TI TWL6041BYFFR

TWL6041
SWCS058B – AUGUST 2010 – REVISED DECEMBER 2011
www.ti.com
8-CHANNEL HIGH_QUALITY LOW-POWER AUDIO CODEC
FOR PORTABLE APPLICATIONS
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
Four Audio DAC Channels
Stereo Capless Headphone Drivers
– Up to 104-dB DR
– Power Tune for performance/power
consumption tradeoff
Stereo 8Ω, 1.5 W per Channel Speaker Drivers
also with 4Ω support capablity
Differential Earpiece Driver
Stereo Line-Out
Two Audio ADC Channels
– 96-dBA SNR
Four Audio Inputs
– Three Differential Microphone Inputs
– Stereo Line-In/FM Input
Two Vibra/Haptics Feedback Channels
– Differential H-bridge Drivers
Two Low-Noise Analog Microphone Bias
Outputs
Two Digital Microphone Bias Outputs
Analog Low-Power Loop from Line-in to
Headphone/Speaker Outputs
Dual PLL for Flexible Clock Support
– 32-kHz Sleep Clock Input for System
•
•
•
•
•
•
Low-Power Playback Mode
– 12/19.2/26/38.4 MHz System Clock Input
Accessory Plug/Unplug Detection, Accessory
Button Press Detection
Integrated Power Supplies
– Negative Charge Pump for Capless
Headphone Driver
– Two LDOs for High PSRR
I2C Control
Thermal Protection
– Host Interrupt
Power Supplies:
– Analog: 2.1 V
– Digital I/O: 1.8 V
– Battery 2.3 V–5.5 V
Package 3.8-mm × 3.8-mm 81-pin WCSP
APPLICATIONS
•
•
•
Mobile and Smart Phones
MP3 Players
Handheld Devices
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2010–2011, Texas Instruments Incorporated
PRODUCT PREVIEW
Check for Samples: TWL6041
TWL6041
SWCS058B – AUGUST 2010 – REVISED DECEMBER 2011
www.ti.com
DESCRIPTION
The TWL6041 is an audio codec with a high level of integration providing analog audio codec functions for
portable applications, as shown in Figure 1. It contains multiple audio analog inputs and outputs, as well as
microphone biases and accessory detection. It is connected to the OMAP4 host processor through a proprietary
PDM interface for audio data communication enabling partitioning with optimized power consumption and
performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL).
The OMAP4 device provides a TWL6041 with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3
are connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL,
HFR), and earpiece (EAR) or stereo line outputs (AUXL, AUXR).
The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable over 100
hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input
and DAC path high-performance (HP) mode. Class-AB headphone drivers provide a 1-Vrms output and are
ground centered for capless connection to headphone, thus enabling system size and cost reduction. The
earpiece driver is a differential class-AB driver with 2-Vrms capability to a typical 32-Ω load or 1.4-Vrms to a
typical 16-Ω load.
Stereo speaker path has filterless class-D outputs with 1.5-W capability per channel. Additionally, the 4-Ω load is
supported. For output power maximization supply connection to an external boost is supported. Speaker drivers
support also hearing aid coil loads.
PRODUCT PREVIEW
For vibrator and haptic feedback support TWL6041 has two PWM channels with independent input signals from
DL4 or I2C. Vibra drivers are differential H-bridge outputs, enabling fast acceleration and deceleration of vibra
motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage can be connected to line
outputs.
The TWL6041 supports three differential microphone inputs (MMIC, HMIC, SMIC) and a stereo line-input (AFML,
AFMR) multiplexed to two parallel analog-to-digital converters (ADCs). The PDM output from the ADCs is
transmitted to the OMAP4 through UL0 and UL1. AFML, AFMR inputs can also be looped to analog outputs
(LB0, LB1).
Two LDOs provide a voltage of 2.1 V to bias analog microphones (MBIAS and HBIAS). The maximum output
current is 2 mA for each analog bias, allowing up to 2 microphones on one bias. Two LDOs provide a voltage of
1.8 V/1.85 V to bias digital microphones (DBIAS1 and DBIAS2). One bias generator can bias up several digital
microphones at the same time, with a total maximum output current of 10 mA.
The TWL6041 has an integrated negative charge pump and two LDOs (HS LDO and LS LDO) for high PSRR.
The only external supply needed is 2.1 V, which is available from the 2.1-V DC-DC of TWL6030/6032 PMIC of
OMAP. By powering audio from low-noise 2.1-V DC-DC of low power consumption, high dynamic range and high
output swing at headset output are achieved. All other supply inputs can be directly connected to battery or
system 1.8-V I/O.
Two integrated phase-locked loops (PLLs) enable operatation from a 12/19.2/26/38.4-MHz system clock (MCLK)
or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s audio
data rate for all channels, and host processor uses sample-rate converters to interface with different sample
rates (that is, 44.1 kHz). In the specific case of low-power audio playback, the 44.1-kS/s and 48-kS/s rates are
supported by the TWL6041. Transitions between sample rates or input clocks are seamless.
Accessory plug and unplug detections are
submitting send/end signal to the terminal
periodic accessory button press detection
properties can be programmed according to
supported (PLUGDET). Some headsets have a manual switch for
through the microphone input pin. This feature is supported by a
to minimize current consumption in sleep mode. Detection cycle
system requirements.
Figure 1 shows a simplified block diagram of the device.
2
Copyright © 2010–2011, Texas Instruments Incorporated
TWL6041
SWCS058B – AUGUST 2010 – REVISED DECEMBER 2011
www.ti.com
AAFL
VDDMBIAS
HBIAS
HMBIAS
MBIAS
DBIAS1
MMICN
ADCL
1
GNDMIC
MMICP
MicAmpL
HMICP
HMICN
0:30 dB
MMBIAS
UpLink
VSSUL
AAFR
DMBIAS1
1
MicAmpR
ADCR
SMICP
SMICN
DBIAS2
DMBIAS2
0:30 dB
LineInAmpR
UL0
UL1
DL0
PDMUP
PDMCLK
PDMCLKLB
PDMFRAME
SCL
LB0
AFML
DL3
–18:24 dB
DL4
VDDVIO
SDA
AFMR
LineInAmpL
DL1
DL2
PDM
Interface
GNDDIGIO
GPO
LB1
EarDrv
EARP
Interface
EARN
–24:6 dB
HSLDrv
2
I C
Registers
PRODUCT PREVIEW
PDMDN
VDDEAR
HSL
PBKG
1
HSDACL
–30:0 dB
VDDV2V1
HSRDrv
VDDULLDO
HS LDO
VSSEARLDO
LS LDO
VDDHS
VSSHS
GNDHS
HSR
1
HSDACR
–30:0 dB
GNDLDO
AUXLN
CFLYP
GNDNCP
CFLYN
VSSDL
AUXLP
VDDREGNCP
Negative
Charge
Pump
AUXRP
DownLink
AUXRN
PGAL
NCPOUT
HFLDrv
VDDHFL
HFLP
VDDRF
REF
REFP
REFN
Power
Reference
Temp
Sense
1
HFLN
HFDACL
GNDHFL
–52:6 dB
PGAR
GNDREF
HFRDrv
VDDHFR
HFRP
PLUGDET
ACCONN
Accessory
Connector
Detection
HFRN
HFDACR
PDM
to
1 PCM
VDDDLPLL
MCLK
1
8
8
HP PLL
PCM
to
PWM
8
CLK32K
VSSPLL
GNDHFR
–52:6 dB
VIBLDrv
VIBLP
1
VIBLN
1
GNDVIB
LP PLL
Clock System
8
8
Osc
8
PCM
to
PWM
VIBRDrv
VDDVIB
VIBRP
1
VIBRN
1
SWCS056-001
Figure 1. SIMPLIFIED BLOCK DIAGRAM
Copyright © 2010–2011, Texas Instruments Incorporated
3
TWL6041
SWCS058B – AUGUST 2010 – REVISED DECEMBER 2011
www.ti.com
space
For the complete TWL60xx data sheet, contact your TI sales representative. The document is internally
available for download on ESP under the corresponding TWL60xx product folders and can be shared
with customers.
PRODUCT PREVIEW
4
Copyright © 2010–2011, Texas Instruments Incorporated
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without obtaining prior authorisation from U.S. Department of Commerce
and other competent Government authorities to the extent required by
those laws. This provision shall survive termination or expiration of this
Agreement.
According to our best knowledge of the state and end-use of this
product or technology, and in compliance with the export control
regulations of dual-use goods in force in the origin and exporting
countries, this technology is classified as follows:
US ECCN: EAR99
EU ECCN: EAR99
And may require export or re-export license for shipping it in compliance
with the applicable regulations of certain countries.
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TWL6041BYFFR
ACTIVE
DSBGA
YFF
81
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
TWL6041BYFFT
ACTIVE
DSBGA
YFF
81
250
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Feb-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TWL6041BYFFR
DSBGA
YFF
81
3000
330.0
12.4
TWL6041BYFFT
DSBGA
YFF
81
250
180.0
12.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.86
3.86
0.69
8.0
12.0
Q1
3.86
3.86
0.69
8.0
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Feb-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TWL6041BYFFR
DSBGA
YFF
81
3000
346.0
346.0
29.0
TWL6041BYFFT
DSBGA
YFF
81
250
210.0
185.0
35.0
Pack Materials-Page 2
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