E2D0082-29-93 ¡ Semiconductor MSM9836-xxx ¡ Semiconductor This version: Sep. 1999 MSM9836-xxx Previous version: May. 1997 Voice Synthesis IC with Built-in Mask ROM GENERAL DESCRIPTION The MSM9836 is a PCM voice synthesis IC with built-in 3-Mbit mask ROM, D/A converter, and low-pass filter (LPF). The MSM9836 is specifically designed for applications that use a microcontroller. For this reason, functional support for standalone mode and RC oscillation has been omitted from the MSM9805, and the ROM capacity and the number of phrases have been increased. By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control Table can be easily set, created, edited, and evaluated. The following table lists the functional differences between the MSM9836 and the MSM9805. MSM9836 ROM Capacity Interface Oscillation Maximum Number of Phrases Status Signal MSM9805 3 Mbits 2 Mbits Microcontroller Microcontroller/Standalone Ceramic Ceramic/RC 127 63 NAR/BUSY simultaneous output Only NAR output when operating in microcontroller interface mode FEATURES • 8-bit OKI nonlinear PCM method/8-bit Straight PCM method • Sampling frequency : 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/ (Can be set for each phrase) 16.0 kHz • ROM capacity : 3 Mbits • Maximum playback time : 97.7 sec (fSAM = 4.0 kHz) 73.7 sec (fSAM = 5.3 kHz) 61.0 sec (fSAM = 6.4 kHz) 48.8 sec (fSAM = 8.0 kHz) • Master clock frequency : 4.096 MHz (Ceramic oscillation/external clock input) • Edit ROM function • Maximum number of phrases : 127 • Built-in current mode 10-bit D/A converter • Built-in low-pass filter • Power supply voltage : +2.0 to +5.5 V • Package : 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9836-xxxGS-K) xxx indicates code number. Chip 1/23 7 3-Mbit ROM (Including 17 Kbits of Edit ROM & Address ROM) 19-Bit Multiplexer ¡ Semiconductor Address Controller BLOCK DIAGRAM I6 I5 I4 I3 I2 I1 I0 8 DATA Controller TEST ST 19-Bit Address Counter I/O Interface PCM Synthesizer NAR BUSY 10 10-Bit DAC & LPF XT XT Crystal Circuit RESET VDD GND VREF AOUT MSM9836-xxx 2/23 EXTCK Timing Controller ¡ Semiconductor MSM9836-xxx PIN CONFIGURATION (TOP VIEW) VDD 1 24 AOUT XT 2 23 VREF XT 3 22 GND NC 4 21 NC TEST 5 20 NAR BUSY 6 19 NC EXTCK 7 18 I6 ST 8 17 RESET NC 9 16 NC I0 10 15 I5 I1 11 14 I4 I2 12 13 I3 NC : No connection 24-Pin Plastic SOP 3/23 ¡ Semiconductor MSM9836-xxx PIN DESCRIPTIONS Pin Symbol Description Type The IC enters the standby state if this pin is set to "L" level. At this time, oscillation 17 RESET I stops and AOUT output becomes GND level, then the IC returns to the initial state. Apply a "L" pulse upon power-on. This pin has an internal pull-up resistor. Signal output pin that indicates whether the 7-bit LATCH (see Block Diagram) is idle. 20 NAR O 7 EXTCK I NAR at "H" level indicates that the LATCH is empty and ST input is enabled. Ceramic oscillator input/external clock input switching pin. Set to "H" level if ceramic oscillation is used. Set to "L" level if external clock is used. Volume setting pin. If this pin is set to GND level, the maximum current is forced in, 23 VREF I and if set to VDD level, the minimum current is forced in. An approx. 10 kW pull-down resistor is internally connected to this pin during operation. Voice output pin. 24 AOUT O The voice signals are output as current changes. A "L" level signal is output through 22 GND — Ground pin. 1 VDD — 2 XT I 3 XT O this pin in standby state. Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. Ceramic oscillator connection pin when ceramic oscillation is selected. Input from this pin if external clock is used. Ceramic oscillator connection pin when ceramic oscillation is selected. Leave this pin open if external clock is used. A "L" level signal is output through this pin in standby state. 5 TEST I Normally leave this pin open. This pin is used only for testing the internal circuit. Voice synthesis starts at fall of ST, and addresses I0 to I6 are fetched at rise of ST. 8 ST I Input ST when NAR, the status signal, is at "H" level. This pin has internal pull-up resistor. 10-15, 18 I0 - I6 I 6 BUSY O Phrase input pins corresponding to playback sound. This pin is at "H" level after reset is input. A "L" level signal is output through this pin for the time during which voice is being played. 4/23 ¡ Semiconductor MSM9836-xxx ABSOLUTE MAXIMUM RATINGS (GND=0V) Parameter Power Supply Voltage Symbol Condition VDD Input Voltage VIN Storage Temperature TSTG Ta=25°C Rating Unit –0.3 to +7.0 V –0.3 to VDD + 0.3 V –55 to +150 °C — RECOMMENDED OPERATING CONDITIONS (GND=0 V) Symbol Condition Range Unit Power Supply Voltage Parameter VDD — 2.0 to 5.5 V Operating Temperature Top — Original Oscillation Frequency fOSC When crystal is selected –40 to +85 °C Min. Typ. Max. 3.5 4.096 4.5 MHz ELECTRICAL CHARACTERISTICS DC Characteristics (1) (VDD=5.0 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit "H" Input Voltage VIH — 4.2 — — V "L" Input Voltage VIL — — — 0.8 V "H" Output Voltage VOH IOH=–1 mA 4.6 — — V "L" Output Voltage VOL IOL=2 mA — — 0.4 V "H" Input Current 1 IIH1 VIH=VDD — — 10 µA "H" Input Current 2 IIH2 — — 15 µA Applies to XT pin only. VIH=VDD "L" Input Current 1 IIL1 VIL=GND –10 — — µA "L" Input Current 2 (*1) IIL2 Internal pull-up resistor –200 –90 –30 µA Dynamic Supply Current 1 (*2) IDD1 VREF=VDD, AOUT voltage=0V — 0.4 1 mA — — 16 mA Ta=–40 to +70°C — — 10 µA Ta=–40 to +85°C — — 50 µA 6 9.5 15 mA 7 10 13 kW Dynamic Supply Current 2 (*3) IDD2 Standby Current IDS AOUT Output Current IAOUT VREF Pin Pull-Down Resistance RVREF At maximum output current VREF=GND, AOUT voltage=0V At maximum output current VREF=VDD, AOUT voltage=0V — *1 Applicable to RESET, ST *2 Dynamic supply current excluding DAC output current *3 Dynamic supply current at maximum output current 5/23 ¡ Semiconductor MSM9836-xxx DC Characteristics (2) (VDD=3.1 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified) Symbol Condition Min. Typ. Max. Unit "H" Input Voltage VIH — 2.7 — — V "L" Input Voltage VIL — — — 0.5 V Parameter "H" Output Voltage VOH IOH=–1 mA 2.6 — — V "L" Output Voltage VOL IOL=2 mA — — 0.4 V "H" Input Current 1 IIH1 VIH=VDD — — 10 µA — — 15 µA VIL=GND –10 — — µA "H" Input Current 2 IIH2 "L" Input Current 1 IIL1 Applies to XT pin only. VIH=VDD "L" Input Current 2 (*1) IIL2 Internal pull-up resistor –100 –30 –10 µA Dynamic Supply Current 1 (*2) IDD1 VREF=VDD, AOUT voltage=0V — 0.15 0.5 mA Dynamic Supply Current 2 (*3) IDD2 — — 5.5 mA Standby Current IDS Ta=–40 to +70°C — — 5 µA Ta=–40 to +85°C — — 20 µA 1.4 3.2 5 mA 7 10 13 kW AOUT Output Current IAOUT VREF Pin Pull-Down Resistance RVREF At maximum output current VREF=GND, AOUT voltage=0V At maximum output current VREF=VDD, AOUT voltage=0V — *1 Applicable to RESET, ST *2 Dynamic supply current excluding DAC output current *3 Dynamic supply current at maximum output current 6/23 ¡ Semiconductor MSM9836-xxx AC Characteristics (VDD=5.0 V, GND=0 V, fOSC=4.096 MHz, Ta=–40 to +85°C) Parameter Symbol Condition Min. Typ. Max. Unit Master Clock Duty Cycle fduty — 40 50 60 % RESET Input Pulse Width tw(RST) — 10 — — µs RESET Input Time After Power-on tD(RST) — 0 — — µs ST Signal Setup Time tSTP At power-on 1 — — µs ST Input Pulse Width t(ST) — 0.35 — 2000 µs The ST-ST Pulse Interval tSS Upon entering the stop code (*4) 40 — — µs Data Setup Time tDW — 1 — — µs Data Hold Time tWD — 1 — — µs NAR Output Time 1 tSNS fSAM=8 kHz — — 10 µs NAR Output Time 2 tNAA fSAM=8 kHz (*4) 350 375 400 µs NAR Output Time 3 tNAB fSAM=8 kHz (*4) 315 440 500 µs NAR Output Time 4 tNAC fSAM=8 kHz (*4) 350 375 500 µs BUSY Output Time 1 tSBS fSAM=8 kHz — — 10 µs BUSY Output Time 2 tBSYA fSAM=8 kHz (*4) 350 375 400 µs tDAR, tDAF — (*4) 60 64 68 ms 200 250 300 ms 350 375 500 µs D/A Converter Change Time Standby Transition Time (at end of voice output) Silence Time Between Phrases tSTB — tBLN fSAM=8 kHz (*4) (*4) *4 Proportional to master the periods of oscillation frequency fOSC1 and fOSC2. The rated values show values when the standard master oscillation frequency is used. 7/23 ¡ Semiconductor MSM9836-xxx TIMING DIAGRAMS , ,,,, 1. AC Characteristics at Power-On VDDMin VDD tD(RST) RESET (I) tW(RST) tSTP ST (I) NAR (O) BUSY (O) 2. AC Characteristics in Standby Status and when the IC is Activated I6 to I0 (I) t(ST) ST ( I ) tDW tWD NAR (O) tSNS BUSY (O) tSBS AOUT (O) tBSYA tNAA tDAR Oscillation start Voice playback tSTB Standby transtion time tDAF D/A converter change time 8/23 1st phrase address 2nd phrase address 3rd phrase address ¡ Semiconductor 3. Playback Timing I6 to I0 (I) ST ( I ) tNAC NAR (O) BUSY (O) AOUT (O) tBSYA tNAB tDAR 1st phrase playback 2nd phrase playback 3rd phrase playback tBLN Oscillation start The pins I6 to I0 are used to enter the address of a phrase subject to voice synthesis. Voice synthesis starts by entering the ST signal during addressing. MSM9836-xxx 9/23 ¡ Semiconductor MSM9836-xxx 4. Stop Code Input Timing I6 to I0 (I) "0000000" User phrase tSS ST ( I ) NAR (O) BUSY (O) AOUT (O) Voice stop When I6-I0 are set to "0000000" during voice playback (during the output of "L" level at the BUSY pin), and a ST signal is input, playback stops regardless of whether NAR is at "H" or "L" level and AOUT becomes 1/2 IAOUT. Stop code becomes valid at the falling edge of ST. The stop code does not initialize internal units but only stops playback. To initialize an internal register, use the RESET pin. 10/23 ¡ Semiconductor MSM9836-xxx 1. Sampling Frequency As shown in Table 1.1, 7 sampling frequencies are available. A sampling frequency can be selected and assigned to each phrase in ROM data. Table 1.1 Sampling Frequency Sampling Frequency At standard Frequency diving ratio oscillation frequency 4.0 kHz fOSC1/1024 5.3 kHz fOSC1/768 6.4 kHz fOSC1/640 8.0 kHz fOSC1/512 10.6 kHz fOSC1/384 12.8 kHz fOSC1/320 16.0 kHz fOSC1/256 2. Recording/Playback Time Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 17 Kbits of data area is allocated for the Phrase Control Table, Phrase Data Control and Test Data. Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 17 Kbits. Phrase Control Table Area 8K bit Pharase Data Control Area 8K bit Test Data Area 1K bit On-chip Mask ROM Capacity 3072K bit User's Area 3055K bit Figure 2.1 Memory Allocation of On-chip Mask ROM 11/23 ¡ Semiconductor MSM9836-xxx The playback time is obtained by dividing the memory capacity by the bit rate. The playback time for 8-bit PCM algorithm is obrained by using the following equation. Memory capacity [bit] Playback time [sec] = Bit rate [bps] Memory capacity [bit] = Sampling frequency [Hz] ¥ 8 [bit] For example, if all phrases are stored in the MSM9836 at 8 kHz sampling frequency, the maximum playback time is as follows. Playback time = (3072–17) ¥ 1024 [bit] 8000 [Hz] ¥ 8 [bit] = 48.8 [sec] Table 2.1 Maximum playback time Model MSM9836 ROM capacity User's area 3M bit 3055K bit Maximum playback time (sec) fSAM=4.0kHz fSAM=6.4kHz fSAM=8.0kHz fSAM=16.0kHz 97.7 61.0 48.8 24.4 3. Playback Method This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved because a resolution equivalent to 10-bit straight PCM is available around the waveform center. You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table 3.1 shows the relationship between playback methods and applicable sounds. It is recommended to evaluate the sound quality before actual use. Table 3.1 Relationship between playback methods and applicable sounds Playback method Applicable sound 8-bit non-linear PCM algorithm Human voice 8-bit straight PCM algorithm BEEP tone, sound effects 12/23 ¡ Semiconductor MSM9836-xxx 4. Phrase Control Table Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in succession by a single easy control operation like controlling a single regular phrase playback. Up to 8 combined phrases including a silence can be registered in a single address in the Phrase Control Table. Further, you can use the maximum memory space for data storage because it is not required to have the same phrase data. To show an example, let's assume that your application needs to speak two similar sentences, "It is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and "today". What you have to do is to prepare these common sound data, not in sentences but in words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and Figure 4.1 Multiple phrases can be played continuously merely by specifying a desired phrase using an X address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played, and when address"02" is specified, "It is rainy" is played. Phrase Control Table, a silence can be inserted without using the User's Area. Minimum time for silence Maximum time for silence Time unit for setting up silence 32 ms 4064 ms 32 ms Table 4.1 Matrix of the Phrase Control Table No. X-Address Y-Address (HEX) (Up to 8 phrases) Sound Data It is (silence) fine today. 2 02 [01] [02] Silence [12] [03] It is (silence) rainy today. 3 03 [01] [02] [10] [21] [11] [12] [22] [03] It is fine becoming cloudy, rainy in some areas today. 126 7E 127 7F ··· [01] [02] Silence [10] [03] ··· 01 ··· 1 13/23 ¡ Semiconductor MSM9836-xxx Figure 4.1 Phrase Combination Matrix for Phrase Control Table Phrase Control Table Area No. X-Address Phrase Data Registration Area Phrase Addigned No. Y-Address Phrase 1 01 1 [01] it 1 01 2 02 2 [02] is 2 02 is 3 03 3 Silence (64ms) 3 03 today 4 04 4 [12] rainy 5 05 5 [03] today 16 10 fine 6 06 6 — 17 11 cloudy 7 07 7 — 18 12 rainy 8 08 8 — 19 13 snowy 9 09 Silence time setting 32 20 occasionally (32ms ¥ n) 33 21 becoming 34 22 in some areas 127 7F — 127 7F 0 Silence time 1 32 ms 2 64 ms 127 4064 ms it 14/23 ¡ Semiconductor MSM9836-xxx 5. Oscillation and Clock Input 5. 1 Ceramic oscillation Figure 2 shows an external circuit using a ceramic oscillator. Pull this pin to "H" level EXTCK XT XT C1 C2 Figure 2 External Circuit Using a Ceramic Oscillator For example, the following table shows the optimum load capacitances, power supply voltage ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co., Ltd., and TDK Co., Ltd. are used. Ceramic oscillator (MHz) C1 (pF) C2 (pF) (V) Murata MFG. Type supply voltage range CSA4.09MGU 4.09 30 30 2.0 to 5.5 CST4.09MGWU 4.09 Built in Built in 2.0 to 5.5 TDK Maker Optimal load capacity Frequency CCR4.00MC3 4.0 Built in Built in 2.4 to 5.5 (Note) Operating temperature range (°C) –40 to +85 –40 to +85 When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is slower by 2 percent than that of an analysis tool or a demonstration board. 15/23 ¡ Semiconductor MSM9836-xxx 5. 2 External clock input Figure 3 shows a circuit for external clock input. EXTCK Pull this pin to "L" level XT XT Open External oscillation circuit Figure 3 Circuit for External Clock Input 16/23 ¡ Semiconductor MSM9836-xxx 6. Low-Pass Filter In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 4 and Table 4 show the LPF frequency characteristics and LPF cutoff frequency respectively. Only the voice output through LPF is enabled in this IC. [dB] 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 100 10 1k 10k [Hz] Figure 4 LPF Frequency Characteristics (fSAM=8 kHz) Table 4 LPF Cutoff Frequency Sampling Frequency (kHz) Cutoff Frequency (kHz) (fSAM) (fCUT) 4.0 5.3 1.2 1.6 6.4 2.0 8.0 2.5 10.6 3.2 12.8 4.0 16.0 5.0 17/23 ¡ Semiconductor MSM9836-xxx 7. Standby Transition When playback of a phrase is finished, if playback of the next phrase does not start up within tSTB (0.25 sec. typ.), the IC enters standby status and the entire operation stops. I5-I0 ST NAR BUSY AOUT Figure 5 Voice Playback Timing during D/A Converter Change Time If playback is attempted during D/A converter change time as shown in Figure 5, the IC exits from standby status and the output from the D/A converter begins going to the 1/2 IAOUT level. When the output reaches 1/2 IAOUT, voice playback starts. 18/23 ¡ Semiconductor MSM9836-xxx 8. Voice Output Unit Equivalent Circuit (AOUT, FREF Pins) Current-Sourcing Type D/A Converter VDD VREF 10kW (TYP) PCM Value AOUT IAOUT Standby Signal (The above switch positions show those when the circuit is active.) Figure 8.1 Voice Output Unit Equivalent Circuit 19/23 ¡ Semiconductor MSM9836-xxx D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS AOUT Output Current [mA] Power Supply Voltage vs. Output Current Characteristics (Ta=25°C, VAOUT=0V) 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 Power Supply Voltage [V] AOUT Output Current [mA] Temperature vs. Output Current Characteristics (VDD=5V, VAOUT=0V) 14 12 10 8 6 4 2 0 –50 –25 0 25 50 75 100 Ambient Temperature Ta [°C] VREF Voltage vs. Output Current Characteristics (Ta=25°C, VDD=5V, VAOUT=0V) AOUT Output Current [mA] 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VREF [V] 20/23 ¡ Semiconductor MSM9836-xxx APPLICATION CIRCUIT MSM9836-xxx MSC1157 (Speaker drive amplifier) VDD MCU I6 I5 I4 I3 I2 I1 I0 ST RESET BUSY NAR VREF VCC AOUT + - AIN SP SP TEST EXTCK XT GND XT STBY GND VR SEL + - 21/23 ¡ Semiconductor MSM9836-xxx PAD CONFIGURATION Pad Layout Chip size Chip thickness Pad size Substrate potential X=7.65mm Y=3.32mm 350mm±30mm 110mm¥110mm GND Chip and pad number Y-axis 16 (NC) 17 15 14 MSM9836 13 18 12 19 11 X-axis 1 2 10 3 8 9 4 5 6 7 Pad coordinates (Chip center is located at X=0 and Y=0) (Unit: mm) PAD No. PAD Name X-axis Y-axis PAD No. PAD Name X-axis Y-axis 1 VDD –3620 –452 11 I3 3673 415 2 XT –3623 –742 12 I4 3673 816 3 XT –3623 –1349 13 I5 3673 1460 4 TEST –1932 –1460 14 RESET 1778 1460 5 BUSY –1044 –1455 15 I6 1260 1458 6 EXTCK 1163 –1453 16 NAR –2443 1460 7 ST 2234 –1455 17 GND –3665 1460 8 I0 3673 –1432 18 VREF –3623 1136 19 AOUT –3623 585 9 I1 3673 –754 10 I2 3673 –312 22/23 ¡ Semiconductor MSM9836-xxx PACKAGE DIMENSIONS (Unit : mm) SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 23/23 E2Y0002-29-62 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan