TI TRF2436IRTBT

TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
High-Power Dual-Band (2.4-GHz to 2.5-GHz and 4.9-GHz to 5.9-GHz) RF Front-End
•
FEATURES
•
•
•
•
•
Highly Integrated 802.16 d/e Radio Frequency
Front End ASIC
Fully Integrated Up/Down Converters, LNAs,
PAs and T/R Switches
Super Heterodyne Architecture for Superior
Adjacent Channel Rejection Performance
Differential LO and IF Interface for Enhanced
Spurious/EMI Performance
Common Frequency Plan uses a Single LO
and Common IF for Single IF Filter for Both
Bands
•
•
•
•
•
•
•
Integrated Temperature Compensated TX
Power Detectors
PA Bias Control Function
Antenna Port OP1dB = +23 dBm Typical
Antenna Port OIP3 = +33 dBm, Typical
Frequency Range: 2.4 to 2.5 and
4.9 to 5.9 GHz
Noise Figure: 4 dB ISM Band, 6 dB 5 GHz
Bands Typical
Typical Gain: 38 dB TX, 20 dB RX
IF = 374 MHz
RSVD2
V+PA1B
PABCB
37
36
35 34
33
V+PA2B
RFB
39 38
BCIN
RXDGC
40
1
TR
MXB
LOADJB
TXGADJB
TRF2436 PACKAGE
(TOP VIEW)
32 31
30
V+PA3B
28
DETN
RSVD1
4
27
RFANTB
LOP
5
26
V+LNABA
LON
6
25
RFANTA
IFP
7
24
GND
IFN
8
23
GND
MXA
9
22
BYPOUT
15
16 17
18
21
19 20
BYPIN
BCOUT
14
V+PA2A
12 13
V+IFN
10
11
V+IF
V+LOA
V+PA3A
3
PABCA
V+LOB
V+GEN
DETB
V+PA1A
29
RFA
2
V+IFP
ABSEL
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION
The TRF2436 is a fully integrated Dual Band Tri Mode Radio Frequency Front End (RFFE) designed specifically
for use in 802.16 d/e applications. The TRF2436 is designed to perform RF up and down conversions in the
unlicensed ISM and 4.9-5.9 GHz bands. The TRF2436 uses a common IF frequency for both bands, eliminating
the need for additional IF filtering. Combined with the TI TRF2432 IF/IQ Transceiver/Synthesizer, the TRF2436
completes the TI WLAN two-chip radio.
The TRF2436 incorporates all of the RF blocks for both the “b” and “a” bands except for low cost ceramic filters.
The ASIC includes LNAs, PAs, mixers, bias circuitry, RX gain control, transmit coupler detectors, and T/R
switches. High integration and internal RF matching enhances performance and greatly reduce external part
count. The only external components needed (other than simple passives) for operation are RF filters and
external low power DC switching FETs.
Functional Block Diagram
V+
V+
BPF
PABCA
RFA
MXA
ABSEL
TR
PA
PA
RFANTA
T/R
RXGC
T/R
T/R
IF
T/R
2
A/B
RFANTB
2
T/R
A/B
LO
PA
PABCB RFB
V+
BPF
MXB
DET
2
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
NAME
2
NO.
I/O
TYPE
DESCRIPTION
MXB
1
I/O
RF SE
B band RF Input/Output to mixer. 50-Ω single ended. Do not apply DC.
ABSEL
2
I
Digital
Band select pin. HIGH = A-band. LOW = B-band.
V+LOB
3
I
Power
B band LO amplifier bias +3.3V
RSVD1
4
-
-
LOP
5
I
RF Dif.
Not connected for normal operation. Leave Open.
LO input (differential) Positive, AC coupled
Submit Documentation Feedback
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
DEVICE INFORMATION (continued)
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
I/O
TYPE
DESCRIPTION
LON
6
I
RF Dif.
LO input (differential) Negative, AC coupled
IFP
7
I/O
RF Dif.
IF input/output (differential) Positive, DC coupled, typical DC Voltage is 2.6V
IFN
8
I/O
RF Dif.
IF input/output(differential) Negative, DC coupled, typical DC Voltage is 2.6V
MXA
9
I/O
RF SE
A band RF Input/Output to mixer. 50-Ω single ended. Do not apply DC.
V+LOA
10
I
Power
A band LO amplifier bias +3.3V
V+IF
11
I
Power
IF amplifier bias +3.3V.
V+IFP
12
I
Power
IFP amplifier bias +3.3V.
V+IFN
13
I
Power
IFN amplifier bias +3.3V.
RFA
14
I/O
RF SE
A Band RF Input/Output to PA/LNA. 50-Ω single ended. AC coupled.
V+PA1A
15
I
Power
A band Power amplifier bias +3.3V.
V+GEN
16
I
Power
DC Bias Control Bias +3.3V.
V+PA2A
17
I
Power
A band Power amplifier bias +3.3V.
PABCA
18
-
-
A band PA Bias Control Input
V+PA3A
19
-
-
A band Power amplifier bias +3.3V.
BCOUT
20
O
Analog
Bias Control Output.
BYPIN
21
I
Analog
DC Bias Bypass Input
BYPOUT
22
O
Analog
DC Bias Bypass Output
23, 24
-
-
RFANTA
25
I/O
RF SE
A band RF in/out to antennas. AC coupled.
V+LNABA
26
I
Power
A and B Band LNA bias +3.3V.
RFANTB
27
I/O
RF SE
B band RF in/out to antennas. AC coupled.
DETN
28
O
Analog
Negative RF power detector output
DETP
29
O
Analog
Positive RF power detector output.
V+PA3B
30
I
Power
B band Power amplifier bias +3.3V.
V+PA2B
31
I
Power
B band Power amplifier bias +3.3V.
BCIN
32
I
Analog
Bias control input
PABCB
33
-
-
V+PA1B
34
I
Power
RSVD2
35
-
-
RFB
36
I/O
RF SE
B band RF Input/Output to PA/LNA. 50-Ω single ended. AC coupled.
RXDGC
37
I
Digital
Rx Gain Control. HIGH = minimum gain. LOW = maximum gain
TR
38
I
Digital
Transmit/Receive mode control. HIGH = transmit. LOW = receive.
LOADJB
39
-
-
Not connected for normal operation. Leave Open. B band LO amp bias adjust.
TXGADJB
40
-
-
Not connected for normal operation. Leave open. PAB Amplifier bias adjust.
GND
Connect to ground
B band PA Bias Control Input
B band Power amplifier bias +3.3V.
Not Connected for normal operation. Leave Open.
Submit Documentation Feedback
3
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
VCC
DC supply voltage
0 to 6.9
V
ICC
DC supply current
600
mA
10
dBm
RF input power
Any port and any mode
VID
Digital input voltage
TJC
Junction temperature
θJC
Thermal resistance junction-to-case
TA
Operating temperature
Tstg
Storage temperature
-40 to 105
°C
220
°C
Lead temperature
40 sec maximum
-0.3 to 5
V
175
°C
35
°C/W
-20 to 85
°C
DC CHARACTERISTICS
TYP ratings are at 25°C and VCC = 3.3 V, MIN and MAX ratings are over operating free-air temperature and voltage ranges
(unless otherwise noted)
PARAMETER
VCC
Supply voltage
ICC
Total supply current
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
IIL
Low-level input current
TEST CONDITIONS
MIN
TYP
MAX
2.7
3.3
4.2
V
B Band, RX Mode
65
105
mA
A Band, RX Mode
80
120
mA
410
520
mA
450
550
mA
Specification compliant
B Band, TX Mode, Max PABC input
A Band, TX Mode, Max PABC input
1.7
UNIT
V
100
0.5
V
300
µA
-50
µA
RECEIVER CHARACTERISTICS
TR = Low, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise
noted)
PARAMETER
fIRF
RF input frequency
fLO
LO input frequency
fIF
IF input frequency
G
∆G
Gain
Gain step size
Noise figure
4
TEST CONDITIONS
MIN
TYP
MAX
B band
2400
2500
A band
4900
5900
B band
2774
2874
A band
2637
3137
374
B Band High Gain Mode
RXGC=LOW
17
19
A Band High Gain Mode
RXGC=LOW
18
23
MHz
MHz
MHz
dB
B Band Low Gain Mode
RXGC=HIGH
25
A Band Low Gain Mode
RXGC=HIGH
15
dB
B Band. Max Gain
4
5
A Band. Max Gain
6
7.5
Submit Documentation Feedback
UNIT
dB
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
RECEIVER CHARACTERISTICS (continued)
TR = Low, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
-16
-13
A Band High Gain Mode
RXGC=LOW
-22
-18
A Band Low Gain Mode
RXGC=HIGH
-16
-13
B Band High Gain Mode
RXGC=LOW
-6
-2
B Band Low Gain Mode
RXGC=HIGH
4
8
A Band High Gain Mode
RXGC=LOW
-12
-8
A Band Low Gain Mode
RXGC=HIGH
-6
-3
B Band High Gain Mode
RXGC=LOW
Input P-1dB
Input 3rd order intercept point
MAX
B Band Low Gain Mode
RXGC=HIGH
UNIT
dBm
dBm
RF input return loss
Z = 50 Ω Both Bands, Both Gain
modes
8
dB
LNA out return loss RF
Z = 50 Ω Both Bands, Both Gain
modes
9
dB
Mixer input MX return loss
Z = 50 Ω Both Bands
10
dB
Output return loss
Measured into 200 Ω differential
10
LO at MX leakage
LO at IF leakage
Gain flatness full band
dB
B band
-30
A Band (5274-6274 MHz)
-30
Both bands
-40
B band
1
A band
2
Gain flatness / 22 MHz
Both bands
Gain settling time
Full range to within 0.5 dB final. All
bands
0.3
In Band: B Band High Gain Mode
RXGC=LOW
30
In Band: B Band Low Gain Mode
RXGC=HIGH
5
In Band: A Band High Gain Mode
RXGC=LOW
25
In Band: A Band Low Gain Mode
RXGC=HIGH
35
RF to RFANT isolation
dBm
dBm
dB
dB
µs
dB
TRANSMITTER CHARACTERISTICS
TR = High, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise
noted)
PARAMETER
fIF
fORF
fLO
G
TEST CONDITIONS
MIN
IF input frequency
RF output frequency
LO input frequency
Gain
TYP
MAX
374
UNIT
MHz
B band
2400
2500
MHz
A band
4900
5900
MHz
B band
2774
2874
MHz
A band
2637
3137
MHz
B Band
37
40
dB
A Band
40
43
dB
Submit Documentation Feedback
5
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
TRANSMITTER CHARACTERISTICS (continued)
TR = High, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25°C and VCC = 3.3 V (unless otherwise
noted)
PARAMETER
Output 1 dB gain compression
Output 3rd order intercept
llkg
MIN
TYP
B band. max PABC input
TEST CONDITIONS
22
23.5
MAX
UNIT
dBm
A band. max PABC input
20.5
22.5
dBm
5150 – 5350 MHz Max PABC input,
V+PA = 2.9 V min,
Other VCC = 2.7 V min
20.5
22.5
dBm
B band
32
35
dBm
A band
30
32.5
dBm
Noise figure
Both bands
IF input return loss
Measured into 200 Ω differential
8
dB
Mixer output return loss MX
Z = 50 Ω both bands
10
dB
RF input return loss RF
Z = 50 Ω both bands
8
dB
RFANT return loss
Z = 50 Ω both bands
6
dB
LO leakage at MX
Gain flatness full band
dB
B band
-35
dBm
A band (5274-6274 MHz)
-35
dBm
B band
1
dB
A band
2
dB
Gain flatness / 22 MHz
Both bands
PA harmonics
Both bands CW at P1 dB
RFANT to RF isolation
8
dB
-20
dBc
B band
50
dB
A band
50
dB
PA Off Isolation RF to RFANT
In band: both bands
50
PA Turn On Time
To within 0.5 dB max power
0.2
dB
µs
PA Turn Off Time
To within -20 dB max power
0.2
µs
PA droop
From max power after turn-on time,
Maximum on duration is 200 ms
PA Bias Control Input Range
(PABC)
Max Current corresponds to max PA
bias state
0.5
dB
mA
COMMON ELECTRICAL CHARACTERISTICS
MIN, TYP, and MAX ratings are at 25°C and VCC = 3.3 V (unless otherwise noted)
PARAMETER
TR_SEL switch time
TEST CONDITIONS
MIN
Gain within 0.5dB. Not Including PA
ramp time
TYP
MAX
0.3
1
AB_SEL switch time
LO input power
Reference to 100 Ω differential
LO input return loss
Measured to 100 Ω differential at
25°C
IF port impedance
Differential
LO port impedance
6
Submit Documentation Feedback
-1
UNIT
µs
1
µs
5
dBm
6
200
Ω
100
Ω
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
TYPICAL CHARACTERISTICS
A Band Detector Output
1000
VDETP−VDETN (mV)
100
10
25C
−25C
1
85C
0.1
0
5
10
15
20
25
Pout(dBm)
Figure 1. A Band Detector Output
B Band Detector Output
1000
VDETP−VDETN (mV)
100
10
25C
−25C
1
85C
0.1
−10−5 0 5 10152025
Pout(dBm)
Figure 2. B Band Detector Output
Submit Documentation Feedback
7
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
PIN 1
PIN 1
APPLICATION INFORMATION
Figure 3. Package Dimensions
8
Submit Documentation Feedback
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
APPLICATION INFORMATION (continued)
Figure 4. Package Dimensions
Submit Documentation Feedback
9
TRF2436
www.ti.com
SLWS176B – APRIL 2005 – REVISED MARCH 2007
APPLICATION INFORMATION (continued)
PIN 1
Figure 5. Recommended PCB Layout
W2
P
W1
D1
D2
Feed Direction
Tape and Reel specifications defined per EIA−481−1A and EIA−481−2A.
Package Description
Parts
per Reel
Pitch P
(mm)
Tape Width
W1 (mm)
Reel Size
D (Inches)
Reel Width
W2 (mm)
6mm x 6mm LPCC40 Pin
3500
12
16
13
18.2
Figure 6. Tape and Reel Specifications
10
Submit Documentation Feedback
Hub Dia.
D2 (mm)
102
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TRF2436IRTBR
ACTIVE
QFN
RTB
40
2500 Green (RoHS &
no Sb/Br)
CU SN
Level-3-260C-168 HR
TRF2436IRTBRG4
ACTIVE
QFN
RTB
40
2500 Green (RoHS &
no Sb/Br)
CU SN
Level-3-260C-168 HR
TRF2436IRTBT
ACTIVE
QFN
RTB
40
250
Green (RoHS &
no Sb/Br)
CU SN
Level-3-260C-168 HR
TRF2436IRTBTG4
ACTIVE
QFN
RTB
40
250
Green (RoHS &
no Sb/Br)
CU SN
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Mailing Address:
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated