TI TPA3107D2PAP

TPA3107D2
HTQFP
www.ti.com
SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
15-W STEREO CLASS-D AUDIO POWER AMPLIFIER
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
15-W/ch into an 8-Ω Load From a 16-V Supply
Operates from 10 V to 26 V
Efficient Class-D Operation Eliminates the
Need for Heat Sinks
Four Selectable, Fixed Gain Settings
Differential Inputs
Thermal and Short-Circuit Protection With
Auto Recovery Feature
Clock Output for Synchronization With
Multiple Class-D Devices
Surface Mount 10 mm × 10 mm, 64-pin
HTQFP Package
Televisions
DESCRIPTION
The TPA3107D2 is a 15-W (per channel) efficient,
Class-D audio power amplifier for driving bridged-tied
stereo speakers. The TPA3107D2 can drive stereo
speakers as low as 6 Ω. The high efficiency of the
TPA3107D2, 87%, eliminates the need for an
external heat sink when playing music.
The gain of the amplifier is controlled by two gain
select pins. The gain selections are 20, 26, 32,
36 dB.
The outputs are fully protected against shorts to
GND, VCC, and output-to-output shorts with an auto
recovery feature and monitor output.
Simplified Application Circuit
1 mF
RINP
1 mF
RINN
TV Audio
Processor
0.22 mF
TPA3107D2
1 mF
LINN
1 mF
BSRN
ROUTN
ROUTP
BSRP
LINP
Shutdown
Control
Mute Control
PGNDR
10 nF
VREG
MUTE
Gain Select
MSTR/SLV
Sync Control
SYNC
FAULT
PVCCR
PVCCL
AVCC
AGND
1 mF
VBYP
ROSC
100 kW
GAIN1
10 V to 26 V
1 mF
SHUTDOWN
GAIN0
Fault Flag
0.22 mF
VCLAMPR
BSLN
LOUTN
0.22 mF
LOUTP
BSLP
VCLAMPL
PGNDL
0.22 mF
1 mF
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TPA3107D2
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
VCC
Supply voltage
VI
Input voltage
AVCC, PVCC
–0.3 V to 30 V
SHUTDOWN, MUTE
–0.3 V to VCC + 0.3 V
GAIN0, GAIN1, RINN, RINP, LINN, LINP, MSTR/SLV, SYNC
Continuous total power dissipation
TA
–0.3 V to VREG + 0.5 V
See Dissipation Rating Table
Operating free-air temperature range
TJ
Operating junction temperature
Tstg
Storage temperature range
Electrostatic discharge
(1)
–40°C to 85°C
range (2)
–40°C to 150°C
–65°C to 150°C
Human body model
(3)
Charged-device model
±2 kV
(all pins)
(4)
±500 V
(all pins)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The TPA3107D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical
Briefs SLMA002 for more information about using the HTQFP thermal pad.
In accordance with JEDEC Standard 22, Test Method A114-B.
In accordance with JEDEC Standard 22, Test Method C101-A
(2)
(3)
(4)
TYPICAL DISSIPATION RATINGS
PACKAGE (1)
64-pin PAP (HTQFP)
(1)
(2)
TA ≤ 25°C
DERATING FACTOR
5.43 W
43.5
mW/°C (2)
TA = 70°C
TA = 85°C
3.47 W
2.82 W
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
This data was taken using a 2 oz trace and copper pad that is soldered directly to a 2-layer high-k PCB (EVM). These are typical values.
See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
MAX
10
26
Supply voltage
PVCC, AVCC
VIH
High-level input voltage
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC
VIL
Low-level input voltage
SHUTDOWN, MUTE, GAIN0, GAIN1, MSTR/SLV, SYNC
0.8
SHUTDOWN, VI = VCC, VCC = 24 V
125
IIH
2
TEST CONDITIONS
VCC
High-level input current
2
MUTE, VI = VCC, VCC = 24 V
75
2
SHUTDOWN, VI = 0, VCC = 24 V
2
IIL
Low-level input current
SYNC, MUTE, GAIN0, GAIN1, MSTR/SLV, VI = 0 V,
VCC = 24 V
1
VOH
High-level output voltage
FAULT, IOH = 1 mA
VOL
Low-level output voltage
FAULT, IOL = -1 mA
fOSC
Oscillator frequency
ROSC Resistor = 100 kΩ
RL
Load Resistance
TA
Operating free-air temperature
VREG - 0.6
µA
µA
V
300
kHz
85
°C
Ω
6
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V
V
AGND + 0.4
–40
V
V
GAIN0, GAIN1, MSTR/SLV, SYNC, VI = VREG,
VCC = 24 V
200
UNIT
TPA3107D2
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
DC CHARACTERISTICS
TA = 25°C, VCC = 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
| VOS |
PSRR
ICC
rDS(on)
TEST CONDITIONS
Class-D output offset voltage (measured
differentially)
VI = 0 V, Gain = 36 dB
Bypass reference for input amplifier
VBYP, no load
4-V internal supply voltage
VREG, no load, VCC = 10 V to 26 V
DC Power supply rejection ratio
VCC = 12 V to 24 V, inputs ac coupled to AGND,
Gain = 36 dB
Quiescent supply current
SHUTDOWN = 2 V, MUTE = 0 V, no load
Quiescent supply current in mute mode
MUTE = 2 V, no load
Drain-source on-state resistance
VCC = 12 V, IO = 500 mA,
TJ = 25°C
Gain
GAIN1 = 2 V
TYP MAX
UNIT
5
50
1.1
1.25
1.45
V
3.75
4
4.25
V
-70
Quiescent supply current in shutdown mode SHUTDOWN = 0.8 V, no load
GAIN1 = 0.8 V
G
MIN
mV
dB
22
26.5
300
400
µA
8
10
mA
High Side
370
Low side
370
Total
780
950
mA
mΩ
GAIN0 = 0.8 V
19
20
21
GAIN0 = 2 V
25
26
27
GAIN0 = 0.8 V
31
32
33
GAIN0 = 2 V
35
36
37
dB
dB
Gain matching
Between channels
tON
Turn-on time
C(VBYP) = 1 µF, SHUTDOWN = 2 V
2%
25
ms
tOFF
Turn-off time
C(VBYP) = 1 µF, SHUTDOWN = 0.8 V
0.1
ms
DC CHARACTERISTICS
TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
| VOS |
PSRR
ICC
rDS(on)
TEST CONDITIONS
Class-D output offset voltage (measured
differentially)
VI = 0 V, Gain = 36 dB
Bypass reference for input amplifier
VBYP, no load
4-V internal supply voltage
VREG, no load
DC Power supply rejection ratio
VCC = 12 V to 24 V, Inputs ac coupled to AGND,
Gain = 36 dB
Quiescent supply current
SHUTDOWN = 2 V, MUTE = 0 V, no load
Quiescent supply current in mute mode
MUTE = 2 V, no load
Drain-source on-state resistance
VCC = 12 V, IO = 500 mA,
TJ = 25°C
Gain
GAIN1 = 2 V
TYP MAX
UNIT
5
50
1.1
1.25
1.45
V
3.75
4
4.25
V
-70
Quiescent supply current in shutdown mode SHUTDOWN = 0.8 V, no load
GAIN1 = 0.8 V
G
MIN
mV
dB
18
22.5
180
300
µA
7
9
mA
High Side
350
Low side
350
Total
780
950
mA
mΩ
GAIN0 = 0.8 V
19
20
21
GAIN0 = 2 V
25
26
27
GAIN0 = 0.8 V
31
32
33
GAIN0 = 2 V
35
36
37
dB
dB
tON
Turn-on time
C(VBYP) = 1 µF, SHUTDOWN = 2 V
25
ms
tOFF
Turn-off time
C(VBYP) = 1 µF, SHUTDOWN = 0.8 V
0.1
ms
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
AC CHARACTERISTICS
TA = 25°C, VCC = 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
KSVR
Supply ripple rejection
200 mVPP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND
PO
Continuous output power
THD+N = 0.1%, f = 1 kHz (thermally limited)
THD+N
Total harmonic distortion + noise
f = 1 kHz, PO = 7.5 W (half-power)
Vn
Output integrated noise
20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB
Crosstalk
VO = 1 Vrms, Gain = 20 dB, f = 1 kHz
Signal-to-noise ratio
Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted
SNR
MIN
TYP
MAX
UNIT
–70
dB
15
W
0.08%
Thermal trip point
Thermal hysteresis
125
µV
–78
dBV
–92
dB
102
dB
150
°C
20
°C
AC CHARACTERISTICS
TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
KSVR
Supply ripple rejection
PO
Continuous output power
TEST CONDITIONS
THD+N = 7%, f = 1 kHz
8.7
THD+N = 10%, f = 1 kHz
9.2
THD+N = 10%, f = 1 kHz, VCC = 16 V
15
Total harmonic distortion + noise
RL = 8 Ω, f = 1 kHz, PO = 5 W
Vn
Output integrated noise
20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB
Crosstalk
Po = 1 W, Gain = 20 dB, f = 1 kHz
Signal-to-noise ratio
Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted
Thermal trip point
Thermal hysteresis
4
TYP
–70
THD+N
SNR
MIN
200 mVPP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND
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MAX
UNIT
dB
W
0.11%
125
µV
–78
dBV
–94
dB
96
dB
150
°C
30
°C
TPA3107D2
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
AVCC
FAULT
MUTE
SHUTDOWN
NC
NC
NC
NC
NC
BSRP
ROUTP
ROUTP
ROUTN
ROUTN
BSRN
NC
64 PIN, HTQFP PACKAGE
(TOP VIEW)
64 63
NC
NC
NC
NC
RINN
RINP
AGND
LINP
LINN
GAIN0
GAIN1
MSTR/SLV
NC
NC
NC
NC
62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
2
47
3
46
4
45
5
44
43
6
7
Exposed
Thermal Pad
8
42
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
NC
NC
PVCCR
PVCCR
PGNDR
PGNDR
NC
VCLAMPR
VCLAMPL
NC
PGNDL
PGNDL
PVCCL
PVCCL
NC
NC
SYNC
ROSC
VREG
VBYP
AGND
NC
NC
NC
NC
BSLP
LOUTP
LOUTP
LOUTN
LOUTN
BSLN
NC
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
SHUTDOWN
61
I
Shutdown signal for IC (LOW = disabled, HIGH = operational). TTL logic levels
with compliance to AVCC. (Active low)
RINN
5
I
Negative audio input for right channel. Biased at VREG/2.
RINP
6
I
Positive audio input for right channel. Biased at VREG/2.
LINN
9
I
Negative audio input for left channel. Biased at VREG/2.
LINP
8
I
Positive audio input for left channel. Biased at VREG/2.
GAIN0
10
I
Gain select least significant bit. TTL logic levels with compliance to VREG.
GAIN1
11
I
Gain select most significant bit. TTL logic levels with compliance to VREG.
MUTE
62
I
Mute signal for quick disable/enable of outputs (HIGH = outputs high-Z, LOW =
outputs enabled). TTL logic levels with compliance to AVCC. (Active high)
FAULT
63
O
TTL compatible output. HIGH = short-circuit fault. LOW = no fault. Only reports
short-circuit faults. Thermal faults are not reported on this terminal.
BSLP
26
I/O
Bootstrap I/O for left channel, positive high-side FET.
Power supply for left channel H-bridge, not internally connected to PVCCR or
AVCC.
PVCCL
35, 36
LOUTP
27, 28
PGNDL
37, 38
LOUTN
29, 30
O
Class-D 1/2-H-bridge negative output for left channel.
BSLN
31
I/O
Bootstrap I/O for left channel, negative high-side FET.
VCLAMPL
40
VCLAMPR
41
BSRN
50
I/O
Bootstrap I/O for right channel, negative high-side FET.
ROUTN
51, 52
O
Class-D 1/2-H-bridge negative output for right channel.
PGNDR
43, 44
O
Class-D 1/2-H-bridge positive output for left channel.
Power ground for left channel H-bridge.
Internally generated voltage supply for left channel bootstrap capacitor.
Internally generated voltage supply for right channel bootstrap capacitor.
Power ground for right channel H-bridge.
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
ROUTP
53, 54
PVCCR
45, 46
O
DESCRIPTION
Class-D 1/2-H-bridge positive output for right channel.
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
BSRP
55
AGND
7, 21
ROSC
18
I/O
MSTR/SLV
12
I
Master/Slave select for determining direction of SYNC terminal. HIGH=Master
mode, SYNC terminal is an output; LOW = slave mode, SYNC terminal accepts a
clock input. TTL logic levels with compliance to VREG.
SYNC
17
I/O
Clock input/output for synchronizing multiple class-D devices. Direction determined
by MSTR/SLV terminal. Input signal not to exceed VREG.
VBYP
20
O
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up time
via external capacitor sizing.
VREG
19
O
4-V regulated output for use by internal cells, GAINx, MUTE, and MSTR/SLV pins
only. Not specified for driving other external circuitry.
AVCC
NC
Thermal Pad
6
I/O
I/O
Analog ground for digital/analog cells in core.
64
I/O for current setting resistor of ramp generator.
High-voltage analog power supply. Not internally connected to PVCCR or PVCCL.
1-4, 13-16,
22-25,
32-34, 39,
42, 47-49,
56-60
-
Bootstrap I/O for right channel, positive high-side FET.
Not internally connected.
-
Connect to AGND and PGND – should be star point for both grounds. Internal
resistive connection to AGND and PGND. Thermal vias on the PCB should
connect this pad to a large copper area on an internal or bottom layer for the best
thermal performance. The Thermal Pad must be soldered to the PCB for
mechanical reliability.
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
FUNCTIONAL BLOCK DIAGRAM
PVCCR
PVCCR
VCLAMPR
PVCCR
VBYP
BSRN
VBYP
AVCC
AVCC
Gain
Control
RINN
RINP
Gate
Drive
Gain
Control
VClamp
Gen
PWM
Logic
BSRP
Gain
Control
8
Gate
Drive
To Gain Adj.
Blocks and
Startup Logic
ROUTP
Gain
FAULT
SC
Detect
VBYP AVCC
ROSC
Ramp
Generator
SYNC
Thermal
Biases
and
Reference
s
MSTR/SLV
VREG
Startup
Protection
Logic
VREGok
PGNDR
VREG
PVCCL
AVCC
PVCCL
VCCok
4V Reg
VREG
PVCCL
SHUTDOWN
TLL Input
Buffer
(VCC Compliant)
MUTE
TLL Input
Buffer
(VCC Compliant)
VCLAMPL
BSLN
Gate
Drive
Gain
Control
LOUTN
VClamp
Gen
VBYP
LINP
PVCCR
VBYP
GAIN0
GAIN1
LINN
ROUTN
Gate
Drive
Gain
PVCCL
BSLP
PWM
Logic
Gain
Control
LOUTP
PGNDL
AGND
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TPA3107D2
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS (1) (2)
FIGURE
THD+N
Total harmonic distortion + noise
vs Frequency
1, 2, 3, 4, 5
THD+N
Total harmonic distortion + noise
vs Output power
6, 7, 8, 9, 10
Closed-loop response
vs Frequency
Output power
vs Supply voltage
13
Supply current
vs Total output power
14
System efficiency
vs Output power
Crosstalk
vs Frequency
16, 17
Supply ripple rejection ratio
vs Frequency
18
VCC
kSVR
(1)
(2)
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
10
THD+N - Total Harmonic Distortion + Noise - %
10
THD+N - Total Harmonic Distortion + Noise - %
15
All graphs were measured using the TPA3107D2 EVM.
Power generated beyond normal and recommended operating conditions may require additional heatsinking.
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
VCC = 12 V
RL = 8 W
Gain = 20 dB
1
PO = 5 W
0.1
PO = 2.5 W
0.01
PO = 1 W
0.001
20
8
11, 12
100
1k
10k 20k
VCC = 18 V
RL = 8 W
Gain = 20 dB
1
PO = 5 W
0.1
PO = 2.5 W
0.01
PO = 1 W
0.001
20
100
1k
f − Frequency − Hz
f − Frequency − Hz
Figure 1.
Figure 2.
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
10
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
10
VCC = 24 V
RL = 8 W
Gain = 20 dB
1
0.1
PO = 1 W
PO = 10 W
0.01
PO = 5 W
0.001
20
100
1k
PO = 10 W
0.1
PO = 1 W
0.01
PO = 5 W
100
1k
10k 20k
f − Frequency − Hz
Figure 3.
Figure 4.
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
10
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
1
f − Frequency − Hz
VCC = 24 V
RL = 6 W
Gain = 20 dB
1
PO = 1 W
PO = 10 W
0.01
PO = 5 W
0.001
20
RL = 6 W
Gain = 20 dB
0.001
20
10k 20k
10
0.1
VCC = 18 V
100
1k
10k 20k
VCC = 12 V
RL = 8 W
Gain = 20 dB
1
10 kHz
1 kHz
0.1
20 Hz
0.01
10 m
100 m
1
f − Frequency − Hz
PO − Output Power − W
Figure 5.
Figure 6.
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40
9
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TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
10
20
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
20
VCC = 18 V
RL = 8 W
Gain = 20 dB
1
10 kHz
1 kHz
0.1
20 Hz
0.01
10 m
100 m
10 20
1
40
1
10 kHz
1 kHz
0.1
20 Hz
0.01
10 m
100 m
10 20 40
1
PO − Output Power − W
Figure 7.
Figure 8.
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
10
VCC = 18 V
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
10
RL = 8 W
Gain = 20 dB
PO − Output Power − W
70
20
VCC = 24 V
10
RL = 8 W
Gain = 32 dB
10
1
10 kHz
1 kHz
0.1
20 Hz
0.01
10 m
100 m
1
10 20 30
VCC = 24 V
RL = 8 W
Gain = 32 dB
1
10 kHz
1 kHz
0.1
20 Hz
0.01
10 m
100 m
1
PO − Output Power − W
PO − Output Power − W
Figure 9.
Figure 10.
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SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
Gain
Phase
VCC = 12 V
RL = 8 W
VI = 0.1 Vrms
CI = 10 mF
Gain = 32 dB
RC filter = 100 W, 10 nF
10
100
1k
10 k
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
Gain
Phase
VCC = 24 V
RL = 8 W
VI = 0.1 Vrms
CI = 10 mF
Gain = 32 dB
RC filter = 100 W, 10 nF
10
100
f - Frequency - Hz
32.5
1k
10 k
f - Frequency - Hz
Figure 11.
Figure 12.
OUTPUT POWER
vs
SUPPLY VOLTAGE
SUPPLY CURRENT
vs
TOTAL OUTPUT POWER
37.5
35
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
-140
-160
-180
-200
100 k
Phase − o
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
-140
-160
-180
-200
100 k
Gain − dB
CLOSED LOOP RESPONSE
vs
FREQUENCY
Phase − o
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
2.5
RL = 8 Ω
Gain = 32 dB
RL = 8 W
Gain = 20 dB
2
ICC − Supply Current − A
30
PO − Output Power − W
Gain − dB
CLOSED LOOP RESPONSE
vs
FREQUENCY
27.5
25
22.5
THD+N = 10%
20
17.5
THD+N = 1%
15
12.5
VCC = 18 V
VCC = 12 V
1.5
VCC = 24 V
1
0.5
10
7.5
5
10
12
14
16
18
20
22
24
26
0
0
VCC - Supply Voltage - V
10
20
30
40
PO − Total Output Power − W
Figure 13.
Figure 14.
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SYSTEM EFFICIENCY
vs
OUTPUT POWER
CROSSTALK
vs
FREQUENCY
-40
100
VCC = 12 V
90
−60
80
VCC = 12 V
RL = 8 Ω
Gain = 20 dB
VO = 1 Vrms
VCC = 18 V
60
Crosstalk − dB
Efficiency − %
70
VCC = 24 V
50
40
−80
R to L
−100
30
L to R
RL = 8 W
Gain = 20 dB
20
−120
10
−140
20
0
0
5
10
15
20
25
100
Figure 15.
Figure 16.
CROSSTALK
vs
FREQUENCY
SUPPLY RIPPLE REJECTION RATIO
vs
FREQUENCY
-40
L to R
−80
−100
R to L
−120
−140
20
100
1k
10k 20k
−10
−20
RL = 8 W
Gain = 20 dB
V(RIPPLE) = 200 mVPP
−30
−40
−50
−60
VCC = 12 V
VCC = 18 V
−70
−80
VCC = 24 V
−90
−100
20
f − Frequency − Hz
100
1k
f − Frequency − Hz
Figure 17.
12
10k 20k
0
VCC = 24 V
RL = 8 Ω
Gain = 20 dB
VO = 1 Vrms
kSVR − Supply Ripple Rejection Ratio − dB
Crosstalk − dB
−60
1k
f − Frequency − Hz
PO − Output Power (Per Channel) − W
Figure 18.
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Shutdown
and Mute
Control
Fault Output
APPLICATION INFORMATION
33 mH
0.1 mF
8W
0.47 mF
0.1 mF
10 V - 26 V
33 mH
220nF
220nF
10 mF
NC
NC
BSRN
ROUTN
ROUTP
ROUTN
BSRP
NC
NC
NC
RINP
PGNDR
AGND
LINN
1 mF
VCLAMPL
NC
GAIN1
PGNDL
220 mF
1 mF
10 V - 26 V
NC
LOUTN
BSLN
LOUTP
LOUTN
NC
1 mF
10 nF
NC
BSLP
NC
LOUTP
PVCCL
NC
NC
NC
NC
PVCCL
AGND
PGNDL
VBYP
MSTR/SLV
NC
100 kW
220 mF
VCLAMPR
GAIN0
NC
1 mF
NC
TPA3107D2
LINP
1 mF
NC
PGNDR
VREG
220nF
1 mF
Synchronize Multiple
Class-D Devices
1 mF
PVCCR
RINN
SYNC
4-Step
Gain Control
1 mF
10 V - 26 V
PVCCR
NC
ROSC
Single-Ended
Analog
Inputs
NC
NC
NC
1 mF
ROUTP
NC
NC
SHUTDOWN
MUTE
AVCC
NC
FAULT
1 mF
220nF
33 mH
0.1 mF
8W
0.47 mF
33 mH
0.1 mF
Figure 19. TPA3107D2 Application Circuit With Single-Ended Inputs
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APPLICATION INFORMATION (continued)
CLASS-D OPERATION
This section focuses on the class-D operation of the TPA3107D2.
Traditional Class-D Modulation Scheme
The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output
where each output is 180 degrees out-of-phase and changes from ground to the supply voltage, VCC. Therefore,
the differential prefiltered output varies between positive and negative VCC, where filtered 50% duty cycle yields
0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in
Figure 20. Note that even at an average of 0 V across the load (50% duty cycle), the current to the load is high,
causing high loss and thus causing a high supply current.
OUTP
OUTN
+12 V
Differential Voltage
Across Load
0V
-12 V
Current
Figure 20. Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms into an
Inductive Load With No Input
TPA3107D2 Modulation Scheme
The TPA3107D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage.
However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater
than 50% and OUTN is less than 50% for positive output voltages. The duty cycle of OUTP is less than 50%
and OUTN is greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout
most of the switching period, greatly reducing the switching current, which reduces any I2R losses in the load.
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APPLICATION INFORMATION (continued)
OUTP
OUTN
Differential
Voltage
Across
Load
Output = 0 V
+12 V
0V
-12 V
Current
OUTP
OUTN
Differential
Voltage
Across
Load
Output > 0 V
+12 V
0V
-12 V
Current
Figure 21. The TPA3107D2 Output Voltage and Current Waveforms Into an Inductive Load
Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform
results in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple
current is large for the traditional modulation scheme, because the ripple current is proportional to voltage
multiplied by the time at that voltage. The differential voltage swing is 2 x VCC, and the time at each voltage is
half the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from
each half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is both
resistive and reactive, whereas an LC filter is almost purely reactive.
The TPA3107D2 modulation scheme has little loss in the load without a filter because the pulses are short and
the change in voltage is VCC instead of 2 x VCC. As the output power increases, the pulses widen, making the
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most
applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance but higher impedance at the switching
frequency than the speaker, which results in less power dissipation, therefore increasing efficiency.
When to Use an Output Filter for EMI Suppression
Design the TPA3107D2 without the filter if the traces from amplifier to speaker are short (< 10 cm). Powered
speakers, where the speaker is in the same enclosure as the amplifier, is a typical application for class-D without
a filter.
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APPLICATION INFORMATION (continued)
Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and
CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high
impedance at high frequencies, but low impedance at low frequencies.
Use an LC output filter if there are low frequency (<1 MHz) EMI-sensitive circuits and/or there are long wires
from the amplifier to the speaker.
When both an LC filter and a ferrite bead filter are used, the LC filter should be placed as close as possible to
the IC followed by the ferrite bead filter.
33 mH
OUTP
L1
33 mH
C2
C1
0.1 mF
0.47 mF
OUTN
C3
L2
0.1 mF
Figure 22. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 8 Ω
15 mH
OUTP
L1
15 mH
C2
C1
0.22 mF
1 mF
OUTN
C3
L2
0.22 mF
Figure 23. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 4 Ω
Ferrite
Chip Bead
OUTP
1 nF
Ferrite
Chip Bead
OUTN
1 nF
Figure 24. Typical Ferrite Chip Bead Filter (Chip Bead Example: Fair-Rite 2518121217Y3)
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APPLICATION INFORMATION (continued)
Adaptive Dynamic Range Control
TPA3107D2
V - Voltage = 1 V/div
V - Voltage = 10 V/div
TPA3107D2
Closest Competitor
Closest Competitor
t - Time = 100 ms/div
t - Time = 20 ms/div
Figure 25. 1-kHz Sine Output at 10% THD+N
Figure 26. 8-kHz Sine Output at 10% THD+N
The Texas Instruments patent-pending adaptive dynamic range control (ADRC) technology removes the notch
inherent in class-D audio power amplifiers when they come out of clipping. This effect is more severe at higher
frequencies as shown in Figure 26.
Gain setting via GAIN0 and GAIN1 inputs
The gain of the TPA3107D2 is set by two input terminals, GAIN0 and GAIN1.
The gains listed in Table 1 are realized by changing the taps on the input resistors and feedback resistors inside
the amplifier. This causes the input impedance (ZI) to be dependent on the gain setting. The actual gain settings
are controlled by ratios of resistors, so the gain variation from part-to-part is small. However, the input
impedance from part-to-part at the same gain may shift by ±20% due to shifts in the actual resistance of the
input resistors.
For design purposes, the input network (discussed in the next section) should be designed assuming an input
impedance of 12.8 kΩ, which is the absolute minimum input impedance of the TPA3107D2. At the lower gain
settings, the input impedance could increase as high as 38.4 kΩ
Table 1. Gain Setting
GAIN1
GAIN0
AMPLIFIER GAIN (dB)
INPUT IMPEDANCE
(kΩ)
TYP
TYP
0
0
20
32
0
1
26
16
1
0
32
16
1
1
36
16
INPUT RESISTANCE
Changing the gain setting can vary the input resistance of the amplifier from its smallest value, 16 kΩ± 20%, to
the largest value, 32 kΩ± 20%. As a result, if a single capacitor is used in the input high-pass filter, the -3 dB or
cutoff frequency may change when changing gain steps.
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Zf
Ci
IN
Input
Signal
Zi
The -3-dB frequency can be calculated using Equation 1. Use the ZI values given in Table 1.
f =
1
2p Zi Ci
(1)
INPUT CAPACITOR, CI
In the typical application, an input capacitor (CI) is required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, CI and the input impedance of the amplifier (ZI) form a
high-pass filter with the corner frequency determined in Equation 2.
-3 dB
fc =
1
2p Zi Ci
fc
(2)
The value of CI is important, as it directly affects the bass (low-frequency) performance of the circuit. Consider
the example where ZI is 20 kΩ and the specification calls for a flat bass response down to 20 Hz. Equation 2 is
reconfigured as Equation 3.
Ci =
1
2p Zi fc
(3)
In this example, CI is 0.4 µF; so, one would likely choose a value of 0.47 µF as this value is commonly used. If
the gain is known and is constant, use ZI from Table 1 to calculate CI. A further consideration for this capacitor is
the leakage path from the input source through the input network (CI) and the feedback network to the load. This
leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially
in high gain applications. For this reason, a low-leakage tantalum or ceramic capacitor is the best choice. When
polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most
applications as the dc level there is held at 2 V, which is likely higher than the source dc level. Note that it is
important to confirm the capacitor polarity in the application. Additionally, lead-free solder can create dc offset
voltages and it is important to ensure that boards are cleaned properly.
Power Supply Decoupling, CS
The TPA3107D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling
to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is
achieved by using two capacitors of different types that target different types of noise on the power supply leads.
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance
(ESR) ceramic capacitor, typically 0.1 µF to 1 µF placed as close as possible to the device VCC lead works best.
For filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 220 µF or greater placed
near the audio power amplifier is recommended. The 220 µF capacitor also serves as local storage capacitor for
supplying current during large signal transients on the amplifier outputs. The PVCC terminals provide the power
to the output transistors, so a 220 µF or larger capacitor should be placed on each PVCC terminal. A 10 µF
capacitor on the AVCC terminal is adequate.
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Bootstrap Capacitors
The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the
high side of each output to turn on correctly. A 220-nF ceramic capacitor, rated for at least 25 V, must be
connected from each output to its corresponding bootstrap input. Specifically, one 220-nF capacitor must be
connected from xOUTP to BSxx, and one 220-nF capacitor must be connected from xOUTN to BSxx. (See the
application circuit diagram in Figure 19.)
The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating
power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching
cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side MOSFETs
turned on.
VCLAMP Capacitors
To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, two
internal regulators clamp the gate voltage. Two 1-µF capacitors must be connected from VCLAMPL (pin 40) and
VCLAMPR (pin 41) to ground and must be rated for at least 16 V. The voltages at the VCLAMPx terminals may
vary with VCC and may not be used for powering any other circuitry.
Internal Regulated 4-V Supply (VREG)
The VREG terminal (pin 19) is the output of an internally generated 4-V supply, used for the oscillator,
preamplifier, and gain control circuitry. It requires a 10-nF capacitor, placed close to the pin, to keep the
regulator stable.
This regulated voltage can be used to control GAIN0, GAIN1, MSTR/SLV, and MUTE terminals, but should not
be used to drive external circuitry.
VBYP Capacitor Selection
The internal bias generator (VBYP) nominally provides a 1.25-V internal bias for the preamplifier stages. The
external input capacitors and this internal reference allow the inputs to be biased within the optimal
common-mode range of the input preamplifiers.
The selection of the capacitor value on the VBYP terminal is critical for achieving the best device performance.
During power up or recovery from the shutdown state, the VBYP capacitor determines the rate at which the
amplifier starts up. When the voltage on the VBYP capacitor equals VBYP, the device starts a 16.4-ms timer.
When this timer completes, the outputs start switching. The charge rate of the capacitor is calculated using the
standard charging formula for a capacitor, I = C x dV/dT. The charge current is nominally equal to 250µA and dV
is equal to VBYP. For example, a 1-µF capacitor on VBYP would take 5 ms to reach the value of VBYP and
begin a 16.4-ms count before the outputs turn on. This equates to a turn-on time of <30 ms for a 1-µF capacitor
on the VBYP terminal.
A secondary function of the VBYP capacitor is to filter high-frequency noise on the internal 1.25-V bias
generator. A value of at least 0.47µF is recommended for the VBYP capacitor. For the best power-up and
shutdown pop performance, the VBYP capacitor should be greater than or equal to the input capacitors.
ROSC Resistor Selection
The resistor connected to the ROSC terminal controls the class-D output switching frequency using Equation 4:
1
FOSC =
2 x ROSC x COSC
(4)
COSC is an internal capacitor that is nominally equal to 20 pF. Variation over process and temperature can
result in a ±15% change in this capacitor value.
For example, if ROSC is fixed at 100 kΩ, the frequency from device to device with this fixed resistance could
vary from 217 kHz to 294 kHz with a 15% variation in the internal COSC capacitor. The tolerance of the ROSC
resistor should also be considered to determine the range of expected switching frequencies from device to
device. It is recommended that 1% tolerance resistors be used.
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Differential Input
The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To
use the TPA3107D2 with a differential source, connect the positive lead of the audio source to the INP input and
the negative lead from the audio source to the INN input. To use the TPA3107D2 with a single-ended source, ac
ground the INP or INN input through a capacitor equal in value to the input capacitor on INN or INP and apply
the audio source to either input. In a single-ended input application, the unused input should be ac grounded at
the audio source instead of at the device input for best noise performance.
SHUTDOWN OPERATION
The TPA3107D2 employs a shutdown mode of operation designed to reduce supply current (ICC) to the absolute
minimum level during periods of nonuse for power conservation. The SHUTDOWN input terminal should be held
high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling
SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state. Never leave
SHUTDOWN unconnected, because amplifier operation would be unpredictable.
For the best power-off pop performance, place the amplifier in the shutdown or mute mode prior to removing the
power supply voltage.
MUTE Operation
The MUTE pin is an input for controlling the output state of the TPA3107D2. A logic high on this terminal
disables the outputs. A logic low on this pin enables the outputs. This terminal may be used as a quick
disable/enable of outputs when changing channels on a television or transitioning between different audio
sources.
The MUTE terminal should never be left floating. For power conservation, the SHUTDOWN terminal should be
used to reduce the quiescent current to the absolute minimum level.
The MUTE terminal can also be used with the FAULT output to automatically recover from a short-circuit event.
When a short-circuit event occurs, the FAULT terminal transitions high indicating a short-circuit has been
detected. When directly connected to MUTE, the MUTE terminal transitions high, and clears the internal fault
flag. This causes the FAULT terminal to cycle low, and normal device operation resumes if the short-circuit is
removed from the output. If a short remains at the output, the cycle continues until the short is removed.
If external MUTE control is desired, and automatic recovery from a short-circuit event is also desired, an OR
gate can be used to combine the functionality of the FAULT output and external MUTE control, see Figure 27.
TPA3107D2
External GPIO
Control
MUTE
FAULT
Figure 27. External MUTE Control
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MSTR/SLV and SYNC operation
The MSTR/SLV and SYNC terminals can be used to synchronize the frequency of the class-D output switching.
When the MSTR/SLV terminal is high, the output switching frequency is determined by the selection of the
resistor connected to the ROSC terminal (see ROSC Resistor Selection). The SYNC terminal becomes an
output in this mode, and the frequency of this output is also determined by the selection of the ROSC resistor.
This TTL compatible, push-pull output can be connected to another TPA3107D2, configured in the slave mode.
The output switching is synchronized to avoid any beat frequencies that could occur in the audio band when two
class-D amplifiers in the same system are switching at slightly different frequencies.
When the MSTR/SLV terminal is low, the output switching frequency is determined by the incoming square wave
on the SYNC input. The SYNC terminal becomes an input in this mode and accepts a TTL compatible square
wave from another TPA3107D2 configured in the master mode or from an external GPIO. If connecting to an
external GPIO, recommended frequencies are 200 kHz to 300 kHz for proper device operation, and the
maximum amplitude is 4 V.
USING LOW-ESR CAPACITORS
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal)
capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this
resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this
resistance, the more the real capacitor behaves like an ideal capacitor.
SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE
The TPA3107D2 has short-circuit protection circuitry on the outputs that prevents damage to the device during
output-to-output shorts, output-to-GND shorts, and output-to-VCC shorts. When a short circuit is detected on the
outputs, the part immediately disables the output drive. This is a latched fault and must be reset by cycling the
voltage on the SHUTDOWN pin or MUTE pin. This clears the short-circuit flag and allows for normal operation if
the short was removed. If the short was not removed, the protection circuitry again activates.
The FAULT terminal can be used for automatic recovery from a short-circuit event, or used to monitor the status
with an external GPIO. For automatic recovery from a short-circuit event, connect the FAULT terminal directly to
the MUTE terminal. When a short-circuit event occurs, the FAULT terminal transitions high indicating a
short-circuit has been detected. When directly connected to MUTE, the MUTE terminal transitions high, and
clears the internal fault flag. This causes the FAULT terminal to cycle low, and normal device operation resumes
if the short-circuit is removed from the output. If a short remains at the output, the cycle continues until the short
is removed. If external MUTE control is desired, and automatic recovery from a short-circuit event is also
desired, an OR gate can be used to combine the functionality of the FAULT output and external MUTE control,
see Figure 27.
THERMAL PROTECTION
Thermal protection on the TPA3107D2 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is
not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30°C. The device
begins normal operation at this point with no external system interaction.
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PRINTED-CIRCUIT BOARD (PCB) LAYOUT GENERAL GUIDELINES
Because the TPA3107D2 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit
board (PCB) should be optimized according to the following guidelines for the best possible performance.
• Decoupling capacitors—The high-frequency 1-µF decoupling capacitors should be placed as close to the
PVCC and AVCC terminals as possible. The VBYP capacitor, VREG capacitor, and VCLAMP capacitor
should also be placed as close to the device as possible. Large bulk power supply decoupling capacitors
should be placed near the TPA3107D2 on the PVCCL, PVCCR, and AVCC terminals.
• Grounding—The AVCC decoupling capacitor, VREG capacitor, VBYP capacitor, and ROSC resistor should
each be grounded to analog ground. The PVCC decoupling capacitors and VCLAMP capacitors should each
be grounded to power ground. Analog ground and power ground should be connected at the thermal pad,
which should be used as a central ground connection or star ground for the TPA3107D2.
• Output filter—The ferrite EMI filter should be placed as close to the output terminals as possible for the best
EMI performance. The LC filter should be placed close to the outputs.
For an example layout, see the TPA3107D2 Evaluation Module User Manual, (SLOU190). Both the EVM user
manual and the thermal pad application note are available on the TI Web site at http://www.ti.com.
BASIC MEASUREMENT SYSTEM
This application note focuses on methods that use the basic equipment listed below:
• Audio analyzer or spectrum analyzer
• Digital multimeter (DMM)
• Oscilloscope
• Twisted-pair wires
• Signal generator
• Power resistor(s)
• Linear regulated power supply
• Filter components
• EVM or other complete audio circuit
Figure 28 shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine
wave is normally used as the input signal because it consists of the fundamental frequency only (no other
harmonics are present). An analyzer is then connected to the APA output to measure the voltage output. The
analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power supply is used to
reduce the noise and distortion injected into the APA through the power pins. A System Two audio
measurement system (AP-II) (Reference 1) by Audio Precision includes the signal generator and analyzer in one
package.
The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling
capacitors, (CIN), so no additional coupling is required. The generator output impedance should be low to avoid
attenuating the test signal, and is important because the input resistance of APAs is not high. Conversely, the
analyzer-input impedance should be high. The output resistance, ROUT, of the APA is normally in the hundreds
of milliohms and can be ignored for all but the power-related calculations.
Figure 28(a) shows a class-AB amplifier system. It takes an analog signal input and produces an analog signal
output. This amplifier circuit can be directly connected to the AP-II or other analyzer input.
This is not true of the class-D amplifier system shown in Figure 28(b), which requires low-pass filters in most
cases in order to measure the audio output waveforms. This is because it takes an analog input signal and
converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some
analyzers.
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Power Supply
Signal
Generator
APA
RL
Analyzer
20 Hz - 20 kHz
(a) Basic Class-AB
Power Supply
Low-Pass RC
Filter
Signal
Generator
Class-D APA
RL
(See note A)
Low-Pass RC
Filter
Analyzer
20 Hz - 20 kHz
(b) Filter-Free and Traditional Class-D
A.
For efficiency measurements with filter-free Class-D, RL should be an inductive load like a speaker.
Figure 28. Audio Measurement Systems
The TPA31071D2 uses a modulation scheme that does not require an output filter for operation, but they do
sometimes require an RC low-pass filter when making measurements. This is because some analyzer inputs
cannot accurately process the rapidly changing square-wave output and therefore record an extremely high level
of distortion. The RC low-pass measurement filter is used to remove the modulated waveforms so the analyzer
can measure the output sine wave.
DIFFERENTIAL INPUT AND BTL OUTPUT
All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs.
Differential inputs have two input pins per channel and amplify the difference in voltage between the pins.
Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly
used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180
degrees out of phase. The load is connected between these pins. This has the added benefits of quadrupling
the output power to the load and eliminating a dc blocking capacitor.
A block diagram of the measurement circuit is shown in Figure 29. The differential input is a balanced input,
meaning the positive (+) and negative (-) pins have the same impedance to ground. Similarly, the BTL output
equates to a balanced output.
Submit Documentation Feedback
23
TPA3107D2
www.ti.com
SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
Evaluation Module
Audio Power
Amplifier
Generator
Analyzer
Low-Pass
RC Filter
CIN
VGEN
RGEN
RIN
ROUT
RIN
ROUT
CIN
RGEN
RL
Low-Pass
RC Filter
Twisted-Pair Wire
RANA
CANA
RANA
CANA
Twisted-Pair Wire
Figure 29. Differential Input, BTL Output Measurement Circuit
The generator should have balanced outputs, and the signal should be balanced for best results. An unbalanced
output can be used, but it may create a ground loop that affects the measurement accuracy. The analyzer must
also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise
in the circuit and providing the most accurate measurement.
The following general rules should be followed when connecting to APAs with differential inputs and BTL
outputs:
• Use a balanced source to supply the input signal.
• Use an analyzer with balanced inputs.
• Use twisted-pair wire for all connections.
• Use shielding when the system environment is noisy.
• Ensure that the cables from the power supply to the APA, and from the APA to the load, can handle the
large currents (see Table 2).
Table 2 shows the recommended wire size for the power supply and load cables of the APA system. The real
concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations
are based on 12-inch long wire with a 20-kHz sine-wave signal at 25°C.
Table 2. Recommended Minimum Wire Size for Power Cables
DC POWER LOSS
(MW)
AWG Size
AC POWER LOSS
(MW)
POUT (W)
RL(Ω)
10
4
18
22
16
40
18
42
2
4
18
22
3.2
8
3.7
8.5
1
8
22
28
2
8
2.1
8.1
< 0.75
8
22
28
1.5
6.1
1.6
6.2
CLASS-D RC LOW-PASS FILTER
An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width
modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff
frequency is set above the audio band. The high frequency of the square wave has negligible impact on
measurement accuracy because it is well above the audible frequency range, and the speaker cone cannot
respond at such a fast rate. The RC filter is not required when an LC low-pass filter is used, such as with the
class-D APAs that employ the traditional modulation scheme (TPA032D0x, TPA005Dxx).
The component values of the RC filter are selected using the equivalent output circuit as shown in Figure 30. RL
is the load impedance that the APA is driving for the test. The analyzer input impedance specifications should be
available and substituted for RANA and CANA. The filter components, RFILT and CFILT, can then be derived for the
system. The filter should be grounded to the APA near the output ground pins or at the power supply ground pin
to minimize ground loops.
24
Submit Documentation Feedback
TPA3107D2
www.ti.com
SLOS509A – OCTOBER 2006 – REVISED NOVEMBER 2006
Load
AP Analyzer Input
RC Low-Pass Filters
RFILT
CFILT
RL
VL= VIN
CANA
RANA
CANA
RANA
VOUT
RFILT
CFILT
To APA
GND
Figure 30. Measurement Low-Pass Filter Derivation Circuit-Class-D APAs
The transfer function for this circuit is shown in Equation 5 where ωO = REQCEQ, REQ = RFILT || RANA and
CEQ = (CFILT + CANA). The filter frequency should be set above fMAX, the highest frequency of the measurement
bandwidth, to avoid attenuating the audio signal. Equation 6 provides this cutoff frequency, fC. The value of RFILT
must be chosen large enough to minimize current that is shunted from the load, yet small enough to minimize
the attenuation of the analyzer-input voltage through the voltage divider formed by RFILT and RANA. A general
rule is that RFILT should be small (~100 Ω) for most measurements. This reduces the measurement error to less
than 1% for RANA ≥ 10 kΩ.
( )
VOUT
VIN
(
=
RANA
RANA + RFILT
1 + j
)
( )
w
wO
(5)
fc = Ö2 x fmax
(6)
An exception occurs with the efficiency measurements, where RFILT must be increased by a factor of ten to
reduce the current shunted through the filter. CFILT must be decreased by a factor of ten to maintain the same
cutoff frequency. See Table 3 for the recommended filter component values.
Once fC is determined and RFILT is selected, the filter capacitance is calculated using . When the calculated
value is not available, it is better to choose a smaller capacitance value to keep fC above the minimum desired
value calculated in Equation 7.
1
CFILT =
2p x fc x RFILT
(7)
Table 3 shows recommended values of RFILT and CFILT based on common component values. The value of fC
was originally calculated to be 28 kHz for an fMAX of 20 kHz. CFILT, however, was calculated to be 57,000 pF, but
the nearest values of 56,000 pF and 51,000 pF were not available. A 47,000-pF capacitor was used instead,
and fC is 34 kHz, which is above the desired value of 28 kHz.
Table 3. Typical RC Measurement Filter Values
MEASUREMENT
RFILT
Efficiency
1000 Ω
5,600 pF
All other measurements
100 Ω
56,000 pF
Submit Documentation Feedback
CFILT
25
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
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applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
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unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
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requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
8-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPA3107D2PAP
ACTIVE
HTQFP
PAP
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-5A-260C-24 HR
TPA3107D2PAPR
ACTIVE
HTQFP
PAP
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-5A-260C-24 HR
TPA3107D2PAPRG4
ACTIVE
HTQFP
PAP
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-5A-260C-24 HR
TPA3107D2PAPT
ACTIVE
HTQFP
PAP
64
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-5A-260C-24 HR
TPA3107D2PAPTG4
ACTIVE
HTQFP
PAP
64
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-5A-260C-24 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated