Semiconductor ML670100 Version 2 Aug., 1999 OKI’s High-Performance CMOS 32-Bit Single Chip Microcontroller GENERAL DESCRIPTION The ML670100 is a high-performance 32-bit microcontroller combining a RISC based, 32-bit CPU core the ARM7TDMITM - with memory and such peripheral circuits as timers, serial ports, and analog-todigital converter. This combination of 32-bit data processing, built-in memory, and on-chip peripherals make it ideal for controlling equipment requiring both high speed and high functionality. An external memory controller supports direct connection to memory and peripheral devices for adding even more functionality. FEATURES Operating Voltage 2.7 to 3.6V Operating Frequency 25MHz maximum(3.0 to 3.6V) On-chip memory -ROM: 128 kilobytes -RAM: 4 kilobytes I/O Function I/O ports: 8 bits x 9, I/O directions are specified at the bit level Timer -Flexible timer (16-bit multi-function timer with six channels) Choice of operating modes: auto-reload timer, compare output, PWM and capture -Time base counter with WDT function Serial Port -One asynchronous serial port (UART) with baud rate generator -Two clock synchronous serial port A-to-D Converter -8-bit resolution A-to-D converter with eight analog input ports Interrupt -Support for 28 interrupt sources: 9 external and 19 internal Controller -Choice of eight priority levels for each source External Memory -Direct connection to ROM, SRAM, DRAM and peripheral devices Controller -Support for four banks: two for ROM, SRAM and I/O devices plus two for DRAM -User-configurable bus width (8/16 bits) and wait control and other parameters for accessing memory and external devices Clock Generator -Built-in crystal oscillation circuit and PLL -Choice of divider ratio (1/1, 1/2, 1/4) for adjusting operating clock frequency to match the load of processing Package 144-pin LQFP ( LQFP144-P-2020-0.50-K) ARM POWERED logo is the registered trademark of ARM Limited. ARM7TDMI is the trademark of ARM Limited. The Information contained herein can change without notice owing to product and/or technical improvement. The signal name of negative logic is being changed to nXXX from XXX in this data sheet. 1 / 27 Semiconductor ML670100 BLOCK DIAGRAM TDI* TDO* nTRST* TMS* TCK* DBGEN* DBGRQ* DBGACK* 4 kilobytes of RAM ARM7TDMI Core address bus Core data bus (32b) TMCLK[1:0]* ASI_TXD* ASI_RXD* CSI1_TXD* CSI1_RXD* CSI1_SCLK* CSI0_TXD* CSI0_RXD* CSI0_SCLK* External Memory Controller (XMC) Internal Bus Controller Time Base Generator (TBG) Interrupt Controller (INT) Flexible Timer Analog-to-digital VREF Converter AI[7:0] Asynchronous Serial Interface (ASI) Clock Synchronous Interface (CSI0 and CSI1) Clock Control Asterisks indicate signals that aresecondary functions of I/O ports. 2 / 27 PIO0[7:0] PIO1[7:0] PIO2[7:0] PIO3[7:0] PIO4[7:0] PIO5[7:0] PIO6[7:0] PIO7[7:0] PIO8[7:0] I/O Ports Brackets indicate bit ranges. nEFIQ nEIR[7:0]* (ADC) Peripheral data bus 16b) TMIN/TMOUT[5:0]* 128 kilobytes of ROM Peripheral address bus nRST nEA DBSEL TEST VDD GND AVDD AGND XA23-16* XA15-1 nLB/XA0 XD15-8* XD7-0 nCS0 nRD nWRE/nWRL nXWAIT* nCS1* nHB/nWRH* nRAS1* nWH/nCASH* nRAS0* nCAS/nCASL* nWL/nWE* nBREQ* nBACK* OSC0 OSC1 CLKOUT FSEL PLLEN VCOM Semiconductor ML670100 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 PIO3[4]/nEIR[4] PIO3[3]/nEIR[3] PIO3[2]/nEIR[2] PIO3[1]/nEIR[1] PIO3[0]/nEIR[0] VDD GND PIO2[7]/nXWAIT PIO2[6]/nCS1 PIO2[5]/nHB/nWRH PIO2[4]/nRAS1 PIO2[3]/nWH/nCASH PIO2[2]/nRAS0 PIO2[1]/nCAS/nCASL PIO2[0]/nWL/nWE VDD GND nWRE/nWRL nRD nCS0 PIO1[7]/XD15 PIO1[6]/XD14 PIO1[5]/XD13 PIO1[4]/XD12 PIO1[3]/XD11 PIO1[2]/XD10 PIO1[1]/XD9 PIO1[0]/XD8 VDD GND XD7 XD6 XD5 XD4 XD3 XD2 PIN CONFIGURATION (TOP VIEW) Top View INDEX MARK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 AI[4] AI[3] AI[2] AI[1] AI[0] VREF AVDD VDD TEST DBSEL PIO6[0] PIO6[1] PIO6[2] PIO6[3] PIO6[4] PIO6[5]] PIO6[6]] PIO6[7] PIO7[0] PIO7[1] PIO7[2] GND VDD PIO7[3] PIO7[4] PIO7[5] PIO7[6]/nBREQ PIO7[7]/nBACK PIO8[0]/DBGACK PIO8[1]/DBGRQ PIO8[2]/DBGEN PIO8[3]/TCK PIO8[4]/TMS PIO8[5]/nTRST PIO8[6]/TDO PIO8[7]/TDI PIO3[5]/nEIR[5] PIO3[6]/nEIR[6] PIO3[7]/nEIR[7] GND PIO4[0]/TMIN[0]/TMOUT[0] PIO4[1]/TMIN[1]/TMOUT[1] PIO4[2]/TMIN[2]/TMOUT[2] PIO4[3]/TMIN[3]/TMOUT[3] PIO4[4]/TMIN[4]/TMOUT[4] PIO4[5]/TMIN[5]/TMOUT[5] PIO4[6]/TMCLK[0] PIO4[7]/TMCLK[1] GND VDD PIO5[0]/CSI0_SCLK PIO5[1]/CSI0_RXD PIO5[2]/CSI0_TXD PIO5[3]/CSI1_SCLK PIO5[4]/CSI1_RXD PIO5[5]/CSI1_TXD PIO5[6]/ASI_RXD PIO5[5]/ASI_TXD CLKOUT GND OSC0 OSC1 VDD VCOM FSEL PLLEN nRST GND AGND AI[7] AI[6] AI[5] 3 / 27 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 XD1 XD0 VDD GND nEA nEFIQ PIO0[7]/XA23 PIO0[6]/XA22 PIO0[5]/XA21 PIO0[4]/XA20 PIO0[3]/XA19 PIO0[2]/XA18 PIO0[1]/XA17 PIO0[0]/XA16 VDD GND XA15 XA14 XA13 XA12 XA11 XA10 XA9 XA8 VDD GND XA7 XA6 XA5 XA4 XA3 XA2 XA1 XA0/nLB VDD GND Semiconductor ML670100 PIN DESCRIPTIONS Type Signal Name Address XA23 bus XA16 XA15 XA0 Data bus XD15 XD8 XD7- -XD0 Bus nCS0 control nCS1 signals nRD nWRL nWRH nWRE nLB nHB nRAS0 nRAS1 nCASL nCASH nWE nCAS nWH nWL nXWAIT I/O Direction Description Output Output These are bits 23-16 of the external address bus. They represent secondary functions for I/O port PIO0[7:0]. These are bits 15 - 0 of the external address bus. Bidirectional These are bits 15-8 of the external data bus. They represent secondary functions for I/O port PIO1[7:0]. Bidirectional These are bits 7-0 of the external data bus. Output This output is the chip select signal for bank 0. Output This output is the chip select signal for bank 1. It represents a secondary function for I/O port PIO2[6]. Output This output is the read signal for SRAM banks (0 and 1). Output This output is the Write Enable Low signal for SRAM banks (0 and 1). Output This output is the Write Enable High signal for SRAM banks (0 and 1). It represents a secondary function for I/O port PIO2[5]. Output This output is the Write Enable signal for SRAM banks (0 and 1). Output This output is the Low Byte Select signal for SRAM banks (0 and 1). Output This output is the High Byte Select signal for SRAM banks (0 and 1). It represents a secondary function for I/O port PIO2[5]. Output This output is the Row Address Strobe signal for bank 2. It represents a secondary function for I/O port PIO2[2]. Output This output is the Row Address Strobe signal for banks 3. It represents a secondary function for I/O port PIO2[4]. Output This output is the Column Address Strobe Low signal for DRAM banks (2 and 3). It represents a secondary function for I/O port PIO2[1]. Output This output is the Column Address Strobe High signal for DRAM banks (2 and 3). It represents a secondary function for I/O port PIO2[3]. Output This output is the Write Enable signal for DRAM banks (2 and 3). It represents a secondary function for I/O port PIO2[0]. Output This output is the Column Address Strobe signal for DRAM banks (2 and 3). It represents a secondary function for I/O port PIO2[1]. Output This output is the Write Enable High signal for DRAM banks (2 and 3). It represents a secondary function for I/O port PIO2[3]. Output This output is the Write Enable Low signal for DRAM banks (2 and 3). It represents a secondary function for I/O port PIO2[0]. Input This input pin controls insertion of wait cycles. It represents a secondary function for I/O port PIO2[7]. 4 / 27 Semiconductor ML670100 PIN DESCRIPTIONS (Cont.) Type Signal Name I/O Direction Bus nBREQ Input control signals nBACK Output Description This input is a bus request signal from an external device. It represents a secondary function for I/O port PIO7[6]. This output is an acknowledgment signal to a bus request signal from an external device. It represents a secondary function for I/O port PIO7[7]. Interru- nEFIQ Input This input is an external fast interrupt request (FIQ). When pts accepted, the request is processed as an FIQ exception. nEIR[7:0] Input This inputs are external interrupt requests. They represent secondary functions for I/O port PIO3[7:0]. Timers TMIN[5:0] Input These pins function as capture trigger input pins for Flexible Timer channels 5-0 in capture mode. They represent secondary functions for I/O port PIO4[5:0]. TMOUT[5:0] Output These pins function as output pins for Flexible Timer channels 5-0 in compare output or PWM mode. They represent secondary functions for I/O port PIO4[5:0]. TMCLK[1:0] Input These pins function as Flexible Timer channels 1 and 0 clock input pins. They represent secondary functions for I/O port PIO4[7:6]. Serial ASI_TXD Output This output is the transmit data for the Asynchronous Serial ports Interface. It represents a secondary function for I/O port PIO5[7]. ASI_RXD Input This input is the receive data for the Asynchronous Serial Interface. It represents a secondary function for I/O port PIO5[6]. CSI0_TXD Output This output is the transmit data for the Clock Synchronous Serial Interface 0. It represents a secondary function for I/O port PIO5[2]. CSI0_RXD Input This input is the receive data for the Clock Synchronous Serial Interface 0. It represents a secondary function for I/O port PIO5[1]. CSI0_SCLK Bidirectional This pin accepts/provides clock signal for the Clock Synchronous Serial Interface 0. It represents a secondary function for I/O port PIO5[0]. CSI1_TXD Output This output is the transmit data for the Clock Synchronous Serial Interface 1. It represents a secondary function for I/O port PIO5[5]. CSI1_RXD Input This input is the receive data for the Clock Synchronous Serial Interface 1. It represents a secondary function for I/O port PIO5[4]. CSI1_SCLK Bidirectional This pin accepts/provides clock signal for the Clock Synchronous Serial Interface 1. It represents a secondary function for I/O port PIO5[3]. 5 / 27 Semiconductor ML670100 PIN DESCRIPTIONS (Cont.) Type Signal Name Analog- VREF to-digital converter AI[7:0] I/O Direction Description Debugg- TDI ing interface TDO Input Input Input Output nTRST Input TMS Input TCK Input DBGEN Input DBGRQ Input DBGACK Output I/O ports PIO8[7:0] Bidirectional PIO7[7:0] Bidirectional PIO6[7:0] Bidirectional PIO5[7:0] Bidirectional PIO4[7:0] Bidirectional PIO3[7:0] Bidirectional PIO2[7:0] Bidirectional PIO1[7:0] Bidirectional PIO0[7:0] Bidirectional This input is the reference voltage for the analog-to-digital converter channels 7-0. Connect it to VDD. These are analog signal input pins for analog-to-digital converter channels 7-0. This input is the serial data input for the debugging scan circuit. It represents a secondary function for I/O port PIO8[7]. This output is the serial data output for the debugging scan circuit. It represents a secondary function for I/O port PIO8[6]. "L" level input to this pin resets the debugging scan circuit. It represents a secondary function for I/O port PIO8[5]. This input selects the mode for the debugging scan circuit. It represents a secondary function for I/O port PIO8[4]. This input is the serial clock input for the debugging scan circuit. It represents a secondary function for I/O port PIO8[3]. "H" level input to this pin enables the CPU's debugging function. It represents a secondary function for I/O port PIO8[2]. This input is a debugging request signal from an external device. It represents a secondary function for I/O port PIO8[1]. This output is an acknowledgment signal to a debugging request signal from an external device. It represents a secondary function for I/O port PIO8[0]. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. These form an 8-bit I/O port. I/O directions are specified at the bit level. 6 / 27 Semiconductor ML670100 PIN DESCRIPTIONS (Cont.) Type Clock control System control Power Supply Signal Name OSC0 I/O Direction Input OSC1 Output CLKOUT FSEL Output Input PLLEN Input VCOM Input nRST Input DBSEL Input nEA Input TEST Input VDD Input GND Input AVDD Input AGND Input Description This pin is for connecting a crystal oscillator. If an external clock is used, supply it to this pin. This pin is for connecting a crystal oscillator. If an external clock is used, leave this pin open. This output is the internal system clock signal. Connect this pin to VDD or ground to indicate the frequency range for the basic clock. Connect this pin to VDD to enable the built-in phase-looked loop. If the PLL is not used because an external clock with a guaranteed duty is available, connect this pin to ground. This input controls the oscillation frequency of the PLL's voltage-controlled oscillator. Connect it to ground. "L" level input to this pin produces an external system reset for this LSI. "H" level input then causes execution to resume from address 0x000000. During a system reset of this LSI, this input specifies the width of the external data bus for bank 0. Connect this pin to VDD for a data bus width of 16bits and to ground for 8bits. During a system reset of this LSI, this input controls the use of the internal ROM. Connect this pin to VDD to enable the ROM and to ground to disable it. During a system reset of this LSI, this input controls the initial pin functions for the I/O port 8 pins(PIO8[7:0]). Connect this pin to VDD to initialize the port for its secondary function, the debugging interface, and to ground for I/O. These pins are this LSI's power supply pins. Connect them all to VDD. These pins are this LSI's ground pins. Connect them all to ground. This pin is the analog-to-digital converter's power supply. Connect it to VDD. This pin is the analog-to-digital converter's ground pin. Connect it to ground. 7 / 27 Semiconductor ML670100 OUTLINE of PERIPHERAL FUNCTIONS I/O Ports The I/O ports consist of nine 8-bit ports: PIOn(n=0 - 8). I/O directions are specified at the bit level. When configured for input, the pins use high-impedance input. Flexible Timer The flexible timer consists of six 16-bit timer channels. Each channel offers independent choice of four operating modes and of eight count clocks. -Timer operating modes - Auto-reload timer - Compare output - Pulse width modulation (PWM) - Capture input -Timer synchronization - Timer channels can be started and stopped in union. -External clocks - Timer channels 0 and 1 accept external clock signals. Time Base Generator The time base generator consists of the time base counter, a frequency divider which derives the time base signals for the on-chip peripherals from the system clock signals, and watchdog timer, which counts time base clock cycles and produces a system reset signal when its internal counter overflows. Asynchronous Serial Interface The asynchronous serial interface is a serial port that frames each character of information with start and stop elements. Parameters control transfer speed (using a dedicated baud rate generator), character length, number of stop bits and use of parity. -Built-in baud rate generator -Character length: 7 or 8 bits -Stop bits: 1 or 2 -Parity: none, odd, or even -Error detection for receiving: parity, framing and overrun errors -Full duplex operation Clock Synchronous Serial Interface The clock synchronous serial interface are two channels of serial ports that transmit 8-bit data synchronized with internal or external clock signals. 8 / 27 Semiconductor ML670100 Analog-to-Digital Converter The analog-to-digital converter is an 8-bit successive approximation analog-to-digital converter with eight input channels and four result registers. It offers two operating mode: scan mode, which sequentially converts the inputs from the selected set of four input channels, and select mode, which converts the input from a single input channel. -Resolution: 8 bits -Eight analog input channels -Four result registers for holding conversion results -Operating modes - Scan modes: Sequential conversion of the analog inputs from the upper or lower set of four input channels - Select mode: Conversion of the analog inputs from a single input channel Interrupt Controller The interrupt controller manages interrupt requests from 9 external sources and 19 internal ones and passes them on to the CPU as interrupt request (IRQ) or fast interrupt request (FIQ) exception requests. It supports eight interrupt levels for each source for use in priority control. -The interrupt controller supports 9 external interrupt sources connected to nEFIQ and nEIR[7:0] pins and 19 internal interrupt sources, including the serial ports and the flexible timer channels. -The interrupt controller simplifies interrupt priority control with a choice of eight interrupt levels for each source. -The interrupt controller assigns a unique interrupt number to each source to permit rapid branching to the appropriate routine. External Memory Controller The external memory controller generates control signals for accessing external memory (ROM, SRAM, DRAM, etc.), and other devices with address in the external memory space. -Support for direct connection of ROM, SRAM and I/O devices - Strobe signal outputs for a variety of memory and I/O devices -Support for direct connection of DRAM - Multiplexed row and column addresses - Random access and high-speed paged modes - Programmable wait cycle insertion -Memory space divided into four banks - Two banks for ROM, SRAM and I/O devices - Two banks for DRAM - Address space of 16 megabytes for each bank - Separate data bus width (8 or 16 bits), wait cycle, and off time setting for each bank -Single-stage store buffer permitting internal access during a wait cycle to external memory or device -Arbitration of external bus requests from external devices 9 / 27 Semiconductor ML670100 Clock Controller The clock controller controls the oscillator circuit based on a crystal oscillator and a built-in phase-locked loop which together generate and control the system clock signal. It offers a choice of divider ratio (1/1, 1/2 and 1/4) for adjusting operating clock frequency to match the load of processing. It also controls the transitions to and from a stand-by mode, HALT mode. 10 / 27 Semiconductor ML670100 CONFIGURATIONS of PINS and I/O PORTS Input Pins (nRST, nEA, DBSEL, TEST, nEFIQ, FSEL, PLLEN, VCOM) VDD Input pins (high impedance) GND Output Pin (CLKOUT) VDD Output pin (CMOS output) GND Tri-state output pins (XA23 - XA1, nLB/XA0, nCS0, nRD, nWRE/nWRL) Output pins (CMOS output when enabled) Output enable signal Bidirectional pins (XD7 - XD0) Bidirectional pins (CMOS output when enabled) Output enable signal Read signal 11 / 27 Semiconductor ML670100 I/O port A (I/O ports without second functions) PIO6[7:0], PIO7[5:0] PMm [n] Peripheral bus POm [n] PIOm [n] Read PIm [n] I/O port B (I/O ports with second functions of input) PIO2[7], PIO3[7:0] , PIO4[7:6] , PIO5[6] , PIO5[4], PIO5[1] , PIO7[6] , PIO8[7] , PIO8[5:1] PMm [n] POm [n] Secondary function input signal PFSm [n] Peripheral bus PIOm [n] Read PIm [n] 12 / 27 Semiconductor ML670100 I/O port C (I/O ports with second functions of output) PIO5[7], PIO5[5], PIO5[2], PIO7[7], PIO8[6], PIO8[0] PMm [n] POm [n] Secondary function output signal PFSm [n] Peripheral bus PIOm [n] Read PIm [n] 13 / 27 Semiconductor ML670100 I/O port D (I/O ports with second functions of tri-state output) PIO0[7:0], PIO2[6:0] PMm [n] Secondary function output enable signal POm [n] Secondary function output signal PFSm [n] Peripheral bus PIOm [n] Read PIm [n] 14 / 27 Semiconductor ML670100 I/O port E (I/O ports with second functions of input and output) PIO1[7:0], PIO4[5:0], PIO5[3], PIO5[0] PMm [n] Secondary function output enable signal POm [n] Secondary function output signal Secondary function input signal PFSm [n] Peripheral bus PIOm [n] Read PIm [n] 15 / 27 Semiconductor ML670100 ELECTRICAL CHARACTERISTICS Absolute Maximum ratings Item Power supply Input voltage Analog input voltage Output current Power dissipation Storage temperature Symbol VDD VIN Condition VDD=AVDD=VREF GND=AGND=0V VAI IO PD TSTG Ta=25V - Recommended Operating Conditions (Condition: GND=AGND=0V) Item Symbol Power supply Analog power supply Analog reference voltage Analog input voltage Operating Frequency 1 Operating Frequency 2 Ambient temperature Condition VDD=AVDD VDD AVDD VREF VAI fC1 fC2 Ta VDD =3.0 to 3.6V, 1 VDD =2.7 to 3.6V, 2 - Rated Value -0.3 to 4.6 -0.3 to VDD +0.3 -0.3 to AVDD +0.3 12 850 -55 to +150 Min. 2.7 2.7 AVDD-0.3 Typ. 3.3 3.3 - Max. 3.6 3.6 AVDD AGND 4 4 -40 25 VREF 25 20 +85 Unit V V mA mW °C Unit V MHz °C 1 Basic clock frequency from the oscillator circuit or an external clock signal 4 - 6.25MHz 8 - 12.5MHz 4 - 25MHz (External clock only) PLLEN Input FSEL Input Operating Frequency 1 fC1 “H” level (Connect to VDD) “L” level (Connect to GND) “H” level (Connect to VDD) “L” level (Connect to GND) “H” level (Connect to VDD) or “L” level (Connect to GND) 4 - 25MHz 4 - 25MHz 4 - 25MHz PLLEN Input FSEL Input Operating Frequency 2 2 Basic clock frequency from the oscillator circuit or an external clock signal 4 - 5MHz 8 - 10MHz 4 - 20MHz (External clock only) fC2 “H” level (Connect to VDD) “L” level (Connect to GND) “H” level (Connect to VDD) “L” level (Connect to GND) “H” level (Connect to VDD) or “L” level (Connect to GND) 16 / 27 4 - 20MHz 4 - 20MHz 4 - 20MHz Semiconductor ML670100 DC Characteristics (Condition: VDD=AVDD=VREF=2.7V to 3.6V, GND=AGND=0V, Ta=-40 to +85°C) Item Symbo Condition Min. Typ. Max. l High level input voltage 1 VIH1 1 0.65x VDD VDD+0.3 High level input voltage 2 VIH2 2 2 VDD+0.3 Low level input voltage 1 VIL1 1 -0.3 0.3x VDD Low level input voltage 2 VIL2 2 -0.3 0.8 High level output voltage VOH IOH=-4mA 2.2(*2) V -0.2 DD IOH=-100uA Low level output voltage VOL IOL= 4mA 0.4 Input leak current 1 |ILI| VI=0/VDD ,3 2.0(*3) Input leak current 2 |IL2| VI=0/VDD ,4 10.0(*3) Output leak current |ILO| VO=0/VDD 2.0(*3) Input capacity CI 6 Output capacity CO 9 Input/output capacity CIO 10 Power consumption IDDH fC= 25MHz 30 50 (in HALT mode) No load Power consumption IDD 60 100 1 2 3 4 Applied to PIO8 - PIO0, XD7 - XD0, nEFIQ Applied to nRST, nEA, DBSEL, TEST, FSEL, PLLEN, VCOM Applied to Input pins other than OSC0 Applied to OSC0 (*1): Typ. means that VDD=3.3V, Ta=25 °C (*2): 2.4V in case of that VDD=AVDD=VREF=3.0 to 3.6V (*3): 20µA in case of that Ta is equal or greater than 50 °C 17 / 27 Unit V µA µF mA Semiconductor ML670100 AC Characteristics (Condition: VDD=AVDD=VREF=2.7V to 3.6V, GND=AGND=0V,Ta=-40 to +85°C) Clock timing Item Max. Unit Clock frequency Symbol fC Condition 4 - 25 MHz Clock cycle time tC 40 - 250 Clock high level pulse width tCH 16 - - Clock low level pulse width tCL 16 - - External clock frequency fEXC 4 - 25 VDD =3.0 to 3.6V Min. Typ. External clock cycle time tEXC 40 - 250 External clock high level pulse width tEXCH 16 - - External clock low level pulse width tEXCL 16 - - Clock frequency fC 4 - 20 Clock cycle time tC 50 - 250 Clock high level pulse width tCH 20 - - Clock low level pulse width tCL 20 - - External clock frequency fEXC 4 - 20 External clock cycle time tEXC 50 - 250 External clock high level pulse width tEXCH 20 - - External clock low level pulse width tEXCL 20 - - Clock rise time Clock fall time VDD =2.7 to 3.6V tR - - - 5 tF - - - 5 External clock rise time tEXR - - - 5 External clock fall time tEXF - - - 5 18 / 27 ns MHz ns MHz ns MHz ns Semiconductor Control Signals Timing Item ML670100 Symbol Condition Min. Typ. Max. Unit * tRSTW1 - 2tC - - ns * tRSTW2 Oscillation - - - nRST pulse width( 1) nRST pulse width( 2) stable time nEFIQ pulse width tEFIQW - 2tC - - nEIR pulse width tEIRW - 2tC - - TMIN pulse width tTMINW - 2tC - - tTMCLKW - 2tC - - fSC - - - 1/8fC SCLK high level pulse width tSCLKH - 4tC - - SCLK low level pulse width TMCLK pulse width SCLKfrequency tSCLKL - 4tC - - TXD delay time tTXD CL=50pF - - 1tC+22 RXD set-up time tRXS - 0.5tC - - RXD hold time tRXH - 1.5tC - - DBGRQ set-up time tRQS - 1.0 - - DBGRQ hold time tRQH - 2.6 - - DBGACK delay time tDBGD CL=50pF 2.4 - 15.2 (*1): Not applied to power-on. (*2): Applied to power-on. 19 / 27 ns MHz ns Semiconductor External Bus Timing Item Symbol XA[23:1],nLB/XA0 delay time tXAD XD[15:0] output delay time tXDOD XD[15:0] input set-up time tXDIS XD[15:0] input hold time tXDIH nXWAIT set-up time tXWAITS nXWAIT hold time tXWAITH nHB delay time tHBD nCS[1:0] delay time tCSD nWRE,nWRH,nWRL delay time tWRD nRD delay time tRDD nRAS[1:0] delay time tRASD nCAS delay time tCASD nWE,nWH,nWL delay time tWED nBREQ set-up time tBREQS nBREQ hold time tBREQH nBACK delay time tBACKD High-impedance delay time tXHD ML670100 Condition CL=50pF 20 / 27 Min. 3 5 11 0 3 0 2 2 3 4 3 3 2 5 3 4 4 Typ. - Max. 14 20 12 11 12 11 12 13 12 13 13 Unit ns Semiconductor ML670100 Clock Timing tC tCH tEXC tEXCH tEXCL tCL tR tF tEXR tEXF CLKOUT External Clock Control Signals Timing tRSTW1, tRSTW2 nRST tEFIQW, tEIRW nEFIQ nEIR tTMINW, tTMCLKW TMIN TMCK tSCLKH tSCLKL SCLK tTXD TXD tRXS RXD 21 / 27 tRXH Semiconductor ML670100 Control Signals Timing (Cont.) CLKOUT tDBGD DBGACK tRQS DBGRQ 22 / 27 tRQH Semiconductor ML670100 External Bus Timing Bank 0 and Bank 1 Write Cycle Timing CLKOUT tXAD tXAD XA23-1 nLB/XA tHBD tHBD tCSD tCSD nHB nCS0 nCS1 tWRD tWRD nWRE nWRL nWRH tXDOD tXDOD Write Data XD15-0 23 / 27 Semiconductor ML670100 Bank 0 and Bank 1 Read Cycle Timing CLKOUT tXAD tXAD XA23-1 nLB/XA tHBD tHBD tCSD tCSD nHB nCS0 nCS1 tRDD tRDD nRD tXDIS Read Data XD15-0 24 / 27 tXDIH Semiconductor ML670100 Bank 2 and Bank 3 Read/Write Cycle Timing CLKOUT tXAD tXAD XA23-1 nLB/XA tRASD tRASD nRAS0 nRAS1 tCASD tCASD nCAS nCASL nCASH tXDIS tXDIH XD15-0 (Read cycle) tXDOD tXDOD XD15-0 (Write cycle) tWED tWED nWE, nWL nWH (Write cycle) CAS before RAS (CBR) Refresh CLKOUT tRASD tRASD nRAS tCASD tCASD nCAS 25 / 27 Semiconductor ML670100 Self Refresh CLKOUT tRASD tRASD nRAS tCASD tCASD nCAS nXWAIT Input Timing CLKOUT tXWAITS tXWAITH nXWAIT External Bus Release Timing CLKOUT tBREQS tBREQH nBREQ CLKOUT tBACKD nBACK tXHD tBACKD tXHD XA XD Control Signals 26 / 27 Semiconductor ML670100 A-to-D Converter Characteristics (Condition: VDD=AVDD=VREF=2.7V to 3.6V, GND=AGND=0V,Ta=-40 to +85°C ) Item Resolution Linearity error Differential linearity error Zero scale error Full scale error Conversion time Symbol n EL ED EZS EFS Condition Refer to the following recommended circuit. Analog input source impedance RI is equal or less than 5K Ω tCONV Definitions of terms Resolution Linearity error Differential linearity error Zero scale error Full scale error fC=25MHz Min. -3.0 -1.0 Typ. - Max. 8 +3.0 +1.0 Unit bit LSB LSB - 10.68 +2.0 -2.0 - LSB LSB µS/CH The minimum distinguishable analog value. For 8 bits, 28=256, i.e.(VREF-AGND)/256. Variance between the ideal conversion characteristics as an 8-bit A-to-D converter and actual conversion characteristics (does not include quantatized error). Indicates the smoothness of the conversion. The width of analog input voltage corresponding to the change by one bit of digital output is 1LSB=(VREF-AGND)/256 ideally. The variance between this ideal bit size and bit size at arbitrary point in the conversion range. Variance between the ideal conversion characteristics at the switching point of digital output ”0x00” - ”0x01” and actual conversion characteristics. Variance between the ideal conversion characteristics at the switching point of digital output ”0xFE” - ”0xFF” and actual conversion characteristics. 3.3V + VRE AVDD 3.3V VDD + F 0.1 µF Analog input - 47 µF ML670100 0.1 0.1 µF µF 47 µF RI AI[7:0] + 0.1 µF GND AGND RI (Analog input source impedance) is equal or less than 5KΩ 27 / 27 0V