SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 D D D D D D Member of the Texas Instruments Widebus Family Low-Power Advanced CMOS Technology Load and Unload Clocks Can Be Asynchronous or Coincident 1024 Words × 18 Bits Programmable Almost-Full/Almost-Empty Flag Empty, Full, and Half-Full Flags D D D D D D Fast Access Times of 30 ns With a 50-pF Load Fall-Through Time Is 20 ns Typical Data Rates up to 40 MHz High-Output Drive for Direct Bus Interface 3-State Outputs Package Options Include 68-Pin (FN) and 80-Pin Thin Quad Flat (PN) Packages D15 D16 D17 GND UNCK NC NC OE RESET VCC GND EMPTY VCC Q17 Q16 GND Q15 FN PACKAGE (TOP VIEW) 9 10 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 60 11 59 12 58 13 57 14 56 15 55 16 54 17 53 18 52 19 51 20 50 21 49 22 48 23 47 24 46 25 45 VCC Q14 Q13 GND Q12 Q11 VCC Q10 Q9 GND Q8 Q7 VCC Q6 Q5 GND Q4 Q0 Q1 GND Q2 Q3 VCC AF/AE GND FULL HF VCC 26 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 DAF GND LDCK NC NC VCC D14 D13 D12 D11 D10 D9 VCC D8 GND D7 D6 D5 D4 D3 D2 D1 D0 NC – No internal connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments Incorporated. Copyright 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 GND GND Q4 Q15 VCC Q14 Q13 GND GND Q12 Q11 VCC Q10 Q9 GND Q8 Q7 VCC Q6 Q5 PN PACKAGE (TOP VIEW) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 2 59 3 58 4 57 5 56 6 55 7 54 8 53 9 52 10 51 11 50 12 49 13 48 14 47 15 46 16 45 17 44 18 43 19 42 20 41 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 VCC VCC NC Q3 Q2 GND Q1 Q0 VCC HF FULL GND GND AF/AE VCC NC NC LDCK GND NC D8 GND D7 D6 D5 D4 D3 D2 D1 D0 DAF NC 1 NC D14 D13 D12 D11 D10 D9 V CC NC GND GND Q16 Q17 VCC EMPTY GND VCC RESET OE NC NC UNCK GND D17 D16 D15 NC NC NC – No internal connection description A FIFO memory is a storage device that allows data to be written into and read from its array at independent data rates. The SN74ACT7802 is a 1024-word by 18-bit FIFO for high-speed applications. It processes data in a bit-parallel format at rates up to 40 MHz and access times of 30 ns. Data is written into the FIFO memory on a low-to-high transition on the load-clock (LDCK) input and is read out on a low-to-high transition on the unload-clock (UNCK) input. The memory is full when the number of words clocked in exceeds by 1024 the number of words clocked out. When the memory is full, LDCK has no effect on the data in the memory; when the memory is empty, UNCK has no effect. A low level on the reset (RESET) input resets the FIFO internal clock stack pointers and sets full (FULL) high, almost full/almost empty (AF/AE) high, half full (HF) low, and empty (EMPTY) low. The Q outputs are not reset to any specific logic level. The FIFO must be reset upon power up. The Q outputs are noninverting and are in the high-impedance state when the output-enable (OE) input is low. When writing to the FIFO after a reset pulse or when the FIFO is empty, the first active transition on LDCK drives EMPTY high and causes the first word written to the FIFO to appear on the Q outputs. An active transition on UNCK is not required to read the first word written to the FIFO. Each subsequent read from the FIFO requires an active transition on UNCK. The SN74ACT7802 can be cascaded in the word-width direction but not in the word-depth direction. The SN74ACT7802 is characterized for operation from 0°C to 70°C. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 logic symbol† Φ FIFO 1024 × 18 SN74ACT7802 RESET LDCK UNCK OE DAF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 1 RESET 29 5 2 LDCK FULL UNCK HALF FULL 26 ALMOST FULL/EMPTY EN1 27 DEF ALMOST FULL EMPTY 0 0 35 36 33 66 38 25 39 24 41 23 42 22 44 21 46 20 47 19 49 17 50 Data 15 Data 1 52 14 53 13 55 12 56 11 58 10 59 9 61 8 63 7 64 17 17 FULL HF AF/AE EMPTY Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q11 Q12 Q13 Q14 Q15 Q16 Q17 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for the FN package. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 functional block diagram OE D0–D17 LDCK Write Control UNCK Read Control Location 1 Read Pointer Location 2 1024 × 18 RAM Write Pointer Location 1023 Location 1024 Q0–Q17 Reset Logic RESET StatusFlag Logic EMPTY FULL HF DAF AF/AE Terminal Functions TERMINAL I/O DESCRIPTION 33 O Almost-full/almost-empty flag. Depth-offset values can be programmed for AF/AE, or the default value of 256 can be used for the almost-empty almost-full offset (X). AF/AE is high when memory contains X or fewer words or (1024 – X) or more words. AF/AE is high after reset. 27 I Define almost-full flag. The high-to-low transition of DAF stores the binary value of data inputs as the AF/AE offset value (X). With DAF held low, a low pulse on RESET defines AF/AE using X. D0–D17 7–15, 17, 19–26 I 18-bit data input port EMPTY 66 O Empty flag. EMPTY is low when the FIFO is empty. A FIFO reset also causes EMPTY to go low. FULL 35 O Full flag. FULL is low when the FIFO is full. A FIFO reset causes FULL to go high. HF 36 O Half-full flag. HF is high when the FIFO memory contains 512 or more words. HF is low after reset. LDCK 29 I Load clock. Data is written to the FIFO on the rising edge of LDCK when FULL is high. NAME NO.† AF/AE DAF OE 2 I Output enable. When OE is low, the data outputs are in the high-impedance state. Q0–Q17 38–39, 41–42, 44, 46–47, 49–50, 52–53, 55–56, 58–59, 61, 63–64 O 18-bit data-output port RESET 1 I Reset. A low level on RESET resets the FIFO and drives AF/AE and FULL high and HF and EMPTY low. UNCK 5 I Unload clock. Data is read from the FIFO on the rising edge of UNCK when EMPTY is high. † Terminal numbers listed are for the FN package. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 offset value values for AF/AE The FIFO memory status is monitored by the FULL, EMPTY, HF, and AF/AE flags. The FULL output is low when the memory is full; the EMPTY output is low when the memory is empty. The HF output is high when the memory contains 512 or more words and low when it contains fewer than 512 words. The level of the AF/AE flag is determined by both the number of words in the FIFO and a user-definable offset X. AF/AE is high when the FIFO is almost full or almost empty, i.e., when it contains X or fewer words or (1024 – X) or more words. The AF/AE offset value is either user-defined or the default value of 256; it is programmed during each reset cycle as follows: user-defined X: Take DAF from high to low. If RESET is not already low, take RESET low. With DAF held low, take RESET high. This defines the AF/AE flag using X. default X: To redefine the AF/AE flag using the default value of X = 256, hold DAF high during the reset cycle. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ Don’t Care ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ LDCK D0–D17 X W1 W2 WX+1 W512 W1024–X Don’t Care W1024 OE • DALLAS, TEXAS 75265 Q0–Q17 W1 W2 WX+1 WX+2 W513 W514 W1024–X W1025–X W1023 W1024 ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ POST OFFICE BOX 655303 UNCK EMPTY AF/AE HF FULL Define the AF/AE Offset Value (X) Using the Data on D0 – D8 Define the AF/AE Offset Value (X) Using the Default Value of 256 Figure 1. Write, Read, and Flag Timing Reference SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY DAF SCAS187D – AUGUST 1990 – REVISED APRIL 1998 6 RESET SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to a disabled 3-state output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Package thermal impedance, θJA (see Note 1): FN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W PN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions ’ACT7802-25 ’ACT7802-40 ’ACT7802-60 MIN MAX MIN MAX MIN MAX 4.5 5.5 4.5 5.5 4.5 5.5 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 0.8 V High-level output current –8 –8 –8 mA IOL TA Low-level output current 16 16 16 mA 70 °C High-level input voltage 2 Operating free-air temperature 0 2 70 0 2 70 0 V V electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VOL VCC = 4.5 V, VCC = 4.5 V, IOH = –8 mA IOL = 16 mA II IOZ VCC = 5.5 V, VCC = 5.5 V, VI = VCC or 0 VO = VCC or 0 ICC§ ∆ICC§ VI = VCC – 0.2 V or 0 VCC = 5.5 V, Ci VI = 0, VO = 0, Co One input at 3.4 V, MIN TYP‡ MAX 2.4 UNIT V Other inputs at VCC or GND 0.5 V ±5 µA ±5 µA 400 µA 1 mA f = 1 MHz 4 pF f = 1 MHz 8 pF ‡ All typical values are at VCC = 5 V, TA = 25°C. § ICC tested with outputs open POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 timing requirements over recommended operating conditions (see Figures 1 and 2) ’ACT7802-25 MIN fclock tw Clock frequency Pulse duration tsu th Setup time Hold time MAX ’ACT7802-40 MIN 40 MAX ’ACT7802-60 MIN 25 MAX 16.7 LDCK high or low 10 14 20 UNCK high or low 10 14 20 DAF high 10 10 10 RESET low 20 25 25 D0–D7 before LDCK↑ 4 5 5 RESET inactive (high) before LDCK↑ 5 5 5 Define AF/AE: D0–D8 before DAF↓ 5 5 5 Define AF/AE: DAF↓ before RESET↑ 7 7 7 Define AF/AE (default): DAF high before RESET↑ 5 5 5 D0–D7 after LDCK↑ 1 2 2 Define AF/AE: D0–D8 after DAF↓ 0 0 0 Define AF/AE: DAF low after RESET↑ 0 0 0 Define AF/AE (default): DAF high after RESET↑ 0 0 0 UNIT MHz ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (see Figures 1 and 2) FROM (INPUT) fmax LDCK or UNCK 40 LDCK↑ 8 tpd d tpd‡ tPLH TO (OUTPUT) ’ACT7802-25 MIN TYP† MAX PARAMETER Any Q UNCK↑ UNCK↑ Any Q LDCK↑ EMPTY UNCK↑ tPHL EMPTY RESET↓ LDCK↑ tPLH tpd d FULL UNCK↑ FULL RESET↓ LDCK↑ AF/AE UNCK↑ ’ACT7802-40 MIN MAX 25 20 12 ’ACT7802-60 MIN MAX 16.7 UNIT MHz 30 8 35 8 45 30 12 35 12 45 21 ns ns 4 18 4 20 4 22 2 18 2 20 2 22 2 18 2 20 2 22 4 18 4 20 4 22 4 17 4 19 4 21 2 17 2 19 2 21 2 20 2 22 2 24 2 20 2 22 2 24 ns ns ns ns RESET↓ AF/AE 2 17 2 19 2 21 LDCK↑ HF 2 18 2 20 2 22 2 18 2 20 2 22 2 17 2 19 2 21 Any Q 2 12 2 14 2 16 ns OE Any Q † All typical values are at VCC = 5 V, TA = 25°C. ‡ This parameter is measured with CL = 30 pF (see Figure 3). 2 14 2 16 2 18 ns tPLH tPHL ten tdis UNCK↑ HF RESET↓ OE ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 8 TEST CONDITIONS Power dissipation capacitance per channel POST OFFICE BOX 655303 CL = 50 pF, • DALLAS, TEXAS 75265 f = 5 MHz TYP 65 UNIT pF SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 PARAMETER MEASUREMENT INFORMATIONFigure 1 7V PARAMETER S1 ten 500 Ω From Output Under Test Test Point CL = 50 pF (see Note A) tdis tpd 500 Ω S1 tPZH tPZL tPHZ tPLZ tPLH tPHL Open Closed Open Closed Open Open tw LOAD CIRCUIT 3V Input 0V 1.5 V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 3V Data Input 1.5 V 1.5 V 0V 3V Output Control tPZL 3V 1.5 V 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 1.5 V 0V tPLH 1.5 V 1.5 V tPZH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ ≈ 3.5 V Output Waveform 1 S1 at 7 V tPHL VOH Output 1.5 V 3V Timing Input Input 1.5 V Output Waveform 2 S1 at Open VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH – 0.3 V ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTE A: CL includes probe and jig capacitance. Figure 2. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 TYPICAL CHARACTERISTICS POWER DISSIPATION CAPACITANCE vs SUPPLY VOLTAGE PROPAGATION DELAY TIME vs LOAD CAPACITANCE typ + 3 VCC = 5 V RL = 500 Ω TA = 25°C typ + 6 Cpd – Power Dissipation Capacitance – pF t pd – Propagation Delay Time – ns typ + 8 typ + 4 typ + 2 typ typ – 2 0 50 100 150 200 250 300 typ + 2 f = 5 MHz TA = 25°C CL = 50 pF typ + 1 typ typ – 1 typ – 2 typ – 3 4.5 4.6 Figure 3 Figure 4 POST OFFICE BOX 655303 5 5.1 5.2 5.3 5.4 5.5 VCC – Supply Voltage – V CL – Load Capacitance – pF 10 4.7 4.8 4.9 • DALLAS, TEXAS 75265 SN74ACT7802 1024 × 18 STROBED FIRST-IN, FIRST-OUT MEMORY SCAS187D – AUGUST 1990 – REVISED APRIL 1998 APPLICATION INFORMATION SN74ACT7802 LDCK LDCK UNCK FULL EMPTY EMPTY FULL OE D18–D35 UNCK D0–D17 Q0–Q17 OE Q18–Q35 SN74ACT7802 LDCK UNCK EMPTY FULL OE D0–D17 D0–D17 Q0–Q17 Q0–Q17 Figure 5. Word-Width Expansion: 1024 × 36 Bit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 1M7802-60PNG4 ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT7802-25FN ACTIVE PLCC FN 68 18 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT7802-25PN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT7802-40FN ACTIVE PLCC FN 68 18 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT7802-40PN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT7802-60FN ACTIVE PLCC FN 68 18 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74ACT7802-60PN ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPLC004A – OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996 PN (S-PQFP-G80) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 0,08 M 41 60 61 40 80 21 0,13 NOM 1 20 Gage Plane 9,50 TYP 12,20 SQ 11,80 14,20 SQ 13,80 0,25 0,05 MIN 0°– 7° 0,75 0,45 1,45 1,35 Seating Plane 0,08 1,60 MAX 4040135 / B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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