E2D0018-39-93
¡ Semiconductor
MSM9802/03/05-xxx
¡ Semiconductor
ThisMSM9802/03/05-xxx
version: Sep. 1999
Previous version: May. 1997
Voice Synthesis IC with Built-in Mask ROM
GENERAL DESCRIPTION
The MSM9802/03/05 is a PCM voice synthesis IC with built-in mask ROM.
This IC has two user selectable playback algorithms, OKI Non-linear PCM and straight PCM. It
also contains a current mode 10-bit D/A converter and a low-pass filter.
External control has been made easy by the built-in edit ROM that can form sentences by linking
phrases. By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control
Table can be easily set, created, edited, and evaluated.
With the stand-alone mode/microcontroller interface mode switching pin, the MSM9802/03/
05 can support various applications.
FEATURES
Device
Speech period (sec)
fSAM=4.0 kHz
fSAM=6.4 kHz
fSAM=8.0 kHz
fSAM=16.0 kHz
512 Kbits
16.0
10.0
8.0
4.0
MSM9803
1 Mbit
32.4
20.2
16.2
8.1
MSM9805
2 Mbits
65.1
40.7
32.5
16.2
MSM9802
*
ROM size*
Actual voice ROM area is smaller by 11 Kbits.
• ROM custom
• 8-bit OKI nonlinear PCM method/8-bit straight PCM method
• Built-in edit ROM
• Random playback function
• Sampling frequency
: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/
16.0 kHz
Note: If RC oscillation is selected, 10.6 kHz, 12.8 kHz, and
16.0 kHz cannot be selected.
• Maximum number of phrases
: 63 (Microcontroller interface mode)
56 (Stand-alone mode)
• Built-in current mode 10-bit D/A converter
• Built-in low-pass filter
• Standby function
• RC oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable
• Package options:
18-pin plastic DIP (DIP18-P-300-2.54) (Product name: MSM9802-xxxRS/MSM9803-xxxRS/
MSM9805-xxxRS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9802-xxxGS-K/MSM9803-xxxGS-K/
MSM9805-xxxGS-K)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name: MSM9802-xxxGS-AK/MSM9803-xxxGSAK/MSM9805-xxxGS-AK)
xxx indicates code number.
Chip
Note: This data sheet explains a stand-alone mode and a microcontroller interface mode,
separately.
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¡ Semiconductor
MSM9802/03/05-xxx
CONTENTS
(1) Stand-alone Mode
BLOCK DIAGRAM ............................................................................................................................. 3
PIN CONFIGURATION ..................................................................................................................... 4
PIN DESCRIPTIONS ........................................................................................................................... 6
ABSOLUTE MAXIMUM RATINGS ................................................................................................. 8
RECOMMENDED OPERATING CONDITIONS ........................................................................... 8
ELECTRICAL CHARACTERISTICS ................................................................................................ 9
TIMING DIAGRAMS ....................................................................................................................... 12
FUNCTIONAL DESCRIPTION ....................................................................................................... 14
1. Playback Code Specification ............................................................................................. 14
2. Pull-up/Pull-down Resistor .............................................................................................. 14
3. Stand-alone Mode ............................................................................................................... 14
APPLICATION CIRCUITS .............................................................................................................. 19
(2) Microcontroller Interface Mode
BLOCK DIAGRAM ...........................................................................................................................
PIN CONFIGURATION ...................................................................................................................
PIN DESCRIPTIONS .........................................................................................................................
ABSOLUTE MAXIMUM RATINGS ...............................................................................................
RECOMMENDED OPERATING CONDITIONS .........................................................................
ELECTRICAL CHARACTERISTICS ..............................................................................................
TIMING DIAGRAMS .......................................................................................................................
FUNCTIONAL DESCRIPTION .......................................................................................................
1. Playback Code Specification .............................................................................................
2. Address Data .......................................................................................................................
3. Stop Code .............................................................................................................................
4. Generating Pseudo - BUSY Signal through NAR pin....................................................
APPLICATION CIRCUIT.................................................................................................................
21
22
24
25
25
26
29
31
31
31
32
33
34
(3) Common
1. Sampling Frequency ...........................................................................................................
2. Recording/Playback Time .................................................................................................
3. Playback Method ................................................................................................................
4. Phrase Control Table ..........................................................................................................
5. RC Oscillation ......................................................................................................................
6. Ceramic Oscillation ............................................................................................................
7. Low-pass Filter ....................................................................................................................
8. Standby Transition ..............................................................................................................
9. Voice Output Unit Equivalent Circuit (AOUT, VREF Pins) ..........................................
D/A CONVERTER CURRENT CHARACTERISTICS ................................................................
PAD CONFIGURATION .................................................................................................................
35
35
36
37
39
40
42
43
44
45
46
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BUSY
Random
Circuit
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Address Counter
8
DATA
Controller
PCM
Synthesizer
I/O
Interface
10
OSC1
OSC2
OSC
XT/RC
Timing Controller
OSC3/TEST
3/51
XT/CR
RESET
VDD
GND
VREF
AOUT
MSM9802/03/05-xxx
10-Bit
DAC
&
LPF
¡ Semiconductor
RND
6
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
ROM
(Including 11 Kbits of
Edit ROM & Address ROM)
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Multiplexer
(1) STAND-ALONE MODE (CPU/STD: "L" level)
CPU/STD
Address &
Switching
Controller
BLOCK DIAGRAM
A2
A1
A0
SW2
SW1
SW0
¡ Semiconductor
MSM9802/03/05-xxx
PIN CONFIGURATION (TOP VIEW)
A0
1
18 SW2
A1
2
17 SW1
A2
3
16 SW0
RESET
4
15 RND
XT/CR
5
14 CPU/STD
BUSY
6
13 OSC3/TEST
GND
7
12 OSC2
VREF
8
11 OSC1
AOUT
9
10 VDD
18-Pin Plastic DIP
Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.
VDD
1
24 AOUT
OSC1
2
23 VREF
OSC2
3
22 GND
NC
4
21 NC
OSC3/TEST
5
20 BUSY
NC
6
19 NC
CPU/STD
7
18 XT/CR
RND
8
17 RESET
NC
9
16 NC
SW0 10
15 A2
SW1 11
14 A1
SW2 12
13 A0
NC: No connection
24-Pin Plastic SOP
Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.
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MSM9802/03/05-xxx
VDD
1
30 AOUT
OSC1
2
29 VREF
OSC2
3
28 GND
NC
4
27 NC
NC
5
26 NC
OSC3/TEST
6
25 BUSY
NC
7
24 NC
CPU/STD
8
23 XT/CR
NC
9
22 NC
RND 10
21 RESET
NC 11
20 NC
NC 12
19 NC
SW0 13
18 A2
SW1 14
17 A1
SW2 15
16 A0
NC: No connection
30-Pin Plastic SSOP
Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.
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MSM9802/03/05-xxx
PIN DESCRIPTIONS
Pin
DIP
SOP SSOP
Symbol
Type
Description
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0mA and becomes GND
4
17
21
RESET
I
level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
6
20
25
BUSY
O
5
18
23
XT/CR
I
14
7
8
CPU/STD
I
Outputs "L" level while voice is being played back.
At power-on, this pin is at "H" level.
XT/RC switching pin. Set to "H" level if ceramic oscillation is used.
Set to "L" level if RC oscillation is used.
Microcontroller interface/stand-alone mode switching pin.
Set to "L" level if the MSM9802/03/05 is used in stand-alone mode.
Volume setting pin. If this pin is set to GND level, the maximum
8
23
29
VREF
I
current is forced in. If this pin is set to VDD level, the minimum current
is forced in. A pull-down resistor of approx. 10 W is internally
connected to this pin during operation.
Voice output pin.
9
24
30
AOUT
O
The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.
7
10
22
1
28
1
GND
VDD
—
—
Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
VDD and GND pins.
Ceramic oscillator connection pin when ceramic oscillation is selected.
11
2
2
OSC1
I
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
Ceramic oscillator connection pin when ceramic oscillation is selected.
12
3
3
OSC2
O
RC connection pin when RC oscillation is selected.
Leave this pin open if external clock is used.
Outputs "L" level in standby state.
Leave this pin open when ceramic oscillation is used.
13
5
6
OSC3/TEST
O
RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
Random playback starts if RND pin is set to "L" level.
15
8
10
RND
I
Fetches addresses from random address generation circuit in the IC at
fall of RND. Set to "H" level when the random playback function is not
used. This pin has internal pull-up resistor.
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¡ Semiconductor
Pin
DIP
SOP SSOP
Symbol
MSM9802/03/05-xxx
Type
Description
Phrase input pins corresponding to playback sound.
16-18 10-12 13-15 SW0 - SW2
I
If input changes, SW0 to SW2 pins fetch addresses after 16 ms and
start voice synthesis.
Each of these pins has internal pull-down resistor.
Phrase input pins corresponding to playback sound.
1-3
13-15 16-18
A0 - A2
I
Input logic of A0 pin becomes invalid if the random playback function
is used.
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ABSOLUTE MAXIMUM RATINGS
(GND=0 V)
Parameter
Symbol
Power Supply Voltage
VDD
Input Voltage
VIN
Storage Temperature
TSTG
Condition
Ta=25°C
Rating
Unit
–0.3 to +7.0
V
–0.3 to VDD+0.3
V
–55 to +150
°C
—
RECOMMENDED OPERATING CONDITIONS
(GND=0 V)
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
VDD
—
2.0 to 5.5
V
Operating Temperature
Top
—
–40 to +85
°C
Master Clock Frequency 1
fOSC1
When crystal is selected
Master Clock Frequency 2
fOSC2
When RC is selected (*1)
Min.
Typ.
Max.
3.5
4.096
4.5
200
256
300
MHz
kHz
*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on
the accuracy of the external R and C.
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ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=5.0 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage
VIH
—
4.2
—
—
V
"L" Input Voltage
VIL
—
—
—
0.8
V
"H" Output Voltage
VOH
IOH=–1 mA
4.6
—
—
V
"L" Output Voltage
VOL
IOL=2 mA
—
—
0.4
V
"H" Input Current 1
IIH1
VIH=VDD
—
—
10
µA
Internal pull-down resistor
30
90
200
µA
—
—
15
µA
"H" Input Current 2
*1
IIH2
Applies to OSC1 pin only.
"H" Input Current 3
IIH3
"L" Input Current 1
IIL1
VIL=GND
–10
—
—
µA
IIL2
Internal pull-up resistor
–200
–90
–30
µA
—
0.4
1
mA
—
—
16
mA
Ta=–40 to +70°C
—
—
10
µA
Ta=70 to 85°C
—
—
50
µA
6
9.5
15
mA
7
10
13
kW
"L" Input Current 2
*2
Dynamic Supply Current 1 *3
IDD1
VIH=VDD
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
Dynamic Supply Current 2 *4
IDD2
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
At maximum output current,
AOUT Output Current
IAOUT
VREF=GND,
AOUT bias voltage=0V
VREF Pin Pull-down Resistance
*1
*2
*3
*4
RVREF
—
Applicable to SW0-SW2
Applicable to RESET, RND
Dynamic supply current (excluding DAC output current)
Dynamic supply current at maximum output current
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DC Characteristics
(VDD=3.1 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)
Parameter
"H" Input Voltage
Symbol
Condition
Min.
Typ.
Max.
Unit
VIH
—
2.7
—
—
V
"L" Input Voltage
VIL
—
—
—
0.5
V
"H" Output Voltage
VOH
IOH=–1 mA
2.6
—
—
V
"L" Output Voltage
VOL
IOL=2 mA
—
—
0.4
V
"H" Input Current 1
IIH1
VIH=VDD
—
—
10
µA
IIH2
Internal pull-down resistor
10
30
100
µA
—
—
15
µA
"H" Input Current 2
*1
"H" Input Current 3
IIH3
"L" Input Current 1
Applies to OSC1 pin only.
VIH=VDD
IIL1
VIL=GND
–10
—
—
µA
*2
IIL2
Internal pull-up resistor
–100
–30
–10
µA
Dynamic Supply Current 1 *3
IDD1
—
0.15
0.5
mA
Dynamic Supply Current 2 *4
IDD2
—
—
5.5
mA
Ta=–40 to +70°C
—
—
5
µA
Ta=70 to 85°C
—
—
20
µA
1.4
3.2
5
mA
7
10
13
kW
"L" Input Current 2
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
At maximum output current,
AOUT Output Current
IAOUT
VREF Pin Pull-down Resistance
RVREF
VREF=GND,
AOUT bias voltage=0V
*1
*2
*3
*4
—
Applicable to SW2-SW0
Applicable to RESET, RND
Dynamic supply current (excluding DAC output current)
Dynamic supply current at maximum output current
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AC Characteristics
(VDD=5.0 V, GND=0 V, Ta=–40 to +85°C)
Parameter
Typ.
Max.
40
50
60
%
10
—
—
µs
Symbol
Condition
Min.
Master Clock Duty Cycle
fduty
—
RESET Input Pulse Width
tw(RST)
—
Unit
RESET Input Time After Power-on
tD(RST)
—
0
—
—
µs
RND Input Pulse Width
tw(RAN)
—
100
—
—
µs
SW0-SW2 Input Pulse Width
tw(SW)
—
16
—
—
ms
BUSY Output Time
tSBS
—
—
—
10
µs
Chattering Prevention Time 1
tCHA
(note)
14
15
16
ms
(note)
Chattering Prevention Time 2
tCHB
—
—
(note)
—
—
16
ms
D/A Converter Change Time
tDAR, tDAF
—
(note)
60
64
68
ms
—
(note)
200
250
300
ms
fSAM=8 kHz (note)
350
375
500
µs
15
16
17
µs
Standby Transition Time
tSTB
Silence Time Between Phrases
tBLN
Random Address Fetch Time
tRA
—
(note)
(Note) Proportional to master the periods of oscillation frequencies fOSC1 and fOSC2.
The rated values show values when the standard master oscillation frequency is used.
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¡ Semiconductor
MSM9802/03/05-xxx
TIMING DIAGRAMS
AC Characteristics at Power-On
VDD
VDDMin
tD(RST)
RESET (I)
tW(RST)
BUSY (O)
SW2-SW0 (I)
AC Characteristics in Standby Status and when the IC is Activated
A2-A0 (I)
SW2-SW0 (I)
First phrase
"000"
First phrase
"000"
tw(SW)
Address data fetch
SW0 (I)
BUSY (O)
tCHA
tSBS
AOUT (O)
tDAR
Standby status
tSTB
tDAF
Standby status
Standby transition time
Oscillation start D/A converter change time
Repeated Playback Timing
First phrase
A2-A0 (I)
SW2-SW0 (I)
"000"
First phrase
"000"
SW0 (I)
BUSY (O)
AOUT (O)
Single phrase
playback
Single phrase
repeated playback
tBLN
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Timing when Changing from SW2 to SW0 During Playback
SW2-SW0 (I)
Second phrase
First phrase
A2-A0 (I)
"000"
First phrase
"000"
Second phrase
"000"
SW2 (I) "L"
tCHB
SW1 (I)
SW0 (I)
BUSY (O)
AOUT (O)
tBLN
First phrase
playback
Second phrase
playback
First phrase playback stops
Repeated Playback Timing for Random Playback
RND (I)
BUSY (O)
AOUT (O)
First phrase
playback
Oscillation start
Same phrase
repeated playback
tBLN
Timing when Changing from A2 to A0 During Playback
Second phrase
A2-A0 (I)
First phrase
First phrase
(Ex.)
Second phrase
tCHA
SW2-SW0 (I)
"000"
First phrase
Address data fetch
(Second phrase)
"000"
SW0 (I)
BUSY (O)
AOUT (O)
tBLN
First phrase
playback
Second phrase
playback
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FUNCTIONAL DESCRIPTION
1. Playback Code Specification
The user can specify a maximum of 56 phrases. Table 1.1 shows the settings by the A2-A0 and
SW2-SW0 pins.
Table 1.1 User-specified Phrases
A2-A0
SW2-SW0
Code Details
000
000
Inhibit code
001
111
User-specified phrase
(56 phrases)
111
2. Pull-up/Pull-down Resistor
The RESET and RND pins have internal pull-up resistors and the SW2-SW0 pins have internal
pull-down resistors.
3. Stand-alone Mode
In a stand-alone mode, the SW input interface function and the random playback function can
be used.
3.1 SW input interface
With the SW input interface, speech synthesis starts when the state of the SW2-SW0 pins has
changed. To prevent chattering, the address data is latched 16 ms (tCHA) after the state of SW2SW0 has changed. Voice synthesis does not start if the state of the A2-A0 pins has changed. Set
the RND pin to "H" level if the random playback function is not used.
Set the A2-A0 pins to "L" level at power-on or at reset.
The SW input interface is effective when the MSM9802/03/05 is operated using a push-button
switch. Voice synthesis starts when an address is changed by pressing the push-button switch.
If the push-button switch is released during playback, then playback stops after the current
phrase is completed.
A2-A0 (I)
SW2-SW1 (I) "L"
tw(SW)
SW0 (I)
BUSY (O)
tCHA
AOUT (O)
Oscillation start
Figure 3.1 SW Input Interface Single-Phrase Playback Timing
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If playback is attempted at an unused address in the phrases, AOUT goes to 1/2 IAOUT and
playback does not occur. Figure 3.2 shows the timing.
A2-A0 (I)
SW2-SW1 (I) "L"
SW0 (I)
BUSY (O)
AOUT (O)
Oscillation start
Figure 3.2 Timing when Playback is Attempted at an Unused Phrase Address
In the SW input interface, no phrase is triggered when SW2 to SW0 are all set to "0". Therefore,
when the circuit consists of a diode matrices that use push-button switches, the maximum
playback phrases are 56 phrases.
A2-A0
SW2-SW0
000
001
002
(000)
001
002
¥
= 56 Phrases
111
111
8 codes
Code Prohibited
¥
7 codes
= 56
3.2 Random playback function
The random playback function randomly generates 15 different addresses corresponding to the
four bits of the addresses of A0 and SW2-SW0 (except ALL "L") on the IC, after which playback
commences.
Therefore, any input to A0 and SW2 to SW0 pins from external control is invalid. Hold these 4
pins either "H" or "L" level. SW2 to SW0 pins may be held open as they have internal pull-down
resistor.
Playback may not occur if all the 15 addresses have not been assigned a phrase. Care must be
taken when creating ROM data.
For example, when four phrases, "sunny", "rainy", "cloudy", and "snowy", are to be played
randomly, set the phrases as shown in Table 3.1 in which a phrase is assigned to all the 15
addresses. The four phrases are then played back at random as shown below.
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Table 3.1 Random Address Setup Example
A2, A1
A0, SW2-SW0
Phrase
00
0001
sunny
0010
rainy
0011
cloudy
0100
snowy
0101
sunny
1110
rainy
1111
snowy
Random playback starts when the timing shown in Figure 3.3 is input to the RND pin. A random
address is fixed based on the "H" level time of the RND pin during IC oscillation. Random
address is captured at the fall of the RND pin, and voice playback commences. Therefore, when
power is turned on, or when RESET is input, the phrase at fixed address "0001" is played while
the random counter remains initialized until random playback is initiated.
RESET (I)
tW (RAN)
RND (I)
tRA
tW (RAN)
Random address fixed time
Random address fixed time
tRA
BUSY (O)
AOUT (O)
Oscillation start
Playback
(Address = 0001)
Playback
(Address = random)
Figure 3.3 Random Address Capture
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Table 3.2 Random Playback Address
Phrase (Sample)
00
0001
0010
0011
0100
Hit
Hit
Hit
Out
Hit
Out
Out
Out
1111
Out
0001
0010
0011
0100
White
Black
Red
Blue
1111
Green
0001
1111
··· ··· ···
···
···
0001
0010
0011
0100
···
11
Out
···
10
1111
···
01
···
A0, SW2 to SW0
···
A2, A1
For a random address, 15 phrases can be set for each logical condition of addresses A2 and A1
(i.e., "00", "01", "10", and "11").
In random playback, the four logic states ("000000", "010000", "100000" and "110000") in userspecified phrases cannot be used. Take it into consideration when creating ROM data.
A random address is set by the "H" level time of the RND pin, so if the same pulse width is input
by microcontroller, the random address fixed time becomes constant, and a random phrase may
not be played under these conditions. The random address fixed time must be inconsistent in
order to produce random playback.
RND (I)
Invalid pulse
Pulse input during this time period is invalid
BUSY (O)
AOUT (O)
Oscillation start
Figure 3.4 Timing when a Pulse is Input to the RND Pin During Random Playback
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Table 3.3 Random Playback and Stop Address
A2, A1
A0, SW2-SW0*
Code Details
0001
Random playback address
(15 addresses)
00
1111
01
*
0001
Stop address
Address(es) corresponding to the A0 and SW2-SW0 pins
SW0
SW1
SW2
A0
A1
A2
RND
Figure 3.5 Circuit Example for Random Playback Stop
An unused user-specified address is used as a stop address, therefore the IC can enter standby
without voice playback, as shown in Figure 3.2.
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APPLICATION CIRCUITS
VDD
S3
S2
S1
SW0
AOUT
SW1
VREF
SW2
BUSY
RND
RESET
A0
S4
A1
A2
OSC3
OSC2
XT/CR
OSC1
CPU/STD
GND
A2
S4="L"
S4="H"
A1
A0
SW2
SW1
SW0
Address [HEX]
S1
0
0
0
0
0
1
01
S2
0
0
0
0
1
0
02
S3
0
0
0
1
0
0
04
S1
0
0
1
0
0
1
09
S2
0
0
1
0
1
0
0A
S3
0
0
1
1
0
0
0C
Application Circuit for Playing Six Phrases Using Four Switches
19/51
1
2
3
4
5
6
7
A2
A1
A0
RND
OSC1
OSC2
OSC3
RESET
BUSY
VREF
AOUT
GND
CPU/STD
XT/CR
SW2
SW1
SW0
VDD
¡ Semiconductor
MSM9802/03/05-xxx
Application Circuit Using Switches
20/51
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Address Counter
8
DATA
Controller
PCM
Synthesizer
NAR
10
OSC1
OSC2
OSC
XT/RC
Timing Controller
OSC3/TEST
21/51
XT/CR
RESET
VDD
GND
VREF
AOUT
MSM9802/03/05-xxx
10-Bit
DAC
&
LPF
¡ Semiconductor
ST
I/O
Interface
6
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
ROM
(Including 11Kbit of
Edit ROM & Address ROM)
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Multiplexer
(2) MICROCONTROLLER INTERFACE MODE (CPU/STD: "H" level)
CPU/STD
Address
Controller
BLOCK DIAGRAM
I5
I4
I3
I2
I1
I0
¡ Semiconductor
MSM9802/03/05-xxx
PIN CONFIGURATION (TOP VIEW)
I3
1
18 I2
I4
2
17 I1
I5
3
16 I0
RESET
4
15 ST
XT/CR
5
14 CPU/STD
NAR
6
13 OSC3/TEST
GND
7
12 OSC2
VREF
8
11 OSC1
AOUT
9
10 VDD
18-Pin Plastic DIP
Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.
VDD
1
24 AOUT
OSC1
2
23 VREF
OSC2
3
22 GND
NC
4
21 NC
OSC3/TEST
5
20 NAR
NC
6
19 NC
CPU/STD
7
18 XT/CR
ST
8
17 RESET
NC
9
16 NC
I0 10
15 I5
I1 11
14 I4
I2 12
13 I3
NC: No connection
24-Pin Plastic SOP
Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.
22/51
¡ Semiconductor
MSM9802/03/05-xxx
VDD
1
30 AOUT
OSC1
2
29 VREF
OSC2
3
28 GND
NC
4
27 NC
NC
5
26 NC
OSC3/TEST
6
25 NAR
NC
7
24 NC
CPU/STD
8
23 XT/CR
NC
9
22 NC
ST 10
21 RESET
NC 11
20 NC
NC 12
19 NC
I0 13
18 I5
I1 14
17 I4
I2 15
16 I3
NC: No connection
30-Pin Plastic SSOP
Note: Applicable to MSM9802-xxxGS-AK, MSM9803-xxxGS-AK, and MSM9805-xxxGS-AK.
23/51
¡ Semiconductor
MSM9802/03/05-xxx
PIN DESCRIPTIONS
Pin
DIP
SOP SSOP
Symbol
Type
Description
The IC enters the standby state if this pin is set to "L" level. At this time,
oscillation stops and AOUT drives a current of 0 mA and becomes GND
4
17
21
RESET
I
level, then the IC returns to the initial state.
Apply a "L" pulse upon power-on.
This pin has an internal pull-up resistor.
Signal output pin that indicates whether the 6-bit LATCH (see Block
6
20
25
NAR
O
Diagram) is idle. NAR at "H" level indicates that the LATCH is empty
and ST input is enabled.
5
18
23
XT/CR
I
14
7
8
CPU/STD
I
XT/RC switching pin. Set to "H" level if ceramic oscillation is used.
Set to "L" level if RC oscillation is used.
Microcontroller interface/stand-alone mode switching pin. Set to "H"
level if the MSM9802/03/05 is used in microcontroller interface mode.
Volume setting pin. If this pin is set to GND level, the maximum
8
23
29
VREF
I
current is forced in, and if set to VDD level, the minimum current is
forced in. An approx. 10 kW pull-down resistor is internally connected
to this pin during operation.
Voice output pin.
9
24
30
AOUT
O
The voice signals are output as current changes. In standby state, this
pin drives a current of 0 mA and becomes GND level.
7
22
28
GND
—
10
1
1
VDD
—
11
2
2
OSC1
I
Ground pin.
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between
this pin and the GND pin.
Ceramic oscillator connection pin when ceramic oscillation is selected.
RC connection pin when RC oscillation is selected.
Input from this pin if external clock is used.
Ceramic oscillator connection pin when ceramic oscillation is selected.
12
3
3
OSC2
O
RC connection pin when RC oscillation is selected.
Leave this pin open if external clock is used.
Outputs "L" level in standby state.
Leave this pin open when ceramic oscillation is used.
13
5
6
OSC3/TEST
O
RC connection pin when RC oscillation is selected.
Outputs "H" level in standby state when RC oscillation is selected.
Voice synthesis starts at fall of ST, and addresses I0 to I5 are fetched
15
8
10
ST
I
at rise of ST. Input ST when NAR, the status signal, is at "H" level.
This pin has internal pull-up resistor.
16-18
1-3
10-15 13-18
I0 - I5
I
Phrase input pins corresponding to playback sound.
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¡ Semiconductor
MSM9802/03/05-xxx
ABSOLUTE MAXIMUM RATINGS
(GND=0V)
Parameter
Power Supply Voltage
Symbol
VDD
Input Voltage
VIN
Storage Temperature
TSTG
Condition
Ta=25°C
Rating
Unit
–0.3 to +7.0
V
–0.3 to VDD+0.3
V
–55 to +150
°C
—
RECOMMENDED OPERATING CONDITIONS
(GND=0 V)
Parameter
Symbol
Condition
Range
Unit
Power Supply Voltage
VDD
—
2.0 to 5.5
V
Operating Temperature
Top
—
–40 to +85
°C
Original Oscillation Frequency 1
fOSC1
When crystal is selected
Original Oscillation Frequency 2
fOSC2
When RC is selected (*1)
Min.
Typ.
Max.
3.5
4.096
4.5
200
256
300
MHz
kHz
*1 The accuracy of the oscillation frequency when RC oscillation is selected depends largely on
the accuracy of the external R and C.
25/51
¡ Semiconductor
MSM9802/03/05-xxx
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=5.0 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)
Parameter
"H" Input Voltage
Symbol
Condition
Min.
Typ.
Max.
Unit
VIH
—
4.2
—
—
V
"L" Input Voltage
VIL
—
—
—
0.8
V
"H" Output Voltage
VOH
IOH=–1 mA
4.6
—
—
V
"L" Output Voltage
VOL
IOL=2 mA
—
—
0.4
V
"H" Input Current 1
IIH1
VIH=VDD
—
—
10
µA
"H" Input Current 2
IIH2
—
—
15
µA
"L" Input Current 1
Applies to OSC1 pin only.
VIH=VDD
IIL1
VIL=GND
–10
—
—
µA
*1
IIL2
Internal pull-up resistor
–200
–90
–30
µA
Dynamic Supply Current 1 *2
IDD1
—
0.4
1
mA
—
—
16
mA
Ta=–40 to +70°C
—
—
10
µA
Ta=70 to 85°C
—
—
50
µA
6
9.5
15
mA
7
10
13
kW
"L" Input Current 2
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
Dynamic Supply Current 2 *3
IDD2
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
At maximum output current,
AOUT Output Current
IAOUT
VREF Pin Pull-down Resistance
RVREF
VREF=GND,
AOUT bias voltage=0V
—
*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current
26/51
¡ Semiconductor
MSM9802/03/05-xxx
DC Characteristics
(VDD=3.1 V, GND=0 V, Ta=–40 to +85°C, unless otherwise specified)
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage
VIH
—
2.7
—
—
V
"L" Input Voltage
VIL
—
—
—
0.5
V
"H" Output Voltage
VOH
IOH=–1 mA
2.6
—
—
V
"L" Output Voltage
VOL
IOL=2 mA
—
—
0.4
V
"H" Input Current 1
IIH1
VIH=VDD
—
—
10
µA
—
—
15
µA
Parameter
Applies to OSC1 pin only.
"H" Input Current 2
IIH2
"L" Input Current 1
IIL1
VIL=GND
–10
—
—
µA
IIL2
Internal pull-up resistor
–100
–30
–10
µA
—
0.15
0.5
mA
—
—
5.5
mA
Ta=–40 to +70°C
—
—
5
µA
Ta=70 to 85°C
—
—
20
µA
1.4
3.2
5
mA
7
10
13
kW
"L" Input Current 2
*1
Dynamic Supply Current 1 *2
IDD1
VIH=VDD
VREF=VDD,
AOUT bias voltage=0V
At maximum output current
Dynamic Supply Current 2 *3
IDD2
VREF=GND,
AOUT bias voltage=0V
Standby Current
IDS
At maximum output current,
AOUT Output Current
IAOUT
VREF=GND,
AOUT bias voltage=0V
VREF Pin Pull-down Resistance
RVREF
—
*1 Applicable to RESET, ST
*2 Dynamic supply current (excluding DAC output current)
*3 Dynamic supply current at maximum output current
27/51
¡ Semiconductor
MSM9802/03/05-xxx
AC Characteristics
(VDD=5.0 V, GND=0 V, Ta=–40 to +85°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Master Clock Duty Cycle
fduty
—
40
50
60
%
RESET Input Pulse Width
tw(RST)
—
10
—
—
µs
RESET Input Time After Power-on
tD(RST)
—
0
—
—
µs
ST Signal Setup Time
tSTP
At power-on
1
—
—
µs
ST Input Pulse Width
t(ST)
—
0.35
—
2000
µs
ST-ST Pulse Interval
tSS
40
—
—
µs
Data Setup Time
tDW
1
—
—
µs
Parameter
Upon entering the stop code
(note)
—
Data Hold Time
tWD
—
1
—
—
µs
NAR Output Time (1)
tSNS
fSAM=8 kHz
—
—
10
µs
NAR Output Time (2)
tNAA
fSAM=8 kHz (note)
350
375
400
µs
NAR Output Time (3)
tNAB
fSAM=8 kHz (note)
315
440
500
µs
tNAC
fSAM=8 kHz (note)
NAR Output Time (4)
D/A Converter Change Time
Standby Transition Time
(at end of voice output)
Silence Time Between Phrases
350
375
500
µs
tDAR, tDAF
—
(note)
60
64
68
ms
tSTB
—
(note)
200
250
300
ms
fSAM=8 kHz (note)
350
375
500
µs
tBLN
(Note) Proportional to master the periods of oscillation frequencies fOSC1 and fOSC2.
The rated values show values when the standard master oscillation frequency is used.
28/51
,
,
,,,
¡ Semiconductor
MSM9802/03/05-xxx
TIMING DIAGRAMS
AC Characteristics at Power-On
VDD
VDDMin
tD(RST)
RESET (I)
tW(RST)
NAR (O)
tSTP
ST (O)
AC Characteristics in Standby Status and when the IC is Activated
I5-I0 (I)
t(ST)
ST ( I )
NAR (O)
tDW
tWD
tSNS
AOUT (O)
tNAA
tDAR
Voice playback
tSTB
tDAF
Standby transition time
Oscillation start
D/A converter change time
29/51
1st phrase address
2nd phrase address
¡ Semiconductor
Playback Timing
I5-I0 (I)
3rd phrase address
ST ( I )
tNAC
NAR (O)
tNAB
AOUT (O)
1st phrase
playback
tDAR
2nd phrase
playback
3rd phrase
playback
tBLN
Oscillation start
MSM9802/03/05-xxx
30/51
¡ Semiconductor
MSM9802/03/05-xxx
FUNCTIONAL DESCRIPTION
1. Playback Code Specification
The user can specify a maximum of 63 phrases. Table 1.1 shows the settings by the I5-I0 pins.
Table 1.1 User-specified Phrases
I5-I0
Code Details
000000
Stop code
000001
111111
User-specified phrase
(63 Phrases)
2. Address Data
If a phrase is input at I5-I0 pins by address data, and if a ST pulse is then applied, voice playback
starts. Figure 2.1 shows voice start timing. Figure 2.2 shows timing when an address other than
a phrase is input.
I5-I0 (I)
User phrase
ST ( I )
NAR (O)
AOUT (O)
Oscillation start
Voice end
Figure 2.1 Voice Start Timing
I5-I0 (I)
Address other than user phrase
ST ( I )
NAR (O)
AOUT (O)
Oscillation start
Figure 2.2 Timing when Address Other than a Phrase
is Input in Stand-by Mode
31/51
¡ Semiconductor
MSM9802/03/05-xxx
3. Stop Code
If I5-I0 are set to "000000" during voice playback, and a ST signal is input, playback stops
regardless of whether NAR is at "H" or "L" level, then AOUT becomes 1/2 IAOUT. Stop code
becomes valid at the falling edge of ST.
Figure 3.1 shows stop code input timing.
I5-I0 (I)
"000000"
User phrase
tSS
ST ( I )
NAR (O)
AOUT (O)
Voice stop
Figure 3.1 Stop Code Input Timing
The stop code does not initialize internal units but only stops playback. To initialize an internal
register, use the RESET pin.
32/51
¡ Semiconductor
MSM9802/03/05-xxx
4. Generating Pseudo-BUSY Signal through NAR Pin
If the application in use requires a BUSY signal when this IC is used in microcontroller interface
mode, a pseudo-BUSY signal can be generated through the NAR pin by controlling signal timing,
as shown below.
4.1 When edit ROM is not used
I5-I0 01 (Phrase 1)
02 (Phrase 2)
03 (Phrase 3)
04 (Silence phrase of 32 ms or more)
ST
30ms or more
30ms or more
30ms or more
NAR
(Pseudo-BUSY)
AOUT
tDAR
Phrase 1
Phrase 2
tNAB
Phrase 3
tNAB
Silence
phrase
tSTB
tDAF
tSTB
tDAF
tNAB
4.2 When edit ROM is used
01
I5-I0 (Phrases
1+2+3)
02 (Silence phrase of 32 ms or more)
ST
30ms or more
NAR
(Pseudo-BUSY)
AOUT
tDAR
Phrase 1
Phrase 2
tBLN
Phrase 3
tBLN
Silence
phrase
tNAB
33/51
¡ Semiconductor
MSM9802/03/05-xxx
APPLICATION CIRCUIT
+
–
VCC
P2.2
ST
P2.1
RESET
P3.0
NAR
RESET
XTAL1 XTAL2
OSC3
VREF
AIN
AOUT
CPU/STD
XT/CR
OSC2
OSC1
GND
STBY
VR
GND
MSC1157 (Speaker AMP)
I5
I4
I3
I2
I1
I0
MSM9802/03/05
MSM83C154 (MCU)
VDD
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
SP
SP
SEL
+
–
Application Circuit in Microcontroller Interface
34/51
¡ Semiconductor
MSM9802/03/05-xxx
(3) Common
1. Sampling Frequency
As shown in Table 1.1, 7 sampling frequencies are available.
A sampling frequency can be selected and assigned to each phrase in ROM data.
Table 1.1 Sampling Frequency
Sampling Frequency
Frequency diving ratio
At standard
XT/CR="H"
XT/CR="L"
oscillation frequency
Ceramic Oscillation
CR Oscillation
4.0 kHz
fOSC1/1024
fOSC2/64
5.3 kHz
fOSC1/768
fOSC2/48
6.4 kHz
fOSC1/640
fOSC2/40
8.0 kHz
fOSC1/512
fOSC2/32
10.6 kHz
fOSC1/384
Unavailable
12.8 kHz
fOSC1/320
Unavailable
16.0 kHz
fOSC1/256
Unavailable
Note: When RC oscillation is selected, 10.6 kHz, 12.8 kHz, and 16 kHz cannot be selected.
2. Recording/Playback Time
Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 11 Kbits of data area
is allocated for the Phrase Control Table, Phrase Data Control and Test Data.
Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 11
Kbits.
Phrase Control Table Area
4K bit
Pharase Data Control Area
4K bit
Test Data Area
3K bit
User's Area
501K bit (MSM9802)
1013K bit (MSM9803)
2037K bit (MSM9805)
On-chip Mask ROM Capacity
512K bit (MSM9802)
1M bit (MSM9803)
2M bit (MSM9805)
Figure 2.1 Memory Allocation of On-chip Mask ROM
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¡ Semiconductor
MSM9802/03/05-xxx
The playback time is obtained by dividing the memory capacity by the bit rate.
The playback time for 8-bit PCM algorithm is obrained by using the following equation.
Memory capacity [bit]
Playback time [sec] =
Bit rate [bps]
=
Memory capacity [bit]
Sampling frequency [Hz] ¥ 8 [bit]
For example, if all phrases are stored in the MSM9802 at 8 kHz sampling frequency, the
maximum playback time is as follows.
Playback time =
(512–11) ¥ 1024 [bit]
8000 [Hz] ¥ 8 [bit]
= 8.0 [sec]
Table 2.1 Maximum playback time
Model
Maximum playback time (sec)
ROM capacity
User's area
MSM9802
512K bit
501K bit
16.0
10.0
8.0
4.0
MSM9803
1M bit
1013K bit
32.4
20.2
16.2
8.1
MSM9805
2M bit
2037K bit
65.1
40.7
32.5
16.2
fSAM=4.0kHz fSAM=6.4kHz fSAM=8.0kHz fSAM=16.0kHz
3. Playback Method
This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM
algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved
because a resolution equivalent to 10-bit straight PCM is available around the waveform center.
You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table
3.1 shows the relationship between playback methods and applicable sounds. It is recommended to evaluate the sound quality before actual use.
Table 3.1 Relationship between playback methods and applicable sounds
Playback method
Applicable sound
8-bit non-linear PCM algorithm Human voice
8-bit straight PCM algorithm
BEEP tone, sound effects
36/51
¡ Semiconductor
MSM9802/03/05-xxx
4. Phrase Control Table
Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in
succession by a single easy control operation like controlling a single regular phrase playback.
Up to 8 combined phrases including a silence can be registered in a single address in the Phrase
Control Table.
Further, you can use the maximum memory space for data storage because it is not required to
have the same phrase data.
To show an example, let's assume that your application needs to speak two similar sentences, "It
is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and
"today". What you have to do is to prepare these common sound data, not in sentences but in
words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and
Figure 4.1
Multiple phrases can be played continuously merely by specifying a desired phrase using an X
address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played,
and when address"02" is specified, "It is rainy" is played.
Phrase Control Table, a silence can be inserted without using the User's Area.
Minimum time for silence
Maximum time for silence
Time unit for setting up silence
32 ms
2016 ms
32 ms
Table 4.1 Matrix of the Phrase Control Table
No.
X-Address
Y-Address
(HEX)
(Up to 8 phrases)
Sound Data
It is (silence) fine today.
2
02
[01] [02] Silence [12] [03]
It is (silence) rainy today.
3
03
[01] [02] [10] [21] [11] [12] [22] [03] It is fine becoming cloudy, rainy in some areas today.
62
3E
63
3F
···
[01] [02] Silence [10] [03]
···
01
···
1
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¡ Semiconductor
MSM9802/03/05-xxx
Figure 4.1 Phrase Combination Matrix for Phrase Control Table
Phrase Control Table Area
No. X-Address
Phrase Data Registration Area
Phrase Addigned
No. Y-Address
Phrase
1
01
1
[01]
it
1
01
2
02
2
[02]
is
2
02
is
3
03
3
Silence (64ms)
3
03
today
4
04
4
[12]
rainy
5
05
5
[03]
today
16
10
fine
6
06
6
—
17
11
cloudy
7
07
7
—
18
12
rainy
8
08
8
—
19
13
snowy
9
09
Silence time setting
32
20
ocasionally
(32ms ¥ n)
33
21
becoming
34
22
in some areas
63
3F
—
63
3F
0
Silence time
1
32 ms
2
64 ms
63
2016 ms
it
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¡ Semiconductor
MSM9802/03/05-xxx
5. RC Oscillation
Figure 5.1 shows an external circuit using RC oscillation. Figure 5.2 shows the RC oscillation
frequency characteristics.
R1
OSC1
R2
OSC2
C
OSC3
Figure 5.1 RC Oscillation
500
450
VDD=5 V
C=30 pF
R1=100 kW
Oscillaiton Frequency fOSC (kHz)
400
350
VDD=5 V
C=47 pF
300
250
200
150
VDD=3 V
C=47 pF
VDD=3 V
C=30 pF
100
50
0
10
20
30
40
50
60
70
Load Resistance R2 (kW)
Figure 5.2 RC Oscillation Frequency Characteristics
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¡ Semiconductor
MSM9802/03/05-xxx
5.1 Determining RC constants
The RC oscillation frequency characteristics are shown in Figure 5.2. If fosc is set to 256 kHz, use
the following values as a guide (see Figure 5.2) to set the C and R2 that fit the printed-circuit board
type used.
R1=100 kW, R2=30 kW, C=30 pF
When choosing RC oscillation, the RC oscillation frequency varies according to the fluctuation
of the external C and R2.
5.2 Fluctuation of RC oscillation frequencies
When choosing RC oscillation, the error of RC oscillation frequency due to process variations of
the IC is ±4% maximum, and the fluctuation of the RC oscillation frequency when using a
capacitor (C) of ±1% accuracy and a resistor (R2) of ±2% accuracy is a maximum of ±7%
approximately.
6. Ceramic Oscillation
Figure 6.1 shows an external circuit using a ceramic oscillator.
OSC1
C1
OSC2
C2
Figure 6.1 Ceramic Oscillation Diagram
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For example, the following table shows the optimum load capacitances, power supply voltage
ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co.,
Ltd., Kyocera Co., Ltd. and TDK Co., Ltd. are used.
Ceramic oscillator
Murata MFG.
Maker
Type
CSA4.09MGU
CST4.09MGWU
CSTCC4.00MG
CSTCC4.00MGU
Optimal load capacity
Frequency
(MHz)
4.096
4.0
Kyocera
PBRC4.00A
KBR-4.0MSB
PBRC4.00B
TDK
(Note)
C2 (pF)
30
30
Built in
Built in
15
15
33
33
4.0
KBR-4.0MKC
CCR4.00MC3
C1 (pF)
4.0
Built in
Built in
Built in
Built in
supply voltage range
(V)
Operating
temperature range
(°C)
3.0 to 5.5
3.6 to 5.5
–40 to +85
2.7 to 5.5
3.1 to 5.5
–20 to +80
2.4 to 5.5
–40 to +85
When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is
slower by 2 percent than that of an analysis tool or a demonstration board.
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7. Low-Pass Filter
In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 7.1 and Table
7.2 show the LPF frequency characteristics and LPF cutoff frequency respectively.
Only the voice output through LPF is enabled in this IC.
[dB] 20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
100
10
1k
10k
[Hz]
Figure. 7.1 LPF Frequency Characteristics (fSAM=8 kHz)
Table 7.2 LPF Cutoff Frequency
Sampling Frequency (kHz)
(fSAM)
Cutoff Frequency (kHz)
(fCUT)
4.0
5.3
1.2
1.6
6.4
2.0
8.0
2.5
10.6
3.2
12.8
4.0
16.0
5.0
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8. Standby Transition
When playback of a phrase is finished, if playback of the next phrase does not start up within tSTB
(0.25 sec. typ.), the IC enters standby status and the entire operation stops.
A2 - A0
SW2 - SW1 "L"
SW0
BUSY
AOUT
Figure 8.1 Timing for Voice Playback during D/A Converter Change Time
(Stand-alone Mode)
I5 - I0
ST
NAR
AOUT
Figure 8.2 Timing for Voice Playback during D/A Converter Change Time
(Microcontroller Interface Mode)
If playback is attempted during D/A converter change time as shown in figures 8.1 and 8.2, the
IC exits from standby status and the output from the D/A converter begins going to the
1/2 IAOUT level. When the output reaches 1/2 IAOUT, voice playback starts.
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9. Voice Output Unit Equivalent Circuit (AOUT, FREF Pins)
Current-Sourcing Type
D/A Converter
VDD
VREF
10kW
(TYP)
PCM Value
AOUT
IAOUT
Standby Signal
(The above switch positions show those when the circuit is active.)
Figure 9.1 Voice Output Unit Equivalent Circuit
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D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS
AOUT Output Current [mA]
Power Supply Voltage vs. Output Current Characteristics (Ta=25°C, VAOUT=0V)
14
12
10
8
6
4
2
0
0
1
2
3
4
5
6
Power Supply Voltage [V]
AOUT Output Current [mA]
Temperature vs. Output Current Characteristics (VDD=5V, VAOUT=0V)
14
12
10
8
6
4
2
0
–50
–25
0
25
50
75
100
Ambient Temperature Ta [°C]
VREF Voltage vs. Output Current Characteristics (Ta=25°C, VDD=5V, VAOUT=0V)
AOUT Output Current [mA]
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VREF [V]
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PAD CONFIGURATION
MSM9802
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
:
:
:
:
X=3.22mm Y=3.17mm
350µm ± 30µm
110µm ¥ 110µm
GND
Y-axis
3
2
1
18 17
16
15
MSM9802
4
14
X-axis
5
(NC)
6
13
7
8
9
10 11
12
Pad Coordinates
(Chip center is located at X=0 and Y=0)
(Unit: µm)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
1
I3/ (A0)
–415
1385
10
VDD
462
–1347
2
I4/ (A1)
–816
1385
11
OSC1
742
–1333
3
I5/ (A2)
–1460
1385
12
OSC2
1349
–1333
4
RESET
–1460
1049
13
OSC3
1460
–972
5
XT/CR
–1458
–20
14
CPU/STD
1389
183
6
NAR
–1460
–899
15
ST/(RND)
1389
1058
7
GND
–1460
–1375
16
I0/(SW0)
1389
1385
8
VREF
–1135
–1333
17
I1/(SW1)
719
1385
9
AOUT
–585
–1333
18
I2/(SW2)
276
1385
Pad name in parentheses is for stand-alone mode.
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MSM9803
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
:
:
:
:
X=3.22mm Y=4.06mm
350µm ± 30µm
110µm ¥ 110µm
GND
Y-axis
3
2
1
18 17
16
15
MSM9803
4
14
5
X-axis
(NC)
6
13
7
8
9
10 11
12
Pad Coordinates
(Chip center is located at X=0 and Y=0)
(Unit: µm)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
1
I3/ (A0)
–415
1829
10
VDD
452
–1788
2
I4/ (A1)
–816
1829
11
OSC1
742
–1776
3
I5/ (A2)
–1460
1829
12
OSC2
1349
–1776
4
RESET
–1460
1493
13
OSC3
1460
–1415
5
XT/CR
–1458
424
14
CPU/STD
1389
628
6
NAR
–1460
–1342
15
ST/(RND)
1389
1502
7
GND
–1460
–1818
16
I0/(SW0)
1389
1829
8
VREF
–1135
–1776
17
I1/(SW1)
720
1829
9
AOUT
–585
–1776
18
I2/(SW2)
276
1829
Pad name in parentheses is for stand-alone mode.
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MSM9805
Pad Layout
Chip size
Chip thickness
Pad size
Substrate potential
:
:
:
:
X=3.22mm Y=5.96mm
350µm ± 30µm
110µm ¥ 110µm
GND
Y-axis
3
2
1
18 17
16
15
4
5
MSM9805
14
X-axis
(NC)
13
6
7
8
9
10 11
12
Pad Coordinates
(Chip center is located at X=0 and Y=0)
(Unit: µm)
Pad No.
Pad Name
X-axis
Y-axis
Pad No.
Pad Name
X-axis
Y-axis
1
I3/ (A0)
–415
2777
10
VDD
452
–2723
2
I4/ (A1)
–816
2777
11
OSC1
742
–2726
3
I5/ (A2)
–1460
2777
12
OSC2
1349
–2726
4
RESET
–1460
882
13
OSC3
1460
–1532
5
XT/CR
–1458
364
14
CPU/STD
1453
267
6
NAR
–1460
–1546
15
ST/(RND)
1455
1338
7
GND
–1460
–2768
16
I0/(SW0)
1432
2777
8
VREF
–1136
–2726
17
I1/(SW1)
754
2777
9
AOUT
–585
–2726
18
I2/(SW2)
312
2777
Pad name in parentheses is for stand-alone mode.
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PACKAGE DIMENSIONS
(Unit : mm)
DIP18-P-300-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.30 TYP.
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(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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MSM9802/03/05-xxx
(Unit : mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.19 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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E2Y0002-29-62
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan