SST SST45VF010-10-4C-SA

512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
FEATURES:
• Single 2.7-3.6V Read and Write Operations
• Serial Interface Architecture
– SPI Compatible: Mode 0 and Mode 3
• Byte Serial Read with Single Command
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption:
– Active Current: 20 mA (typical)
– Standby Current: 10 µA (typical)
• Sector or Chip-Erase Capability
– Uniform 4 KByte sectors
• Fast Erase and Byte-Program:
– Chip-Erase Time: 70 ms (typical)
– Sector-Erase Time: 18 ms (typical)
– Byte-Program Time: 14 µs (typical)
• Automatic Write Timing
– Internal VPP Generation
• End-of-Write Detection
– Software Status
• 10 MHz Max Clock Frequency
1
• Hardware Reset Pin (RESET#)
– Resets the device to Standby Mode
• CMOS I/O Compatibility
3
• Hardware Data Protection
– Protects and unprotects the device
from Write operation
• Packages Available
– 8-Pin SOIC (4.9mm x 6mm)
2
4
5
6
7
PRODUCT DESCRIPTION
The SST45VF512, SST45VF010 and SST45VF020 are
manufactured with SST’s proprietary, high performance
CMOS SuperFlash technology. The Serial Flash is
organized as 16 sectors of 4096 Bytes for SST45VF512,
32 sectors of 4096 Bytes for the SST45VF010 and
64 sectors of 4096 Bytes for the SST45VF020. The
memory is accessed for Read or Erase/Program by the
SPI bus compatible serial protocol. The bus signals are:
serial data input (SI), serial data output (SO), serial clock
(SCK), write protect (WP#), chip enable (CE#), and
hardware reset (RESET#).
The SST45VFxxx devices are offered in 8-pin SOIC
package. See Figure 1 for the pinout.
Device Operation
The SST45VFxxx uses bus cycles of 8 bits each for
commands, data, and addresses to execute operations.
The operation instructions are listed in Table 2.
All instructions are synchronized off a high to low transition of CE#. The first low to high transition on SCK will
initiate the instruction sequence. Inputs will be accepted
on the rising edge of SCK starting with the most significant bit. Any low to high transition on CE# before the input
instruction completes will terminate any instruction in
progress and return the device to the standby mode.
Read
The Read operation outputs the data in order from the
initial accessed address. While SCK is input, the address
will be incremented automatically until end (top) of the
address space, then the internal address pointer automatically increments to beginning (bottom) of the address space (00000H), and data out stream will continue.
The read data stream is continuous through all addresses until terminated by a low to high transition on
CE#.
Sector/Chip-Erase Operation
The Sector-Erase operation clears all bits in the selected
sector to “FF”. The Chip-Erase instruction clears all bits
in the device to “FF”.
Byte-Program Operation
The Byte-Program operation programs the bits in the
selected byte to the desired data. The selected byte must
be in the erased state (“FF”) when initiating a Program
operation. The data is input from bit 7 to bit 0 in order.
Software Status Operation
The Status operation determines if an Erase or Program
operation is in progress. If bit 0 is at a “0” an Erase or
Program operation is in progress, the device is busy. If bit
0 is at a “1” the device is ready for any valid operation. The
status read is continuous with ongoing clock cycles until
terminated by a low to high transition on CE#.
© 2000 Silicon Storage Technology, Inc. The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice.
514-1 10/00
S71178
1
8
9
10
11
12
13
14
15
16
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
Reset
Reset will terminate any operation, e.g., Read, Erase
and Program, in progress. It is activated by a high to low
transition on the RESET# pin. The device will remain in
reset condition as long as RESET# is low. Minimum reset
time is 10µs. See Figure 14 for reset timing diagram.
RESET# is internally pulled-up and could remain unconnected during normal operation. After reset, the device is
in standby mode, a high to low transition on CE# is
required to start the next operation.
TABLE 1: PRODUCT IDENTIFICATION
An internal power-on reset circuit protects against accidental data writes. Applying a logic level low to RESET#
during the power-on process then changing to a logic
level high when VDD has reached the correct voltage
level will provide additional protection against accidental
writes during power on.
Write Protect
The WP# pin provides inadvertent write protection. The
WP# pin must be held high for any Erase or Program
operation. The WP# pin is “don’t care” for all other
operations. In typical use, the WP# pin is connected to
VSS with a standard pull-down resistor. WP# is then
driven high whenever an Erase or Program operation is
required. If the WP# pin is tied to VDD with a pull-up
resistor, then all operations may occur and the write
protection feature is disabled. The WP# pin has an
internal pull-up and could remain unconnected when not
used.
Manufacturer’s ID
Device ID
SST45VF512
SST45VF010
SST45VF020
Byte
0000 H
Data
BF H
0001 H
0001 H
0001 H
41 H
45 H
43 H
514 PGM T1.4
Read SST ID/Read Device ID
The Read SST ID and Read Device ID operations read
the JEDEC assigned manufacturer identification and the
manufacturer assigned device identification codes.
These codes may be used to determine the actual device
resident in the system.
FUNCTIONAL BLOCK DIAGRAM
SuperFlash
Cell Array
X - Decoder
Address
Buffers
and
Latches
Y - Decoder
I/O Buffers
and
Data Latches
Control Logic
Serial Interface
CE#
© 2000 Silicon Storage Technology, Inc.
SCK
SI
SO
WP# RESET#
2
514ILL B1.0
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
WP#
1
VDD
2 Standard Pinout 7
CE#
3
SCK
4
8
Top View
Die Up
RESET#
1
VSS
6
SO
5
SI
2
3
514 ILL F01.0
FIGURE 1: PIN ASSIGNMENTS FOR 8-PIN SOIC
4
TABLE 2: PIN DESCRIPTION
Symbol
Pin Name
SCK
Serial Clock
SI
Serial Data Input
SO
Serial Data Output
CE#
WP#
Chip Enable
Write Protect
RESET#
Reset
VDD
VSS
Power Supply
Ground
5
Functions
To provide the timing of the serial interface. Commands, addresses, or
input data are latched on the rising edge of the clock input, while output
data is shifted out on the falling edge of the clock input.
To transfer commands, addresses, or data serially into the device. Inputs
are latched on the rising edge of the serial clock.
To transfer data serially out of the device. Data is shifted out on the
falling edge of the serial clock.
The device is enabled by a high to low transition on CE#.
To protect the device from unintentional Write (Erase or Program)
operations. When WP# is low, all Erase and Program commands are
ignored. When WP# is high, the device may be erased or programmed.
This pin has an internal pull-up and could remain unconnected when not used.
A high to low transition on RESET# will terminate any operation in progress
and reset the internal logic to the standby mode. The device will remain in the
reset condition as long as the RESET# is low. Operations may only occur
when RESET# is high. This pin has an internal pull-up and could remain
unconnected when not used.
To provide power supply (2.7-3.6V).
514 PGM T2.2
6
7
8
9
10
11
12
13
14
15
16
© 2000 Silicon Storage Technology, Inc.
3
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
TABLE 3: DEVICE OPERATION INSTRUCTIONS
Bus Cycle
Operation/Type
Read
Sector-Erase2
Chip-Erase
Byte-Program
Software-Status
Read SST ID
Read Device ID3
1
Command
FFH
20H
60H
10H
9FH
90H
90H
2
Address1
A23-A16
A23-A16
X
A23-A16
Dout
X
X
3
Address
A15-A8
A15-A8
X
A15-A8
4
Address
A7-A0
X
X
A7-A0
X
X
A0=0
A0=1
5
Data
X
D0H
D0H
Din
6
Dummy
X
X
X
X
7 and after
Data
Dout
BFH
Device ID
514 PGM T3.3
Notes:
1. A23-A16 are “Don't Care” for SST45VF512, A23-A17 are “Don't Care” for SST45VF010, A23-A18 are “Don't Care” for SST45VF020.
2. A16-A12 are used to determine sector address, A11-A8 are don't care.
3. With A15-A1 = 0, SST45VF512 Device ID = 41H, is read with A0 = 1.
With A16-A1 = 0, SST45VF010 Device ID = 45H, is read with A0 = 1.
With A17-A1 = 0, SST45VF020 Device ID = 43H, is read with A0 = 1.
TABLE 4: DEVICE OPERATION TABLE
Operation
Read
Sector-Erase
Chip-Erase
Byte-Program
Software-Status
Reset2
Read SST ID
SI
X
X
X
Din
X
X
X
SO
Dout
X
X
X
Dout
X
Dout
CE#1
Low
Low
Low
Low
Low
X
Low
WP#
X
High
High
High
X
X
X
RESET#
High
High
High
High
High
Low
High
Read Device ID
X
Dout
Low
X
High
Notes:
1. A high to low transition on CE# will be required to start any device operation except for Reset.
2. The RESET# low will return the device to standby and terminate any Erase or Program operation in progress.
© 2000 Silicon Storage Technology, Inc.
4
514 PGM T4.1
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute maximum Stress
Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device
at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied.
Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias ................................................................................................................. -55°C to +125°C
Storage Temperature ...................................................................................................................... -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential ............................................................................ -0.5V to VDD + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential ........................................................ -1.0V to VDD + 1.0V
Package Power Dissipation Capability (Ta = 25°C) ........................................................................................... 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) ............................................................................... 240°C
Output Short Circuit Current1 ................................................................................................................................................................... 50 mA
1
2
3
4
5
OPERATING RANGE
Range
Ambient Temp
Commercial
0 °C to +70 °C
AC CONDITIONS OF TEST
VDD
2.7-3.6V
Input Rise/Fall Time ......... 5 ns
6
Output Load ..................... CL = 30 pF
See Figures 2 and 3
TABLE 5: DC OPERATING CHARACTERISTICS VDD = 2.7-3.6V
Limits
Symbol Parameter
Min
Max Units
IDD
ISB
ILI
ILO
IIL
VIL
VIH
VIHC
VOL
VOH
Power Supply Current
Read
Program and Erase
Standby Current
Input Leakage Current
Output Leakage Current
Input Low Current(2)
Input Low Voltage
Input High Voltage
0.7 VDD
Input High Voltage (CMOS) VDD-0.3
Output Low Voltage
Output High Voltage
VDD-0.2
20
30
15
1
1
360
0.8
mA
mA
µA
µA
µA
µA
V
V
V
V
V
0.2
7
8
Test Conditions
9
f = 10 MHz
CE# = VIL, VDD = VDD Max.
CE# = VIL, VDD = VDD Max.
CE# = VIHC, VDD = VDD Max.
VIN =GND to VDD, VDD = VDD Max.
VOUT =GND to VDD, VDD = VDD Max.
WP#, RESET# = GND
VDD = VDD Min.
VDD = VDD Max.
VDD = VDD Max.
IOL = 100 µA, VDD = VDD Min.
IOH = -100 µA, VDD = VDD Min.
10
11
12
13
514 PGM T5.2
Note: 1. Outputs shorted for no more than one second. No more than one output shorted at a time.
2. This parameter only applies to WP# and RESET# pins.
14
15
16
© 2000 Silicon Storage Technology, Inc.
5
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
TABLE 6: CAPACITANCE (Ta = 25 °C, f=1 Mhz, other pins open)
Parameter
Description
Test Condition
COUT
CIN1
1
Output Pin Capacitance
Input Capacitance
Maximum
VOUT = 0V
VIN = 0v
12 pF
6 pF
514 PGM T6.0
TABLE 7: RELIABILITY CHARACTERISTICS
Symbol
Parameter
1
NEND
TDR1
VZAP_HBM1
VZAP_MM1
ILTH1
Minimum Specification
Units
Test Method
10,000
100
2000
Cycles
Years
Volts
JEDEC Standard A117
JEDEC Standard A103
JEDEC Standard A114
200
Volts
JEDEC Standard A115
100 + IDD
mA
Endurance
Data Retention
ESD Susceptibility
Human Body Model
ESD Susceptibility
Machine Model
Latch Up
JEDEC Standard 78
514 PGM T7.0
Note: 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 8: AC OPERATING CHARACTERISTICS VDD = 2.7-3.6V
Symbol
FCLK
TSCKH
TSCKL
TCES
TCEH
TCPH
TCHZ
TCLZ
TRLZ
TDS
TDH
TOH
TV
TWPS
TWPH
TSE
TSCE
TBP
TRST
TREC
TPURST
Parameter
Serial Clock Frequency
Serial Clock High Time
Serial Clock Low Time
CE# Setup Time
CE# Hold Time
CE# High Time
CE# High to High-Z Output
CE# Low to Low-Z Output
RESET# Low to High-Z Output
Data In Setup Time
Data In Hold Time
Output Hold from SCK Change
Output Valid from SCK
Write Protect Setup Time
Write Protect Hold Time
Sector-Erase
Chip-Erase
Byte-Program
Reset Pulse Width
Reset Recovery Time
Reset Time After Power-Up
Min
Limits
Max
10
45
45
250
250
250
25
0
25
20
20
0
35
10
10
25
100
20
10
1
10
Units
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
µs
µs
µs
µs
514 PGM T8.2
© 2000 Silicon Storage Technology, Inc.
6
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
1
VIHT
VIT
INPUT
REFERENCE POINTS
VOT
2
OUTPUT
VILT
3
514 ILL F02.0
AC test inputs are driven at VIHT (0.9 VDD) for a logic “1” and VILT (0.1 VDD) for a logic “0”.
Measurement reference points for inputs and outputs are at VIT (0.5 VDD) and VOT (0.5 VDD)
Input rise and fall times (10%
90%) are <5 ns.
«ÿ
4
Note: VIT–VINPUT Test
VOT–VOUTPUT Test
VIHT–VINPUT HIGH Test
VILT–VINPUT LOW Test
FIGURE 2: AC INPUT/OUTPUT REFERENCE WAVEFORMS
5
6
7
8
TO TESTER
9
TO DUT
10
CL
514 ILL F03.0
11
FIGURE 3: A TEST LOAD EXAMPLE
12
13
14
15
16
© 2000 Silicon Storage Technology, Inc.
7
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
WP#
TCPH
CE#
TSCKH TSCKL
TCES
TCEH
SCK
TDS
SI
SO
TDH
DATA VALID
HIGH-Z
HIGH-Z
514 ILL F04.0
FIGURE 4: SERIAL INPUT TIMING DIAGRAM (INACTIVE SERIAL CLOCK LOW - MODE 0)
WP#
CE#
TSCKH TSCKL
TCEH
SCK
TCHZ
TOH
TCLZ
DATA VALID
SO
TV
SI
514 ILL F05.0
FIGURE 5: SERIAL OUTPUT TIMING DIAGRAM (INACTIVE SERIAL CLOCK LOW - MODE 0)
© 2000 Silicon Storage Technology, Inc.
8
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
1
WP#
2
TCPH
CE#
TCES
TSCKL TSCKH
3
TCEH
SCK
TDS
SI
SO
4
TDH
DATA VALID
5
HIGH-Z
HIGH-Z
514 ILL F17.0
6
7
FIGURE 6: SERIAL INPUT TIMING DIAGRAM (INACTIVE SERIAL CLOCK HIGH - MODE 3)
8
9
WP#
10
CE#
TSCKH TSCKL
TCEH
11
SCK
TCHZ
TOH
TCLZ
12
DATA VALID
SO
TV
13
SI
514 ILL F18.0
14
15
FIGURE 7: SERIAL OUTPUT TIMING DIAGRAM (INACTIVE SERIAL CLOCK HIGH - MODE 3)
© 2000 Silicon Storage Technology, Inc.
9
16
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
TWPS
TWPH
WP#
CE#
TSE
0 1 2 3 4 5
6 7 8
15 16
23 24
31 32
47
39 40
SCK
0 0 1 0 0 0 0 0
SI
ADD.
ADD.
D0H
X
SELF-TIMED SECTORERASE CYCLE
X
HIGH IMPEDANCE
SO
514 ILL F06.1
FIGURE 8: SECTOR-ERASE TIMING DIAGRAM
TWPS
TWPH
WP#
CE#
TSCE
0 1 2 3 4 5
6 7 8
15 16
23 24
31 32
39 40
47
SCK
SI
0 1 1 0 0 0 0 0
SO
X
X
X
D0H
SELF-TIMED CHIPERASE CYCLE
X
HIGH IMPEDANCE
514 ILL F07.1
FIGURE 9: CHIP-ERASE TIMING DIAGRAM
© 2000 Silicon Storage Technology, Inc.
10
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
1
TWPS
TWPH
WP#
2
CE#
3
0 1 2 3 4 5
6 7 8
15 16
23 24
31 32
39 40
47
SCK
SI
0 0 0 1 0 0 0 0
ADD.
ADD.
ADD.
Din
MSB
TBP
SELF-TIMED BYTEPROGRAM CYCLE
4
5
X
LSB
HIGH IMPEDANCE
SO
6
514 ILL F08.1
7
FIGURE 10: BYTE-PROGRAM TIMING DIAGRAM
8
9
10
WP#
11
CE#
0 1 2 3 4 5
6 7 8
15 16
23 24
31 32
39 40
47 48
55 56
63 64
71
12
SCK
13
SI
1 1 1 1 1 1 1 1
SO
ADD.
ADD.
HIGH IMPEDANCE
ADD.
X
X
N
Dout
N+1
Dout
MSB
MSB
N+2
Dout
MSB
514 ILL F10.1
15
16
FIGURE 11: READ TIMING DIAGRAM
© 2000 Silicon Storage Technology, Inc.
14
11
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
WP#
CE#
0 1 2 3 4 5
6 7 8
15 16
23 24
31 32
39 40
47 48
55 56
63 64
71
SCK
1 0 0 1 0 0 0 0
SI
X
ADD1
X
HIGH IMPEDANCE
SO
Dout1
MSB
LSB
514 ILL F19.5
Note: 1. SST Manufacturer's ID = BFH is read with A0=0
SST45VF512 Device ID = 41H is read with A0=1
SST45VF010 Device ID = 45H is read with A0=1
SST45VF020 Device ID = 43H is read with A0=1
FIGURE 12: READ-ID TIMING DIAGRAM
WP#
CE#
0 1 2 3 4 5
6 7 8
9 10 11 12 13 14 15 16
23 24
31
SCK
SI
SO
1 0 0 1 1 1 1 1
HIGH IMPEDANCE
DATA
MSB
DATA
MSB
DATA
MSB
514 ILL F11.1
FIGURE 13: SOFTWARE-STATUS TIMING DIAGRAM
© 2000 Silicon Storage Technology, Inc.
12
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
1
CE#
TREC
TCES
...
SCK
2
TRST
3
RESET#
SO
...
SI
...
HIGH IMPEDANCE
TRLZ
4
HIGH IMPEDANCE
5
514 ILL F20.0
6
FIGURE 14: RESET TIMING DIAGRAM (INACTIVE CLOCK POLARITY LOW SHOWN)
7
8
VDD
TPURST
9
RESET#
10
TREC
CE#
11
514 ILL F13.0
FIGURE 15: POWER-ON RESET TIMING DIAGRAM
12
TWPS
13
TWPH
WP#
14
TCPH
CE#
TCES
15
TCEH
SCK
514 ILL F14.0
FIGURE 16: WRITE PROTECT TIMING DIAGRAM
© 2000 Silicon Storage Technology, Inc.
13
S71178
514-1 10/00
16
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
Device
SST45VFxxx
-
Speed Suffix1
XXX - XX -
Suffix2
XX
Package Modifier
A = 8 pins
Package Type
S = SOIC
Temperature Range
C = Commercial = 0° to 70°C
Minimum Endurance
4 = 10,000 cycles
Operating Frequency
10 = 10 MHz
Device Density
512 = 512 Kilobit
010 = 1 Megabit
020 = 2 Megabit
Voltage Range
V = 2.7-3.6V
SST45VF512 Valid combinations
SST45VF512-10-4C-SA
SST45VF010 Valid combinations
SST45VF010-10-4C-SA
SST45VF020 Valid combinations
SST45VF020-10-4C-SA
Example: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales
representative to confirm availability of valid combinations and to determine availability of new combinations.
© 2000 Silicon Storage Technology, Inc.
14
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
PACKAGING DIAGRAMS
1
4.00
3.80
2
6.20
5.80
3
Pin #1
Identifier
4
5.0
4.8
5
7˚
4 places
45˚
1.75
1.35
7˚
4 places
.51
.33
Note:
1.27 BSC
0.25
0.19
0.25
0.10
6
0˚
8˚
1.27
0.40
7
8.soic-SA-ILL.3
8
1. Complies with JEDEC publication 95 MS-012 AA dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
9
8-PIN SMALL OUTLINE INTEGRATED CIRCUIT PACKAGE (SOIC)
SST PACKAGE CODE: SA
10
11
12
13
14
15
16
© 2000 Silicon Storage Technology, Inc.
15
S71178
514-1 10/00
512 Kbit / 1 Mbit / 2 Mbit Serial Flash
SST45VF512 / SST45VF010 / SST45VF020
Advance Information
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.ssti.com • Literature FaxBack 888-221-1178, International 732-544-2873
© 2000 Silicon Storage Technology, Inc.
16
S71178
514-1 10/00