SIPEX SP207EHCT

SP207EH–SP213EH
®
High Speed +5V High Performance
RS232 Transceivers
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■
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Single +5V Supply Operation
0.1µF External Charge Pump Capacitors
500Kbps Data Rate Under Load
Standard SOIC and SSOP Packages
Lower Supply Current Than Competition
(typical 3mA)
1µA Shutdown Mode
WakeUp Feature in Shutdown Mode
Tri–State Receiver Outputs
Ideal for High Speed RS-232 Applications
Improved ESD Specifications:
+15kV Human Body Model
+15kV IEC1000-4-2 Air Discharge
+8kV IEC1000-4-2 Contact Discharge
DESCRIPTION
The SP207EH/208EH/211EH/213EH devices are high speed enhanced multi-channel
RS-232 line transceivers with improved electrical performance. The SP207EH/208EH/
211EH/213EH series is a superior drop-in replacement to our previous versions as well as
popular industry standards. All devices feature low-power CMOS construction and the
Sipex-patented (5,306,954) on-board charge pump circuitry that generates the +10V
RS-232 voltage levels using 0.1µF charge pump capacitors. The SP211E and SP213E
devices feature a low-power shutdown mode, which reduces power supply drain to 1µA.
Enhancements to this series include a higher transmission rate of 500Kbps, a lower
power supply current at 3mA typical (no load), and superior ESD performance. The ESD
tolerance has been improved for this series to over +15kV for both Human Body Model and
IEC1000-4-2 Air Discharge test methods.
Nu RS232
Model
Drivers Receivers
SP207EH
5
3
SP208EH
4
4
SP211EH
4
5
SP213EH
4
5
No. of Receivers
No. of External
Active in Shutdown 0.1µF Capacitors
0
4
0
4
0
4
2
4
Shutdown WakeUp TTL Tri–State
No
No
No
No
No
No
Yes
No
Yes
Yes
Yes
Yes
Table 1. Model Selection Table
SP207EHDS/08
SP207EH Series High Performance Transceivers
1
© Copyright 2000 Sipex Corporation
Power Dissipation Per Package
ABSOLUTE MAXIMUM RATINGS
24-pin SSOP (derate 11.2mW/oC above +70oC)....900mW
24-pin PDIP (derate 15.9mW/oC above +70oC)....1300mW
24-pin SOIC (derate 12.5mW/oC above +70oC)...1000mW
28-pin SSOP (derate 11.2mW/oC above +70oC)....900mW
28-pin SOIC (derate 12.7mW/oC above +70oC)...1000mW
These are stress ratings only and functional operation of the device at
these or any other above those indicated in the operation sections of
the specifications below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect reliability.
VCC ............................................................................................ +6V
V+ ................................................................. (VCC – 0.3V) to +13.2V
V– ........................................................................................... 13.2V
Input Voltages
TIN ................................................................... –0.3V to (VCC +0.3V)
RIN ........................................................................................... ±20V
Output Voltages
TOUT .......................................................... (V+, +0.3V) to (V–, –0.3V)
ROUT ................................................................. –0.3V to (VCC +0.3V)
Short Circuit Duration on TOUT ....................................... Continuous
Power Dissipation
Plastic DIP .......................................................................... 375mW
(derate 7mW/°C above +70°C)
Small Outline ...................................................................... 375mW
(derate 7mW/°C above +70°C)
SPECIFICATIONS
VCC at nominal ratings; 0.1µF charge pump capacitors; TMIN to TMAX, unless otherwise noted.
PARAMETER
TTL INPUTS
Logic Threshold
VIL
VIH
Logic Pullup Current
Maximum Transmission Rate
TTL OUTPUTS
Compatibility
VOL
VOH
Leakage Current
RS232 OUTPUT
Output Voltage Swing
MIN.
TYP.
0.8
Volts
Volts
µA
Kbps
15
200
480
CONDITIONS
TIN, EN, SD
TIN = 0V
CL = 1000pF, RL = 3KΩ
TTL/CMOS
0.4
3.5
0.05
+5
+10
Volts
Volts
µA
+7
Volts
+25
Ω
mA
1.2
1.7
0.5
5
250
200
Transition Time
SP207EHDS/08
UNIT
2.0
Output Resistance
300
Output Short Circuit Current
RS232 INPUT
Voltage Range
–15
Voltage Threshold
Low
0.8
High
Hysteresis
0.2
Resistance
3
DYNAMIC CHARACTERISTICS
Driver Propagation Delay
Receiver Propagation Delay
Instantaneous Slew Rate
Output Enable Time
Output Disable Time
MAX.
IOUT = 3.2mA; VCC = +5V
IOUT = –1.0mA
0V ≤ ROUT ≤ VCC ; SP211 EN = 0V;
SP213 EN = VCC
TA = +25°C
All transmitter outputs loaded
with 3KΩ to ground
VCC = 0V; VOUT = +2V
Infinite duration, VOUT = 0V
+15
Volts
2.8
1.0
7
Volts
Volts
Volts
kΩ
VCC = 5V, TA = +25°C
VCC = 5V, TA = +25°C
VCC = +5V
VIN =+15V; TA = +25°C
500
TBD
ns
ns
V/µs
TBD
µs
TTL–to–RS-232
RS-232–to–TTL
CL = 50pF, RL = 3–7KΩ;
TA = +25°C; from +3V
CL = 2,500pF, RL = 3KΩ;
measured from +3V to –3V
or –3V to +3V
400
250
ns
ns
SP207EH Series High Performance RS232 Transceivers
2
© Copyright 2000 Sipex Corporation
SPECIFICATIONS
VCC at nominal ratings; 0.1µF charge pump capacitors; TMIN to TMAX, unless otherwise noted.
PARAMETER
POWER REQUIREMENTS
VCC
SP207EH
All other parts
ICC
MIN.
TYP.
MAX.
UNIT
4.75
4.50
5.00
5.00
5.25
5.50
Volts
Volts
3
15
1
6
mA
mA
µA
Shutdown Current
10
ENVIRONMENTAL AND MECHANICAL
Operating Temperature
Commercial, –C
0
+70
°C
Extended, –E
–40
+85
°C
Storage Temperature
–65
+125
°C
Package
–A
Shrink (SSOP) small outline
–T
Wide (SOIC) small outline
–P
Narrow (PDIP) Plastic Dual-In-Line
Transmitter Output @ 240Kbps RL = 3KΩ, CL = 1,000pF
SP207EHDS/08
CONDITIONS
TA = +25°C
No load; VCC = ±10%
All transmitters RL = 3KΩ
TA = +25°C
Transmitter Output @ 500Kbps RL = 3KΩ, CL = 1,000pF
SP207EH Series High Performance Transceivers
3
© Copyright 2000 Sipex Corporation
PINOUT
24
T4 OUT
T2 OUT
1
24
T3 OUT
2
23
R2IN
T1OUT
2
23
R3IN
T2OUT
3
22
R2OUT
R2IN
3
22
R3OUT
R1IN
4
21
T5IN
R2OUT
4
21
T4IN
R1OUT
5
20
T5OUT
T1IN
5
20
T4OUT
T2IN
6
19
T4IN
R1OUT
6
19
T3IN
T1IN
7
18
T3IN
R1IN
7
18
T2IN
GND
8
17
R3OUT
GND
8
17
R4OUT
VCC
9
16
R3IN
VCC
9
16
R4IN
C1+
10
15
V–
C1+
10
15
V–
V+
11
14
C2–
V+
11
14
C2–
C1–
12
13
C2+
C1–
12
13
C2+
T3 OUT
1
28
T4 OUT
T3 OUT
1
28
T4 OUT
T1OUT
2
27
R3IN
T1OUT
2
27
R3IN
T2OUT
3
26
R3OUT
T2OUT
3
26
R3OUT
R2IN
4
25
SHUTDOWN (SD)
R2IN
4
25
SHUTDOWN (SD)
R2OUT
5
24
EN
R2OUT
5
24
EN
T2IN
6
23
R4IN
T2IN
6
23
R4IN
T1IN
7
22
R4OUT
T1IN
7
22
R4OUT
R1OUT
8
21
T4IN
R1OUT
8
21
T4IN
R1IN
9
20
T3IN
R1IN
9
20
T3IN
GND
10
19
R5OUT
GND
10
19
R5OUT
VCC
11
18
R5IN
VCC
11
18
R5IN
C1+
12
17
V–
C1+
12
17
V–
V+
13
16
C2–
V+
13
16
C2–
C1–
14
15
C2+
C1–
14
15
C2+
SP213EH
SP211EH
SP207EHDS/08
SP208EH
1
T1OUT
SP207EH
T3 OUT
SP207EH Series High Performance RS232 Transceivers
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© Copyright 2000 Sipex Corporation
FEATURES
As in the original RS-232 multi-channel
products, the SP207EH Series high speed
multi-channel RS-232 line transceivers provide
a variety of configurations to fit most designs,
especially high speed applications where +12V
is not available. The SP207EH Series is a
superior high speed drop-in replacement to our
previous versions as well as popular industry
standards.
Charge–Pump
The charge pump is a Sipex–patented design
(5,306,954) and uses a unique approach
compared to older less–efficient designs. The
charge pump still requires four external capacitors,
but uses a four–phase voltage shifting technique
to attain symmetrical 10V power supplies.
Figure 3a shows the waveform found on the
positive side of capacitor C2, and Figure 3b shows
the negative side of capacitor C2. There is a
free–running oscillator that controls the four
phases of the voltage shifting. A description of
each phase follows.
All devices in this series feature low-power
CMOS construction and Sipex's proprietary
on-board charge pump circuitry to generate the
+10V RS-232 voltage levels. The ability to
use 0.1µF charge pump capacitors saves
board space and reduces production costs.
The devices in this series provide different
driver/receiver combinations to match any
application requirement.
Phase 1
— VSS charge storage —During this phase of the
clock cycle, the positive side of capacitors C1
and C2 are initially charged to +5V. Cl+ is then
switched to ground and the charge in C1– is
transferred to C2–. Since C2+ is connected to
+5V, the voltage potential across capacitor C2 is
now 10V.
The SP211EH and SP213EH models feature a
low–power shutdown mode, which reduces
power supply drain to 1µA. The SP213EH
includes a Wake-Up function which keeps two
receivers active in the shutdown mode, unless
disabled by the EN pin.
Phase 2
— VSS transfer — Phase two of the clock
connects the negative terminal of C2 to the VSS
storage capacitor and the positive terminal of C2
to ground, and transfers the generated –l0V to
C3. Simultaneously, the positive side of capacitor
C 1 is switched to +5V and the negative side is
connected to ground.
The family is available in 28–pin SO (wide) and
SSOP (shrink) small outline packages. Devices
can be specified for commercial (0°C to +70°C)
and industrial/extended (–40°C to +85°C) operating temperatures.
Phase 3
— VDD charge storage — The third phase of the
clock is identical to the first phase — the charge
transferred in C1 produces –5V in the negative
terminal of C1, which is applied to the negative
side of capacitor C2. Since C2+ is at +5V, the
voltage potential across C2 is l0V.
THEORY OF OPERATION
The SP207EH Series devices are made up of
three basic circuit blocks — 1) transmitter/
driver, 2) receiver and 3) the SIPEX–proprietary charge pump. Each model within the
Series incorporates variations of these circuits
to achieve the desired configuration and
performance.
VCC = +5V
+5V
C1
+
–
–5V
C2
C4
+
–
–
+
+
–
VDD Storage Capacitor
VSS Storage Capacitor
C3
–5V
Figure 1. Charge Pump — Phase 1
SP207EHDS/08
SP207EH Series High Performance Transceivers
5
© Copyright 2000 Sipex Corporation
VCC = +5V
C4
C1
+
–
C2
+
–
–
+
+
–
VDD Storage Capacitor
VSS Storage Capacitor
C3
–10V
Figure 2. Charge Pump — Phase 2
Phase 4
— VDD transfer — The fourth phase of the clock
connects the negative terminal of C2 to ground,
and transfers the generated l0V across C2 to C4,
the VDD storage capacitor. Again, simultaneously
with this, the positive side of capacitor C1 is
switched to +5V and the negative side is
connected to ground, and the cycle begins again.
designs in personal computer peripherals and
LAN applications that demand high speed
performance.
The drivers are inverting transmitters, which
accept either TTL or CMOS inputs and output the
RS-232 signals with an inverted sense relative to
the input logic levels. Typically, the RS-232
output voltage swing is +9V with no load, and +5V
minimum with full load. The transmitter outputs
are protected against infinite short–circuits to
ground without degradation in reliability. The
drivers of the SP211EH, and SP213EH can be
tri–stated by using the SHUTDOWN function.
Since both V+ and V– are separately generated
from VCC; in a no–load condition V+ and V– will
be symmetrical. Older charge pump approaches
that generate V– from V+ will show a decrease in
the magnitude of V– compared to V+ due to the
inherent inefficiencies in the design.
In the “power-off” state, the output impedance will
remain greater than 300 ohms, again satisfying the
RS-232 specifications. Should the input of the
driver be left open, an internal 400Kohm pullup
resistor to VCC forces the input high, thus committing the output to a low state. The slew rate of the
transmitter output is internally limited to a maximum of 30V/µs in order to meet the EIA standards
(EIA RS-232D 2.1.7, Paragraph 5). The transition
of the loaded output from high to low also meets
the monotonicity requirements of the standard.
The clock rate for the charge pump typically
operates at 15kHz. The external capacitors can
be as low as 0.1µF with a 16V breakdown
voltage rating.
Transmitter/Driver
The drivers of the SP207EH Series can maintain
a typical data rate of 500Kbps. This superior
RS-232 data transmission rate makes the
SP207EH Series an ideal match for many
+10V
a) C2
+
GND
GND
b) C2
–
–10V
Figure 3. Charge Pump Waveforms
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
6
© Copyright 2000 Sipex Corporation
VCC = +5V
C4
+5V
+
C1
+
C2
–
–5V
–
+
–
–
+
VDD Storage Capacitor
VSS Storage Capacitor
C3
–5V
Figure 4. Charge Pump — Phase 3
VCC = +5V
C4
+10V
C1
+
–
C2
+
–
–
+
+
–
VDD Storage Capacitor
VSS Storage Capacitor
C3
Figure 5. Charge Pump — Phase 4
Receivers
The high performance receivers of the SP207EH
Series can accept input signals at a typical data
rate of 500Kbps. The receivers convert RS-232
input signals to inverted TTL signals. The
receivers convert RS-232 input signals to
inverted TTL signals. Since the input is usually
from a transmission line where long cable lengths
and system interference can degrade the signal,
the inputs have a typical hysteresis margin of
500mV. This ensures that the receiver is
virtually immune to noisy transmission lines.
Should an input be left unconnected, a 5kΩ
pulldown resistor to ground will commit the
output of the receiver to a high state.
For complete shutdown to occur and the 10µA
power drain to be realized, the following
conditions must be met:
SP211EH:
• +5V must be applied to the SD pin
• ENABLE must be either 0V, +5.0V or not
connected
• the transmitter inputs must be either +5.0V
or not connected
• VCC must be +5V
• Receiver inputs must be >0V and <+5V
SP213EH:
• 0V must be applied to the SD pin
• ENABLE must be either 0V, +5.0V or not
connected
• the transmitter inputs must be either +5.0V
or not connected
• VCC must be +5V
• Receiver inputs must be >0V and <+5V
SHUTDOWN MODE
The SP211EH, and SP213EH all feature a
control input which will disable the device and
reduce the power supply current to less than
10µA, making the parts ideal for battery–
powered systems. In the “shutdown” mode the
receivers and transmitters will both be tri–stated.
The V+ output of the charge pump will discharge
to VCC, and the V– output will discharge to
ground. Products with the Wake-Up function
can enable or disable the receivers during
shutdown.
SP207EHDS/08
SP207EH Series High Performance Transceivers
7
© Copyright 2000 Sipex Corporation
ENABLE
The SP211EH and SP213EH all feature an
enable input, which allows the receiver outputs
to be either tri–stated or enabled. This can be
especially useful when the receiver is tied directly to a microprocessor data bus. For the
SP211EH, enable is active low; that is, 0V
applied to the ENABLE pin will enable the
receiver outputs. For the SP213EH, enable is
active high; that is, +5V applied to the ENABLE
pin will enable the receiver outputs.
SP213EH Only
SD
0
0
1
1
EN
0
1
0
1
SD
1
1
0
0
EN
1
0
1
0
Power
Up/Down
Up
Up
Down
Down
Receiver
Outputs
Enable
Tri–state
Enable
Tri–state
Table 2. Wake–Up Truth Table
POWER UP WITH SD ACTIVE (Charge pump in shutdown mode)
t 0 (POWERUP)
+5V
R OUT
DATA VALID
0V
t WAIT
ENABLE
SD
DISABLE
POWER UP WITH SD DISABLED (Charge pump in active mode)
t 0 (POWERUP)
+5V
R OUT
DATA VALID
0V
t ENABLE
ENABLE
SD
DISABLE
EXERCISING WAKE–UP FEATURE
t 0 (POWERUP)
+5V
R OUT
DATA VALID
DATA VALID
DATA VALID
0V
t ENABLE
SD
t ENABLE
DISABLE
ENABLE
t ENABLE
DISABLE
t WAIT
VCC = +5V ±10%; TA = 25°C
t WAIT = 2ms typical, 3ms maximum
t ENABLE = 1ms typical, 2ms maximum
Figure 6. Wake–Up Timing
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
8
© Copyright 2000 Sipex Corporation
WAKEUP FUNCTION
The SP213EH has a wake–up feature that keeps
two receivers (R4 and R5) in an enabled state
when the device is in the shutdown mode. With
only the receivers active during shutdown, the
devices draw 5–10µA of supply current.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potential to store electro-static energy and discharge
it to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 7. This method will test the IC’s
capability to withstand an ESD transient during
normal handling such as in manufacturing areas
where the ICs tend to be handled frequently.
A typical application of this function would be
where a modem is interfaced to a computer in a
power–down mode. The ring indicator signal
from the modem could be passed through an
active receiver in the SP213EH that is itself in
the shutdown mode. The ring indicator signal
would propagate through the SP213EH to the
power management circuitry of the computer to
power up the microprocessor and the SP213EH
drivers. After the supply voltage to the SP213EH
reaches +5.0V, the SHUTDOWN pin can be
disabled, taking the SP213EH out of the
shutdown mode.
The IEC-1000-4-2, formerly IEC801-2, is generally
used for testing ESD on equipment and systems.
For system manufacturers, they must guarantee a
certain amount of ESD protection since the system
itself is exposed to the outside environment and
human presence. The premise with IEC1000-4-2
is that the system is required to withstand an
amount of static electricity when ESD is applied to
points and surfaces of the equipment that are
accessible to personnel during normal usage. The
transceiver IC receives most of the ESD current
when the ESD source is applied to the connector
pins. The test circuit for IEC1000-4-2 is shown
on Figure 8. There are two methods within
IEC1000-4-2, the Air Discharge method and the
Contact Discharge method.
All receivers that are active during shutdown
maintain 500mV (typical) of hysteresis.
ESD TOLERANCE
The SP207EH Family incorporates ruggedized
ESD cells on all driver output and receiver input
pins. The ESD structure is improved over our
previous family for more rugged applications
and environments sensitive to electro-static discharges and associated transients. The improved
ESD tolerance is at least +15kV without damage
nor latch-up.
R
RS
S
R
RC
C
SW2
SW2
SW1
SW1
C
CS
S
DC Power
Source
Device
Under
Test
Figure 7. ESD Test Circuit for Human Body Model
SP207EHDS/08
SP207EH Series High Performance Transceivers
9
© Copyright 2000 Sipex Corporation
Contact-Discharge Module
R
RS
S
R
RC
C
RV
SW2
SW2
SW1
SW1
Device
Under
Test
C
CS
S
DC Power
Source
RS and RV add up to 330Ω
330Ω ffor
or IEC1000-4-2.
Figure 8. ESD Test Circuit for IEC1000-4-2
i➙
With the Air Discharge Method, an ESD voltage is
applied to the equipment under test (EUT) through
air. This simulates an electrically charged person
ready to connect a cable onto the rear of the system
only to find an unpleasant zap just before the
person touches the back panel. The high energy
potential on the person discharges through an
arcing path to the rear panel of the system before he
or she even touches the system. This energy,
whether discharged directly or through air, is
predominantly a function of the discharge current
rather than the discharge voltage. Variables with
an air discharge such as approach speed of the
object carrying the ESD potential to the system
and humidity will tend to change the discharge
current. For example, the rise time of the discharge
current varies with the approach speed.
30A
15A
0A
t=0ns
Figure 9. ESD Test Waveform for IEC1000-4-2
The circuit model in Figures 7 and 8 represent the
typical ESD testing circuit used for all three
methods. The CS is initially charged with the DC
power supply when the first switch (SW1) is on.
Now that the capacitor is charged, the second
switch (SW2) is on while SW1 switches off. The
voltage stored in the capacitor is then applied
through RS, the current limiting resistor, onto the
device under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under test
receives a duration of voltage.
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the ESD
arc. The discharge current rise time is constant
since the energy is directly transferred without the
air-gap arc. In situations such as hand held systems,
the ESD charge can be directly discharged to the
equipment from a person already holding the
equipment. The current is transferred on to the
keypad or the serial port of the equipment directly
and then travels through the PCB and finally to the IC.
SP207EHDS/08
t=30ns
t➙
SP207EH Series High Performance RS232 Transceivers
10
© Copyright 2000 Sipex Corporation
For the Human Body Model, the current limiting
resistor (RS) and the source capacitor (CS) are
1.5kΩ an 100pF, respectively. For IEC-1000-4-2,
the current limiting resistor (RS) and the source
capacitor (CS) are 330Ω an 150pF, respectively.
EIA STANDARDS
The Electronic Industry Association (EIA)
developed several standards of data transmission
which are revised and updated in order to meet
the requirements of the industry. In data
processing, there are two basic means of
communicating between systems and components.
The RS-232 standard was first introduced in
1962 and, since that time, has become an
industry standard.
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than the
Human Body Model. The larger storage capacitor
injects a higher voltage to the test point when SW2
is switched on. The lower current limiting resistor
increases the current charge onto the test point.
DEVICE PIN
TESTED
Driver Outputs
Receiver Inputs
HUMAN BODY
MODEL
The RS-232 is a relatively slow data exchange
protocol, with a maximum baud rate of only
20kbps, which can be transmitted over a
maximum copper wire cable length of 50 feet.
The SP207EH through SP213EH Series of data
communications interface products have been
designed to meet both the EIA protocol
standards, and the needs of the industry.
Air Discharge
+15kV
+15kV
IEC1000-4-2
Direct Contact
+15kV
+15kV
+8kV
+8kV
Level
4
4
Table 3. Transceiver ESD Tolerance Levels
Specification
RS–232D
RS–423A
RS–422
RS–485
RS–562
Single–Ended
Single–Ended
Differential
Differential
Single–Ended
1 Driver
1 Receiver
1 Driver
10 Receivers
1 Driver
10 Receivers
32 Drivers
32 Receivers
1 Driver
1 Receiver
Maximum Cable Length
50 feet
4,000 feet
4,000 feet
4,000 feet
Maximum Data Rate
Mode of Operation
No. of Drivers and Receivers
Allowed on One Line
20Kb/s
100Kb/s
10Mb/s
10Mb/s
C ≤ 2,500pF @ <20Kbps;
C ≤1,000pF @ >20Kbps
64Kb/s
Driver output Maximum Voltage
±25V
±6V
–0.25V to +6V
–7V to +12V
–3.7V to +13.2V
Driver Output Signal Level
Loaded
Unloaded
±5V
±15V
±3.6V
±6V
±2V
±5V
±1.5V
±5V
±3.7V
±13.2V
Driver Load Impedance
3 – 7Kohm
450 ohm
100 ohm
54 ohm
3–7Kohm
Max. Driver Output Current
(High Impedance State)
Power On
Power Off
VMAX/300
100µA
±100µA
±100µA
±100µA
Slew Rate
30V/µs max.
Controls Provided
Receiver Input Voltage Range
±15V
±12V
–7V to +7V
–7V to +12V
30V/µs max.
Receiver Input Sensitivity
±3V
±200mV
±200mV
±200mV
±3V
Receiver Input Resistance
3–7Kohm
4Kohm min.
4Kohm min.
12Kohm min.
3–7Kohm
±15V
Table 4. EIA Standard Definitions
SP207EHDS/08
SP207EH Series High Performance Transceivers
11
© Copyright 2000 Sipex Corporation
TYPICAL APPLICATION CIRCUITS...SP207EH TO SP213EH
+5V INPUT
9
V+
11
12 C –
1
V–
13 C +
2
15
+5V INPUT
0.1µF
+ 6.3V
9
10
0.1µF
6.3V
0.1µF
16V
+
SP207EH
14
+
400KOHM
T3 IN
1
T3
T3 OUT
400KOHM
19
T4 IN
24
T4
T4 OUT
400KOHM
21
R1 OUT
5KOHM
23
R2
5KOHM
17
R3 OUT
4
R1
22
R2 OUT
20
T5
5
V–
16
R3
T5 OUT
R1 IN
R2 IN
R3 IN
5
T2 IN
18
T2
0.1µF
16V
T3 IN
19
VCC
V+
V–
15 C +
2
T4 IN
21
R3 OUT
R4 OUT
5KOHM
13
22
17
0.1µF
16V
+
C2 –
17
T1 OUT
T2
3
20
T3
1
R2 OUT
R3 OUT
R4 OUT
R5 OUT
EN
21
5
26
22
19
T4
28
9
R1
5KOHM
R2
5KOHM
R3
5KOHM
R4
5KOHM
R5
4
27
23
18
24
TTL/CMOS INPUTS
2
RS-232 OUTPUTS
6
8
5KOHM
16
R4
R1 IN
R2 IN
R3 IN
R4 IN
0.1µF
6.3V
+
0.1µF
16V
+
C1 +
VCC
V+
13
14 C –
1
V–
15 C +
2
17
0.1µF
+ 6.3V
0.1µF
16V
+
SP213EH
16
C2 –
400KOHM
T1
T2 OUT
T3 OUT
T4 OUT
R2 IN
R3 IN
R4IN
T1 IN
T2 IN
T3 IN
25
6
T2
20
T3
T4 IN
R2 OUT
R3 OUT
R4 OUT*
21
8
5
26
22
19
T4
3
1
28
9
R1
5KOHM
R2
5KOHM
R3
5KOHM
R4
5KOHM
R5
4
27
23
18
24
5KOHM
SD
10
2
T1 OUT
T2 OUT
T3 OUT
400KOHM
EN
5KOHM
T1
400KOHM
R5 OUT*
R5 IN
7
400KOHM
R1 OUT
R1 IN
TTL/CMOS OUTPUTS
R1 OUT
TTL/CMOS OUTPUTS
7
400KOHM
T4 IN
23
T4 OUT
11
400KOHM
T3 IN
5KOHM
R3
12
0.1µF
6.3V
400KOHM
T2 IN
T3 OUT
+5V INPUT
0.1µF
+ 6.3V
RS-232 INPUTS
TTL/CMOS INPUTS
T1 IN
3
R2
400KOHM
*Receivers active during shutdown
25
T4 OUT
R1 IN
R2 IN
R3 IN
R4IN*
R5 IN*
SD
10
GND
GND
SP207EHDS/08
7
R1
4
R2 OUT
20
T4
6
R1 OUT
SP211EH
16
24
T3
400KOHM
8
14 C –
1
+
T2 OUT
GND
11
C1 +
T1 OUT
5KOHM
+5V INPUT
12
1
400KOHM
8
+
2
T1
400KOHM
GND
0.1µF
6.3V
0.1µF
16V
+
15
C2 –
5KOHM
0.1µF
6.3V
0.1µF
+ 6.3V
SP208EH
14
T1 IN
TTL/CMOS INPUTS
T2 OUT
TTL/CMOS OUTPUTS
RS-232 OUTPUTS
3
T2
18
T5 IN
TTL/CMOS OUTPUTS
T1 OUT
RS-232 INPUTS
TTL/CMOS INPUTS
6
11
400KOHM
2
T1
400KOHM
T2 IN
V+
13 C +
2
400KOHM
7
T1 IN
VCC
12 C –
1
0.1µF
16V
C2 –
C1 +
+
0.1µF
6.3V
RS-232 OUTPUTS
+
VCC
RS-232 INPUTS
0.1µF
16V
C1 +
RS-232 OUTPUTS
0.1µF
6.3V
+
RS-232 INPUTS
10
0.1µF
6.3V
SP207EH Series High Performance RS232 Transceivers
12
© Copyright 2000 Sipex Corporation
PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)
E
H
D
A
Ø
e
B
A1
L
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
SP207EHDS/08
24–PIN
28–PIN
A
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
A1
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
B
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
D
0.317/0.328
(8.07/8.33)
0.397/0.407
(10.07/10.33)
E
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
e
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
H
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
L
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
SP207EH Series High Performance Transceivers
13
© Copyright 2000 Sipex Corporation
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
(WIDE)
E
H
D
A
Ø
e
B
A1
L
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
SP207EHDS/08
24–PIN
28–PIN
A
0.093/0.104
(2.352/2.649)
0.093/0.104
(2.352/2.649)
A1
0.004/0.012
(0.102/0.300)
0.004/0.012
(0.102/0.300)
B
0.013/0.020
(0.330/0.508)
0.013/0.020
(0.330/0.508)
D
0.599/0.614
(15.20/15.59)
0.697/0.713
(17.70/18.09)
E
0.291/0.299
(7.402/7.600)
0.291/0.299
(7.402/7.600)
e
0.050 BSC
(1.270 BSC)
0.050 BSC
(1.270 BSC)
H
0.394/0.419
(10.00/10.64)
0.394/0.419
(10.00/10.64)
L
0.016/0.050
(0.406/1.270)
0.016/0.050
(0.406/1.270)
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
SP207EH Series High Performance RS232 Transceivers
14
© Copyright 2000 Sipex Corporation
PACKAGE: PLASTIC
DUAL–IN–LINE
(NARROW)
E1 E
D1 = 0.005" min.
(0.127 min.)
A1 = 0.015" min.
(0.381min.)
D
A = 0.210" max.
(5.334 max).
C
A2
e = 0.100 BSC
(2.540 BSC)
B1
B
Ø
L
eA = 0.300 BSC
(7.620 BSC)
ALTERNATE
END PINS
(BOTH ENDS)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
SP207EHDS/08
24–PIN
A2
0.115/0.195
(2.921/4.953)
B
0.014/0.022
(0.356/0.559)
B1
0.045/0.070
(1.143/1.778)
C
0.008/0.014
(0.203/0.356)
D
1.230/1.280
(31.24/32.51)
E
0.300/0.325
(7.620/8.255)
E1
0.240/0.280
(6.096/7.112)
L
0.115/0.150
(2.921/3.810)
Ø
0°/ 15°
(0°/15°)
SP207EH Series High Performance Transceivers
15
© Copyright 2000 Sipex Corporation
ORDERING INFORMATION
RS232 Transceivers:
Model .................... Drivers .......................... Receivers ..................................... Temperature Range ................................. Package Type
SP207EHCA .............. 5 ....................................... 3 ................................................... 0°C to +70°C ............................................... 24–pin SSOP
SP207EHCP .............. 5 ....................................... 3 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP
SP207EHCT ............... 5 ....................................... 3 ................................................... 0°C to +70°C ................................................ 24–pin SOIC
SP207EHEA .............. 5 ....................................... 3 ............................................... –40°C to +85°C ............................................... 24–pin SSOP
SP207EHEP ............... 5 ....................................... 3 ............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP
SP207EHET ............... 5 ....................................... 3 ............................................... –40°C to +85°C ................................................ 24–pin SOIC
SP208EHCA ..............
SP208EHCP ..............
SP208EHCT ...............
SP208EHEA ..............
SP208EHEP ...............
SP208EHET ...............
4 .......................................
4 .......................................
4 .......................................
4 .......................................
4 .......................................
4 .......................................
4 ................................................... 0°C
4 ................................................... 0°C
4 ................................................... 0°C
4 ............................................... –40°C
4 ............................................... –40°C
4 ............................................... –40°C
to
to
to
to
to
to
+70°C ............................................... 24–pin SSOP
+70°C ....................................... 24–pin Plastic DIP
+70°C ................................................ 24–pin SOIC
+85°C ............................................... 24–pin SSOP
+85°C ....................................... 24–pin Plastic DIP
+85°C ................................................ 24–pin SOIC
RS232 Transceivers with Low–Power Shutdown and Tri–state Enable:
Model .................... Drivers .......................... Receivers ..................................... Temperature Range ................................. Package Type
SP211EHCA .............. 4 ....................................... 5 ................................................... 0°C to +70°C ............................................... 28–pin SSOP
SP211EHCT ............... 4 ....................................... 5 ................................................... 0°C to +70°C ................................................ 28–pin SOIC
SP211EHEA .............. 4 ....................................... 5 ............................................... –40°C to +85°C ............................................... 28–pin SSOP
SP211EHET ............... 4 ....................................... 5 ............................................... –40°C to +85°C ................................................ 28–pin SOIC
RS232 Transceivers with Low–Power Shutdown, Tri–state Enable, and Wake–Up Function:
Model .................... Drivers .......................... Receivers ..................................... Temperature Range ................................. Package Type
SP213EHCA .............. 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ............................................... 28–pin SSOP
SP213EHCT ............... 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ................................................ 28–pin SOIC
SP213EHEA .............. 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ............................................... 28–pin SSOP
SP213EHET ............... 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ................................................ 28–pin SOIC
Please consult the factory for pricing and availability on a Tape-On-Reel option.
Corporation
SIGNAL PROCESSING EXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: [email protected]
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
SP207EHDS/08
SP207EH Series High Performance RS232 Transceivers
16
© Copyright 2000 Sipex Corporation