TXS0104E www.ti.com............................................................................................................................................................... SCES651D – JUNE 2006 – REVISED MAY 2008 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS FEATURES 1 • No Direction-Control Signal Needed • Max Data Rates – 24 Mbps (Push Pull) – 2 Mbps (Open Drain) • Available in the Texas Instruments NanoFree™ Package • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (VCCA ≤ VCCB) • No Power-Supply Sequencing Required – VCCA or VCCB Can Be Ramped First • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – A Port – 2000-V Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) – B Port – 15-kV Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 2 • IEC 61000-4-2 ESD (B Port) – ±8-kV Contact Discharge – ±10-kV Air-Gap Discharge GXU/ZXU (BGA) PACKAGE (TOP VIEW) A B C 4 3 2 1 TERMINAL ASSIGNMENTS (GXU/ZXU Package) A B C 4 A4 GND B4 3 A3 OE B3 2 A2 VCCA B2 1 A1 VCCB B1 VCCB A1 2 13 B1 A2 3 12 B2 A3 4 11 B3 A4 5 10 B4 NC GND 6 9 7 8 NC OE NC − No internal connection A1 A2 A3 A4 NC VCCB 14 1 14 2 13 3 4 12 5 6 10 11 9 7 8 OE 1 GND VCCA VCCA RGY PACKAGE (TOP VIEW) D OR PW PACKAGE (TOP VIEW) B1 B2 B3 B4 NC NC − No internal connection 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2008, Texas Instruments Incorporated TXS0104E SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com TERMINAL ASSIGNMENTS (YZT Package) YZT (WCSP) PACKAGE (TOP VIEW) 3 2 1 D C B A 3 2 1 D A4 GND B4 C A3 OE B3 B A2 VCCA B2 A A1 VCCB B1 DESCRIPTION/ORDERING INFORMATION This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. VCCA must be less than or equal to VCCB. The B port is designed to track VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXS0104E is designed so that the OE input circuit is supplied by VCCA. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. ORDERING INFORMATION PACKAGE (1) (2) TA NanoFree — WCSP (DSBGA) 0.23-mm Large Bump – YZT (Pb-free) 0.625-mm max height) UFBGA – GXU UFBGA – ZXU (Pb-free) –40°C to 85°C QFN – RGY Reel of 3000 Reel of 2500 Reel of 1000 Tube of 50 SOIC – D Reel of 2500 TSSOP – PW (1) (2) (3) 2 Reel of 2000 ORDERABLE PART NUMBER TXS0104EYZTR TOP-SIDE MARKING (3) 2N7 TXS0104EGXUR TXS0104EZXUR TXS0104ERGYR TXS0104ERGYRG4 YF04E YF04E TXS0104ED TXS0104EDG4 TXS0104E TXS0104EDR TXS0104EDRG4 TXS0104EPWR TXS0104EPWRG4 YF04E For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E TXS0104E www.ti.com............................................................................................................................................................... SCES651D – JUNE 2006 – REVISED MAY 2008 PIN DESCRIPTION PIN NO. BALL NO. NAME FUNCTION D, PW, OR RGY GXU/ZXU YZT 1 B2 B2 VCCA 2 A1 A3 A1 Input/output A1. Referenced to VCCA. 3 A2 B3 A2 Input/output A2. Referenced to VCCA. 4 A3 C3 A3 Input/output A3. Referenced to VCCA. 5 A4 D3 A4 Input/output A4. Referenced to VCCA. No connection. Not internally connected. A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB. 6 – – NC 7 B4 D2 GND 8 B3 C2 OE 3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. Ground 9 – – NC No connection. Not internally connected. 10 C4 D1 B4 Input/output B4. Referenced to VCCB. 11 C3 C1 B3 Input/output B3. Referenced to VCCB. 12 C2 B1 B2 Input/output B2. Referenced to VCCB. 13 C1 A1 B1 Input/output B1. Referenced to VCCB. 14 B1 A2 VCCB B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCCA VCCB MIN MAX –0.5 4.6 –0.5 6.5 A port –0.5 4.6 B port –0.5 6.5 A port –0.5 4.6 B port –0.5 6.5 A port –0.5 VCCA + 0.5 B port –0.5 VCCB + 0.5 Supply voltage range UNIT V VI Input voltage range (2) VO Voltage range applied to any output in the high-impedance or power-off state (2) VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through each VCCA, VCCB, or GND D package (4) Package thermal impedance RGY package 47 (1) (2) (3) (4) (5) °C/W 128 YZT package Storage temperature range V 113 (5) GXU/ZXU package (4) Tstg V 86 PW package (4) θJA V TBD –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E 3 TXS0104E SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com Recommended Operating Conditions (1) (2) VCCA VCCA VCCB Supply voltage (3) A-port I/Os VIH VCCB High-level input voltage B-port I/Os OE input 1.65 V to 1.95 V 2.3 V to 3.6 V 2.3 V to 5.5 V 1.65 V to 3.6 V 2.3 V to 5.5 V 1.65 V to 3.6 V 2.3 V to 5.5 V A-port I/Os VIL Low-level input voltage B-port I/Os OE input MIN MAX 1.65 3.6 2.3 5.5 VCCI – 0.2 VCCI VCCI – 0.4 VCCI VCCI – 0.4 VCCI VCCA × 0.65 5.5 0 0.15 0 0.15 0 VCCA × 0.35 A-port I/Os, push-pull driving Δt/Δv Input transition rise or fall rate B-port I/Os, push-pull driving (1) (2) (3) 4 V V V 10 1.65 V to 3.6 V 2.3 V to 5.5 V ns/V 10 Control input TA UNIT 10 Operating free-air temperature –40 85 °C VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E TXS0104E www.ti.com............................................................................................................................................................... SCES651D – JUNE 2006 – REVISED MAY 2008 Electrical Characteristics (1) (2) (3) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA VCCB TA = 25°C MIN TA = 25°C to 85°C TYP MAX MIN MAX VOHA IOH = –20 µA, VIB ≥ VCCB – 0.4 V 1.65 V to 3.6 V 2.3 V to 5.5 V VOLA IOL = 1 mA, VIB ≤ 0.15 V 1.65 V to 3.6 V 2.3 V to 5.5 V VOHB IOH = –20 µA, VIA ≥ VCCA – 0.2 V 1.65 V to 3.6 V 2.3 V to 5.5 V VOLB IOL = 1 mA, VIA ≤ 0.15 V 1.65 V to 3.6 V 2.3 V to 5.5 V VI = VCCI or GND 1.65 V to 3.6 V 2.3 V to 5.5 V 1.65 V to 3.6 V 2.3 V to 5.5 V 1.65 V to VCCB 2.3 V to 5.5 V 2.4 3.6 V 0 2.2 0 5.5 V –1 1.65 V to VCCB 2.3 V to 5.5 V 12 3.6 V 0 –1 0 5.5 V 1 1.65 V to VCCB 2.3 V to 5.5 V 3.3 V 3.3 V II OE IOZ A or B port OE = VIL VI = VO = Open, IO = 0 ICCA ICCB VI = VO = Open, IO = 0 ICCA + ICCB VI = VO = Open, IO = 0 CI Cio (1) (2) (3) OE A port B port 3.3 V 3.3 V VCCA × 0.8 UNIT V 0.4 VCCB × 0.8 V V 0.4 V ±1 ±2 µA ±1 ±2 µA µA µA 14.4 µA 2.5 3.5 pF 5 6.5 12 16.5 pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E 5 TXS0104E SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com Timing Requirements over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN Data rate tw Pulse duration MAX Push-pull driving Open-drain driving Push-pull driving Open-drain driving Data inputs VCCB = 3.3 V ± 0.3 V MIN VCCB = 5 V ± 0.5 V MAX MIN UNIT MAX 24 24 24 2 2 2 41 41 41 500 500 500 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN Data rate tw Pulse duration MAX Push-pull driving Open-drain driving Push-pull driving Open-drain driving Data inputs VCCB = 3.3 V ± 0.3 V MIN VCCB = 5 V ± 0.5 V MAX MIN UNIT MAX 24 24 24 2 2 2 41 41 41 500 500 500 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) VCCB = 3.3 V ± 0.3 V MIN Data rate tw 6 Pulse duration Push-pull driving Open-drain driving Push-pull driving Open-drain driving Data inputs Submit Documentation Feedback VCCB = 5 V ± 0.5 V MAX MIN UNIT MAX 24 24 2 2 41 41 500 500 Mbps ns Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E TXS0104E www.ti.com............................................................................................................................................................... SCES651D – JUNE 2006 – REVISED MAY 2008 Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 2.5 V ± 0.2 V MIN Push-pull driving tPHL A B tPLH Open-drain driving Open-drain driving 8.8 45 260 5.3 9.6 36 208 5.8 3 4.4 10 7 27 4.5 1.1 UNIT MIN MAX 6.8 4.4 1.9 MAX VCCB = 5 V ± 0.5 V 4.7 2.9 6.8 Push-pull driving tPHL MIN 4.6 2.9 Push-pull driving Open-drain driving MAX VCCB = 3.3 V ± 0.3 V ns 198 4.7 1.2 4 B A ten OE A or B 200 200 200 ns tdis OE A or B 50 40 35 ns tPLH Push-pull driving Open-drain driving trA A-port rise time trB B-port rise time tfA A-port fall time Channel-to-channel skew Max data rate 36 140 27 9.5 2.3 9.3 2 7.6 38 165 30 132 22 95 4 10.8 2.7 9.1 2.7 7.6 34 145 23 106 10 58 2 5.9 1.9 6 1.7 13.3 Open-drain driving 4.4 6.9 4.3 6.4 4.2 6.1 Push-pull driving 2.9 7.6 2.8 7.5 2.8 8.8 Open-drain driving 6.9 13.8 7.5 16.2 7 16.2 Push-pull driving Open-drain driving 1 1 1 24 24 24 2 2 2 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E ns 102 3.2 Push-pull driving tSK(O) 175 0.5 Open-drain driving Open-drain driving B-port fall time 45 4.5 Push-pull driving Push-pull driving tfB 5.3 ns ns ns ns Mbps 7 TXS0104E SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com Switching Characteristics over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) VCCB = 2.5 V ± 0.2 V MIN Push-pull driving tPHL A B tPLH Open-drain driving MIN 6.3 43 250 4.7 6 36 206 3.4 2.1 4.2 5.8 4.4 27 3.6 2.6 UNIT MIN MAX 4.1 3 1.8 MAX VCCB = 5 V ± 0.5 V 3.3 2 3.5 Push-pull driving Open-drain driving MAX VCCB = 3.3 V ± 0.3 V 3.2 1.7 Push-pull driving Open-drain driving tPHL ns 190 4.3 1.2 4 B A ten OE A or B 200 200 200 ns tdis OE A or B 50 40 35 ns tPLH Push-pull driving Open-drain driving trA A-port rise time trB B-port rise time tfA A-port fall time tfB B-port fall time tSK(O) Channel-to-channel skew Max data rate 8 TEST CONDITIONS 2.5 44 170 1.6 37 140 0.7 27 103 Push-pull driving 2.8 7.4 2.6 6.6 1.8 5.6 Open-drain driving 34 149 28 121 24 89 Push-pull driving 3.2 8.3 2.9 7.2 2.4 6.1 Open-drain driving 35 151 24 112 12 64 Push-pull driving 1.9 5.7 1.9 5.5 1.8 5.3 Open-drain driving 4.4 6.9 4.3 6.2 4.2 5.8 Push-pull driving 2.2 7.8 2.4 6.7 2.6 6.6 Open-drain driving 5.1 8.8 5.4 9.4 5.4 10.4 Push-pull driving 24 24 24 2 2 2 1 Open-drain driving Submit Documentation Feedback 1 ns 1 ns ns ns ns ns Mbps Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E TXS0104E www.ti.com............................................................................................................................................................... SCES651D – JUNE 2006 – REVISED MAY 2008 Switching Characteristics over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS VCCB = 3.3 V ± 0.3 V MIN Push-pull driving tPHL A B tPLH Open-drain driving Open-drain driving 3.1 1.4 4.2 36 Push-pull driving tPHL 4.2 204 124 4.6 4.4 28 2.5 1 UNIT MIN MAX 2.4 1.3 Push-pull driving Open-drain driving MAX VCCB = 5 V ± 0.5 V ns 165 3.3 1 97 B A ten OE A or B 200 200 ns tdis OE A or B 40 35 ns tPLH Push-pull driving Open-drain driving trA A-port rise time trB B-port rise time tfA A-port fall time tfB B-port fall time tSK(O) Channel-to-channel skew 3 139 2.6 3 2.3 5.6 1.9 4.8 Open-drain driving 25 116 19 85 Push-pull driving 2.5 6.4 2.1 7.4 Open-drain driving 26 116 14 72 Push-pull driving 2 5.4 1.9 5 Open-drain driving 4.3 6.1 4.2 5.7 Push-pull driving 2.3 7.4 2.4 7.6 5 7.6 4.8 8.3 Open-drain driving 1 Open-drain driving 1 24 24 2 2 ns 105 Push-pull driving Push-pull driving Max data rate 2.5 ns ns ns ns ns Mbps PRINCIPLES OF OPERATION Applications The TXS0104E can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. The TXS0104E is ideal for use in applications where an open-drain driver is connected to the data I/Os. The TXS0104E can also be used in applications where a push-pull driver is connected to the data I/Os, but the TXB0104 might be a better option for such push-pull applications. Architecture The TXS0104E architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E 9 TXS0104E SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com VCCA T1 VCCB One-shot One-shot 10 kΩ T2 10 kΩ Gate Bias B A Figure 1. Architecture of a TXS01xx Cell Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition. Input Driver Requirements The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of the TXS0104E. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver. The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the external driver is less than 50 Ω. Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. Enable and Disable The TXS0104E has an OE input that is used to disable the device by setting OE low, which places all I/Os in the Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistors on I/O Lines Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O to VCCA or VCCB (in parallel with the internal 10-kΩ resistors). 10 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E TXS0104E www.ti.com............................................................................................................................................................... SCES651D – JUNE 2006 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION VCCI VCCO VCCI VCCO DUT IN DUT IN OUT OUT 1 MW 15 pF 1 MW 15 pF DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING AN OPEN-DRAIN DRIVER DATA RATE, PULSE DURATION, PROPAGATION DELAY, OUTPUT RISE AND FALL TIME MEASUREMENT USING A PUSH-PULL DRIVER 2 × VCCO 50 kW From Output Under Test 15 pF S1 Open 50 kW LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT TEST S1 tPZL/tPLZ tPHZ/tPZH 2 × VCCO Open tw VCCI VCCI/2 Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VCCA Output Control (low-level enabling) VCCA/2 0V tPLZ tPZL VCCI Input VCCI/2 VCCI/2 0V tPLH Output tPHL VCCO/2 VOH VCCO/2 VOL 0.9 y VCCO 0.1 y VCCO Output Waveform 1 S1 at 2 × VCCO (see Note B) Output Waveform 2 S1 at GND (see Note B) VCCA/2 VCCO VCCO/2 0.1 y VCCO VOL tPHZ tPZH VOH 0.9 y VCCO VCCO/2 0V tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. VCCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. J. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E 11 PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TXS0104ED ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TXS0104EDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office TXS0104EDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TXS0104EDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TXS0104EGXUR ACTIVE BGA MICROSTAR JUNIOR GXU 12 2500 TBD TXS0104EPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TXS0104EPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TXS0104ERGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TXS0104ERGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TXS0104EYZTR ACTIVE DSBGA YZT 12 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Request Free Samples TXS0104EZXUR ACTIVE BGA MICROSTAR JUNIOR ZXU 12 2500 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Request Free Samples SNPB Level-1-240C-UNLIM Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2010 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Aug-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXS0104EDR Package Package Pins Type Drawing SOIC TXS0104EGXUR BGA MI CROSTA R JUNI OR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 GXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2 TXS0104EPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TXS0104ERGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 TXS0104EYZTR DSBGA YZT 12 3000 180.0 8.4 1.49 1.99 0.75 4.0 8.0 Q2 TXS0104EZXUR BGA MI CROSTA R JUNI OR ZXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Aug-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS0104EDR SOIC D 14 2500 346.0 346.0 33.0 TXS0104EGXUR BGA MICROSTAR JUNIOR GXU 12 2500 340.5 338.1 20.6 TXS0104EPWR TSSOP PW 14 2000 346.0 346.0 29.0 TXS0104ERGYR VQFN RGY 14 3000 346.0 346.0 29.0 TXS0104EYZTR DSBGA YZT 12 3000 190.5 212.7 31.8 TXS0104EZXUR BGA MICROSTAR JUNIOR ZXU 12 2500 340.5 338.1 20.6 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. 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