TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 SD CARD VOLTAGE-TRANSLATION TRANSCEIVER Check for Samples: TXS0206A FEATURES 1 • • YFP PACKAGE (TOP VIEW) Level Translator – VCCA and VCCB Range of 1.1 V to 3.6 V – Fast Propagation Delay (4.4 ns Max When Translating Between 1.8 V and 3 V) ESD Protection Exceeds JESD 22 – 2500-V Human-Body Model (A114-B) – 250-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) 1 2 3 4 A B C D E TERMINAL ASSIGNMENTS 1 2 3 4 A DAT2A VCCA WP DAT2B B DAT3A CD VCCB DAT3B C CMDA GND GND CMDB D DAT0A CLKA CLKB DAT0B E DAT1A CLK-f EN DAT1B DESCRIPTION/ORDERING INFORMATION The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level. The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications. ORDERING INFORMATION (1) TA –40°C to 85°C (1) (2) PACKAGE (2) WCSP – YFP (Pb-free) Tape and reel ORDERABLE PART NUMBER TXS0206AYFPR TOP-SIDE MARKING BTR For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. REFERENCE CIRCUIT VCCA VCCB C3 0.1 µF U1A VCCB C4 0.1 µF C1 0.1 µF J1 U2 A2 VDDA D1 DAT0 E1 A1 DAT1 DAT2 B1 DAT3 C1 CMD D2 CLK E2 CLKin C2 GND CD C3 VCCA VCCB DAT0A DAT1A DAT2A DAT3A CMDA B3 D4 DAT0B DAT0B DAT1B E4 DAT1B DAT2B A4 DAT2B DAT3B B4 DAT3B C4 CMDB CMDB D3 CLKB CLKB CLKA CLK-f DAT2B DAT3B CMDB CLKB DAT0B DAT1B Processor SD/SDIO MMC CD DAT2 DAT3 CMD VSS1 VDD CLK VSS2 DAT0 DAT1 10 CD (Physical) 11 GND 12 GND CD GND GND 0 1 2 3 4 5 6 7 8 B2 CD 54794-0978 Micro SD TXS0206A Figure 1. Interfacing With SD/SDIO Card VCCA VCCB C3 0.1 µF U1A VCCB C4 0.1 µF C1 0.1 µF J1 U2 VDDA DAT0 DAT1 DAT2 DAT3 CMD CLK CLKin GND CD A2 D1 E1 A1 B1 C1 D2 E2 C2 C3 VCCA VCCB DAT0A DAT1A DAT2A DAT3A CMDA CLKA CLK-f DAT2B DAT3B CMDB B3 D4 DAT0B DAT0B DAT1B E4 DAT1B DAT2B A4 DAT2B DAT3B B4 DAT3B C4 CMDB CMDB D3 CLKB CLKB CLKB DAT0B DAT1B CD B2 CD WP Processor SD/SDIO MMC DAT2 DAT3 CMD VSS1 VDD CLK VSS2 DAT0 DAT1 10 CD (Physical) 11 GND 12 GND 14 WP (Physical) CD GND GND 0 1 2 3 4 5 6 7 8 Standard SD Card TXS0206A VCCA Figure 2. Interfacing With Seperate WP and CD Pin 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 VCCA VCCB C3 0.1 µF U1A VCCB C4 0.1 µF C1 0.1 µF U2 A2 VDDA D1 DAT0 E1 A1 DAT1 DAT2 B1 DAT3 C1 CMD D2 CLK E2 CLKin C2 GND C3 VCCA VCCB DAT0A CMDB 2 DAT1B 3 E4 DAT1B DAT1B A4 DAT2B DAT2B B4 DAT3B DAT3B DAT0B 4 DAT2B 5 CD 6 C4 CMDB CMDB D3 CLKB CLKB DAT3B 7 CLKB 8 DAT0B D4 DAT0B DAT1A DAT2A DAT3A CMDA CLKA CLK-f 1 B3 GND BS DATA1 (see Note) DATA0/SDIO (see Note) DATA2 (see Note) INS DATA3 (see Note) SCLK 9 GND CD CD Memory Stick™ Controller VSS B2 CD VCC 10 TXS0206 VSS Memory Stick™ Connector NOTE: The TXS0206A has integrated pullup resistor values that dynamically change value depending on whether a low or high signal is being transmitted through the device. When the output is low, the TXS0206A internal pullup value is 40 kΩ, and when the output is high, the internal pullup value change to a value of 4 kΩ. For MSA and MSH Memory Stick™ memory cards, to ensure that a valid VIH (i.e., receiver input voltage high) is achieved, the internal pulldown resistors for these memory cards are not smaller than a 10-kΩ value. See the Application Information section of this data sheet, which explains the impact of adding too heavy (i.e., <10-kΩ value) of a pulldown resistor to the data lines of the TXS0206A device and the resulting 4-kΩ pullup/10-kΩ pulldown voltage divider network, which has a direct impact on the VIH of the signal being sent into the Memory Stick™. Figure 3. Interfacing With Memory Stick™ Card 1.8 V CPU A Side B Side 2.9 V CLK CLK Feedback CLK CMD CMD Data 0–3 Level-Shifter Data 0–3 Antenna Pins 10, 11 EN WP, CD MMC, SD Card, or MS Card WP, CD 1.8-V Pullup WP, CD Integrated Pullup/Pulldown Resistors Figure 4. Typical Application Circuit Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 3 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com LOGIC TABLE EN TRANSLATOR I/Os L Disabled, pulled to VCCA, VCCB through 40 kΩ H Active TERMINAL FUNCTIONS TERMINAL 4 TYPE DESCRIPTION NO. NAME A1 DAT2A I/O Data bit 2 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. A2 VCCA Pwr A-port supply voltage. VCCA powers all A-port I/Os and control inputs. A3 WP O Connected to write protect on the mechanical connector. The WP pin has an internal 100-kΩ pullup resistor to VCCA. A4 DAT2B I/O Data bit 2 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. B1 DAT3A I/O Data bit 3 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. B2 CD O Connected to card detect on the mechanical connector. The CD pin has an internal 100-kΩ pullup resistor to VCCA. B3 VCCB Pwr B-port supply voltage. VCCB powers all B-port I/Os. B4 DAT3B I/O Data bit 3 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. I/O Command bit connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. C1 CMDA C2, C3 GND C4 CMDB I/O Command bit connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. D1 DAT0A I/O Data bit 0 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. D2 CLKA I Clock signal connected to host. Referenced to VCCA. D3 CLKB O Clock signal connected to memory card. Referenced to VCCB. D4 DAT0B I/O Data bit 0 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. E1 DAT1A I/O Data bit 1 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA. E2 CLK-f O Clock feedback to host for resynchronizing data to a processor. Leave unconnected if not used. E3 EN I Enable/disable control. Pull EN low to place all outputs in Hi-Z state. Referenced to VCCA. E4 DAT1B I/O Ground Data bit 1 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 VCCA VCCB EN CLKA CLKB CLK-f VCCA VCCB One-Shot R1 R2 Translator One-Shot CMDA CMDB Gate Control One-Shot Translator One-Shot VCCA VCCB One-Shot R1 R2 Translator One-Shot DAT0A DAT0B Gate Control One-Shot Translator One-Shot VCCA VCCB One-Shot R1 R2 Translator One-Shot DAT1A DAT1B Gate Control One-Shot Translator One-Shot VCCA VCCB One-Shot R1 R2 Translator One-Shot DAT2A DAT2B Gate Control One-Shot Translator One-Shot VCCA VCCB One-Shot R1 R2 Translator One-Shot DAT3A DAT3B Gate Control One-Shot Translator One-Shot VCCA 100 kW WP 100 kW CD Figure 5. Logic Diagram Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 5 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com VCCA RCD RWP WP CD RESISTORS RWP, RCD 100 kΩ Tolerance ±30% Figure 6. WP, CD Pullup Resistors ABSOLUTE MAXIMUM RATINGS (1) Level Translator over operating free-air temperature range (unless otherwise noted) VCCA Supply voltage range VCCB Supply voltage range MIN MAX –0.5 4.6 V V –0.5 4.6 I/O ports (A port) –0.5 4.6 I/O ports (B port) –0.5 4.6 Control inputs –0.5 4.6 A port –0.5 4.6 B port –0.5 4.6 A port –0.5 4.6 B port –0.5 4.6 UNIT VI Input voltage range VO Voltage range applied to any output in the high-impedance or power-off state VO Voltage range applied to any output in the high or low state IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current Continuous current through VCCA or GND Tstg (1) Storage temperature range –65 V V V ±50 mA ±100 mA 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL IMPEDANCE RATINGS UNIT θJA (1) 6 Package thermal impedance (1) 117 °C/W The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 RECOMMENDED OPERATING CONDITIONS (1) Level Translator VCCA VCCB MIN MAX UNIT VCCA Supply voltage 1.1 3.6 V VCCB Supply voltage 1.1 3.6 V VCCI – 0.2 VCCI VCCI x 0.65 VCCI 0 0.15 High-level input voltage VIH Low-level input voltage VIL VO Output voltage IOH A-Port CMD and DATA I/Os B-Port CMD and DATA I/Os 1.1 V to 1.95 V 1.1 V to 1.95 V 1.95 V to 3.6 V 1.95 V to 3.6 V EN and CLKA 1.1 V to 3.6 V 1.1 V to 3.6 V A-Port CMD and DATA I/Os B-Port CMD and DATA I/Os 1.1 V to 1.95 V 1.1 V to 1.95 V 1.95 V to 3.6 V 1.95 V to 3.6 V EN and CLKA 1.1 V to 3.6 V 1.1 V to 3.6 V 0 VCCI x 0.35 Active state 0 VCCO 3-state 0 3.6 High-level output current (CLK-f output) 1.1 V to 3.6 V –100 1.1 V to 1.3 V –0.5 1.4 V to 1.6 V 1.65 V to 1.95 V IOL Low-level output current (CLK-f output) –2 –8 1.1 V to 3.6 V 100 1.1 V to 1.3 V 0.5 2 IOL Low-level output current (CLK output) Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) 1.1 V to 3.6 V 1.1 V to 3.6 V mA μA mA 4 3 V to 3.6 V High-level output current (CLK output) μA 1 1.1 V to 3.6 V 2.3 V to 2.7 V IOH V –4 3 V to 3.6 V 1.65 V to 1.95 V V –1 1.1 V to 3.6 V 2.3 V to 2.7 V 1.4 V to 1.6 V V 8 1.1 V to 3.6 V –100 1.1 V to 1.3 V –0.5 1.4 V to 1.6 V –1 1.65 V to 1.95 V –2 2.3 V to 2.7 V –4 3 V to 3.6 V –8 1.1 V to 3.6 V 100 1.1 V to 1.3 V 0.5 1.4 V to 1.6 V 1 1.65 V to 1.95 V 2 2.3 V to 2.7 V 4 3 V to 3.6 V 8 –40 μA mA μA mA 5 ns/V 85 °C All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 7 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com ELECTRICAL CHARACTERISTICS Level Translator over recommended operating free-air temperature range (unless otherwise noted) PARAMETER A port (CLK-f output) VOH A port (DAT and CMD outputs) A port (CLK-f output) VOL A port (DAT and CMD outputs) TEST CONDITIONS VCCA VOH B port (DAT output) (1) 8 MIN TYP (1) MAX IOH = –100 μA 1.1 V to 3.6 V IOH = –0.5 mA 1.1 V 0.8 IOH = –1 mA 1.4 V 1.05 IOH = –2 mA 1.65 V IOH = –4 mA 2.3 V IOH = –8 mA 3V IOH = –20 μA 1.1 V to 3.6 V IOL = 100 μA 1.1 V to 3.6 V IOL = 0.5 mA 1.1 V IOL = 1 mA 1.4 V IOL = 2 mA 1.65 V IOL = 4 mA 2.3 V 0.55 IOL = 8 mA 3V 0.7 IOL = 135 μA 1.1 V 0.4 IOL = 180 μA 1.4 V IOL = 220 μA 1.65 V IOL = 300 μA 2.3 V 0.4 IOL = 400 μA 3V 0.55 IOH = –100 μA B port (CLK output) VCCB IOH = –4 mA 1.2 1.65 V to 3.6 V VCCA × 0.8 VCCA × 0.2 0.35 0.35 1.65 V to 3.6 V 0.45 V 0.4 1.65 V to 3.6 V 0.4 V VCCB × 0.8 1.65 V 1.2 2.3 V 1.75 IOH = –8 mA 3V 2.3 IOH = –20 μA 1.65 V to 3.6 V 1.1 V to 3.6 V V 1.75 2.3 1.65 V to 3.6 V IOH = –2 mA UNIT VCCA * 0.8 V VCCB × 0.8 All typical values are at TA = 25°C. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 ELECTRICAL CHARACTERISTICS Level Translator (continued) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA IOL = 100 μA B port IOL = 2 mA 1.1 V to 3.6 V IOL = 4 mA IOL = 135 μA B port (DAT output) MIN TYP (1) 1.65 V to 3.6 V IOL = 8 mA VOL VCCB IOL = 220 μA 1.1 V to 3.6 V IOL = 300 μA IOL = 300 μA MAX UNIT VCCB × 0.2 1.65 V 0.45 2.3 V 0.55 3V 0.7 1.65 V to 3.6 V 0.4 1.65 V 0.4 2.3 V 0.4 3V 0.55 V V 1.65 V to 3.6 V ±1 μA ICCA VI = VCCI IO = 0 1.1 V to 3.6 V 1.65 V to 3.6 V 7 μA ICCB VI = VCCI IO = 0 1.1 V to 3.6 V 1.65 V to 3.6 V 11 μA II Cio Ci Control inputs VI = VCCA or GND A port 5.5 6.5 B port 7 9.5 3.5 4.5 3 4 Control inputs Clock input VI = VCCA or GND pF pF TIMING REQUIREMENTS VCCA = 1.2 V ± 0.1 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Command Data rate Clock Data Command tW Pulse duration Clock Data Push-pull driving Open-drain driving Push-pull driving Push-pull driving Open-drain driving Push-pull driving VCCB = 3.3 V ± 0.3 V MAX MIN UNIT MAX 40 40 1 1 40 40 MHz 40 Mbps 40 Mbps 25 25 ns 1 1 μs 10 8.3 ns 25 25 ns TIMING REQUIREMENTS VCCA = 1.8 V ± 0.15 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Command Data rate Clock Data Command tW Pulse duration Clock Data Push-pull driving Open-drain driving Push-pull driving Push-pull driving Open-drain driving Push-pull driving VCCB = 3.3 V ± 0.3 V MAX MIN UNIT MAX 60 60 1 1 60 60 MHz 60 60 Mbps Mbps 17 17 ns 1 1 μs 8.3 8.3 ns 17 17 ns Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 9 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com TIMING REQUIREMENTS VCCA = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Command Data rate Clock Data Command tW Pulse duration Clock Data 10 Push-pull driving Open-drain driving Push-pull driving Push-pull driving Open-drain driving Push-pull driving VCCB = 3.3 V ± 0.3 V MAX MIN UNIT MAX 60 60 1 1 55 55 MHz 60 Mbps 60 Mbps 17 17 ns 1 1 μs 9 9 ns 17 17 ns Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 SWITCHING CHARACTERISTICS VCCA = 1.2 V ± 0.1 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VCCB = 1.8 V ± 0.15 V TO (OUTPUT) CMDA CMDB 5.7 4.4 CMDB CMDA 6.7 5.8 CLKA CLKB 6.2 4.5 DATxA DATxB 7.6 7.5 DATxB DATxA 6.3 4.6 CLKA CLK-f 12 7.9 EN B-port 1 1 EN A-port 1 1 EN B-port 412 363 EN A-port 423 422 MIN tpd ten tdis trA trB tfA tfB tSK(O) MAX MIN UNIT MAX CMDA rise time 3.5 8.4 3.4 8.1 CLK-f rise time 1 4.7 1 4.1 DATxA rise time 3.5 8.4 3.4 8.1 CMDB rise time 1.4 6.5 0.6 3.1 CLKB rise time 0.6 5.9 0.5 4.3 DATxB rise time 1.4 10.9 0.6 5 CMDA fall time 2.4 5.7 2 5.1 CLK-f fall time 0.8 2.5 0.8 3 DATxA fall time 2.4 5.7 1.9 5.1 CMDB fall time 1.2 5.4 0.6 3.6 CLKB fall time 0.6 6.3 0.5 4 DATxB fall time 0.6 6.3 0.5 3.6 Channel-to-channel skew ns μs ns ns ns ns ns 1 1 Push-pull driving 40 40 Open-drain driving 1 1 Clock 40 60 MHz Data 40 40 Mbps Command Max data rate VCCB = 3.3 V ± 0.3 V FROM (INPUT) ns Mbps Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 11 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com SWITCHING CHARACTERISTICS VCCA = 1.8 V ± 0.15 V over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VCCB = 1.8 V ± 0.15 V TO (OUTPUT) CMDA CMDB 4.9 3.3 CMDB CMDA 5.6 3.6 CLKA CLKB 5.4 3.4 DATxA DATxB 5 4.4 DATxB DATxA 5.4 3.5 CLKA CLK-f 10.2 5.7 EN B-port 1 1 EN A-port 1 1 EN B-port 411 411 EN A-port 413 361 MIN tpd ten tdis trA trB tfA tfB tSK(O) MIN MAX 2.1 4.5 2.1 4.1 CLK-f rise time 0.6 2.5 0.6 2.3 DATxA rise time 1.8 4.5 1.8 4.2 CMDB rise time 1.4 6.6 0.7 3.8 CLKB rise time 0.5 5.8 0.5 4.4 DATxB rise time 1.4 10.8 0.7 8 CMDA fall time 0.4 3.4 0.3 2.9 CLK-f fall time 0.3 2.8 0.3 2.8 DATxA fall time 0.4 3.4 0.3 2.9 CMDB fall time 1.1 6.3 0.6 3.7 CLKB fall time 0.6 8.7 0.5 4.1 DATxB fall time 1.2 7 0.2 4 Channel-to-channel skew Max data rate MAX UNIT CMDA rise time Command 12 VCCB = 3.3 V ± 0.3 V FROM (INPUT) ns μs ns ns ns ns ns 1 1 Push-pull driving 60 60 Open-drain driving 1 1 Clock 60 60 MHz Data 60 60 Mbps Submit Documentation Feedback ns Mbps Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 SWITCHING CHARACTERISTICS VCCA = 3.3 V ± 0.3 V over recommended operating free-air temperature range (unless otherwise noted) VCCB = 1.8 V ± 0.15 V VCCB = 3.3 V ± 0.3 V PARAMETER FROM (INPUT) TO (OUTPUT) tpd CMDA CMDB 5.3 3.2 CMDB CMDA 5.1 3 MIN MAX UNIT MIN MAX CLKA CLKB 4.8 3.1 DATxA DATxB 5.1 3.2 DATxB DATxA 9.6 5.1 CLKA CLK-f 6.8 4.2 EN B-port 1 1 EN A-port 1 1 EN B-port 410 364 EN A-port 396 398 ten tdis trA trB tfA tfB CMDA rise time 1.4 4.2 1.4 4.2 CLK-f rise time 0.5 1.5 0.5 1.4 DATxA rise time 1.4 3.4 1.3 3 CMDB rise time 1.4 6.4 0.9 4 4.4 CLKB rise time 0.6 5.9 0.5 DATxB rise time 1.4 14 0.9 14 CMDA fall time 0.8 2.3 0.8 2.3 CLK-f fall time 0.4 1.3 0.4 1.3 DATxA fall time 0.8 2.2 0.7 2 CMDB fall time 0.8 6.2 0.8 5 CLKB fall time 0.6 7.8 0.5 4.3 DATxB fall time 0.7 6.8 0.6 5 Channel-to-channel skew tSK(O) μs ns ns ns ns ns 1 1 60 60 1 1 Clock 55 55 MHz Data 60 60 Mbps Push-pull driving Command Max data rate ns Open-drain driving ns Mbps OPERATING CHARACTERISTICS TA = 25°C, VCCA = 1.2 V TEST CONDITIONS PARAMETER A-port input, B-port output CpdA (1) B-port input, A-port output A-port input, B-port output B-port input, A-port output (1) VCCB TYP 1.8 V 3.3 V CLK Enabled 15.1 15 DATA Enabled 9.26 9.19 12.4 11.9 0.1 0.1 DATA Disabled 1.3 1.3 DATA Disabled 0.1 0.1 DATA Enabled CLK Disabled CL = 0, f = 10 MHz, tr = tf = 1 ns UNIT pF Power dissipation capacitance per transceiver Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 13 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com OPERATING CHARACTERISTICS (continued) TA = 25°C, VCCA = 1.2 V TEST CONDITIONS PARAMETER A-port input, B-port output CpdB (1) B-port input, A-port output A-port input, B-port output B-port input, A-port output VCCB TYP 1.8 V 3.3 V 26.7 30.3 25.6 27 16.38 19.91 0.1 0.1 CLK Disabled 0.1 0.1 DATA Disabled 1.1 0.8 DATA Enabled CLK Enabled DATA Enabled DATA Disabled CL = 0, f = 10 MHz, tr = tf = 1 ns UNIT pF OPERATING CHARACTERISTICS TA = 25°C, VCCA = 1.8 V TEST CONDITIONS PARAMETER 1.8 V 3.3 V CLK Enabled 17.5 17.1 DATA Enabled 9.96 9.82 15.6 14 0.1 0.1 DATA Disabled 1.3 1.3 B-port input, A-port output DATA Disabled 0.1 0.1 A-port input, B-port output DATA Enabled 26 28.5 A-port input, B-port output CpdA (1) B-port input, A-port output A-port input, B-port output CpdB (1) B-port input, A-port output A-port input, B-port output B-port input, A-port output (1) VCCB TYP DATA Enabled CLK Disabled CL = 0, f = 10 MHz, tr = tf = 1 ns CLK Enabled 25.8 27 16.69 19.60 0.1 0.1 CLK Disabled 0.1 0.1 DATA Disabled 1.1 0.8 DATA Enabled DATA Disabled CL = 0, f = 10 MHz, tr = tf = 1 ns UNIT pF pF Power dissipation capacitance per transceiver OPERATING CHARACTERISTICS TA = 25°C, VCCA = 3.3 V TEST CONDITIONS PARAMETER A-port input, B-port output CpdA (1) B-port input, A-port output A-port input, B-port output B-port input, A-port output (1) 14 VCCB TYP 1.8 V 3.3 V CLK Enabled 17.5 17.1 DATA Enabled 12.50 13.29 15.6 14 0.1 0.1 DATA Disabled 1.3 1.3 DATA Disabled 0.1 0.1 DATA Enabled CLK Disabled CL = 0, f = 10 MHz, tr = tf = 1 ns UNIT pF Power dissipation capacitance per transceiver Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 OPERATING CHARACTERISTICS (continued) TA = 25°C, VCCA = 3.3 V TEST CONDITIONS PARAMETER A-port input, B-port output CpdB (1) B-port input, A-port output A-port input, B-port output B-port input, A-port output VCCB TYP 1.8 V 3.3 V 26 28.5 25.8 27 16.67 19.92 0.1 0.1 CLK Disabled 0.1 0.1 DATA Disabled 1.1 0.8 DATA Enabled CLK Enabled DATA Enabled DATA Disabled CL = 0, f = 10 MHz, tr = tf = 1 ns UNIT pF Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 15 TXS0206A SCES833A – NOVEMBER 2011 – REVISED MAY 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION VCCI VCCO VCCI VCCO DUT IN DUT IN OUT 15 pF OUT 1 MW 1 MW 15 pF DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING A PUSH-PULL DRIVER 2 × VCCO 50 kW From Output Under Test 15 pF S1 Open 50 kW LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT TEST S1 tPZL/tPLZ tPHZ/tPZH 2 × VCCO Open tw VCCI VCCI/2 Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VCCA Output Control (low-level enabling) VCCA/2 0V tPLZ tPZL VCCI Input VCCI/2 VCCI/2 0V tPLH Output tPHL VOH VCCO/2 VOL 0.9 y VCCO VCCO/2 0.1 y VCCO Output Waveform 1 S1 at 2 × VCCO (see Note B) Output Waveform 2 S1 at GND (see Note B) VCCA/2 VCCO VCCO/2 0.1 y VCCO VOL tPHZ tPZH VOH 0.9 y VCCO VCCO/2 0V tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. VCCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. J. All parameters and waveforms are not applicable to all devices. Figure 7. Load Circuit and Voltage Waveforms 16 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A TXS0206A www.ti.com SCES833A – NOVEMBER 2011 – REVISED MAY 2012 APPLICATION INFORMATION The TXS0206A has integrated pullup resistors on the data and command ports and their values dynamically change. When the port is in a low signal state, there is a nominal pullup resistor value of 40 kΩ, and power consumption is minimized. When the port is in a high signal state, the nominal pullup resistor value changes to 4 kΩ, and simultaneous switching performance is improved as a result. The threshold at which the resistance changes is approximately VCCx/2. When using the TXS0206A device with MMCs, SD, and Memory Stick™ to ensure that a valid receiver input voltage high (VIH) is achieved, the value of any pulldown resistors (external or internal to a memory card) must not be smaller than a 10-kΩ value. The impact of adding too heavy (i.e., <10-kΩ value) a pulldown resistor to the data and command lines of the TXS0206A device and the resulting 4-kΩ pullup / 10-kΩ pulldown voltage divider network has a direct impact on the VIH of the signal being sent into the memory card and its associated logic. The resulting VIH voltage for the 10-kΩ pulldown resistor value would be: VCC × 10 kΩ / (10 kΩ+ 4 kΩ) = 0.714 × VCC This is marginally above a valid input high voltage for a 1.8-V signal (i.e., 0.65 × VCC). The resulting VIH voltage for 20-kΩ pulldown resistor value would be: VCC × 20 kΩ / (20 kΩ + 4 kΩ) = 0.833 × VCC Which is above the valid input high voltage for a 1.8-V signal of 0.65 × VCC. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TXS0206A 17 D: Max = 1.988 mm, Min = 1.928 mm E: Max = 1.588 mm, Min = 1.527 mm PACKAGE OPTION ADDENDUM www.ti.com 31-May-2012 PACKAGING INFORMATION Orderable Device TXS0206AYFPR Status (1) ACTIVE Package Type Package Drawing DSBGA YFP Pins Package Qty 20 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish SNAGCU MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXS0206AYFPR Package Package Pins Type Drawing SPQ DSBGA 3000 YFP 20 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 1.66 B0 (mm) K0 (mm) P1 (mm) 2.06 0.56 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS0206AYFPR DSBGA YFP 20 3000 210.0 185.0 35.0 Pack Materials-Page 2 D: Max = 1.988 mm, Min =1.928 mm E: Max = 1.588 mm, Min =1.527 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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