connected between VIN and SW. In the first cycle of operation the
transistor is closed and the diode is reverse biased. Energy
is collected in the inductor and the load current is supplied by
COUT and the rising current through the inductor. During the
second cycle the transistor is open and the diode is forward
biased due to the fact that the inductor current cannot instantaneously change direction. The energy stored in the inductor
is transferred to the load and output capacitor. The ratio of
these two cycles determines the output voltage. The output
voltage is defined approximately as: D=VOUT/VIN and D’ = (1D) where D is the duty cycle of the switch. D and D' will be
required for design calculations.
General Description
The LMR14206 is a PWM DC/DC buck (step-down) regulator.
With a wide input range from 4.5V-42V, they are suitable for
a wide range of applications such as power conditioning from
unregulated sources. They feature a low RDSON (0.9Ω typical)
internal switch for maximum efficiency (85% typical). Operating frequency is fixed at 1.25 MHz allowing the use of small
external components while still being able to have low output
voltage ripple. Soft-start can be implemented using the shutdown pin with an external RC circuit allowing the user to tailor
the soft-start time to a specific application.
The LMR14206 is optimized for up to 600 mA load current
with a 0.765V nominal feedback voltage.
Additional features include: thermal shutdown, VIN under-voltage lockout, and gate drive under-voltage lockout. The
LMR14206 is available in a low profile TSOT-6L package.
DESIGN PROCEDURE
This section presents guidelines for selecting external components.
Operation
SETTING THE OUTPUT VOLTAGE
The output voltage is set using the feedback pin and a resistor
divider connected to the output as shown on the front page
schematic. The feedback pin voltage is 0.762V, so the ratio
of the feedback resistors sets the output voltage according to
the following equation: VOUT=0.765V(1+(R1/R2)) Typically
R2 will be given as 100Ω-10 kΩ for a starting value. To solve
for R1 given R2 and VOUT use R1=R2((VOUT/0.765V)-1).
PROTECTION
The LMR14206 has dedicated protection circuitry running
during normal operation to protect the IC. The thermal shutdown circuitry turns off the power device when the die temperature reaches excessive levels. The UVLO comparator
protects the power device during supply power startup and
shutdown to prevent operation at voltages less than the minimum input voltage. A gate drive (CB) under-voltage lockout
is included to guarantee that there is enough gate drive voltage to drive the MOSFET before the device tries to start
switching. The LMR14206 also features a shutdown mode
decreasing the supply current to approximately 16 µA.
INPUT CAPACITOR
A low ESR ceramic capacitor (CIN) is needed between the
VIN pin and GND pin. This capacitor prevents large voltage
transients from appearing at the input. Use a 2.2 µF-10 µF
value with X5R or X7R dielectric. Depending on construction,
a ceramic capacitor’s value can decrease up to 50% of its
nominal value when rated voltage is applied. Consult with the
CONTINUOUS CONDUCTION MODE
The LMR14206 contains a current-mode, PWM buck regulator. A buck regulator steps the input voltage down to a lower
www.ti.com
6
DC switching regulator. The SHDN pin in conjunction with a
RC filter is used to tailor the soft-start for a specific application.
When a voltage applied to the SHDN pin is between 0V and
up to 2.3V it will cause the cycle by cycle current limit in the
power stage to be modulated for minimum current limit at 0V
up to the rated current limit at 2.3V. Thus controlling the output
rise time and inrush current at startup. The resistor value
should be selected so the current sourced into the SHDN pin
will be greater then the leakage current of the SHDN pin (1.5
µA ) when the voltage at SHDN is equal or greater then 2.3V.
INDUCTOR SELECTION
The most critical parameters for the inductor are the inductance, peak current, and the DC resistance. The inductance
is related to the peak-to-peak inductor ripple current, the input
and the output voltages.
SHUTDOWN OPERATION
The SHDN pin of the LMR14206 is designed so that it may
be controlled using 2.3V or higher logic signals. If the shutdown function is not to be used the SHDN pin may be tied to
VIN. The maximum voltage to the SHDN pin should not exceed 42V. If the use of a higher voltage is desired due to
system or other constraints it may be used, however a 100
kΩ or larger resistor is recommended between the applied
voltage and the SHDN pin to protect the device.
A higher value of ripple current reduces inductance, but increases the conductance loss, core loss, and current stress
for the inductor and switch devices. It also requires a bigger
output capacitor for the same output voltage ripple requirement. A reasonable value is setting the ripple current to be
30% of the DC output current. Since the ripple current increases with the input voltage, the maximum input voltage is
always used to determine the inductance. The DC resistance
of the inductor is a key parameter for the efficiency. Lower DC
resistance is available with a bigger winding area. A good
tradeoff between the efficiency and the core size is letting the
inductor copper loss equal 2% of the output power. See
AN-1197 for more information on selecting inductors. A good
starting point for most applications is a 10 µH to 22 µH with
1.1A or greater current rating. Using such a rating will enable
the LMR14206 to current limit without saturating the inductor.
This is preferable to the device going into thermal shutdown
mode and the possibility of damaging the inductor if the output
is shorted to ground or other longterm overload.
SCHOTTKY DIODE
The breakdown voltage rating of the diode (D1) is preferred
to be 25% higher than the maximum input voltage. The current rating for the diode should be equal to the maximum
output current for best reliability in most applications. In cases
where the input voltage is much greater than the output voltage the average diode current is lower. In this case it is
possible to use a diode with a lower average current rating,
approximately (1-D)IOUT, however the peak current rating
should be higher than the maximum load current. A 0.5A to
1A rated diode is a good starting point.
LAYOUT CONSIDERATIONS
To reduce problems with conducted noise pick up, the ground
side of the feedback network should be connected directly to
the GND pin with its own connection. The feedback network,
resistors R1 and R2, should be kept close to the FB pin, and
away from the inductor to minimize coupling noise into the
feedback pin. The input bypass capacitor CIN must be placed
close to the VIN pin. This will reduce copper trace resistance
which effects input voltage ripple of the IC. The inductor L1
should be placed close to the SW pin to reduce magnetic and
electrostatic noise. The output capacitor, COUT should be
placed close to the junction of L1 and the diode D1. The L1,
D1, and COUT trace should be as short as possible to reduce
conducted and radiated noise and increase overall efficiency.
The ground connection for the diode, CIN, and COUT should
be as small as possible and tied to the system ground plane
in only one spot (preferably at the COUT ground point) to minimize conducted noise in the system ground plane. For more
detail on switching power supply layout considerations see
Application Note AN-1149: Layout Guidelines for Switching
Power Supplies.
OUTPUT CAPACITOR
The selection of COUT is driven by the maximum allowable
output voltage ripple. The output ripple in the constant frequency, PWM mode is approximated by: VRIPPLE = IRIPPLE
(ESR+(1/(8fSWCOUT))) The ESR term usually plays the dominant role in determining the voltage ripple. Low ESR ceramic
capacitors are recommended. Capacitors in the range of 22
µF-100 µF are a good starting point with an ESR of 0.1Ω or
less.
BOOTSTRAP CAPACITOR
A 0.15 µF ceramic capacitor or larger is recommended for the
bootstrap capacitor (CBOOT). For applications where the input
voltage is less than twice the output voltage a larger capacitor
is recommended, generally 0.15 µF to 1 µF to ensure plenty
of gate drive for the internal switches and a consistently low
RDSON.
SOFT-START COMPONENTS
The LMR14206 has circuitry that is used in conjunction with
the SHDN pin to limit the inrush current on start-up of the DC/
7
www.ti.com
LMR14206
capacitor manufacturer's data sheet for information on capacitor derating over voltage and temperature.
LMR14206
Typical Applications
30167105
FIGURE 1. Application Circuit, 3.3V Output
30167108
FIGURE 2. Application Circuit, 5V Output
30167109
FIGURE 3. Application Circuit, 12V Output
www.ti.com
8
LMR14206
30167116
FIGURE 4. Application Circuit, 15V Output
30167117
FIGURE 5. Application Circuit, 0.8V Output
9
www.ti.com
LMR14206
Physical Dimensions inches (millimeters) unless otherwise noted
TSOT 6 Pin Package (MK)
For Ordering, Refer to Ordering Information Table
NS Package Number MK06A
www.ti.com
10
LMR14206
Notes
11
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated