CXD3508TQ LCD Interface IC For the availability of this product, please contact the sales office. Description The CXD3508TQ is a LCD interface IC for the color LCD module ACX704AKM driver. 100 pin TQFP (Plastic) Features • Generates the color LCD module ACX704AKM drive pulse. • Standby mode function • Thin package (100-pin TQFP) Applications PDA, compact LCD monitor, etc. Structure Silicon gate CMOS IC Absolute Maximum Ratings (Ta = 25°C) • Supply voltage VDD Vss – 0.3 to +5.5 • Input voltage VI Vss – 0.3 to VDD + 0.3 • Output voltage VO Vss – 0.3 to VDD + 0.3 • Operating temperature Topr –25 to +75 • Storage temperature Tstg –55 to +150 V V V °C °C Recommended Operating Conditions • Supply voltage VDD 3.0 to 3.6 • Operating temperature Topr –10 to +60 V °C Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E00228-PS CXD3508TQ Block Diagram R0 9 R1 8 31 to 28 R01, R11, R21, R31 R2 7 43 to 41 XR01, XR11, XR21, XR31 R3 6 94 to 97 R02, R12, R22, R32 G0 13 DATA IN 82 to 89 XR02, XR12, XR22, XR32 G1 12 G2 11 G3 10 B0 17 35 to 32 G01, G11, G21, G31 Serial/ Parallel Conversion Block 47 to 44 XG01, XG11, XG21, XG31 90 to 93 G02, G12, G22, G32 78 to 81 XG02, XG12, XG22, XG32 B1 16 39 to 36 B01, B11, B21, B31 B2 15 53, 52, 49, 48 B3 14 FA 24 86 to 89 B02, B12, B22, B32 72 to 74, XB02, XB12, XB22, XB32 77 MCK 20 PCI 21 Hsync/DENB 18 XB01, XB11, XB21, XB31 27 PCO Power CTR. 64 HST1 H Counter Delay SLIN 22 65 XHST1 66 HST2 67 XHST2 60 HCK1 H Timing Pulse GEN. Delay 61 XHCK1 62 HCK2 63 XHCK2 68 OE1 69 XOE1 V sync 19 V Counter 70 OE2 71 XOE2 54 VST 55 XVST V Timing Pulse GEN. 58 VCK 59 XVCK 56 ENB 57 XENB 98 FRP Timing Generator Block –2– CXD3508TQ VSS XB11 XB01 VST XVST ENB XENB VCK XVCK HCK1 XHCK1 HCK2 XHCK2 HST1 XHST1 HST2 XHST2 OE1 XOE1 OE2 XOE2 XB02 XB12 XB22 VSS Pin Configuration 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 VDD 76 50 VDD XB32 77 49 XB21 XG02 78 48 XB31 XG12 79 47 XG01 XG22 80 46 XG11 XG32 81 45 XG21 XR02 82 44 XG31 XR12 83 43 XR01 XR22 84 42 XR11 XR32 85 41 XR21 B02 86 40 XR31 B12 87 39 B01 B22 88 38 B11 B32 89 37 B21 G02 90 36 B31 G12 91 35 G01 G22 92 34 G11 G32 93 33 G21 R02 94 32 G31 R12 95 31 R01 R22 96 30 R11 R32 97 29 R21 FRP 98 28 R31 TESTV 99 27 PCO VSS R0 FA R1 TESTP R2 SLIN R3 PCI CLR MCK VSS Vsync TEST2 –3– Hsync/DENB 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 B0 8 B1 7 B2 6 B3 5 G0 4 G1 3 G2 2 G3 1 VSS 26 VDD TEST1 VDD 100 CXD3508TQ Pin Description Pin No. Symbol I/O Description Input pin for open status 1 VSS 2 TEST1 I Test signal input DWN∗1 3 TEST2 I Test signal input DWN∗1 4 VSS — 5 CLR I System reset 6 R3 I Red signal input (MSB) — 7 R2 I Red signal input — 8 R1 I Red signal input — 9 R0 I Red signal input (LSB) — 10 G3 I Green signal input (MSB) — 11 G2 I Green signal input — 12 G1 I Green signal input — 13 G0 I Green signal input (LSB) — 14 B3 I Blue signal input (MSB) — 15 B2 I Blue signal input — 16 B1 I Blue signal input — 17 B0 I Blue signal input (LSB) — 18 Hsync/DENB I Hsync/data enable pulse input — 19 Vsync I Vsync pulse input — 20 MCK I Dot clock input — 21 PCI I Power control signal input — 22 SLIN I Sync input signal mode switch 23 TESTP I Test signal input DWN∗1 DWN∗1 24 FA I Data phase adjustment DWN∗1 25 VSS — GND — 26 VDD — Power supply — 27 PCO O Power control signal output — 28 R31 O Red signal output — 29 R21 O Red signal output — 30 R11 O Red signal output — 31 R01 O Red signal output — 32 G31 O Green signal output — 33 G21 O Green signal output — — — GND GND — UP∗2 ∗1 Built-in pull-down resistor (82.5kΩ) ∗2 Built-in pull-up resistor (82.5kΩ) –4– CXD3508TQ Pin No. Symbol I/O Description Input pin for open status 34 G11 O Green signal output — 35 G01 O Green signal output — 36 B31 O Blue signal output — 37 B21 O Blue signal output — 38 B11 O Blue signal output — 39 B01 O Blue signal output — 40 XR31 O Red signal output (inverse) — 41 XR21 O Red signal output (inverse) — 42 XR11 O Red signal output (inverse) — 43 XR01 O Red signal output (inverse) — 44 XG31 O Green signal output (inverse) — 45 XG21 O Green signal output (inverse) — 46 XG11 O Green signal output (inverse) — 47 XG01 O Green signal output (inverse) — 48 XB31 O Blue signal output (inverse) — 49 XB21 O Blue signal output (inverse) — 50 VDD — Power supply — 51 VSS — GND — 52 XB11 O Blue signal output (inverse) — 53 XB01 O Blue signal output (inverse) — 54 VST O VST pulse output — 55 XVST O VST pulse output (inverse) — 56 ENB O ENB pulse output — 57 XENB O ENB pulse output (inverse) — 58 VCK O VCK pulse output — 59 XVCK O VCK pulse output (inverse) — 60 HCK1 O HCK1 pulse output — 61 XHCK1 O HCK1 pulse output (inverse) — 62 HCK2 O HCK2 pulse output — 63 XHCK2 O HCK2 pulse output (inverse) — 64 HST1 O HST1 pulse output — 65 XHST1 O HST1 pulse output (inverse) — 66 HST2 O HST2 pulse output — 67 XHST2 O HST2 pulse output (inverse) — –5– CXD3508TQ Pin No. Symbol I/O Description Input pin for open status 68 OE1 O OE1 pulse output — 69 XOE1 O OE1 pulse output (inverse) — 70 OE2 O OE2 pulse output — 71 XOE2 O OE2 pulse output (inverse) — 72 XB02 O Blue signal output (inverse) — 73 XB12 O Blue signal output (inverse) — 74 XB22 O Blue signal output (inverse) — 75 VSS — GND — 76 VDD — Power supply — 77 XB32 O Blue signal output (inverse) — 78 XG02 O Green signal output (inverse) — 79 XG12 O Green signal output (inverse) — 80 XG22 O Green signal output (inverse) — 81 XG32 O Green signal output (inverse) — 82 XR02 O Red signal output (inverse) — 83 XR12 O Red signal output (inverse) — 84 XR22 O Red signal output (inverse) — 85 XR32 O Red signal output (inverse) — 86 B02 O Blue signal output — 87 B12 O Blue signal output — 88 B22 O Blue signal output — 89 B32 O Blue signal output — 90 G02 O Green signal output — 91 G12 O Green signal output — 92 G22 O Green signal output — 93 G32 O Green signal output — 94 R02 O Red signal output — 95 R12 O Red signal output — 96 R22 O Red signal output — 97 R32 O Red signal output — 98 FRP O Polarity inversion pulse signal output — 99 TESTV I Test signal input 100 VDD — DWN∗1 Power supply — ∗1 Built-in pull-down resistor (82.5kΩ) –6– CXD3508TQ Electrical Characteristics DC Characteristics Item Symbol Supply voltage VDD Current consumption IDD Input voltage 1 (VDD = 3.0 to 3.6V, Ta = –25 to + 75°C) VIH1 VIL1 Applicable pins VDD Vt– Input current 1 | IIH1 | Input current 2 | IIL2 | | IIH2 | | IIL3 | Input current 3 | IIH3 | Output voltage 1 VOL1 VOH1 VOL2 Output voltage 2 VOH2 Output voltage 3 VOL3 Output voltage 4 VOL4 VOH3 VOH4 Typ. Max. Unit — 3.0 3.3 3.6 V MCK LVTTL input cell All output pins excluding MCK LVTTL Schmitt trigger input cell Vt+ – Vt– | IIL1 | Min. No load, Ta = 25°C, VDD = 3.3V, MCK: 5.58MHz — Vt+ Input voltage 2 Conditions R0, R1, R2, R3, G0, G1, G2, G3, B0, B1, B2, B3, Hsync/DENB, Vsync, MCK, PCI TEST1, TEST2, SLIN, TESTV, FA, TESTP mA 2.0 0.8 V 2.0 V 0.5 0.2 VI = 0V 1.0 VI = VDD 1.0 µA VI = 0V CLR 0.9 10 100 VI = VDD 3.0 VI = 0V 3.0 µA µA VI = VDD 10 IOL1 = 0.75mA 100 0.2 ENB, XENB V IOH1 = –0.50mA VDD – 0.2 R01, R11, R21, R31, R02, R12, R22, R32, XR01, XR11, XR21, XR31, XR02, XR12, XR22, XR32, G01, G11, G21, G31, G02, G12, G22, G32, XG01, XG11, XG21, XG31, XG02, XG12, XG22, XG32, B01, B11, B21, B31, B02, B12, B22, B32, XB01, XB11, XB21, XB31, XB02, XB12, XB22, XB32, PCO, VST, XVST, VCK, XVCK, OE1, XOE1, OE2, XOE2, FRP IOL2 = 1.5mA 0.2 V IOH2 = –1.0mA VDD – 0.2 HST1, XHST1, HST2, XHST2 IOL3 = 3.0mA HCK1, XHCK1, HCK2, XHCK2 IOL4 = 4.5mA 0.2 IOH3 = –2.0mA VDD – 0.2 IOH4 = –3.0mA VDD – 0.2 –7– V 0.2 V CXD3508TQ AC Characteristics (VDD = 3.0 to 3.6V, Ta = –10 to +60°C) Item Symbol Applicable pins HCK, HST time difference ∆tHST-HCKU ∆tHST-HCKD HCK1, HCK2, XCHK1, XHCK2, HST1, HST2, XHST1, XHST2 Data output rise time tRD Data output fall time tFD H pulse output rise time tRHP H pulse output fall time tFHP V pulse output rise time tRVP V pulse output fall time tFVP ENB pulse output rise time tREP ENB pulse output fall time R01, R11, R21, R31, R02, R12, R22, R32, XR01, XR11, XR21, XR31, XR02, XR12, XR22, XR32, G01, G11, G21, G31, G02, G12, G22, G32, XG01, XG11, XG21, XG31, XG02, XG12, XG22, XG32, B01, B11, B21, B31, B02, B12, B22, B32, XB01, XB11, XB21, XB31, XB02, XB12, XB22, XB32 Conditions Min. Typ. GND – VDD (0 – 90%) Max. Unit 15∗2 ns 40 ns VDD – GND (100 – 10%) 40 HCK1, HCK2, XCHK1, XHCK2, HST1, HST2, XHST1, XHST2 GND – VDD (0 – 90%) 30 VDD – GND (100 – 10%) 30 VCK, XVCK, VST, XVST, OE1, OE2, XOE1, XOE2, FRP, PCO GND – VDD (0 – 90%) 60 VDD – GND (100 – 10%) 60 GND – VDD (0 – 90%) 80 VDD – GND (100 – 10%) 80 ENB, XENB tFEP HCK1, HCK2, XHCK1, XHCK2, DATA setup time tSTP HCK1, HCK2, XHCK1, XHCK2, R01, R11, R21, R31, R02, R12, R22, R32, XR01, XR11, XR21, XR31, XR02, XR12, XR22, XR32, G01, G11, G21, G31, G02, ∗3 G12, G22, G32, XG01, XG11, XG21, XG31, XG02, XG12, XG22, XG32, B01, B11, B21, B31, B02, B12, B22, B32, XB01, XB11, XB21, XB31, XB02, XB12, XB22, XB32 HCK, VCK duty dHCK dVCK HCK1, HCK2, XHCK1, XHCK2, VCK, XVCK ∗4 ns ns ns 35 50 120 ns 48 50 52 % ∗1 CL of each output pin is shown below. • R01, R11, R21, R31, R02, R12, R22, R32, XR01, XR11, XR21, XR31, XR02, XR12, XR22, XR32, G01, G11, G21, G31, G02, G12, G22, G32, XG01, XG11, XG21, XG31, XG02, XG12, XG22, XG32, B01, B11, B21, B31, B02, B12, B22, B32, XB01, XB11, XB21, XB31, XB02, XB12, XB22, XB32, ENB, XENB: CL = 70pF • HCK1, HCK2, XHCK1, XHCK2 : CL = 150pF • HST, XHST, VCK, XVCK : CL = 100pF • VST, XVST : CL = 85pF • OE1, XOE1, OE2, XOE2, PCO, FRP : CL = 60pF ∗2 The absolute value of time difference (HST1, XHST1, HCK1, XHCK1) is within 15ns. In the same manner, the absolute value of time difference (HST2, XHST2, HCK2, XHCK2) is within 15ns. ∗3 tSTP: tST1D, tST1U, tST2D, tST2U ∗4 dHCK = (tHH/(tHH + tHL)) × 100, dVCK = (tVH/(tVH + tVL)) × 100 –8– CXD3508TQ Timing Definition H system tHH tHL VDD HCK1 50% 50% 50% GND VDD 50% XHCK1 GND ∆tH ∆tH VDD HCK2 50% 50% 50% GND VDD 50% XHCK2 50% GND ∆tH ∆tH VDD HST1 (HST2) 50% 50% GND VDD XHST1 (XHST2) 50% 50% GND VDD HCK1 (HCK2) 50% 50% GND VDD XHCK1 (XHCK2) 50% 50% GND ∆tHST-HCKU ∆tHST-HCKD –9– CXD3508TQ V system tVH tVL VDD VCK 50% 50% 50% GND VDD XVCK 50% 50% GND ∆tV ∆tV DATA VDD HCK1 50% 50% GND VDD 50% XHCK1 50% GND VDD HCK2 50% 50% GND VDD 50% XHCK2 GND VDD DATA GND tST1D tST2D tSTX1U tST1U tSTX2U – 10 – tST2U tSTX1D tSTX2D CXD3508TQ PCI, PCO These pins control to turn power on/off of the ACX704AKM and the CXD2475TQ when the LCD is turned on/off. Connect PCO to DC-DC converter that can control power on/off of the ACX704AKM and the CXD2475TQ. • When LCD is on, effective screen is displayed after entire white display (2 fields). • When LCD is off, LCD is off after entire white display. Power Up Sequence VDD VDD 0 VDD CLR 0 PCI Inactive (low) Active PCO Inactive (low) Active Pulse∗ Inactive (low) Active DATA (out) Inactive (low) White Data MCK Hsync Vsync DENB DATA (in) Valid 2 Fields Invalid (low) Valid 1 Field (typ.) 288H (min.) Power Down Sequence (Standby) Standby Mode PCI Active (high) Inactive (low) Inactive (low) Active (high) PCO VDD VDD DATA Pulse∗ 0 Valid Invalid (all low) White Data Invalid (all low) Valid Vsync DENB 3 Fields 10 Fields ∗ HST1, HST2, XHST1, XHST2, HCK1, HCK2, XHCK1, XHCK2, VST, XVST, VCK, XVCK, ENB. XENB, OE1, XOE1, OE2, XOE2, FRP – 11 – CXD3508TQ FA This is a selector switch for phase relationship between data and other pulses. (Normally, set to low.) MCK HCK1 XHCK1 HCK2 XHCK2 (FA: L) Default (FA: H) OUTPUT DATA R/G/B 01 to 31 Invalid 2 4 6 8 OUTPUT DATA R/G/B 02 to 31 Invalid 1 3 5 7 OUTPUT DATA R/G/B 01 to 31 Invalid 2 4 6 8 OUTPUT DATA R/G/B 02 to 31 Invalid 1 3 5 7 SLIN This is a selector switch for input sync signal mode. SLIN: LOW → Hsync + Vsync Mode SLIN: HIGH → DENB ONLY Mode (Vsync input is invalid.) – 12 – – 13 – DATA DENB∗ Hsync∗ MCK DATA DENB∗ Hsync∗ MCK 315 320 thsw ∗ Input either Hsync + Vsync or DENB as sync signal input. thss 307 308 309 310 311 312 313 314 315 316 317 318 319 320 310 Horizontal Direction Input Signal Timing Chart 325 tds 1 tdes 16 dots tdh 330 2 340 4 dots (min.) 320 tdeh 16 dots 345 350 0 1 2 3 4 tch 5 5 tclk 6 tcl 7 8 9 10 11 352 dots tch, tcl tds tdh tdes tdeh thss thsw MCK low, high pulse width Hsync low pulse width Hsync setup time DENB hold time DENB setup time DATA hold time DATA setup time ftch Symbol MCK frequency Item 4tclk 10ns 15ns 10ns 15ns 10ns 3MHz Min. 0.5tclk 5.58MHz Typ. 16tclk 8MHz Max. Input Signal AC Characteristics (VDD = 3.0 to 3.6V, Ta = –25 to +75°C) 32 dots 335 CXD3508TQ – 14 – DATA DENB∗ Vsync∗ Hsync∗ DENB∗ Vsync∗ Hsync∗ 235 tvhde 240 tvsw 10 lines 245 ∗ Input either Hsync + Vsync or DENB as sync signal input. 230 Vertical Direction Input Signal Timing Chart 250 260 0 5 10 15 334tclk 2 lines tvsw Vsync low pulse width Min. tvhde Symbol Vsync falling edge → Hsync rising edge Item Typ. 14 lines 349tclk Max. Input Signal AC Characteristics (VDD = 3.0 to 3.6V, Ta = –25 to +75°C) 14 lines 255 264 lines CXD3508TQ Output Input – 15 – FRP XVCK VCK XVST VST XENB ENB XOE2 OE2 XOE1 OE1 XHCK2 HCK2 XHST2 HST2 XHCK1 HCK1 XHST1 HST1 R/G/B 01 to 31 R/G/B 02 to 32 DATA DENB Hsync MCK 16 dot 320 328 334 32 dot 330 16 dot 344 340 4 dot 348 304 320 334 334 4 dot 340 342 350 346 0 0 3 4 1 23 4 5 6 7 8 9 0 1 310 269 271 273 275 277 279 281 283 285 287 289 291 293 295 297 299 301 303 305 307 309 311 313 315 317 319 300 2 290 316 317 318 319 320 270 272 274 276 278 280 282 284 286 288 290 292 294 296 298 300 302 304 306 308 310 312 314 316 318 320 280 Horizontal Direction Timing Chart 5 6 7 8 20 352 dot 9 11 13 15 17 19 21 23 10 12 14 16 18 20 22 24 10 CXD3508TQ Output Input – 16 – FRP (E)∗ FRP (O)∗ XOE2 OE2 XOE1 OE1 XENB ENB XVCK VCK XVST VST DENB Vsync Hsync 240 245 250 255 FRP (E): FRP output timing at even field. ∗ FRP (O): FRP output timing at odd field. 10 line Vertical Direction Timing Chart 14 line 260 0 5 10 15 20 264 lines CXD3508TQ CXD3508TQ Application Circuit To ACX704AKM VDD VSS XB11 VST XB01 ENB XVST VCK XENB HCK1 XVCK HCK2 XHCK1 HST1 XHCK2 HST2 XHST1 OE1 76 VDD XHST2 OE2 XOE1 XB02 XOE2 XB12 VSS XB22 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 VDD 50 XB21 49 78 XG02 XB31 48 79 XG12 XG01 47 80 XG22 XG11 46 81 XG32 XG21 45 82 XR02 XG31 44 83 XR12 XR01 43 84 XR22 XR11 42 85 XR32 XR21 41 86 B02 XR31 40 87 B12 B01 39 88 B22 B11 38 89 B32 B21 37 90 G02 B31 36 91 G12 G01 35 92 G22 G11 34 93 G32 G21 33 94 R02 G31 32 95 R12 R01 31 96 R22 R11 30 97 R32 R21 29 R31 28 VSS FA SLIN PCI MCK 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Vsync 8 B0 R0 7 B1 R1 6 B2 R2 5 B3 R3 4 G0 CLR 3 G1 VSS 2 G2 TEST2 1 G3 TEST1 VDD 26 VSS 100 VDD PCO 27 TESTP 99 TESTV Hsync/DENB 98 FRP To ACX704AKM To ACX704AKM 77 XB32 VDD ∗ To DC-DC Converter Input To CXD2475TQ (Pins 9, 10) VDD ∗ Connect PCO to DC-DC converter that can control power on/off of the ACX704AKM and the CXD2475TQ. Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. – 17 – CXD3508TQ Package Outline Unit: mm TQFP-100P-L111 1.2 MAX 16.0 ± 0.3 1.0 ± 0.1 14.0 ± 0.2 0.4375 75 0.1 51 76 15.0 ± 0.2 50 A 26 100 1 25 0.2 ± 0.06 0.5 0.08 0.125 ± 0.05 M 0.1 ± 0.1 0 ° to 10 ° PACKAGE STRUCTURE DETAIL A PACKAGE MATERIAL EPOXY RESIN SONY CODE TQFP-100P-L111 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-TQFP100-14X14-0.5 LEAD MATERIAL 42ALLOY PACKAGE WEIGHT 0.6g JEDEC CODE – 18 – Sony Corporation