SHINDENGEN U6SB20

SHINDENGEN
General Purpose Rectifiers
UL Bridges
OUTLINE DIMENSIONS
U6SB20
Case
Case :: 3S
5S
(Unit : mm)
200V 6A
FEATURES
● Thin Single In-Line Package
● UL Recognized
(UL File No.E142422)
● High IFSM
● Applicable to Automatic Insertion
APPLICATION
● Switching power supply
● Home Appliances, Office Equipment
● Telecommunication, Factory Automation
RATINGS
●Absolute Maximum Ratings (If not specified Tc=25℃)
Item
Symbol
Tstg
Storage Temperature
Tj
Operating Junction Temperature
VRM
Maximum Reverse Voltage
IO
Average Rectified Forward Current
50Hz sine wave, R-load
Peak Surge Forward Current
Current Squared Time
Dielectric Strength
Mounting Torque
IFSM
I 2t
Vdis
TOR
Conditions
With heatsink
Tc=111℃
50Hz sine wave, R-load Without heatsink Ta=25℃
50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25℃
2ms≦t<10ms Tj=25℃
Terminals to case, AC 1 minute
(
Recommended torque : 0.5N・m)
●Electrical Characteristics (If not specified Tc=25℃)
Item
Symbol
Conditions
VF
Forward Voltage
IF=3A,
Pulse measurement, Rating of per diode
IR
VR=VRM , Pulse measurement, Rating of per diode
Reverse Current
θjc junction to case With heatsink
θjl junction to lead
Thermal Resistance
Without heatsink
θja junction to ambient Without heatsink
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
Ratings
-40∼150
150
200
6
2.8
170
140
2
0.8
Unit
℃
℃
V
A
Ratings
Max.1.05
Max.10
Max.3.4
Max.5
Max.26
Unit
V
μA
A
A 2s
kV
N・ m
℃/W
U6SBx
Forward Voltage
100
Forward Current IF [A]
10
Tl=150°C [TYP]
Tl=25°C [TYP]
1
Pulse measurement per diode
0.1
0.4
0.5
0.6
0.7
0.8
0.9
Forward Voltage VF [V]
1
1.1
1.2
U6SBx
Forward Power Dissipation
14
Forward Power Dissipation PF [W]
SIN
12
10
8
6
4
2
0
0
1
2
3
4
5
6
Average Rectified Forward Current IO [A]
Tj= 150°C
Sine wave
7
U6SBx
Derating Curve
Average Rectified Forward Current IO [A]
14
12
PCB
10
Glass-epoxy substrate
Soldering land 5mmφ
8
6
4
2
0
80
90
100
110
120
130
Case Temperature Tc [°C]
Sine wave
R-load
Free in air
140
150
U6SBx
Derating Curve
Average Rectified Forward Current IO [A]
6
5
PCB
Glass-epoxy substrate
Soldering land 5mmφ
4
3
2
1
0
0
20
40
60
80
100
120
Ambient Temperature Ta [°C]
Sine wave
R-load
Free in air
140
160
U6SBx
Peak Surge Forward Capability
IFSM
350
10ms 10ms
1 cycle
Peak Surge Forward Current IFSM [A]
300
non-repetitive,
sine wave,
Tj=25°C before
surge current is applied
250
200
150
100
50
0
1
2
5
10
20
Number of Cycles [cycles]
50
100