GP2W0106YP IrDA Data Sheet 115 kbps Transceiver FEATURES • Built-in Photodiode • Operating voltage 2.0 V to 3.6 V • Conforms to eye safety IEC60825-1, without external resistor • This product shall not contain the following materials, and these materials shall not be used in the production process for this product. – CFCS – Halon – Carbon Tetrachloride – 1.1.1. Trichloroethane (Methylchloroform) – Specific brominated flame retardants such as the PBBOS and PBBS are not used in this device. INTRODUCTION This specification applies to the outline and characteristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2 kbps, low power option compliant) optical data communication transceiver. NOTES • Caution should be taken to prevent the detector surface from being smeared with dust or dirt, or from being touched, as it may cause faulty operation. • Cleaning conditions: – Solvent cleaning: Solvent temperature 45°C or less. Immersion for 3 minutes or less. – Ultrasonic cleaning: The effect of ultrasonic cleaning on the device differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition, etc. Test the device under actual conditions and confirm that ultrasonic cleaning does not cause any immediate or potential defects. – Cleaning solvent: The cleaning shall be carried out with ethyl alcohol, methyl alcohol, or isopropyl alcohol. • In order to prevent electrostatic damage to the integrated circuit, handle this device in a static-free environment and workstation. IrDA Data Sheet • External force applied to the device after mounting can cause mounting defects such as the terminal coming off. Be careful when handling the device and prevent objects from touching the device after mounting. • Refer to the ‘Precautions for Soldering’ section. • When the system (program) is designed, the turn around time from transmit to receive should be designed by considering 200 µs or more that is specified by IrDA. This turn around time means the time that this device does not temporarily detect the incoming signal, since the transmitted light from the transmitter side reaches the detector side of the same transceiver. • Consider that 200 µs or more (at TA = 25°C, no input signal) is necessary to return from shut-down mode to ready-operation mode. In addition, thoroughly confirm the operation in the actual application. • When there is considerable external stray light or a light source is located near the transceiver, or the detector face receives considerable external stray light, a pulse other than desired signal output may be generated as noise on output terminal of the transceiver. Consider the layout and structure in your design to minimize disturbing light on the detector face. • When the sensor is adopted in an IR communication system, it should be used according to the signal method which is specified by ‘Serial Infrared Physical Layer Link Specification’ published by the Infrared Data Association. Faulty operation may occur, if a signal method other than that specified is used. • RXD pinout is a pullup (260 kΩ TYP.) to VDD in shutdown mode. See Table 1 and Figure 2. • In circuit designs, make allowance for the degradation of the light emitting diode output that results from long-term continuous operation (50% degradation/5 years). The light emitting diode output may be degraded quickly when operated at TA = -40°C, therefore it is recommended to operate over TA = -20°C. 1 GP2W0106YP 115 kbps Transceiver Table 1. I/O Truth Table 1 NC 2 NC 3 4 VDD GND 5 6 7 8 SD RXD TXD LEDA SD TXD LED RECEIVER TR1 TR2 RXD Low High On Don’t Care — — Not Valid Low Low Low Low Off IrDA Signal Off On Low Off No Signal On Off High High Don’t Care Off Don’t Care Off Off High Pullup + CX VDD GND SD RXD TXD 260 kΩ TYP. TR1 COMPONENT RECOMMENDED VALUE RXD TR2 3.3 µF/6.3 V (NOTE 1) CX NOTES: 1. Choose the most suitable CX according to the noise level and noise frequency of power supply. 2. Pin 1 and Pin 2 are not connected internally. GP2W0106YP-2 Figure 2. RXD Equivalent Circuit GP2W0106YP-1 Figure 1. Recommended External Circuit + LEDA 1 2 ENCODER CIRCUIT TXD CX VDD CONSTANT CURRENT CIRCUIT 3 GP2W0106YP UART 5 DECODER CIRCUIT 4 3 RXD SD GND SD INPUT PERFORMANCE LOW Normal Mode HIGH Shutdown Mode NOTES: 1 Transmitting data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 4 GP2W0106YP receiver output waveform 5 Receiving data waveform GP2W0106YP-3 Figure 3. Example of Circuit 2 IrDA Data Sheet 115 kbps Transceiver 1 GP2W0106YP T T 0 1 Recommended Size of Solder Cream Paste 0 Open the solder mask as shown in Figure 5. The size of solder cream paste for this device before reflow soldering must be as large as one of the foot pattern land, indicated in Figure 6. 1 3T/16 2 1.55 0.1 2.0 1.1 3 0 5 1 0 1.55 4 1 0.6 NOTES: 1 Transmitting data waveform 0.475 1.425 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform 2.375 4 GP2W0106YP receiver output waveform 5 Receiving data waveform T= 3.325 NOTES: 1. Dimensions are in mm. 2. Dimensions are for reference. 1 Data Rate Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps, 57.6 kbps, 115.2 kbps 3. Soldering paste area GP2W0106YP-6 GP2W0106YP-4 Figure 5. Solder Cream Paste Size Figure 4. Example of Signal Waveform 1.0 PIN 1.55 SYMBOL 1 NC NC 2 NC NC 3 VDD VDD 4 Ground GND 5 Shutdown SD 6 Receiver Data Output RXD 7 Transmitter Data Input TXD 8 LED Anode LEDA 1.55 0.1 2.0 1.1 CENTER OF MOUNTING AREA PIN NAME 8 0.6 7 6 5 4 3 2 1 0.475 1.425 2.375 3.325 NOTES: 1. Dimensions are in mm. 2. Dimensions are shown for reference. 3. Connect foot pattern of shield case to GND pattern. GP2W0106YP-5 Figure 6. Foot Pattern of PCB IrDA Data Sheet 3 GP2W0106YP 115 kbps Transceiver COMPONENT SIDE SHIELD GND VDD GND SD RXD TXD LEDA CX CIRCUIT SIDE 2W0106-7 Figure 7. PCB Layout Example 4 IrDA Data Sheet 115 kbps Transceiver GP2W0106YP 0.9 2.75 ±0.3 0.48 1.15 2.7 ±0.3 3.9 1.88 1.15 2.5 7.9 ±0.3 5.2 CENTER EMBOSSED OF DETECTOR 'S' 1.05 ±0.3 φ2.2 2.15 ±0.3 φ2.2 1.5 ±0.3 2 ±0.3 CENTER OF EMITTER 0.8 +0.3 -0.2 0.35 1 2 8 - 0.4 3 4 5 6 8 7 +0.2 -0.3 PO .95 x 7 = 6.65 PIN PIN NAME SYMBOL 1 NC NC 2 NC NC 3 VDD VDD 4 Ground GND 5 Shutdown SD 6 Receiver Data Output RXD 7 Transmitter Data Input TXD 8 LED Anode LEDA BOTTOM VIEW 0.6 ±0.3 8 - 0.6 PO .95 x 7 = 6.65 NOTES: 1. Dimensions are in mm. 2. Unspecified tolerances are ±0.2 3. Adhesion of resin to the terminal area are allowed MAX. 0.2 mm. area: Au plating GP2W0106YP-8 Figure 8. GP2W0106YP Outline Dimensions IrDA Data Sheet 5 GP2W0106YP 115 kbps Transceiver RATINGS AND CHARACTERISTICS Absolute Maximum Ratings PARAMETER SYMBOL RATINGS UNIT VDD 0 to 6.0 V VLEDA 0 to VDD +1.0 V IFM 60 mA 1 2 Supply voltage LED supply voltage Peak forward current Operating temperature TOPR -20 to +85 °C Storage temperature TSTG -40 to +85 °C Soldering temperature TSOL 230 °C NOTES 3 NOTES: 1. Pulse width: 78.1 µs. Duty ratio: 3/16. 2. Recommended condition: -20°C to +85°C. 3. Soldering reflow time: 5 seconds. Recommended Operating Conditions PARAMETER SYMBOL OPERATING CONDITION UNIT VDD 2.0 to 3.6 V LED supply voltage VLEDA 2.0 to VDD +1.0 V Operating temperature TOPR -20 to +85 °C BR 2.4 to 115.2 kbps SD terminal high level input voltage VIHSD VDD × 0.95 to VDD V 1 SD terminal low level input voltage VILSD 0.0 to VDD × 0.1 V 2 TXD high level input voltage VIHTXD VDD × 0.8 to VDD V 3 TXD low level input voltage VILTXD 0.0 to VDD × 0.2 V 4 Supply voltage Data rate NOTES NOTES: 1. Shut down mode 2. Normal mode 3. LED ON. See Figure 14. 4. LED OFF. See Figure 14. 6 IrDA Data Sheet 115 kbps Transceiver GP2W0106YP Electrical Characteristics TOPR = -40°C to +85°C, VDD = 2.0 V to 3.6 V unless otherwise specified PARAMETER SYMBOL Current consumption at no input signal MIN. IDD TYP. MAX. UNIT NOTES 100 170 µA 1 0.01 0.2 µA 2 V 3 Current consumption at shut-down mode IDD-S High level output voltage VOH Low level output voltage VOL 0.5 V 4 tr 0.4 µs 5 Rise time Fall time tf Low level pulse width tw Reception distance L Input irradiance VDD 1.0 Ee Receiver latency Receiver wakeup time 0.4 µs 5 3.0 µs 5 20 cm 5 9.0 µW/cm2 5 tl 30 500 µs tsdw 60 500 µs 6 25 mW/sr 7 26 mA 7 Radiant intensity IE 3.6 LED peak current ILED 16 20 Rise time tr 0.6 µs 8 Fall time tf 0.6 µs 8 Peak emission wavelength λp 870 nm NOTES: 1. No input signal, VILSD = 0 V. Output terminal open. 2. No input signal, VIHSD = VDD. Output terminal open. VDD = 3.3 V. 3. IOH = 20 µA. See Figures 9, 10, and 11. 4. BR = 115.2 kbps, φ ≤ 15°, See Figures 9, 10, and 11. 5. BR = 115.2 kbps, φ ≤ 15°, TOPR = 25°C. See Figures 9, 10, and 11. 6. No input signal. 7. BR = 115.2 kbps, φ ≤ 15°, TOPR = 25°C. VDD = VLEDA = 3.3 V. VIHTXD = 2.8 V. See Figures 12, 13, and 14. 8. BR = 115.2 kbps. See Figures 12, 13, and 14. T1 T1 tF tR T2 VOH 90% RADIATION INTENSITY OF TRANSMITTER 3.6 mW/sr NOTE: At BR = 2.4 kbps: T1 = 416.7 µs, T2 = 78.1 µs At BR = 115.2 kbps: T1 = 8.68 µs, T2 = 1.63 µs GP2W0106YP-9 Figure 9. Input Signal Waveform (Detector Side) IrDA Data Sheet 50% 10% VOL tW GP2W0106YP-10 Figure 10. Output Waveform (Detector Side) 7 GP2W0106YP 115 kbps Transceiver φ φ GP2W0106YP TRANSMITTER (NOTE) OSCILLOSCOPE L NOTE: 1. Transmitter uses GP2W0106YP (λp = 870 nm TYP.) which is adjusted to a radiation intensity of 3.6 mW/sr. 2. φ Indicates horizontal and vertical directions. 3. Ee: Detector face illuminance < 10 x GP2W0106YP-11 Figure 11. Standard Optical System (Detector Side) 90% IE 10% tR tF GP2W0106YP-12 Figure 12. Output Waveform Specification (Emitter Side) 8 IrDA Data Sheet 115 kbps Transceiver GP2W0106YP GP2W0106YP DETECTOR FOR RADIATION INTENSITY MEASURING φ φ NOTE: φ indicates horizontal and vertical directions GP2W0106YP-13 Figure 13. Standard Optical System (Emitter Side) VDD = 3.3 V 60 1.63 µs LEDA TXD GP2W0106YP PEAK 40 FORWARD CURRENT 26 IFM (mA) 20 VIN Tx = 2.8 V BR = 115.2 kbps 0 GP2W0106YP-14 Figure 14. Recommended Circuit (Emitter Side) -20 -25 85 0 25 50 75 100 AMBIENT TEMPERATURE TA (°C) NOTE: Pulse width ≤ 78.1 µs, Duty ratio 3/16 GP2W0106YP-15 Figure 15. Peak Forward Current Versus Ambient Temperature IrDA Data Sheet 9 GP2W0106YP 115 kbps Transceiver RELIABILITY TEST ITEMS TEST CONDITIONS FAILURE JUDGEMENT CRITERIA SAMPLES (n) DEFECTIVE (c) NOTES Temperature cycling 1 cycle -20°C to 85°C (30 minutes at each extreme) 20 cycles test n = 22 c=0 1 High temperature and high humidity storage +40°C, 90% RH, 240 hours n = 22 c=0 1 High temperature storage +85°C, 240 hours n = 22 c=0 1 Low temperature storage -30°C, 240 hours n = 22 c=0 1 Operation life 1 +25°C, VDD = 3.3 V, 240 hours n = 11 c=0 1 Operation life 2 +25°C, VDD = LEDA = 3.3 V, 240 hours, Pulse width 78.1 µs, Duty ratio 3/16 Up: Upper Specification Limint n = 11 c=0 Mechanical shock 1,000 m/s2, 6 ms, 3 times/±X, ±Y, ±Z direction Low: Lower Specification Limint n = 11 c=0 Variable frequency vibration 200 m/s2, 100 to 2,000 to 100 Hz for approximately 4 minutes 48 minutes/X, Y, Z direction n = 11 c=0 Reflow solder head 230°C, 5 s. n = 11 c=0 IDD > Up × 1.2 L < Low × 0.8 IE < Low × 0.8 IE > Up × 1.2 2 NOTES: 1. The sample to be tested shall be left at normal temperature and humidity for 2 hours after it is taken out of the chamber. No dew point. 2. Refer to the ‘Precautions for Soldering’ section for temperature profile. 10 IrDA Data Sheet 115 kbps Transceiver GP2W0106YP OUTGOING INSPECTION • Inspection lot: Inspection shall be carried out per each delivery lot. • Inspection method: A single sampling plan, normal inspection level two based on ISO 2859 shall be adopted. Table 2. Outgoing Inspection INSPECTION ITEMS AND TEST METHOD PARAMETER Major defect Minor defect AQL(%) Disconnection, short 0.1 Inverse polarity on terminal 0.1 Soldering defect (obstacle to use) 0.1 Electrical characteristic defect 0.1 Appearance defect which affects the electrical characteristics such as, split, chip, scratch, stain, or blur PRECAUTIONS FOR SOLDERING Solder Reflow Solder only once at the temperature and the time within the temperature profile as shown in Figure 16. Other Precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. Keep the package temperature within that specified in Figure 16. Also avoid immersing the resin part in the solder. Even if within the temperature profile shown in Figure 16, there is the possibility that the gold wire in the package may break if the deformation of the PCB affects the lead pins. Use after fully confirming the conditions of actual solder reflow machine. Soldering 0.25 • Soldering iron shall be less than 25 W, and temperature of soldering iron point shall be used at less than 260°C. • Soldering time shall be within 5 seconds. • Soldered product shall treat at normal temperature. • Solder: 6/4 solder or included Ag solder. 230°C MAX. 1 - 4°C/s 200°C 165°C MAX. 1 - 4°C/s 1 - 4°C/s 25°C 5 s MAX. 60 s MAX. 120 s MAX. 90 s MAX. GP2W0106YP-16 Figure 16. Temperature Profile IrDA Data Sheet 11 GP2W0106YP 115 kbps Transceiver • Taping structure and dimensions: The tape should have a structure in which a cover tape is sealed heatpressed on the carrier tape of conductive PET. See Figure 17. • Reel structure and dimensions: The taping reel should be conductive plastic with its dimensions as shown in Figure 18. • Direction of product insertion: Product direction in carrier tape should be such that electrode side of product is placed on the cover tape side and lens side of product is placed on the hold side of the tape. See Figure 19. 2.0 ±0.1 • Adhesiveness of cover tape: The exfoliation force between carrier tape and cover tape should be 0.2 N to 1 N for the angle from 160° to 180°. • Rolling method and quantity: Wind the tape back on the reel so that the cover tape is on the outside. Attach more than 20 cm of blank tape to the trailer and the leader of the tape and fix both ends with adhesive tape. One reel shall contain 2,000 pieces. • Safety protection during shipping: There should be no deformation of component or degradation of electrical characteristics due to shipping. φ1.5 2.65 ±0.1 +0.1 -0.0 8.0 ±0.1 16.0 ±0.3 1.75 ±0.1 0.3 ±0.05 7.5 ±0.1 4.0 ±0.1 • Taped device repair: To repair taped device failure, cut the bottom of carrier tape with a cutter, and after replacing with good devices, seal the cut portion with adhesive tape. 8.5 ±0.1 TAPING SPECIFICATIONS Taping Method 3.25 ±0.1 NOTE: Dimensions are in mm. GP2W0106YP-17 Figure 17. Tape Structure and Dimensions 12 IrDA Data Sheet 115 kbps Transceiver GP2W0106YP 21 ±0.8 13 ±0.2 2 ±0.5 100 ±1 22.4 MAX. 330 ±2 17.5 ±0.5 NOTE: Dimensions are in mm. GP2W0106YP-18 Figure 18. Reel Structure and Dimensions PULL-OUT DIRECTION LENS SIDE GP2W0106YP-19 Figure 19. Direction of Product Insertion IrDA Data Sheet 13 GP2W0106YP 115 kbps Transceiver TAPING MOISTURE-PROOF PACKING Packaging Specifications Table 3. Packaging Material NAME MATERIAL Aluminum laminate bag Aluminum polyethylene Label Paper Siccative Outer case Paper Pads Paper Packaging Method • Seal the aluminum laminated bag containing the tape reel (2,000 pieces per reel) and siccative. • Fill out necessary information on the label and paste it on the aluminum laminate bag. • Pack four aluminum laminated bags (containing one reel each) into the designated outer case, where paper pads are placed on the bottom and top of the outer case, as well as between each layer of the aluminum laminated bags. Minimum order/shipment quantity should be one laminated bag. • The outer case should then be sealed with packaing tape, with indicating the model name, quantity, and outgoing inspection data on the case. Total of 8,000 pieces per carton. Storage and Treatment After Unsealing • Storage conditions: The product should be stored with these conditions: – Storage temperature: 10°C to 30°C – Humidity: below 60% RH • Treatment after opening: – After unsealing, devices should be mounted under the temperature condition of 10°C to 30°C, at the humidity conditions of below 60% RH, within two days. – In case long term storage is needed, devices should either be stored in dry box or re-sealed in a moisture-proof bag with siccative and kept in an environment where the temperature is 10°C to 30°C, at the humidity condition of below 60% RH. Devices must be mounted within two weeks. • Baking before mounting: – In the event that the devices are not maintained in the recommended storage conditions or the enclosed siccative indicator has turned pink, baking must be done before devices are mounted. Please also note that baking should only be done once. – Recommended condition: 100°C, 12 to 24 hours. – Baking will not be properly done with the devices in their shipping package. To complete the baking properly, devices should either be temporarily mounted to PCB with adhesive, or placed in a metal tray. The temporary mounting should be done using adhesive, not by soldering. Table 4. Packaging Method Specifications PACKAGE SHAPE PRODUCT QUANTITY SACK QUANTITY Tape reel (φ 330 mm) 1 model 2,000 pieces per reel 1 reel per moisture-proof laminated bag 14 IrDA Data Sheet 115 kbps Transceiver GP2W0106YP PRODUCTS IN TAPE-REEL PADS (TOTAL 5 SHEETS) TAPE-REEL IN ALUMINUM LAMINATED BAG (TOTAL 4 SETS) DESICCANT ALUMINUM LAMINATED BAG EXAMPLE 1 PACKING CASE LABEL (MODEL NUMBER QUANTITY DATE) TAPE-REEL IN ALUMINUM LAMINATED BAG EXAMPLE 3 370 mm TYP. 440 mm TYP. PACKING TAPE 150 mm TYP. EXAMPLE 2 PACKAGE METHOD EXAMPLES: 1. Seal the aluminum laminated bag, including the tape reel with 2,000 pieces and desiccant. 2. Fill out the model name, quantity etc. in the blank area of label and paste on the bag. 3. Put the four moisture-proof laminated bags in the ruled case. Put the pad between the bags, and top and bottom. 4. Seal the case with packing tape, and indicate model name and quantity. (8,000 pieces/package) Total Packaged mass: Approximately 3.3 kg. MODEL NUMBER QUANTITY DATE EXAMPLE 4 NOTE: Dimensions are in mm. GP2W0106YP-20 Figure 20. Packing Specification IrDA Data Sheet 15 GP2W0106YP 115 kbps Transceiver LIFE SUPPORT POLICY SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation. LIMITED WARRANTY SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage. The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor. In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost. SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied. NORTH AMERICA EUROPE ASIA SHARP Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (360) 834-2500 Telex: 49608472 (SHARPCAM) Facsimile: (360) 834-8903 http://www.sharpsma.com SHARP Electronics (Europe) GmbH Microelectronics Division Sonninstraße 3 20097 Hamburg, Germany Phone: (49) 40 2376-2286 Facsimile: (49) 40 2376-2232 http://www.sharpmed.com SHARP Corporation Integrated Circuits Group 2613-1 Ichinomoto-Cho Tenri-City, Nara, 632, Japan Phone: +81-743-65-1321 Facsimile: +81-743-65-1532 http://www.sharp.co.jp ©2000 by SHARP Corporation Reference Code SMA00007