SIPEX SP385E-1ET

®
SP385E-1
True +3V or +5V RS-232 Line Driver/Receiver
■ Operates from 3.3V or 5V Power Supply
■ Meets True EIA/TIA-232-F Standards
from a +3.0V to +5.5V Power Supply
■ Meets EIA-562 Specifications at VCC≥
2.7V
■ Two Drivers and Receivers
■ Operates with 0.1µF Capacitors
■ High Data Rate — 120kbps Under Load
■ Low Power Shutdown ≤1µA
■ 3-State TTL/CMOS Receiver Outputs
■ Low Power CMOS — <1mA Operation
■ Improved ESD Specifications:
+15kV Human Body Model
+15kV IEC1000-4-2 Air Discharge
+8kV IEC1000-4-2 Contact Discharge
DESCRIPTION
The Sipex SP385E-1 is an enhanced version of the Sipex SP200 family of RS232 line
drivers/receivers. The SP385E-1 offers +3.3V operation for EIA-562 and EIA-232 applications. The SP385E-1 maintains the same performance features offered in its predecessors.
The SP385E-1 is available in plastic SOIC or SSOP packages operating over the commercial
and industrial temperature ranges. The SP385E-1 is pin compatible to the LTC1385 EIA-562
transceiver, except the drivers in the SP385E-1 can only be disabled with the ON/OFF pin.
RS232 OUTPUTS
Charge
Pumps
T1
T2
R1
TTL/CMOS INPUTS
Rev. 07/26/02
RS232 INPUTS
R2
TTL/CMOS OUTPUTS
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
1
© Copyright 2001 Sipex Corporation
Output Voltages
TOUT .................................................................................................... (V+, +0.3V) to (V-, -0.3V)
ROUT ................................................................................................................ -0.3V to (Vcc +0.3V)
Short Circuit Duration
TOUT ......................................................................................................................................... Continuous
Power Dissipation
CERDIP .............................................................................. 675mW
(derate 9.5mW/°C above +70°C)
Plastic DIP .......................................................................... 375mW
(derate 7mW/°C above +70°C)
Small Outline ...................................................................... 375mW
(derate 7mW/°C above +70°C)
ABSOLUTE MAXIMUM RATINGS
This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect
reliability.
Vcc ................................................................................................................................................................. +6V
V+ .................................................................................................................... (Vcc-0.3V) to +13.2V
V- .............................................................................................................................................................. 13.2V
Input Voltages
TIN ......................................................................................................................... -0.3 to (Vcc +0.3V)
RIN ............................................................................................................................................................ ±15V
SPECIFICATIONS
VCC = +3.3V ± 10%; cap on (V+) and (V-) = 1.0µF, C1 = C2 = 0.1µF; TMIN to TMAX unless otherwise noted.
PARAMETERS
TTL INPUT
Logic Threshold
Low
High
Logic Pullup Current
Maximum Data Rate
TTL OUTPUT
TTL/CMOS Output
Voltage, Low
Voltage, High
Leakage Current; TA = +25°C
EIA-562 OUTPUT
Output Voltage Swing
Power-Off Output Resistance
Output Short Circuit Current
EIA-562 INPUT
Voltage Range
Voltage Threshold
Low
High
Hysteresis
Resistance
DYNAMIC CHARACTERISTICS
Driver Propagation Delay
Receiver Propagation Delay
Instantaneous Slew Rate
MIN.
TYP.
MAX.
0.8
TIN ; ON/OFF Vcc = 3.3V
TIN ; ON/OFF Vcc = 3.3V
TIN = 0V
CL = 2500pF, RL= 3kΩ
Volts
Volts
µA
IOUT = 1.6mA; Vcc = 3.3V
IOUT = -1.0mA
ON/OFF=0V, 0 ≤ VOUT ≤ VCC
±4.2
Volts
±35
Ω
mA
All transmitter outputs loaded
with 3kΩ to ground
VCC = 0V; VOUT = ±2V
Infinite duration
0.01
200
120
0.4
VCC-0.6
0.05
±10
300
-15
0.6
3
1.2
1.5
0.5
5
+15
Volts
2.4
1.0
7
Volts
Volts
Volts
kΩ
VCC = 3.3V, TA = +25°C
VCC = 3.3V, TA = +25°C
VCC = 3.3V, TA = +25°C
VIN = 15V to –15V
30
µs
µs
V/µs
TTL to RS-562
RS-562 to TTL
CL = 10pF, RL= 3kΩ - 7kΩ;
TA = +25°C
CL = 2500pF, RL= 3kΩ;
measured from +2V to -2V
or -2V to +2V
1.0
0.3
Transition Region Slew Rate
10
V/µs
Output Enable Time
Output Disable Time
POWER REQUIREMENTS
VCC Power Supply Current
200
200
ns
ns
0.5
6
8
Shutdown Supply Current
Rev. 07/26/02
CONDITIONS
Volts
Volts
µA
kbps
2.0
±3.7
UNITS
mA
mA
0.010
5
µA
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
2
No load, TA= +25°C;
VCC = 3.3V
All transmitters RL = 3kΩ
TA = +25°C
VCC = 3.3V, TA = +25°C
© Copyright 2002 Sipex Corporation
SPECIFICATIONS
VCC = +3.3V ± 10%; cap on (V+) and (V-) = 1.0µF, C1 = C2 = 0.1µF; TMIN to TMAX unless otherwise noted.
PARAMETERS
TTL INPUT
Logic Threshold
Low
High
Logic Pullup Current
Maximum Data Rate
TTL OUTPUT
TTL/CMOS Output
Voltage, Low
Voltage, High
Leakage Current; TA = +25°C
EIA-232 OUTPUT
Output Voltage Swing
MIN.
TYP.
MAX.
UNITS
Volts
Volts
µA
kbps
TIN ; ON/OFF
TIN ; ON/OFF
TIN = 0V
CL = 2500pF, RL= 3kΩ
Volts
Volts
µA
IOUT = 1.6mA; Vcc = +5V
IOUT = -1.0mA
EN = VCC, 0V ≤ VOUT ≤ VCC
±9
Volts
±35
Ω
mA
All transmitter outputs loaded
with 3kΩ to ground.
VCC = 0V; VOUT = ±2V
Infinite duration
0.8
2.4
0.01
200
120
0.4
VCC-0.6
0.05
±5
Power-Off Output Resistance
Output Short Circuit Current
EIA-562 INPUT
Voltage Range
Voltage Threshold
Low
High
Hysteresis
Resistance
DYNAMIC CHARACTERISTICS
Propagation Delay, RS-232 to TTL
Instantaneous Slew Rate
±10
300
-15
0.8
1.5
1.8
0.5
5
3
+15
Volts
2.4
1.0
7
Volts
Volts
Volts
kΩ
VCC = 5V, TA = +25°C
VCC = 5V, TA = +25°C
VCC = 5V, TA = +25°C
VIN = 15V to –15V
30
µs
V/µs
TTL to RS-562
CL = 10pF, RL= 3kΩ - 7kΩ;
TA =+25°C
CL = 2500pF, RL= 3kΩ;
measured from +3V to -3V
or -3V to +3V
1
Transition Region Slew Rate
10
V/µs
Output Enable Time
Output Disable Time
POWER REQUIREMENTS
VCC Power Supply Current
200
200
ns
ns
0.5
15
mA
25
Shutdown Supply Current
CONDITIONS
No load,
TA= +25°C; VCC = 5V
All transmitters RL = 3kΩ;
TA = +25°C
VCC = 5V, TA = +25°C
mA
1
10
µA
PERFORMANCE CURVES
-11
12
30
10
25
8.4
8.2
-10
8.0
-6
VCC = 4V
-5
0
2
4
6
8
10
Load Current (mA)
Rev. 07/26/02
6
VCC = 4V
VCC = 5V
15
4
10
2
5
0
0
-55
VCC = 4V
7.8
7.6
Load current = 0mA
TA = 25°C
7.4
7.2
-4
-3
ICC (mA)
VCC = 5V
-7
20
VCC = 5V
VOH (Volts)
8
-8
V+ (Volts)
V– Voltage (Volts)
-9
12
14
VCC = 3V
7.0
0
5
10
15
20
25
30
35
40
Load Current (mA)
-40
0
25
70
85
Temperature (°C)
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
3
125
6.8
4.5
4.75
5.0
5.25
5.5
VCC (Volts)
© Copyright 2001 Sipex Corporation
PINOUT
N/C
1
18
ON/OFF
C1+
V+
2
17
3
16
V
CC
GND
C 1-
4
15
T1 OUT
C2 +
C2 -
5
14
R1 IN
6
13
R 1 OUT
V-
7
12
T1 IN
T2 OUT
8
11
R 2 IN
9
10
T2 IN
R OUT
2
18-pin SOIC
N/C
1
20
ON/OFF
C 1+
2
19
V
CC
GND
V+
3
18
C1 C2 +
4
17
5
16
C2 V-
6
15
7
14
T2OUT
R2IN
8
13
9
12
N/C 10
11
T1 OUT
R1 IN
R1 OUT
T IN
1
T IN
2
R OUT
2
N/C
20-pin SSOP
TYPICAL OPERATING CIRCUIT
+5V INPUT
+5V INPUT
17
+10V to -10V
Voltage Inverter
V+
V-
0.1µF
16V
3+
+
7
2
0.1µF +
6.3V
4
5
+
0.1µF
16V
6
0.1µF
16V
R1 OUT
13
2
8
T2 OUT
14
R
1
R1 IN
5kΩ
R 2OUT
10
9
R
2
R2IN
INPUTS
T
TTL/CMOS
11
OUTPUTS
T IN
2
TTL/CMOS
400kΩ
RS232
T1OUT
OUTPUTS
1
15
RS232
T
INPUTS
TTL/CMOS
INPUTS
OUTPUTS
TTL/CMOS
12
C
+
19
Vcc
+5V to +10V
Voltage
Doubler
+10V to -10V
Voltage
Inverter
T1 IN
14
V
3+
7
+
0.1µF
16V
T
SP385E-1
1
17
T1 OUT
400kΩ
T2 IN
R 1OUT
13
15
T
2
8
16
R
1
T2 OUT
R1IN
5kΩ
R 2OUT
12
9
R
2
5kΩ
R IN
2
5kΩ
18
SP385E-1
ON/OFF
GND 16
GND
SOIC Package
Rev. 07/26/02
0.1µF
16V
V
400kΩ
400kΩ
T1 IN
C
+
RS232
C
+
V
+5V to +10V
Voltage Doubler
OUTPUTS
C
+
+
RS232
2
0.1µF +
6.3V
4
5
+
0.1µF
16V
6
0.1µF
+
INPUTS
0.1µF
20
ON/OFF
18
SSOP Package
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
4
© Copyright 2002 Sipex Corporation
Driver/Transmitter
The drivers are inverting level transmitters, that
convert TTL or CMOS logic levels to ±5.0V
EIA/TIA-232 levels inverted relative to the
input logic levels. Typically the RS-232 output
voltage swing is ±5.5V with no load and at least
±5V minimum fully loaded. The driver outputs
are protected against infinite short-circuits to
ground without degradation in reliability. Driver
outputs will meet EIA/TIA-562 levels of ±3.7V
with supply voltages as low as 2.7V.
FEATURES…
The Sipex SP385E-1 is a +3V to +5V EIA-232/
EIA-562 line transceiver. It is a pin-for-pin
alternative for the SP310A and will operate in
the same socket with 0.1µF capacitors, either
polarized or non–polarized, in +3V supplies.
The SP385E-1 offers the same features such as
120kbps guaranteed transmission rate, increased
drive current for longer and more flexible cable
configurations, low power dissipation and
overall ruggedized construction for commercial
and industrial environments. The SP385E-1
also includes a shutdown feature that tri-states
the drivers and the receivers.
The instantaneous slew rate of the transmitter
output is internally limited to a maximum of
30V/µs in order to meet the standards [EIA 232D 2.1.7, Paragraph (5)]. However, the transition
region slew rate of these enhanced products is
typically 10V/µs. The smooth transition of the
loaded output from VOL to VOH clearly meets
the monotonicity requirements of the standard
[EIA 232-D 2.1.7, Paragraphs (1) & (2)].
The SP385E-1 includes a charge pump voltage
converter which allows it to operate from a single
+3.3V or +5V supply. These converters double the
VCC voltage input in order to generate the EIA-232
or EIA-562 output levels. For +5V operation, the
SP385E-1 driver outputs adhere to all EIA-232-F
and CCITT V.28 specifications. While at +3.3V
operation, the outputs adhere to EIA-562 specifications. Due to Sipex's efficient charge pump design,
the charge pump levels and the driver outputs are
less noisy than other 3V EIA-232 transceivers.
Receivers
The receivers convert RS-232 input signals to
inverted TTL signals. Since the input is usually
from a transmission line, where long cable
lengths and system interference can degrade the
signal, the inputs have a typical hysteresis
margin of 500mV. This ensures that the receiver
is virtually immune to noisy transmission lines.
The SP385E-1 has a single control line which
simultaneously shuts down the internal DC/DC
converter and puts all transmitter and receiver
outputs into a high impedance state.
The input thresholds are 0.8V minimum and
2.4V maximum, again well within the ±3V RS232 requirements. The receiver inputs are also
protected against voltages up to ±15V. Should
an input be left unconnected, a 5kΩ pull-down
resistor to ground will commit the output of the
receiver to a high state.
The SP385E-1 is available in 18-pin plastic
SOIC and 20-pin plastic SSOP packages for
operation over commercial and industrial
temperature ranges. Please consult the factory
for surface-mount packaged parts supplied on
tape-on-reel as well as parts screened to MILM-38510.
In actual system applications, it is quite possible
for signals to be applied to the receiver inputs
before power is applied to the receiver circuitry.
This occurs for example when a PC user
attempts to print only to realize the printer
wasn’t turned on. In this case an RS-232 signal
from the PC will appear on the receiver input at
the printer. When the printer power is turned on,
the receiver will operate normally. All of these
enhanced devices are fully protected.
The SP385E-1 is ideal for +3.3V battery
applications requiring low power operation.
The charge pump strength allows the drivers
to provide ±4.0V signals, plenty for typical
EIA-562 applications since the EIA-562
receivers have input sensitivity levels of less
than ±3V.
THEORY OF OPERATION
The SP385E-1 device is made up of three basic
circuit blocks — 1) a driver/transmitter, 2) a
receiver and 3) a charge pump.
Rev. 07/26/02
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
5
© Copyright 2001 Sipex Corporation
the negative side of capacitor C2. Since C2+ is
at +5V, the voltage potential across C2 is l0V.
CHARGE PUMP
The charge pump is a Sipex–patented design
(5,306,954) and uses a unique approach
compared to older less–efficient designs. The
charge pump still requires four external
capacitors, but uses a four–phase voltage
shifting technique to attain symmetrical 10V
power supplies. There is a free–running
oscillator that controls the four phases of the
voltage shifting. A description of each phase
follows.
Phase 4
— VDD transfer — The fourth phase of the
clock connects the negative terminal of C2 to
ground,
and transfers the generated l0V across C2 to
C4, the VDD storage capacitor. Again, simultaneously
with this, the positive side of capacitor C1 is
switched to +5V and the negative side is
connected to ground, and the cycle begins
again.
Phase 1
— VSS charge storage —During this phase of
the clock cycle, the positive side of capacitors
C1 and C2 are initially charged to +5V. Cl+ is
then switched to ground and the charge in C1–
is transferred to C2–. Since C2+ is connected to
+5V, the voltage potential across capacitor C2
is now 10V.
Since both V+ and V– are separately generated
from VCC; in a no–load condition V+ and V–
will
be symmetrical. Older charge pump approaches that generate V– from V+ will show
a decrease in the magnitude of V– compared
to V+ due to the inherent inefficiencies in the
design.
Phase 2
— VSS transfer — Phase two of the clock
connects the negative terminal of C2 to the
VSS storage capacitor and the positive
terminal of C2 to ground, and transfers the
generated –l0V to C3. Simultaneously, the
positive side of capacitor C 1 is switched to
+5V and the negative side is connected to
ground.
The clock rate for the charge pump typically
operates at 15kHz. The external capacitors
can be as low as 0.1µF with a 16V breakdown
voltage rating.
VCC = +5V
C4
C1
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –5V in the
negative terminal of C1, which is applied to
–
–
–
–
+
VDD Storage Capacitor
VSS Storage Capacitor
C3
Figure 2. Charge Pump — Phase 2
C4
+
–5V
+
+
10V
+5V
+
–
C2
–10V
VCC = +5V
C1
+
C2
–
+
–
–5V
–
+
C2+
VDD Storage Capacitor
VSS Storage Capacitor
GND
C3
GND
C2-
Figure 1. Charge Pump — Phase 1
-10V
Figure 3. Charge Pump Waveforms
Rev. 07/26/02
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
6
© Copyright 2002 Sipex Corporation
in MIL-STD-883, Method 3015.7 for ESD
testing. The premise of this ESD test is to
simulate the human body’s potential to store
electro-static energy and discharge it to an
integrated circuit. The simulation is
performed by using a test model as shown in
Figure 6. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in
manufacturing areas where the ICs tend to be
handled frequently.
VCC = +5V
C4
+5V
C1
+
–
C2
–5V
+
–
–
+
+
–
VDD Storage Capacitor
VSS Storage Capacitor
C3
–5V
Figure 4. Charge Pump — Phase 3
VCC = +5V
C4
+10V
C1
+
–
C2
+
–
–
+
+
–
The IEC-1000-4-2, formerly IEC801-2, is
generally used for testing ESD on equipment
and systems. For system manufacturers, they
must guarantee a certain amount of ESD
protection since the system itself is exposed to
the outside environment and human presence.
The premise with IEC1000-4-2 is that the
system is required to withstand an amount of
static electricity when ESD is applied to points
and surfaces of the equipment that are
accessible to personnel during normal usage.
The transceiver IC receives most of the ESD
current when the ESD source is applied to the
connector pins. The test circuit for IEC10004-2 is shown on Figure 7. There are two
methods within IEC1000-4-2, the Air
Discharge method and the Contact Discharge
method.
VDD Storage Capacitor
VSS Storage Capacitor
C3
Figure 5. Charge Pump — Phase 4
Shutdown (ON/OFF)
The SP385E-1 has a shut-down/standby mode
to conserve power in battery-powered
systems. To activate the shutdown mode,
which stops the operation of the charge pump,
a logic "0" is applied to the appropriate
control line. The shutdown mode is controlled
on the SP385E-1 by a logic "0" on the ON/
OFF control line (pin 18 for the SOIC and pin
20 for the SSOP packages); this puts the
transmitter outputs in a tri-state mode.
ESD Tolerance
The SP385E-1 device incorporates ruggedized ESD cells on all driver output and
receiver input pins. The ESD structure is
improved over our previous family for more
rugged applications and environments
sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least ±15KV
without damage nor latch-up.
SW2
SW1
Device
Under
Test
CSS
DC Power
Source
Figure 6. ESD Test Circuit for Human Body Model
Contact-Discharge Module
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
RSS
RC
C
DC Power
Source
RV
SW2
SW1
The Human Body Model has been the
generally accepted ESD testing method for
semiconductors. This method is also specified
Rev. 07/26/02
RSS
RC
C
Device
Under
Test
CSS
RS and RV add up to 330Ω
330 for
or IEC1000-4-2.
Figure 7. ESD Test Circuit for IEC1000-4-2
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
7
© Copyright 2001 Sipex Corporation
the ESD arc. The discharge current rise time
is constant since the energy is directly
transferred without the air-gap arc. In
situations such as hand held systems, the ESD
charge can be directly discharged to the
equipment from a person already holding the
equipment. The current is transferred on to
the keypad or the serial port of the equipment
directly and then travels through the PCB and
finally to the IC.
30A
15A
0A
0ns
The circuit models in Figures 6 and 7
represent the typical ESD testing circuit used
for all three methods. The CS is initially
charged with the DC power supply when the
first switch (SW1) is on. Now that the
capacitor is charged, the second switch (SW2)
is on while SW1 switches off. The voltage
stored in the capacitor is then applied through
RS, the current limiting resistor, onto the
device under test (DUT). In ESD tests, the
SW2 switch is pulsed so that the device under
test receives a duration of voltage.
30ns
Figure 8. ESD Test Waveform for IEC1000-4-2
With the Air Discharge Method, an ESD
voltage is applied to the equipment under test
(EUT) through air. This simulates an
electrically charged person ready to connect a
cable onto the rear of the system only to find
an unpleasant zap just before the person
touches the back panel. The high energy
potential on the person discharges through an
arcing path to the rear panel of the system
before he or she even touches the system.
This energy, whether discharged directly or
through air, is predominantly a function of the
discharge current rather than the discharge
voltage. Variables with an air discharge such
as approach speed of the object carrying the
ESD potential to the system and humidity will
tend to change the discharge current. For
example, the rise time of the discharge current
varies with the approach speed.
For the Human Body Model, the current
limiting resistor (RS) and the source capacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-1000-4-2, the current limiting resistor
(RS) and the source capacitor (CS) are 330Ω an
150pF, respectively.
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than
the Human Body Model. The larger storage
capacitor injects a higher voltage to the test
point when SW2 is switched on. The lower
current limiting resistor increases the current
charge onto the test point.
The Contact Discharge Method applies the
ESD current directly to the EUT. This method
was devised to reduce the unpredictability of
SP385E-1
Family
Driver Outputs
Receiver Inputs
HUMAN BODY
MODEL
Air Discharge
±15kV
±15kV
±15kV
±15kV
IEC1000-4-2
Direct Contact
±8kV
±8kV
Level
4
4
Table 1. Transceiver ESD Tolerance Levels
Rev. 07/26/02
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
8
© Copyright 2002 Sipex Corporation
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
(WIDE)
E
H
D
A
Ø
e
B
A1
L
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
Rev. 07/26/02
18–PIN
A
0.090/0.104
(2.29/2.649))
A1
0.004/0.012
(0.102/0.300)
B
0.013/0.020
(0.330/0.508)
D
0.447/0.463
(11.35/11.74)
E
0.291/0.299
(7.402/7.600)
e
0.050 BSC
(1.270 BSC)
H
0.394/0.419
(10.00/10.64)
L
0.016/0.050
(0.406/1.270)
Ø
0°/8°
(0°/8°)
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
9
© Copyright 2001 Sipex Corporation
PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)
E
H
D
A
Ø
e
B
A1
L
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
Rev. 07/26/02
20–PIN
A
0.068/0.078
(1.73/1.99)
A1
0.002/0.008
(0.05/0.21)
B
0.010/0.015
(0.25/0.38)
D
0.278/0.289
(7.07/7.33)
E
0.205/0.212
(5.20/5.38)
e
0.0256 BSC
(0.65 BSC)
H
0.301/0.311
(7.65/7.90)
L
0.022/0.037
(0.55/0.95)
Ø
0°/8°
(0°/8°)
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
10
© Copyright 2002 Sipex Corporation
ORDERING INFORMATION
Part Number
Temperature Range
Package
SP385E-1CA ........................................... 0°C to +70°C .......................................... 20–pin SSOP
SP385E-1EA .......................................... –40°C to +85°C ........................................ 20–pin SSOP
SP385E-1CT ............................................ 0°C to +70°C ........................................... 18–pin SOIC
SP385E-1ET .......................................... –40°C to +85°C ......................................... 18–pin SOIC
CT and ET packages available Tape–on–Reel. Please consult the factory for pricing and availability for this option, and for parts screened to
MIL–STD–883.
Corporation
SIGNAL PROCESSING EXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: [email protected]
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
Rev. 07/26/02
SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver
11
© Copyright 2001 Sipex Corporation