www.ti.com SLLS266F − FEBRUARY 1997 − REVISED JULY 2004 FEATURES D Design to Protect Submicron 3-V or 5-V Circuits from Noise Transients APPLICATIONS D USB 1.1 Host, Hub, or Peripheral Ports D Port ESD Protection Capability Exceeds: DESCRIPTION The SN65220 is a single transient voltage suppressor and the SN65240 and SN75240 are dual transient voltage suppressors designed to provide electrical noise transient protection to Universal Serial Bus (USB) 1.1 ports. Note that the input capacitance of the device makes it unsuitable for high-speed USB 2.0 applications. SN65220DBV (TOP VIEW)† NC 1 GND 2 NC 3 6 A 5 GND A A1 A2 GND 4 B B B1 B2 GND SN65240P, SN65240PW SN75240P, SN75240PW (TOP VIEW) GND C GND D 1 2 3 4 8 7 6 5 A GND B GND CURRENT vs VOLTAGE 7.5 5 2.5 Current − A EQUIVALENT SCHEMATIC DIAGRAM A or C SN65220YZB (Size: 925 mm x 925 mm +6 mm) (TOP VIEW) NC − No internal connection †When read horizontally, Pin 1 is the bottom left pin. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the USB transceiver and/or the USB ASIC if they are of sufficient magnitude and duration. USB ports are typically implemented in 3-V or 5-V digital CMOS with very limited ESD protection. The SN65220, SN65240, and SN75240 can significantly increase the port ESD protection level and reduce the risk of damage to the circuits of the USB port. The IEC1000-4-2 ESD performance of the SN65220, SN65240, and SN75240 is measured at the system level. Therefore, system design impacts the results of these tests. A high compliance level may be attained with proper board design and layout. SADI D D D D − 15-kV Human Body Model − 2-kV Machine Model Available in a WCSP Chip-Scale Package Stand-Off Voltage . . . 6.0 V Min Low Current Leakage . . . 1 µA Max at 6 V Low Capacitance . . . 35 pF Typ 0 −2.5 −5 −7.5 GND −10 −10 −5 0 5 10 15 Voltage − V B or D (One Suppressor Shown) NOTE: All GND terminals should be connected to ground. NOTE A: Typical current versus voltage curve was derived using the IEC 1.2/50-µs surge waveform. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ Copyright 1997 − 2003, Texas Instruments Incorporated www.ti.com SLLS266F − FEBRUARY 1997 − REVISED JULY 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. IEC1000-4-2 COMPLIANCE LEVEL MAXIMUM TEST VOLTAGE IEC1000-4-2 COMPLIANCE LEVEL CONTACT DISCHARGE (kV) AIR DISCHARGE (kV) 1 2 2 2 4 4 3 6 8 4 8 15 PACKAGE/ORDERING INFORMATION PRODUCT SUPRESSORS SN65220 SN65240 SN75240 1 2 2 TA PACKAGE PACKAGE DESIGNATOR MARKED AS WCSP−4 YZB NWP or 65220 SOT23−6 DBV SADI DIP−8 P TSSOP−8 PW DIP−8 P −40°C to 85°C −40°C −40 C to 85 85°C C 0°C 0 C to 70 70°C C TSSOP−8 PW ORDER NUMBER SN65220YZBR (Reel) SN65220YZBT (Mini Reel) SN65220DBVR (Mini Reel) SN65220DBVT (Mini Reel) SN65240P (Rail) A65240 SN65240PW (Rail) SN65240PWR (Reel) SN75240P (Rail) A75240 SN75240PW (Rail) SN75240PWR (Reel) ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Continuous power dissipation Electrostatic discharge See Dissipation Rating Table 15 kV(2), 2 kV(3) Peak power dissipation, PD(peak) 60 W Peak forward surge current, IFSM 3A Peak reverse surge current, IRSM −9 A Storage temperature range, Tstg −65°C to 150°C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Human Body Model − Tested in accordance with JEDEC Standard 22, Test Method A114−A. (3) Charged Device Model − Tested in accordance with JEDEC Standard 22, Test Method C101. 2 www.ti.com SLLS266F − FEBRUARY 1997 − REVISED JULY 2004 DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DBV P TA = 70°C POWER RATING TA = 85°C POWER RATING 385 mW DERATING FACTOR ABOVE TA = 25°C‡ 3.1 mW/°C 246 mW 200 mW 1150 mW 9.2 mW/°C 736 mW 598 mW PW 520 mW 4.2 mW/°C 331 mW 268 mW ‡ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. recommended operating conditions SN75240 Operating free-air temperature, TA SN65220, SN65240 MIN MAX 0 70 −40 85 UNIT °C electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS Ilkg V(BR) Leakage current Breakdown voltage VI = 6 V at A, B, C, or D terminals VI = 1 mA at A, B, C, or D terminals CIN Input capacitance to ground VI = 0.4 sin (4E6πt) + 0.5 V MIN TYP 6.5 7 35 MAX UNIT 1 µA 8 V pF APPLICATION INFORMATION Full-Speed or Low-Speed USB Host-or-Hub Port Transceiver Full-Speed or Low-Speed USB Down Stream Transceiver 1.5 kΩ (Full Speed Only) 27 Ω D+ A A 15 kΩ 15 kΩ 27 Ω GND SN75220 or 1/2 SNx5240 B 27 Ω D+ D− SN75220 or 1/2 SNx5240 D− B GND 1.5 kΩ (Low Speed Only) 27 Ω 3 PACKAGE OPTION ADDENDUM www.ti.com 1-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65220DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65220DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65220YZBR ACTIVE DSBGA YZB 4 3000 None Call TI Level-1-260C-UNLIM SN65220YZBT ACTIVE DSBGA YZB 4 250 None Call TI Level-1-260C-UNLIM SN65240P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC Lead/Ball Finish MSL Peak Temp (3) SN65240PW ACTIVE TSSOP PW 8 150 None CU NIPDAU Level-1-220C-UNLIM SN65240PWR ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-220C-UNLIM SN75240P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC 150 None CU NIPDAU Level-1-220C-UNLIM None Call TI SN75240PW ACTIVE TSSOP PW 8 SN75240PWLE OBSOLETE TSSOP PW 8 SN75240PWR ACTIVE TSSOP PW 8 2000 None CU NIPDAU SN75240PWRG4 PREVIEW TSSOP PW 8 2000 None Call TI Call TI Level-1-220C-UNLIM Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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