TLV61224 SLVSAM7 – MARCH 2011 www.ti.com Single Cell High Efficient Step-Up Converter in 6 Pin SC-70 Package FEATURES APPLICATIONS • • 1 • • • • • • • • • Up to 94% Efficiency at Typical Operating Conditions 5 μA Quiescent Current Operating Input Voltage from 0.7 V to 3.0 V Pass-Through Function during Shutdown More than 40mA Output Current from a 1.2V Input Typical Switch Current Rating 400 mA Output Overvoltage Protection Overtemperature Protection Fixed 3.0 V Output Voltage Small 6-pin SC-70 Package • • Battery Powered Applications – 1 to 2 Cell NiMH or Alkaline – 1 cell Li-Primary Consumer and Portable Medical Products Personal Care Products DESCRIPTION The TLV61224 provides a power-supply solution for products powered by either a single-cell or two-cell alkaline or NiMH, or one-cell Li-primary battery. Possible output currents depend on the input-to-output voltage ratio. The boost converter is based on a hysteretic controller topology using synchronous rectification to obtain maximum efficiency at minimal quiescent currents. The output voltage of this device is set internally to a fixed output voltage of 3.0 V. The converter can be switched off by a featured enable pin. While being switched off, battery drain is minimized. The device is offered in a 6-pin SC-70 package (DCK) measuring 2 mm x 2 mm to enable small circuit layout size. L1 4.7 µH VIN 0.8 V to VOUT VOUT L VIN C1 10 µF FB C2 10µF VOUT 3.0 V EN GND TLV61224 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TLV61224 SLVSAM7 – MARCH 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE DEVICE OPTIONS (1) TA OUTPUT VOLTAGE DC/DC PACKAGE MARKING PACKAGE –40°C to 85°C 3.0 V QXC 6-Pin SC-70 (1) (2) (2) PART NUMBER TLV61224DCK Contact the factory to check availability of other fixed output voltage versions. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage range (2) VIN, L, VOUT, EN, FB –0.3 7.5 V Temperature range Operating junction temperature, TJ –40 150 °C Storage, Tstg –65 150 °C 2 kV ESD rating (3) (1) (2) (3) Human Body Model - (HBM) Machine Model (MM) 200 V Charge Device Model - (CDM) 1.5 kV Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network ground terminal. ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL INFORMATION THERMAL METRIC (1) TLV61224 θJA Junction-to-ambient thermal resistance 231.9 θJCtop Junction-to-case (top) thermal resistance 55.8 θJB Junction-to-board thermal resistance 77.3 ψJT Junction-to-top characterization parameter 0.7 ψJB Junction-to-board characterization parameter 76.4 (1) UNITS DCK (6) PINS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS MIN VIN Supply voltage at VIN 0.7 TA Operating free air temperature range TJ Operating virtual junction temperature range 2 Submit Documentation Feedback NOM MAX UNIT 3.0 V –40 85 °C –40 125 °C Copyright © 2011, Texas Instruments Incorporated TLV61224 SLVSAM7 – MARCH 2011 www.ti.com ELECTRICAL CHARACTERISTICS over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted) DC/DC STAGE PARAMETER TEST CONDITIONS VIN Input voltage range VIN Maximum minimum input voltage RLoad ≥ 150 Ω, TA = 25°C for startup VOUT TLV61224 output voltage ILH Inductor current ripple ISW MIN TYP 0.7 3.0 0.7 VIN < VOUT 2.85 switch current limit VOUT = 3.0 V, VIN = 1.2 V 160 RDSon_HSD Rectifying switch on resistance VOUT = 3.0 V RDSon_LSD Main switch on resistance VOUT = 3.0 V Line regulation VIN < VOUT 0.5 % Load regulation VIN < VOUT 0.5 % VIN Quiescent current ISD Shutdown current ILKG_VOUT Leakage current into VOUT VEN = 0 V, VIN = 1.2 V, VOUT = 3.0 V ILKG_L Leakage current into L VEN = 0 V, VIN = 1.2 V, VL = 1.2 V, VOUT ≥ VIN IEN EN input current Clamped on GND or VIN (VIN < 1.5 V) VIN 3.0 IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.0 V VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN UNIT V V 3.15 200 IQ VOUT MAX V mA 400 mA 1000 mΩ 600 mΩ 0.5 1 μA 5 10 μA 0.2 1 μA μA 1 0.01 0.7 μA 0.005 0.1 μA CONTROL STAGE VIL maximum EN input low voltage VIN ≤ 1.5 V 0.2 × VIN VIH minimum EN input high voltage VIN ≤ 1.5 V VIL maximum EN input low voltage VIN > 1.5 V 0.4 V VIH minimum EN input high voltage VIN > 1.5 V 1.2 V VUVLO Undervoltage lockout threshold for turn off VIN decreasing 500 mV 0.8 × VIN Undervoltage lockout hysteresis Overvoltage protection threshold V 50 5.5 V mV 7.5 V Overtemperature protection 140 °C Overtemperature hysteresis 20 °C Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 3 TLV61224 SLVSAM7 – MARCH 2011 www.ti.com PIN ASSIGNMENTS DCK PACKAGE (TOP VIEW) VIN FB GND EN L VOUT Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION EN 6 I Enable input (1: enabled, 0: disabled). Must be actively tied high or low. FB 2 I Output voltage sense input. Must be connected to VOUT. GND 3 L 5 I Connection for Inductor VIN 1 I Boost converter input voltage VOUT 4 O Boost converter output voltage 4 Control / logic and power ground Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TLV61224 SLVSAM7 – MARCH 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM (TLV61224) L VOUT VOUT VIN Gate Driver VIN Start Up Current Sensor FB Device Control EN GND VREF PARAMETER MEASUREMENT INFORMATION L1 L VIN VOUT VOUT VIN C2 FB EN C1 GND TLV61224 Table 1. List of Components: COMPONENT REFERENCE PART NUMBER MANUFACTURER VALUE C1 GRM188R60J106ME84D Murata 10 μF, 6.3V C2 GRM188R60J106ME84D Murata 10 μF, 6.3V L1 EPL3015-472MLB Coilcraft 4.7 μH Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 5 TLV61224 SLVSAM7 – MARCH 2011 www.ti.com TYPICAL CHARACTERISTICS Table of Graphs FIGURE Minimum of Maximum Output Current Efficiency Input Current Output Voltage Waveforms vs Input Voltage 1 vs Output Current, VIN = [1.2 V; 2.4 V] 2 vs Input Voltage, IOUT = [100 uA; 1 mA; 10 mA; 50 mA] 3 vs Input Voltage at No Output Load, Device Enabled 4 vs Output Current, VIN = [1.2 V; 2.4 V] 5 vs Input Voltage, Device Disabled, RLOAD = [1 kΩ; 10 kΩ] 6 Load Transient Response, VIN = 1.2 V, IOUT = 10 mA to 30 mA 7 Line Transient Response, VIN = 0.9 V to 1.2 V, IOUT = 30 mA 8 Startup after Enable, VIN = 0.7 V, RLOAD = 150 Ω 9 EFFICIENCY vs OUTPUT CURRENT 180 100 160 90 140 80 70 120 Efficiency (%) Output Current (mA) MINIMUM OF MAXIMUM OUTPUT CURRENT vs INPUT VOLTAGE 100 80 60 60 50 40 30 40 20 20 10 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Input Voltage (V) 2.4 2.6 2.8 VIN = 1.2 V VIN = 2.4 V 0 0.01 3.0 0.1 1 Output Current (mA) 10 100 Figure 1. Figure 2. EFFICIENCY vs INPUT VOLTAGE NO LOAD APPLICATION INPUT CURRENT vs INPUT VOLTAGE 100 40 90 35 80 30 Input Current (µA) Efficiency (%) 70 60 50 40 30 IOUT = 0.1 mA IOUT = 1 mA IOUT = 10 mA IOUT = 50 mA 20 10 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Input Voltage (V) Figure 3. 6 Submit Documentation Feedback 2.4 2.6 2.8 3.0 25 20 15 10 5 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Input Voltage (V) 2.4 2.6 2.8 3.0 Figure 4. Copyright © 2011, Texas Instruments Incorporated TLV61224 SLVSAM7 – MARCH 2011 www.ti.com OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs INPUT VOLTAGE, DEVICE DISABLED 3.15 2.4 2.2 2.0 Output Voltage (V) Output Voltage (V) 3.10 3.05 3.00 2.95 1.8 1.6 1.4 1.2 1.0 0.8 0.6 2.90 0.4 VIN = 1.2 V VIN = 2.4 V 2.85 0.01 0.1 RLoad = 1 kΩ RLoad = 10 kΩ 0.2 1 Output Current (mA) 10 0.0 0.8 100 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Input Voltage (V) 2.4 Figure 5. Figure 6. LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE 2.6 2.8 3.0 Input Voltage 500 mV/div, DC Output Current 20 mA/div, DC Output Voltage 10 mV/div, AC Output Voltage 10 mV/div, AC VIN = 1.2 V, IOUT = 10 mA to 30 mA VIN = 0.9 V to 1.2 V, IOUT = 30 mA TLV61224 TLV61224 Time 2 ms/div Figure 7. Time 2 ms/div Figure 8. STARTUP AFTER ENABLE Enable Voltage 2 V/div, DC Output Voltage 500 mV/div, DC Inductor Current 100 mA/div, DC TLV61224 VIN = 1.2 V, RLOAD = 150 W Time 40 ms/div Figure 9. Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 7 TLV61224 SLVSAM7 – MARCH 2011 www.ti.com DETAILED DESCRIPTION OPERATION The TLV61224 is a high performance, high efficient boost converter. To achieve high efficiency the power stage is implemented as a synchronous boost topology. For the power switching two actively controlled low RDSon power MOSFETs are used. CONTROLLER CIRCUIT The device is controlled by a hysteretic current mode controller. This controller regulates the output voltage by keeping the inductor ripple current constant in the range of 200 mA and adjusting the offset of this inductor current depending on the output load. In case the required average input current is lower than the average inductor current defined by this constant ripple the inductor current gets discontinuous to keep the efficiency high at low load conditions. IL Continuous Current Operation Discontinuous Current Operation 200 mA (typ.) 200 mA (typ.) t Figure 10. Hysteretic Current Operation The output voltage VOUT is monitored via the internal feedback network which is connected to the voltage error amplifier. To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage reference and adjusts the required offset of the inductor current accordingly. Device Enable and Shutdown Mode The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops switching and all internal control circuitry is turned off. In this case the input voltage is connected to the output through the back-gate diode of the rectifying MOSFET. This means that there always will be voltage at the output which can be as high as the input voltage or lower depending on the load. Startup After the EN pin is tied high, the device starts to operate. In case the input voltage is not high enough to supply the control circuit properly a startup oscillator starts to operate the switches. During this phase the switching frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has built up the output voltage to about 1.8V, high enough for supplying the control circuit, the device switches to its normal hysteretic current mode operation. The startup time depends on input voltage, load current and output capacitance. Operation at Output Overload If in normal boost operation the inductor current reaches the internal switch current limit threshold the main switch is turned off to stop further increase of the input current. In this case the output voltage will decrease since with limited input current it is not possible anymore to provide sufficient power to the output to maintain the programmed output voltage. If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased and current starts flowing through it. This diode cannot be turned off, so the current finally is only limited by the remaining DC resistances. As soon as the output load has decreased to a value the converter can supply, the converter resumes normal operation providing the set output voltage. 8 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TLV61224 www.ti.com SLVSAM7 – MARCH 2011 Undervoltage Lockout An implemented undervoltage lockout function (UVLO) stops the operation of the converter if the input voltage drops below the typical undervoltage lockout threshold. This function is implemented in order to prevent malfunctioning of the converter and protect batteries against deep discharge. Overvoltage Protection If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the output voltage will not work anymore. Therefore overvoltage protection is implemented to avoid the output voltage exceeding critical values for the device and possibly for the system it is supplying. For this protection the TLV61224 output voltage is also monitored internally. In case it reaches the internally programmed threshold the voltage amplifier regulates the output voltage to this value. Overtemperature Protection The device has a built-in temperature sensor which monitors the internal IC junction temperature. If the temperature exceeds the programmed threshold (see electrical characteristics table), the device stops operating. As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. To prevent unstable operation close to the region of overtemperature threshold, a built-in hysteresis is implemented. Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 9 TLV61224 SLVSAM7 – MARCH 2011 www.ti.com APPLICATION INFORMATION DESIGN PROCEDURE The TLV61224 DC/DC converter is intended for systems powered by a single or dual cell Alkaline or NiMH battery with a typical terminal voltage between 0.7 V and 3.0 V. Additionally, any other voltage source with a typical output voltage between 0.7 V and 3.0 V can be used with the TLV61224. Programming the Output Voltage At fixed voltage versions, the output voltage is programmed by an internal resistor divider. The FB pin is used to sense the output voltage. To configure the devices properly, the FB pin needs to be connected directly to VOUT. Inductor Selection To make sure that the TLV61224 devices can operate, a suitable inductor must be connected between pin VIN and pin L. Inductor values of 4.7 μH show good performance over the whole input and output voltage range. Due to the fixed inductor current ripple control the switching frequency is defined by the inductor value. For a given switching frequency, input and output voltage the required inductance can be estimated using Equation 1. L= V ´ (VOUT - VIN ) 1 ´ IN f ´ 200 mA VOUT (1) Using inductor values higher than 4.7 μH can improve efficiency since higher values cause lower switching frequency and less switching losses. Using inductor values below 2.2 μH is not recommended. To ensure reliable operation of the TLV61224 under all load conditions it is recommended to use inductors with a current rating of 400mA or higher. This will cover normal operation including current peaks during line and load transients. The following inductor series from different suppliers have been used with the TLV61224 converter: Table 2. List of Inductors VENDOR Coilcraft INDUCTOR SERIES EPL3015 EPL2010 Murata LQH3NP Tajo Yuden NR3015 Wurth Elektronik WE-TPC Typ S Capacitor Selection Input Capacitor At least a 10-μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and GND pins of the IC is recommended. Output Capacitor For the output capacitor C2, it is recommended to use small ceramic capacitors placed as close as possible to the VOUT and GND pins of the IC. There are no minimum output capacitor ESR requirements for maintaining control loop stability. If, for any reason, the application requires the use of large capacitors which can not be placed close to the IC, the use of a small ceramic capacitor with a capacitance value in the range of 2.2μF in parallel to the large capacitor is recommended. This small capacitor should be placed as close as possible to the VOUT and GND pins of the IC. A minimum capacitance value of 4.7 μF should be used, 10 μF are recommended. To calculate the required output capacitance, in case an inductor with a value higher than 4.7 μH has been selected, Equation 2 can be used. 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated TLV61224 SLVSAM7 – MARCH 2011 www.ti.com C2 ³ L ´ 2 (2) Layout Considerations As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC. To lay out the ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current. Assure that the ground traces are connected close to the device GND pin. L1 VOUT Enable VIN C2 VIN GND VOUT C1 GND Figure 11. PCB Layout Suggestion THERMAL INFORMATION Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below. • Improving the power-dissipation capability of the PCB design • Improving the thermal coupling of the component to the PCB • Introducing airflow in the system For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953). Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 24-Mar-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV61224DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV61224DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Mar-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV61224DCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 TLV61224DCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Mar-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV61224DCKR SC70 DCK 6 3000 203.0 203.0 35.0 TLV61224DCKT SC70 DCK 6 250 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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