SONY CXP87948

CXP87940/87948
CMOS 8-bit Single Chip Microcomputer
Description
The CXP87940/87948 is a CMOS 8-bit single chip
microcomputer which consists of A/D converter, serial
interface, timer/counter, time base timer, high
precision timing pattern generation circuit, PWM
output, VISS/VASS circuit, 32kHz timer/counter,
remote control reception circuit, VSYNC separator and
the measurement circuit which measures signals of
capstan FG and drum FG/PG and other servo
systems, as well as basic configurations like 8-bit
CPU, ROM, RAM and I/O port.
Also the CXP87940/87948 provides sleep/stop
functions which enable to lower power consumption.
100 pin QFP (PIastic)
Structure
Silicon gate CMOS IC
Features
• A wide instruction set (213 instructions) which covers various types of data
— 16-bit operation/multiplication and division/Boolean bit operation instructions
• Minimum instruction cycle
250ns at 16MHz operation (4.5V to 5.5V)
122µs at 32kHz operation (2.7V to 5.5V)
• Incorporated ROM capacity
40K bytes (CXP87940), 48K bytes (CXP87948)
• Incorporated RAM capacity
1376 bytes
• Peripheral functions
— A/D converter
8 bits, 12 channels, successive approximation method
(Conversion time of 20.0µs at 16MHz)
— Serial Interface
Incorporated buffer RAM (Auto transfer for 1 to 32 bytes), 1 channel
Incorporated 8-bit and 8-stage FIFO
(Auto transfer for 1 to 8 bytes), 1 channel
Incorporated two-wire 8-bit and 8-stage FIFO
(Auto transfer for 1 to 8 bytes), 1 channel
— Timer
8-bit timer, 8-bit timer/counter, 19-bit time base timer,
32kHz timer/counter
— High-precision timing pattern generator PPG: maximum of 19 pins, 32 stages programmable
RTG: 5 pins, 2 channels
— PWM/DA gate output
PWM: 12 bits, 2 channels (Repetitive frequency of 62kHz at 16MHz)
DA gate pulse output: 13 bits, 4 channels
— Servo input control
Capstan FG, drum FG/PG, CTL input
— VSYNC separator
— FRC capture unit
Incorporated 26-bit and 8-stage FIFO
— PWM output
14 bits
— VISS/VASS circuit
Pulse duty auto detection circuit
— Remote control reception circuit
8-bit pulse measurement counter with on-chip 6-stage FIFO
• Interruption
22 factors, 15 vectors, multi-interruption possible
• Standby mode
Sleep/stop
• Package
100-pin plastic QFP
• Piggyback/evaluator
CXP87800 100-pin ceramic PQFP
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E96X01-PS
CKOUT
ADJ
PWM0
DAA0
DAB0
PWM1
DAA1
DAB1
PWM
RMC
CFG
DFG
DPG
PBCTL
SYNC0
SYNC1
EXI0
EXI1
TO/DDO
FIFO
RAM
FIFO
AVss
12 BIT PWM GENERATOR CH1
12 BIT PWM GENERATOR CH0
14 BIT PWM GENERATOR
VISS/VASS
FIFO
SERVO INPUT
CONTROL
REMOCON INPUT
CTL
DRUM
CAPSTAN
VSYNC SEPARATOR
8 BIT TIMER 1
8 BIT TIMER/COUNTER 0
SERIAL
INTERFACE UNIT
(CH1)
SI1
SO1
SCK1
EC
SERIAL
INTERFACE UNIT
(CH0)
CS0
SI0
SO0
SCK0
A/D CONVERTER
AVDD
SERIAL
INTERFACE UNIT
(CH2)
12
4
2
2
3
2
2
2
INT1/NMI
INT2
2
XTAL
RST
MP
32kHz
TIMER/COUNTER
PRESCALER/
TIME BASE TIMER
RAM
1376 BYTES
CH1
REALTIME
PULSE
GENERATOR
CH0
VDD
CLOCK
GENERATOR/
SYSTEM CONTROL
5
RAM
FIFO
ROM
40K/48K BYTES
SPC700
CPU CORE
A
A
AA
19
PROGRAMMABLE
PATTERN
GENERATOR
FRC
CAPTURE UNIT
INTERRUPT CONTROLLER
AVREF
SCL0
SCL1
SDA0
SDA1
AN0 to AN11
2
TEX
PPO0 to PPO18
PC0 to PC7
PD0 to PD7
PE0 to PE1
PE2 to PE7
8
8
2
6
PH0 to PH7
8
8
PJ0 to PJ7
PI1 to PI7
PG0 to PG7
8
7
PF4 to PF7
4
PF0 to PF3
PB0 to PB7
8
4
PA0 to PA7
8
PORT B
TX
EXTAL
RTO3 to RTO7
PORT A
PORT C
PORT D
PORT E
PORT F
PORT G
PORT H
PORT I
–2–
PORT J
Block Diagram
CXP87940/87948
Vss
INT0
CXP87940/87948
PI5/SCK1
PI4/INT1/NMI
PI3/TO/DDO/ADJ
PI2/PWM
PI1/RMC
TEX
TX
VDD
VSS
NC
PA7/PPO7
PA6/PPO6
PA5/PPO5
PA4/PPO4
PA3/PPO3
PA2/PPO2
PA1/PPO1
PA0/PPO0
PB7/PPO15
PB6/PPO14
Pin Assignment (Top View)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
PB5/PPO13
1
80
PI6/SO1
PB4/PPO12
2
79
PI7/SI1
PB3/PPO11
3
78
PE0/INT0/CKOUT
PB2/PPO10
4
77
PE1/EC/INT2
PB1/PPO9
5
76
PE2/PWM0
PB0/PPO8
6
75
PE3/PWM1
PC7/RTO7
7
74
PE4/DAA0
PC6/RTO6
8
73
PE5/DAA1
PC5/RTO5
9
72
PE6/DAB0
PC4/RTO4
10
71
PE7/DAB1
PC3/RTO3
11
70
PG0/CFG
PC2/PPO18
12
69
PG1/DFG
PC1/PPO17
13
68
PG2/DPG
PC0/PPO16
14
67
PG3/PBCTL
PJ7
15
66
PG4/SYNC0
PJ6
16
65
PG5/SYNC1
PJ5
17
64
PG6/EXI0
PJ4
18
63
PG7/EXI1
PJ3
19
62
AN0
PJ2
20
61
AN1
PJ1
21
60
AN2
PJ0
22
59
AN3
PD7
23
58
PF0/AN4
PD6
24
57
PF1/AN5
PD5
25
56
PF2/AN6
PD4
26
55
PF3/AN7
PD3/SDA1
27
54
AVDD
PD2/SDA0
28
53
AVREF
PD1/SCL1
29
52
AVSS
PD0/SCL0
30
51
PF4/AN8
PF5/AN9
PF6/AN10
PF7/AN11
SO0
SCK0
SI0
CS0
XTAL
EXTAL
VSS
RST
MP
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Note) 1. NC (Pin 90) is always connected to VDD.
2. Vss (Pins 41 and 88) are both connected to GND.
3. MP (Pin 39) is always connected to GND.
–3–
CXP87940/87948
Pin Description
Symbol
I/O
PA0/PPO0
to
PA7/PPO7
Output/
Real-time
output
(Port A)
8-bit output port. Data is
gated with PPO contents by
OR-gate and they are output.
(8 pins)
PB0/PPO8
to
PB7/PPO15
Output/
Real-time
output
(Port B)
8-bit output port. Data is
gated with PPO contents by
OR-gate and they are output.
(8 pins)
PC0/PPO16
to
PC2/PPO18
I/O/
Real-time
output
PC3/RTO3
to
PC7/RTO7
I/O/
Real-time
output
PD0/SCL0
PD1/SCL1
PD2/SDA0
PD3/SDA1
I/O
PD4 to PD7
PE0/INT0/
CKOUT
Description
(Port C)
8-bit I/O port. I/O can be set
in a unit of single bits.
Data is gated with PPO or
RTO contents by OR-gate
and they are output.
(8 pins)
Programmable pattern generator (PPG)
output.
Functions as high-precision real-time
pulse output port.
PB0 and PB2 can be 3-state controlled
with PPG.
(19 pins)
Real-time pulse generator (RTG) output.
Functions as high-precision real-time
pulse output port. PC3 can be 3-state
controlled with RTG. (5 pins)
(Port D)
8-bit I/O port. I/O can be set in a unit of
single bits for upper 4 bits.
Can drive 12mA sink current.
Lower 4-bit output is N-ch open drain.
(8 pins)
Input to request external
interruption.
Active at the falling edge.
Input/Input/Output
(Port E)
8-bit port.
Lower 2 bits
are for inputs;
upper 6 bits
are for outputs.
(8 pins)
Serial clock (CH2) I/O.
(2 pins)
Serial data (CH2) I/O.
(2 pins)
System clock
frequency dividing
output.
External event
Input to request external interruption.
input for
Active at the falling edge.
timer/counter.
PE1/EC/INT2
Input/Input/Input
PE2/PWM0
Output/Output
PE3/PWM1
Output/Output
PE4/DAA0
Output/Output
PE5/DAA1
Output/Output
PE6/DAB0
Output/Output
PE7/DAB1
Output/Output
AN0 to AN3
Input
PF0/AN4
to
PF3/AN7
Input/Input
PF4/AN8
to
PF7/AN11
Output/Input
(Port F)
8-bit port. Lower 4 bits are for inputs; upper 4 bits are for
outputs.
Lower 4 bits also serve as standby release input pin.
(8 pins)
SCK0
I/O
Serial clock (CH0) I/O.
SO0
Ouput
Serial data (CH0) output.
SI0
Input
Serial data (CH0) input.
CS0
Input
Serial chip select (CH0) input.
PWM outputs.
(2 pins)
DA gate pulse outputs.
(4 pins)
Analog inputs to A/D converter. (12 pins)
–4–
CXP87940/87948
Symbol
I/O
Description
PG0/CFG
Input/Input
Capstan FG input.
PG1/DFG
Input/Input
Drum FG input.
PG2/DPG
Input/Input
Drum PG input.
PG3/PBCTL
Input/Input
PG4/SYNC0
Input/Input
PG5/SYNC1
Input/Input
PG6/EXI0
Input/Input
PG7/EXI1
Input/Input
(Port G)
8-bit input port.
(8 pins)
Playback CTL pulse input.
External event input for timer/counter.
Composite sync signal input.
(2 pins)
External input to FRC capture unit.
(2 pins)
(Port H)
8-bit output port. N-ch open drain output of medium drive voltage (12V)
and large current (12mA).
(8 pins)
PH0 to PH7
Output
PI1/RMC
I/O/Input
Remote control reception circuit input.
PI2/PWM
I/O/Output
14-bit PWM output.
PI3/TO/
DDO/ADJ
I/O/Output/
Output/Output
PI4/INT1/
NMI
I/O/Input/Input
PI5/SCK1
I/O/I/O
PI6/SO1
I/O/Output
Serial data (CH1) output.
PI7/SI1
I/O/Input
Serial data (CH1) input.
PJ0 to PJ7
I/O
EXTAL
Input
XTAL
Output
TEX
Input
TX
Output
Connects a crystal oscillator for 32kHz timer/counter clock. The 32kHz
crystal oscillator is inserted between TEX and TX. When used as event
input, connect the clock source to TEX and leave TX open.
RST
Input
System reset; active at Low level.
MP
Input
Test mode input. Always connect to GND.
Timer/counter, CTL duty detection, 32kHz oscillation
adjustment output.
Input to request external interruption and
non-maskable interruption. Active at the falling edge.
Serial clock (CH1) I/O.
(Port J)
8-bit I/O port. I/O and standby release input function can be set in a
unit of single bits.
Connects a crystal oscillator for system clock. When supplying the
external clock, input the external clock to EXTAL and input the
opposite phase clock to XTAL .
Positive power supply of A/D converter.
AVDD
AVREF
(Port I)
7-bit I/O port.
I/O port can be
set in a unit of
single bits.
(7 pins)
Input
Reference voltage input of A/D converter.
AVss
GND of A/D converter.
VDD
Positive power supply. Connect VDD pin to VDD.
NC
No connected. Connect to VDD in normal operation.
Vss
GND. Connect both Vss pins to GND.
–5–
CXP87940/87948
Input/Output Circuit Formats for Pins
Pin
When reset
Circuit format
Port A
Port B
PA0 /PPO0
to
PA7/PPO7
PB4/PPO12
to
PB7/PPO15
AA
AA
AAAA
PPO data
Ports A, B data
Hi-Z
Output becomes active from high
impedance by data writing to port register.
Data bus
RD (Ports A, B)
12 pins
PB0/PPO8
PB2/PPO10
AA
AA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
PPO8, PPO10 data
PB0, PB2 data
Hi-Z
Data bus
RD (Port B)
2 pins
PPO9, PPO11 data
PPG control
status register
bit 0
3-state control selection
Output becomes active from high
impedance by data writing to port register.
AA
AA
PPO9, PPO11 data
PB1/PPO9
PB3/PPO11
PB1, PB3 data
Data bus
RD (Port B)
Output becomes active from high
impedance by data writing to port register.
2 pins
–6–
Hi-Z
CXP87940/87948
Pin
When reset
Circuit format
Port C
PC0/PPO16
to
PC2/PPO18
PC5/RTO5
to
PC7/RTO7
AA
AA
AA
AA
AAA
AAA
AAA
PPO, RTO data
Input
protection
circuit
Port C data
Hi-Z
IP
Port C direction
“0” when reset
Data bus
RD (Port C)
6 pins
AAA
AAA
AAA
AAAAA
AAAAA
AAAAA
AAA
AAA
AAA
RTO3 data
PC3 data
PC3/RTO3
PC3 direction
“0” when reset
AA
AA
AA
AA
Hi-Z
AA
AA
AA
AA
Hi-Z
IP
Data bus
RD (Port C)
RTO4 data
1 pin
RTG interruption
control register
bit 7
3-state control selection
“0” when reset
RTO4 data
PC4 data
PC4/RTO4
PC4 direction
“0” when reset
IP
Data bus
RD (PortC)
RTO data is OR-gate data of CH0 and CH1.
1 pin
–7–
CXP87940/87948
Pin
When reset
Circuit format
Port D
A
SCL, SDA
AAAA
AAAA
∗
Serial interface CH2
output enable
PD0/SCL0
PD1/SCL1
PD2/SDA0
PD3/SDA1
Port D data
AA
IP
Data bus
Schmitt input
RD (Port D)
SCL, SDA
(Serial interface CH2 circuit)
Hi-Z
BUS SW
To another serial CH2 pin
∗ Large current 12mA
4 pins
Port D
PD4 to PD7
AAAA
AAAA
AAAA
∗
Port D data
AA
AA
AA
AA
Hi-Z
IP
Port D direction
“0” when reset
Data bus
4 pins
∗ Large current 12mA
RD (Port D)
Port E
ESL0
Port E selection
ESL1
PS1
PS2
PS3
PE0/INT0/
CKOUT
AAA
AAA
01
10 MPX
11
Data bus
RD (Port E)
1 pin
Interruption circuit
–8–
AA
AA
AA
AA
IP
Hi-Z
CXP87940/87948
Pin
When reset
Circuit format
Port E
AAA
Data bus
IP
PE1/EC/INT2
Hi-Z
RD (Port E)
Interruption circuit/
event counter
1 pin
Port E
AA
AA
AAAA
AA
AAAA
AA
AAAA
AA
DA gate output,
PWM output
MPX
Hi-Z control
PE2/PWM0
PE3/PWM1
PE4/DAA0
PE5/DAA1
Port E data
Port/DA output
selection
Hi-Z
“0” when reset
Data bus
4 pins
RD (Port E)
Port E
AA
AA
AAAA
AA
AAAA
AAAA
AA
DA gate output
MPX
Hi-Z control
PE6/DAB0
PE7/DAB1
Port E data
Port/DA output
selection
High level
“1” when reset
Data bus
2 pins
AN0 to AN3
RD (Port E)
AAAA
Input multiplexer
IP
4 pins
–9–
Hi-Z
A/D converter
CXP87940/87948
Pin
When reset
Circuit format
AAAA
Port F
Input multiplexer
PF0/AN4
to
PF3/AN7
IP
A/D converter
Hi-Z
Data bus
4 pins
RD (Port F)
AAAA
AAAAAAAA
AAAA
Port F
PF4/AN8
to
PF7/AN11
Port F data
Data bus
RD
(Port F)
Port G
PG0/CFG
PG1/DFG
PG2/DPG
PG3/PBCTL
PG4/SYNC0
PG5/SYNC1
PG6/EXI0
PG7/EXI1
IP
Port/AD
selection
“0” when reset
4 pins
AAAA
AA
A/D converter
Schmitt input
Servo input
IP
Data bus
Hi-Z
RD (Port G)
Note) For PG4/SYNC0, PG5/SYNC1, CMOS Schmitt input and TTL Schmitt
input can be selected with the mask option.
Port H
AAAA
∗
Port H data
Data bus
8 pins
Hi-Z
Input multiplexer
8 pins
PH0 to PH7
AA
AA
AA
AA
RD (Port H)
– 10 –
AA
AA
∗ Large current 12mA
Medium drive voltage 12V
Hi-Z
CXP87940/87948
Pin
AAA
AAAAA
AA
AAAA
AA
AA
AAAA
AA
A
AAAA
A
AAA
AA
AAA
AA
AAA AA
AA
Circuit format
Port I
When reset
Port I function
selection
“0” when reset
PI2...14-bit PWM
PI3...Timer/counter,
CTL duty detection circuit,
32kHz timer
PI2/PWM
PI3/TO/
DDO/ADJ
MPX
Port I data
Port I direction
Hi-Z
IP
“0” when reset
Data bus
2 pins
RD (Port I)
Port I
PI1/RMC
PI4/INT1/NMI
PI7/SI1
Port I data
Port I direction
“0” when reset
IP
Hi-Z
Data bus
RD (Port I)
Schmitt input
PI1...Remote control circuit
PI4...Interruption circuit
PI7...Serial interface CH1
3 pins
AAAA
AAAA
AA
AAAA
AA
A
AAAA
AA
AAA
A
AAAA AAA
A
AAA
AAA
AAA
A
AAA
A
AA
A
Port I
Port I function
selection
PI5/SCK1
PI6/SO1
“0” when reset
Serial interface
CH1
MPX
Port I data
MPX
Port I direction
Hi-Z
IP
“0” when reset
Data bus
2 pins
RD (Port I)
Serial interface CH1
PI6 is not Schmitt input.
Port J
Port J data
Port J direction
PJ0 to PJ7
“0” when reset
IP
Data bus
RD
(PortJ)
Edge detection
Standby release
Data bus
8 pins
RD (Port J direction)
– 11 –
Hi-Z
CXP87940/87948
Pin
When reset
Circuit format
AA
A
AAA
CS0
SI0
Schmitt input
2 pins
AA
AA
SO0
SO0
Serial interface CH0
1 pin
SO0 output enable
SCK0
SCK0
Serial interface CH0
SCK0 output enable
Schmitt input
1 pin
2 pins
TEX
TX
2 pins
RST
AA
AA
AA
AA
AA
AA
AA
AA
EXTAL
XTAL
TEX
AA
AA
Hi-Z
Hi-Z
• Shows the circuit
composition during
oscillation.
IP
• Feedback resistor is removed
during stop mode and XTAL
becomes High level.
AA
AA
32kHz
timer/counter
IP
TX
AA
AA
AA AA
• Shows the circuit
composition during
oscillation.
• Feedback resistor is
removed during 32kHz
oscillation circuit stop
by software.
At this time TEX pin
outputs Low level and
TX pin outputs High level.
Oscillation
Oscillation
Pull-up resistor
Mask option
Schmitt input
OP
1 pin
AA
AA
AA
AA
IP
SCK0
EXTAL
XTAL
Hi-Z
CS0 Serial interface CH0
SIO
IP
IP
– 12 –
Low level
CXP87940/87948
Absolute Maximum Ratings
Item
(Vss = 0V reference)
Symbol
VDD
AVDD
Supply voltage
AVSS
AVREF
Symbol
Unit
–0.3 to +7.0
AVss to +7.0∗1
V
–0.3 to +0.3
AVss to +7.0∗1
V
Unit
V
V
Input voltage
VIN
Output voltage
VOUT
–0.3 to +7.0∗2
–0.3 to +7.0∗2
Medium drive output voltage
VOUTP
–0.3 to +15.0
V
High level output current
IOH
–5
mA
–50
mA
Total of output pins
IOL
15
mA
Ports excluding large current output
(value per pin)
IOLC
20
mA
Large current output port (value per pin∗3)
Low level total output current
∑IOL
130
mA
Total of output pins
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +150
°C
Allowable power dissipation
PD
600
mW
High level total output current ∑IOH
V
V
Low level output current
Port H pin
∗1 AVDD and AVREF should not exceed VDD + 0.3V.
∗2 VIN and VOUT should not exceed VDD + 0.3V.
∗3 The large current output ports are the pins of the port D (PD) and Port H (PH).
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding those conditions may adversely
affect the reliability of the LSI.
– 13 –
CXP87940/87948
Recommended Operating Conditions
Item
Supply voltage
Analog voltage
High level
input voltage
Symbol
(Vss = 0V reference)
Min.
Max.
Unit
Remarks
4.5
5.5
V
Guaranteed operation range for 1/2 and 1/4
frequency dividing modes
3.5
5.5
V
Guaranteed operation range for 1/16 frequency
dividing mode or during sleep mode
2.7
5.5
V
Guaranteed operation range by TEX clock
2.0
5.5
V
4.5
5.5
V
VIH
0.7VDD
VDD
V
VIHS
0.8VDD
VDD
V
5.5
V
VIHTS
2.2
5.5
V
CMOS Schmitt input∗7
TTL Schmitt input∗4
V
EXTAL pin∗5 and TEX pin∗6
VDD
AVDD
VIHEX
VDD – 0.4 VDD + 0.3
VIL
0
0.3VDD
V
VILS
0
0.2VDD
V
VILTS
0
0.8
V
VILEX
–0.3
0.4
V
Operating temperature Topr
–20
+75
°C
Low level
input voltage
∗1
∗2
∗3
∗4
∗5
∗6
∗7
Guaranteed data hold range during stop
mode
∗1
Includes the serial CH2 input∗2
CMOS Schmitt input∗3 and PE0/INT0 pin
Includes the serial CH2 input∗2
CMOS Schmitt input∗3 and PE0/INT0 pin
TTL Schmitt input∗4
EXTAL pin∗5 and TEX pin∗6
AVDD and VDD should be set to the same voltage.
Normal input port (PC, PD4 to PD7, PF0 to PF3, PG, PI and PJ), MP pin
SCK0, RST, EC/INT2, RMC, INT1/NMI, SCK1 and SI1
PG4 and PG5 (When TTL Schmitt input is selected with mask option)
Specifies only when the external clock is input.
Specifies only when the external event count clock is input.
CS0, SI0, and PG (For PG4 and PG5, when CMOS Schmitt input is selected with mask option.)
– 14 –
CXP87940/87948
Electrical Characteristics
DC Characteristics (VDD = 4.5 to 5.5V)
Item
High level
output voltage
Low level
output voltage
Symbol
VOH
VOL
IIHE
Pins
IIHT
Typ.
Max.
Unit
4.0
V
VDD = 4.5V, IOH = –1.2mA
3.5
V
VDD = 4.5V, IOL = 1.8mA
0.4
V
VDD = 4.5V, IOL = 3.6mA
0.6
V
PD, PH
VDD = 4.5V, IOL = 12.0mA
1.5
V
PD0 to PD3
(SCL0, CSL1
SDA0, SDA1)
VDD = 4.5V, IOL = 3.0mA
0.4
V
VDD = 4.5V, IOL = 6.0mA
0.6
V
EXTAL
VDD = 5.5V, VIH = 5.5V
0.5
40
µA
VDD = 5.5V, VIL = 0.4V
–0.5
–40
µA
VDD = 5.5V, VIH = 5.5V
0.1
10
µA
–0.1
–10
µA
–1.5
–400
µA
TEX
IILR
RST∗1
VDD = 5.5V,
VIL = 0.4V
IIZ
PA to PG,
PI, PJ, MP
AN0 to AN3,
CS0, SI0, SO0
SCK0, RST∗1
VDD = 5.5V,
VI = 0, 5.5V
±10
µA
PH
VDD = 5.5V
VOH = 12V
50
µA
PD0 to PD3
VDD = 5.5V
VOH = 5.5V
10
µA
120
Ω
Open drain
output leakage
ILOH
current (in N-CH
Tr off state)
Serial interface
CH2 bus switch
connection
impedance
(in output Tr off
state)
Min.
VDD = 4.5V, IOH = –0.5mA
IILT
I/O leakage
current
Conditions
PA to PC,
PD4 to PD7,
PE2 to PE7,
PF4 to PF7,
PH (VOL only)
PI1 to PI7
PJ, SO0, SCK0
IILE
Input current
(Ta = –20 to +75°C, Vss = 0V reference)
RBS
VDD = 4.5V
SCL0: SCL1
VSCL0 = VSCL1 = 2.25V
SDA0: SDA1
VSDA0 = VSDA1 = 2.25V
– 15 –
CXP87940/87948
Item
Symbol
Pins
Conditions
Min.
Typ.
Max.
Unit
VDD = 5.5V, 16MHz crystal
oscillation (C1 = C2 = 16pF)
36
50
mA
VDD = 3V, 32kHz crystal
oscillation (C1 = C2 = 47pF)
60
100
µA
2.8
8
mA
10
30
µA
10
µA
20
pF
1/2 frequency dividing clock operation
IDD1
IDD2
Supply
current∗2
Input
capacity
Sleep mode
IDDS1
VDD
VDD = 5.5V, 16MHz crystal
oscillation (C1 = C2 = 16pF)
IDDS2
VDD = 3V, 32kHz crystal
oscillation (C1 = C2 = 47pF)
IDDS3
Stop mode
VDD = 5.5V, termination of 16MHz
and 32kHz crystal oscillation
CIN
PC, PD,
PE0, PE1,
PF, PG,
PI1 to PI7,
PJ, CS0,
Clock 1MHz
SI0, SCK0, 0V for all pins excluding measured
AN0 to AN3, pins
EXTAL,
XTAL, TEX,
TX, MP,
RST
10
∗1 RST pin specifies the input current when the pull-up resistor is selected, and specifies leakage current
when non-resistor is selected.
∗2 When all output pins are open.
– 16 –
CXP87940/87948
AC Characteristics
(1) Clock timing
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Pins
Min.
Conditions
System clock frequency
fC
XTAL
Fig. 1,
EXTAL Fig. 2
1
System clock input
pulse width
tXL,
tXH
XTAL
Fig. 1,
EXTAL Fig. 2 (External clock drive)
28
System clock input
rise and fall times
XTAL
Fig. 1, Fig. 2
EXTAL (External clock drive)
Event count input clock
rise and fall times
tCR,
tCF
tEH,
tEL
tER,
tEF
System clock frequency
fC
Event count input clock
pulse width
tTL,
tTH
tTR,
tTF
Event count input clock
pulse width
Event count input clock
rise and fall times
Typ.
Max.
Unit
16
MHz
ns
200
4tsys∗1
EC
Fig. 3
EC
Fig. 3
TEX
TX
Fig. 2 VDD = 2.7 to 5.5V
(32kHz clock applied condition)
TEX
Fig. 3
TEX
Fig. 3
ns
ns
20
ns
kHz
32.768
µs
10
20
ms
∗1 tsys indicates three values according to the contents of the clock control register (CLC: 00FEH) upper 2 bits
(CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”)
Fig. 1. Clock timing
1/fc
VDD – 0.4V
EXTAL
0.4V
tXH
tCF
tXL
tCR
Fig. 2. Clock applied condition
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA AAAA AAAA
Crystal oscillation
Ceramic oscillation
EXTAL
C1
32kHz clock applied condition
crystal oscillation
External clock
EXTAL
XTAL
C2
TEX
XTAL
TX
C1
74HC04
C2
Fig. 3. Event count clock timing
0.8VDD
TEX
EC
0.2VDD
tEH
tEF
tEL
tER
tTH
tTF
tTL
tTR
– 17 –
CXP87940/87948
(2) Serial transfer (CH0)
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Pin
Condition
Min.
Max.
Unit
CS0 ↓ → SCK0
delay time
tDCSK
SCK0
Chip select transfer mode
(SCK = output mode)
tsys + 200
ns
CS0 ↑ → SCK0
floating delay time
tDCSKF SCK0
Chip select transfer mode
(SCK = output mode)
tsys + 200
ns
CS0 ↓ → SO0
delay time
tDCSO
SO0
Chip select transfer mode
tsys + 200
ns
CS0 ↓ → SO0
floating delay time
tDCSOF SO0
Chip select transfer mode
tsys + 200
ns
CS0
High level width
tWHCS CS0
Chip select transfer mode
tsys + 200
ns
SCK0
cycle time
Input mode
SCK0
2tsys + 200
ns
tKCY
16000/fc
ns
SCK0
High and Low level widths
tKH
tKL
tsys + 100
ns
SCK0
Output mode
8000/fc – 100
ns
SI0 input setup time
(for SCK0 ↑)
SCK input mode
SI0
–tsys + 100
ns
tSIK
200
ns
SI0 input hold time
(for SCK0 ↑)
SI0
2tsys + 100
ns
tKSI
100
ns
SCK0 ↓ → SO0 delay time
tKSO
SO0
Output mode
Input mode
SCK output mode
SCK input mode
SCK output mode
SCK input mode
SCK output mode
2tsys + 200
ns
100
ns
Note 1) tsys indicates three values according to the contents of the clock control register (CLC: 00FEH) upper
2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”)
Note 2) The load of SCK0 output mode and SO0 output delay time is 50pF + 1TTL.
– 18 –
CXP87940/87948
Fig. 4. Serial transfer CH0 timing
tWHCS
CS0
0.8VDD
0.2VDD
tKCY
tDCSK
tKL
tDCSKF
tKH
0.8VDD
0.8VDD
SCK0
0.2VDD
tSIK
tKSI
0.8VDD
Input
data
SI0
0.2VDD
tDCSO
tKSO
tDCSOF
0.8VDD
SO0
Output
data
0.2VDD
– 19 –
CXP87940/87948
Serial transfer (CH1) (SIO mode)
Item
Symbol
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Pin
Condition
tKCY
SCK1
SCK1 High and Low
level widths
tKH
tKL
SCK1
SI1 input setup time
(for SCK1 ↑)
tSIK
SI1
SI1 input hold time
(for SCK1 ↑)
tKSI
SI1
SCK1 ↓ → SO1 delay time
tKSO
SO1
Max.
Unit
2tsys + 200
ns
Output mode
16000/fc
ns
Input mode
tsys +100
ns
8000/fc – 50
ns
SCK1 input mode
100
ns
SCK1 output mode
200
ns
tsys + 200
ns
100
ns
Input mode
SCK1 cycle time
Min.
Output mode
SCK1 input mode
SCK1 output mode
SCK1 input mode
SCK1 output mode
tsys + 200
ns
100
ns
Note 1) tsys indicates three values according to the contents of the clock control register (CLC: 00FEH) upper
2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”)
Note 2) The load of SCK1 output mode and SO1 output delay time is 50pF + 1TTL.
Fig. 5. Serial transfer CH1 timing (SIO mode)
tKCY
tKL
tKH
SCK1
0.8VDD
0.2VDD
tSIK
tKSI
0.8VDD
SI1
Input data
0.2VDD
tKSO
0.8VDD
Output data
SO1
0.2VDD
– 20 –
CXP87940/87948
Serial transfer (CH1) (Special mode) (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pin
Condition
Min.
∗1
Typ.
Max.
Unit
SO1 cycle time
tLCY
SO1
SI1
SI1 data setup time
tLSU
tLHD
SI1
2
µs
SI1
2
µs
SI1 data hold time
∗1
104
µs
tLCY is specified only when serial mode register (CH1) (SIOM1: 05FZH) lower 2 bits (SO1 clock selection)
are set at 104µs.
Note) The load of SO1 pin is 50pF + 1TTL.
Fig. 6. Serial transfer CH1 timing (Special mode)
tLCY
SO1
tLCY
Start bit
Output data bit
0.5VDD
tLCY/2
tLSU
tLHD
Input
data bit
SI1
– 21 –
0.8VDD
0.2VDD
CXP87940/87948
Serial transfer (CH2)
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Item
Pin
Condition
Min.
Max.
Unit
400
kHz
SCL0, SCL1 clock frequency
fSLC
SCL0, SCL1
Bus-free time before starting transfer
tBUF
SDA0, SCL1
SDA0, SCL1
2.6
µs
Hold time for starting transfer
tHD; STA
SDA0, SCL1
SDA1, SCL1
1.0
µs
Clock Low level width
SCL0, SCL1
1.0
µs
Clock High level width
tLOW
tHIGH
SCL0, SCL1
1.0
µs
Setup time for repeated transfers
tSU; STA
SDA0, SCL0
SDA0, SCL1
1.0
µs
Data hold time
tHD; DAT
SDA0, SCL0
SDA1, SCL1
0∗1
µs
Data setup time
tSU; DAT
SDA0, SCL0
SDA1, SCL1
100
ns
SDA0, SCL0, SDA1, SCL1 rise time
tR
SDA0, SCL0
SDA1, SCL1
300
ns
SDA0, SCL0, SDA1, SCL1 fall time
tF
SDA0, SCL0
SDA1, SCL1
300
ns
Setup time for transfer completion
tSU; STO
SDA0, SCL0
SDA1, SCL1
1.6
µs
∗1 The SCL0, SCL1 fall time (300ns Max.) is not included in the data hold time.
Fig. 7. Serial transfer CH2 timing
SDA0
SDA1
tBUF
SCL0
SCL1
tR
tF
tHD; STA
tHD; STA
tSU; STA
P
S
tLOW
tHD; DAT
tHIGH
tSU; DAT
St
tSU; STO
P
Fig. 8. Device recommended circuit
Device
RS
Device
RS RS
R S RP
RP
SDA0
(or SDA1)
SCL0
(or SCL1)
• A pull-up resistor (RP) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1).
• The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300Ω or less) can be used to reduce the
spike noise caused by CRT flashover.
– 22 –
CXP87940/87948
(3) A/D converter characteristics
(Ta = –20 to +75°C, VDD = AVDD = 4.5 to 5.5V, AVREF = 4.0 to AVDD, Vss = AVSS = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Typ.
Max.
Unit
8
Bits
±1
LSB
±2
LSB
Resolution
Ta = 25°C
VDD = AVDD = AVREF = 5.0V
VSS = AVSS = 0V
Linearity error
Absolute error
160/fADC∗1
12/fADC∗1
tCONV
tSAMP
Conversion time
Sampling time
Reference input voltage VREF
Analog input voltage
VIAN
AVREF
AN0 to AN11
IREF
AVREF current
IREFS
µs
AVDD – 0.5
AVDD
V
0
AVREF
V
1.0
mA
10
µA
0.6
Operation mode
AVREF
µs
Sleep mode
Stop mode
32kHz operation mode
Fig. 9. Definitions of A/D converter terms
∗1 fADC indicates the below values due to the peripheral
clock control register (PCC: 05F8H) bit 3 and clock control
register (CLC: 00FEH) upper 2 bits.
Digital conversion value
FFH
FEH
PCC bit 3
0 (φ/2 selection) 1 (φ selection)
CLC upper 2 bits
Linearity error
01H
00H
00 (φ = fEX/2)
fADC = fc/2
fADC = fc
01 (φ = fEX/4)
fADC = fc/4
fADC = fc/2
11 (φ = fEX/16)
fADC = fc/16
fADC = fc/8
Analog input
– 23 –
CXP87940/87948
(4) Interruption, reset input
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
External interruption
High and Low level widths
tIH
tIL
INT0
INT1
INT2
NMI
PJ0 to PJ7
Reset input Low level width
tRSL
RST
Min.
Max.
Unit
1
µs
32/fc
µs
Fig. 10. Interruption input timing
INT0
INT1
INT2
NMI
PJ0 to PJ7
(During standby release input)
(Falling edge)
tIH
tIL
0.8VDD
0.2VDD
Fig. 11. RST input timing
tRSL
RST
0.2VDD
(5) Others
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
tCFH
tCFL
DFG input
tDFH
High and Low level widths tDFL
DPG minimum pulse width tDPW
CFG input
High and Low level widths
DPG minimum
removal time
trem
tCTH
tCTL
EXI input
tEIH
High and Low level widths tEIL
PBCTL input
High and Low level widths
Pins
Conditions
Min.
Max.
Unit
CFG
24tFRC + 200
ns
DFG
16tFRC + 200
ns
DPG
8tFRC + 200
ns
DPG
16tFRC + 200
ns
PBCTL
tsys = 2000/fc
8tFRC + 200 + tsys
ns
EXI0
EXI1
tsys = 2000/fc
8tFRC + 200 + tsys
ns
Note 1) tFRC = 1000/fc [ns]
Note 2) tsys indicates three values according to the contents of the clock control register (CLC: 00FEH)
upper 2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”)
– 24 –
CXP87940/87948
Fig. 12. Other timings
tCFH
tCFL
0.8VDD
CFG
0.2VDD
tDFH
tDFL
0.8VDD
DFG
0.2VDD
tDPW
trem
trem
0.8VDD
DPG
tCTH
tCTL
0.8VDD
PBCTL
0.2VDD
tEIH
EXI0
EXI1
tEIL
0.8VDD
0.2VDD
– 25 –
CXP87940/87948
Appendix
Fig. 13. Recommended oscillation circuit for SPC 700 series
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
AAAAA
(i)
EXTAL
(ii)
TEX
XTAL
Rd
C1
Manufacturer
RIVER
ELETEC
CO., LTD.
Rd
C2
Model
C2
C1
fc (MHz)
C1 (pF)
C2 (pF)
8.00
10
10
5
5
8.00
16
16
10.00
16
16
12.00
12
12
16.00
12
12
32.768kHz
30
18
10.00
HC-49/U03
TX
12.00
Rd (Ω)
Circuit
example
0
(i)
0
(i)
470k
(ii)
16.00
HC-49/U (-S)
KINSEKI LTD.
P3
Mask option table
Content
Item
Reset pin pull-up resistor
Input circuit format∗1
Non-existent
Existent
C-MOS Schmitt
TTL Schmitt
∗1 The input circuit format can be selected for PG4/SYNC0 and PG5/SYNC1, respectively.
– 26 –
CXP87940/87948
Characteristics Curve
IDD vs. VDD
IDD vs. fc
(fc = 16MHz, Ta = 25°C, Typical)
(VDD = 5.0V, Ta = 25°C, Typical)
1/2 dividing mode
1/4 dividing mode
10
40
1/16 dividing mode
Sleep mode
32kHz mode
(instruction)
0.1
32kHz
Sleep mode
0.01
(10µA)
IDD – Supply current [mA]
IDD – Supply current [mA]
30
1
20
1/2 dividing mode
10
1/4 dividing mode
1/16 dividing mode
Sleep mode
0
2.5
3.0
3.5 4.0
4.5
5.0
VDD – Supply voltage [V]
5.5
6.0
0
– 27 –
5
10
fc – System clock [MHz]
15
CXP87940/87948
Package Outline
Unit: mm
100PIN QFP (PLASTIC)
+ 0.4
14.0 – 0.01
17.9 ± 0.4
15.8 ± 0.4
+ 0.1
0.15 – 0.05
23.9 ± 0.4
+ 0.4
20.0 – 0.1
A
0.65
+ 0.35
2.75 – 0.15
±0.12 M
0° to 15°
DETAIL A
0.8 ± 0.2
(16.3)
0.15
PACKAGE STRUCTURE
SONY CODE
QFP-100P-L01
EIAJ CODE
∗QFP100-P-1420-A
JEDEC CODE
– 28 –
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER / 42 ALLOY
PACKAGE WEIGHT
1.4g