SN54ABT16623, SN74ABT16623 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS211B – FEBRUARY 1991 – REVISED JANUARY 1997 D D D D D D D D SN54ABT16623 . . . WD PACKAGE SN74ABT16623 . . . DGG OR DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation 1OEAB 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 2OEAB Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout High-Drive Outputs (–32-mA IOH, 64-mA IOL) Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings description The ’ABT16623 are 16-bit transceivers designed for asynchronous communication between data buses. The control-function implementation allows for maximum flexibility in timing. The ’ABT16623 provide true data at the outputs. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic levels at the output-enable (OEAB and OEBA) inputs. The output-enable inputs can be used to disable the device so that the buses are effectively isolated. The dual-enable configuration gives the transceivers the capability of storing data by simultaneously enabling OEAB and OEBA. Each output reinforces its input in this configuration. When both OEAB and OEBA are enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of bus lines (32 total) remain at their last states. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OEBA 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OEBA Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABT16623, SN74ABT16623 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS211B – FEBRUARY 1991 – REVISED JANUARY 1997 description (continued) To ensure the high-impedance state during power up or power down, OEBA should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The SN54ABT16623 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT16623 is characterized for operation from –40°C to 85°C. FUNCTION TABLE (each 8-bit section) INPUTS OPERATION OEBA OEAB L L B data to A bus L H B data to A bus, A data to B bus H L Isolation H H A data to B bus logic symbol† 1OEBA 1OEAB 2OEBA 2OEAB 1A1 48 1 EN1 EN2 25 24 47 EN3 EN4 1 1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 2A1 3 44 5 43 6 41 8 40 9 38 11 37 12 36 3 2A3 2A4 2A5 2A6 2A7 2A8 13 1 14 33 16 32 17 30 19 29 20 27 22 26 23 POST OFFICE BOX 655303 1B2 1B3 1B4 1B5 1B6 1B7 1B8 2B1 4 35 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 1B1 2 46 1 2A2 2 1 • DALLAS, TEXAS 75265 2B2 2B3 2B4 2B5 2B6 2B7 2B8 SN54ABT16623, SN74ABT16623 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS211B – FEBRUARY 1991 – REVISED JANUARY 1997 logic diagram (positive logic) 1OEBA 1OEBA 1OEBA 48 2OEBA 1 2OEBA 47 2OEBA 2 25 24 36 13 1B1 To Seven Other Channels 2B1 To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT16623 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT16623 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51. recommended operating conditions (see Note 3) SN54ABT16623 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC –24 Low-level output current 48 ∆t/∆v Input transition rise or fall rate High-level input voltage SN74ABT16623 MIN 2 2 0.8 Input voltage 0 Outputs enabled TA Operating free-air temperature NOTE 3: Unused pins (input or I/O) must be held high or low to prevent them from floating. 5 –55 125 –40 V V 0.8 0 UNIT V VCC –32 mA V 64 mA 5 ns/V 85 °C PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54ABT16623, SN74ABT16623 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS211B – FEBRUARY 1991 – REVISED JANUARY 1997 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VCC = 5 V, VCC = 4 4.5 5V VOL VCC = 4 4.5 5V MIN –1.2 MAX SN74ABT16623 MIN –1.2 IOH = –3 mA IOH = –24 mA 3 3 3 2 2 IOH = –32 mA IOL = 48 mA 2* IOL = 64 mA IOZH‡ IOZL‡ VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.5 V Ioff VCC = 0, VCC = 5.5 V, VO = 5.5 V VI or VO ≤ 4.5 V VCC = 5.5 V, VO = 2.5 V Outputs high ICEX IO§ 0.55 0.55* 0.55 A or B ports VCC = 5.5 V, IO = 0, VI = VCC or GND Outputs high ±1 ±1 ±1 ±100 ±100 ±100 50 50 50 µA –50 –50 µA ±100 µA 50 µA –180 mA –180 50 –50 –180 –50 2 2 2 35 35 35 Outputs disabled 2 2 2 1 1.5 1 0.05 0.05 0.05 Control inputs VCC = 5.5 V, Outputs enabled One input at 3.4 V,, Other inputs at Outputs disabled VCC or GND VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND 1.5 1.5 1.5 Control inputs VI = 2.5 V or 0.5 V ts Data inp inputs ∆ICC¶ Outputs low 3 Cio A or B ports VO = 2.5 V or 0.5 V 8 * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ The parameters IOZH and IOZL include the input leakage current. § Not more than one output should be tested at a time, and the duration of the test should not exceed one second. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 µ µA –50 50 –100 V mV ±100 –50 V V 100 Control inputs UNIT 2 0.55 A or B ports 4 MAX –1.2 2.5 VI = VCC or GND Ci MIN 2.5 VCC = 5.5 V,, ICC SN54ABT16623 2.5 Vhys II TA = 25°C TYP† MAX • DALLAS, TEXAS 75265 mA mA pF pF SN54ABT16623, SN74ABT16623 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS211B – FEBRUARY 1991 – REVISED JANUARY 1997 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OEBA or OEAB A or B tPHZ tPLZ OEBA or OEAB A or B PARAMETER VCC = 5 V, TA = 25°C SN54ABT16623 SN74ABT16623 MIN TYP MAX MIN MAX MIN MAX 1 2 3.2 1 3.7 1 3.6 1 2.2 3.4 1 4.4 1 4.3 1.1 3 4 1.1 5 1.1 4.9 1.4 3.3 4.9 1.4 6.2 1.4 6 1 3.5 4.9 1 6.2 1 6 1.4 2.8 4.7 1.4 5.6 1.4 5.4 UNIT ns ns ns PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54ABT16623, SN74ABT16623 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS211B – FEBRUARY 1991 – REVISED JANUARY 1997 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL Output 3V Output Control tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ABT16623DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABT16623DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16623DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16623DL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16623DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16623DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT16623DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT16623DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 SN74ABT16623DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT16623DGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74ABT16623DLR SSOP DL 48 1000 346.0 346.0 49.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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