128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) 128Mb SDRAM Specification P2V28S20DTP-7,-75,-8 P2V28S30DTP-7,-75,-8 P2V28S40DTP-7,-75,-8 MIRA TECHNOLOGY INC. 8F., 68, SEC.3, NANKING E. RD. , TAIPEI, TAIWAN, R.O.C. TEL:886-2-25170055.25170066 FAX:886-2-25174575 JULY.2000 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 P2V28S30ATP-7,-75,-8 P2V28S40ATP-7,-75,-8 PRELIMINARY (4-BANK x 8,388,608-WORD x 4-BIT) (4-BANK x 4,194,304-WORD x 8-BIT) (4-BANK x 2,097,152-WORD x 16-BIT) Some of contents are described for general products and are subject to change without notice. DESCRIPTION P2V28S20ATP is organized as 4-bank x 8,388,608-word x 4-bit Synchronous DRAM with LVTTL interface and P2V28S30ATP is organized as 4-bank x 4,194,304-word x 8-bit and P2V28S40ATP is organized as 4-bank x 2,097, P2V28S20ATP,P2V28S30ATP and P2V28S40ATP achieve very high speed data rates up to 166MHz, and are suitable for main memories or graphic memories in computer systems. 152-word x 16-bit. All inputs and outputs are referenced to the rising edge of CLK. FEATURES ITEM -7 tCLK Clock Cycle Time tRAS tRCD Active to Precharge Command Period (Min.) (Min.) Row to Column Delay tAC Access Time from CLK (Max.) Ref /Active Command Period (Min.) tRC Icc1 Icc6 Operation Current (Single Bank) Self Refresh Current (Min.) (Max.) (Max.) CL=2 CL=3 - P2V28S20/30/40ATP -75 -8 7ns 10ns 7.5ns 10ns 8ns 45ns 45ns 48ns 20ns - 20ns 6ns 20ns 6ns 5.4ns 63ns 5.4ns 6ns 67.5ns 70ns V28S20D 85mA 85mA 85mA V28S30D 85mA 85mA 85mA V28S40D 85mA 85mA 85mA 1mA 1mA 1mA CL=2 CL=3 -7,-75,-8 - Single 3.3V ±0.3V power supply - Max. Clock frequency -7:143MHz<3-3-3>/-75:133MHz<3-3-3>/-8:100MHz<2-2-2> - Fully synchronous operation referenced to clock rising edge - 4-bank operation controlled by BA0,BA1(Bank Address) - /CAS latency- 2/3 (programmable) - Burst length- 1/2/4/8/FP (programmable) - Burst type- Sequential and interleave burst (programmable) - Byte Control- DQML and DQMU (P2V28S40ATP) - Random column access - Auto precharge / All bank precharge controlled by A10 - Auto and self refresh - 4096 refresh cycles /64ms - LVTTL Interface - Package P2V28S20ATP/30ATP/40ATP 400-mil, 54-pin Thin Small Outline (TSOP II) with 0.8mm lead pitch JULY.2000 Page-1 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) PIN CONFIGURATION (TOP VIEW) P2V28S20ATP P2V28S30ATP P2V28S40ATP PIN CONFIGURATION (TOP VIEW) JULY.2000 Vdd DQ0 VddQ NC DQ1 VssQ NC DQ2 VddQ NC DQ3 VssQ NC Vdd NC /WE /CAS /RAS /CS BA0(A13) BA1(A12) A10(AP) A0 A1 A2 A3 Vdd Vdd DQ0 VddQ DQ1 DQ2 VssQ DQ3 DQ4 VddQ DQ5 DQ6 VssQ DQ7 Vdd DQML /WE /CAS /RAS /CS BA0(A13) BA1(A12) A10(AP) A0 A1 A2 A3 Vdd 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 400mil 54pin TSOP(II) Vdd NC VddQ NC DQ0 VssQ NC NC VddQ NC DQ1 VssQ NC Vdd NC /WE /CAS /RAS /CS BA0(A13) BA1(A12) A10(AP) A0 A1 A2 A3 Vdd 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 Vss DQ15 VssQ DQ14 DQ13 VddQ DQ12 DQ11 VssQ DQ10 DQ9 VddQ DQ8 Vss NC DQMU CLK CKE NC A11 A9 A8 A7 A6 A5 A4 Vss Vss NC VssQ NC DQ3 VddQ NC NC VssQ NC DQ2 VddQ NC Vss NC DQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 Vss Vss DQ7 VssQ NC DQ6 VddQ NC DQ5 VssQ NC DQ4 VddQ NC Vss NC DQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 Vss CLK : Master Clock DQM : Output Disable / Write Mask CKE : Clock Enable /CS : Chip Select A0-11 BA0,1 : Address Input : Bank Address /RAS : Row Address Strobe Vdd : Power Supply /CAS : Column Address Strobe VddQ : Power Supply for Output /WE : Write Enable Vss : Ground DQ0-15 : Data I/O VssQ : Ground for Output Page-2 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) BLOCK DIAGRAM DQ0-7 I/O Buffer Memory Array Memory Array Memory Array Memory Array 4096 x1024 x8 Cell Array 4096 x1024 x8 Cell Array 4096 x1024 x8 Cell Array 4096 x1024 x8 Cell Array Bank #0 Bank #1 Bank #2 Bank #3 Mode Register Control Circuitry Address Buffer Control Signal Buffer Clock Buffer A0-11 BA0,1 CLK CKE /CS /RAS /CAS /WE DQM Note:This figure shows the P2V28S30ATP The A2V28S20ATP configuration is 4096x2048x4 of cell array and DQ0-3 The A2V28S40ATP configuration is 4069x512x16 of cell array and DQ0-15 Type Designation Code P2 V 28 S 3 0 A TP -8 Access Item Package Type -7 : 7 ns (143MHz/3-3-3) -75 : 7.5ns (100MHz/2-2-2 or 133MHz/3-3-3) -8 : 8 ns (100MHz/2-2-2 or 125MHz/3-3-3) TP : TSOP(II) Process Generation A : 2nd generation Function 0 : Random Column Organization 2 : x4, 3 : x8, 4: x16 Synchronous DRAM Density 128 :128Mbit Interface V :LVTTL PSC DRAM JULY.2000 Page-3 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) PIN FUNCTION Input Master Clock: All other inputs are referenced to the rising edge of CLK CKE Input Clock Enable: CKE controls internal clock.When CKE is low, internal clock for the following cycle is ceased. CKE is also used to select auto / self-refresh. After self-refresh mode is started, CKE becomes asynchronous input. Self-refresh is maintained as long as CKE is low. /CS Input Chip Select: When /CS is high, any command means No Operation. /RAS, /CAS, /WE Input Combination of /RAS, /CAS, /WE defines basic commands. A0-11 Input A0-11 specify the Row / Column Address in conjunction with BA0,1. The Row Address is specified by A0-11. The Column Address is specified by A0-9,11(x4)/A0-9(x8)/A0-8(x16). A10 is also used to indicate precharge option. When A10 is high at a read / write command, an auto precharge is performed. When A10 is high at a precharge command, all banks are precharged. BA0,1 Input Bank Address: BA0,1 specifies one of four banks to which a command is applied. BA0,1 must be set with ACT, PRE , READ , WRITE commands. CLK DQ0-3(x4), DQ0-7(x8), DQ0-15(x16) DQM(x4,x8), DQMU/L(x16) Vdd, Vss VddQ, VssQ JULY.2000 Input / Output Data In and Data out are referenced to the rising edge of CLK. Input Power Supply Din Mask / Output Disable: When DQM(U/L) is high in burst write, Din for the current cycle is masked. When DQM(U/L) is high in burst read, Dout is disabled at the next but one cycle. Power Supply for the memory array and peripheral circuitry. Power Supply VddQ and VssQ are supplied to the Output Buffers only. Page-4 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) BASIC FUNCTIONS The P2V28S20 , 30 and 40ATP provides basic functions, bank (row) activate, burst read / write, bank (row) precharge, and auto / self refresh. Each command is defined by control signals of /RAS, /CAS and /WE at CLK rising edge. In addition to 3 signals, /CS ,CKE and A10 are used as chip select, refresh opt ion, and precharge option, respectively . To know the detailed definition of commands, please see the command truth table. CLK /CS Chip Select : L=select, H=deselect /RAS Command /CAS Command /WE Command CKE Refresh Option @ refresh command A10 Precharge Option @ precharge or read/write command define basic command Activate (ACT) [/RAS =L, /CAS =/WE =H] ACT command activates a row in an idle bank indicated by BA. Read (READ) [/RAS =H, /CAS =L, /WE =H] READ command starts burst read from the active bank indicated by BA. First output data appears after /CAS latency. When A10 =H at this command, the bank is deactivated after the burst read (auto-precharge, READA). Write (WRITE) [/RAS =H, /CAS =/WE =L] WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write (auto-precharge, WRITEA). Precharge (PRE) [/RAS =L, /CAS =H, /WE =L] PRE command deactivates the active bank indicated by BA. This command also terminates burst read / write operation. When A10 =H at this command, all banks are deactivated (precharge all, PREA ). Auto-Refresh (REFA) [/RAS =/CAS =L, /WE =CKE =H] REFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically. JULY.2000 Page-5 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) COMMAND TRUTH TABLE MNEMONIC CKE n-1 CKE n /CS DESEL H X H X X X X No Operation NOP H X L H H H Row Address Entry & Bank Active ACT H X L L H Single Bank Precharge PRE H X L L PREA H X L WRITE H X WRITE A H READ COMMAND A1 0 A0-9 X X X X X X X H V V V V H L V X L X L H L X X H X L H L L V V L V X L H L L V V H V H X L H L H V V L V READA H X L H L H V V H V Auto-Refresh REFA H H L L L H X X X X Self-Refresh Entry REFS H L L L L H X X X X L H H X X X X X X X Self-Refresh Exit REFSX L H L H H H X X X X TBST H X L H H L X X X X MRS H X L L L L L L L V*1 Deselect Precharge All Banks Column Address Entry &Write Column Address Entry & Write with Auto-Precharge Column Address Entry & Read Column Address Entry & Read with Auto-Precharge Burst Terminate Mode Register Set /RAS /CAS /WE BA0,1 A1 1 H=High Level, L=Low Level, V=Valid, X=Don't Care, n=CLK cycle number NOTE: 1. A7-A9 =0, A0-A6 =Mode Address JULY.2000 Page-6 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE Current State /CS /RAS /CAS /WE Address IDLE ROW ACTIVE JULY.2000 Command Action H X X X X DESEL NOP L H H H X NOP NOP L H H L BA TBST ILLEGAL*2 L H L X BA, CA, A10 READ / WRITE ILLEGAL*2 L L H H BA, RA ACT L L H L BA, A10 PRE / PREA NOP*4 L L L H X REFA Auto-Refresh*5 L L L L Op-Code, Mode-Add MRS Mode Register Set*5 H X X X X DESEL NOP L H H H X NOP NOP L H H L BA TBST NOP L H L H BA, CA, A10 L H L L BA, CA, A10 L L H H BA, RA ACT L L H L BA, A10 PRE / PREA Precharge / Precharge All L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL READ / READA WRITE / WRITEA Page-7 Bank Active, Latch RA Begin Read, Latch CA, Determine Auto-Precharge Begin Write, Latch CA, Determine Auto-Precharge Bank Active / ILLEGAL*2 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE (continued) Current State /CS READ H X X X X DESEL NOP (Continue Burst to END) L H H H X NOP NOP (Continue Burst to END) L H H L BA L H L H BA, CA, A10 READ /READA Terminate Burst, Latch CA,Begin Read, Determine Auto-Precharge*3 L H L L BA, CA, A10 WRITE / WRITEA Terminate Burst, Latch CA,Begin Write, Determine Auto-Precharge*3 L L H H BA, RA ACT Bank Active / ILLEGAL*2 L L H L BA, A10 PRE / PREA Terminate Burst, Precharge L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL H X X X X DESEL NOP (Continue Burst to END) L H H H X NOP NOP (Continue Burst to END) L H H L BA L H L H BA, CA, A10 L H L L BA, CA, A10 L L H H BA, RA ACT Bank Active / ILLEGAL*2 L L H L BA, A10 PRE / PREA Terminate Burst, Precharge L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL WRITE JULY.2000 /RAS /CAS /WE Address Command Action TBST TBST READ / READA WRITE / WRITEA Page-8 Terminate Burst Terminate Burst, Latch CA,Begin Terminate Burst, Latch CA,Begin Read, Determine Auto-Precharge*3 Terminate Burst, Latch CA,Begin Write, Determine Auto-Precharge*3 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE (continued) Current State READ with AUTO PRECHARGE WRITE with AUTO PRECHARGE JULY.2000 /CS /RAS /CAS /WE Address Command Action H X X X X DESEL NOP (Continue Burst to END) L H H H X NOP NOP (Continue Burst to END) L H H L BA TBST ILLEGAL L H L H BA, CA, A10 READ / READA ILLEGAL L H L L BA, CA, A10 WRITE / WRITE A ILLEGAL L L H H BA, RA ACT L L H L BA, A10 PRE / PREA ILLEGAL*2 L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL H X X X X DESEL NOP (Continue Burst to END) L H H H X NOP NOP (Continue Burst to END) L H H L BA L H L H BA, CA, A10 L H L L BA, CA, A10 L L H H BA, RA ACT L L H L BA, A10 PRE / PREA ILLEGAL*2 L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL TBST Bank Active / ILLEGAL*2 ILLEGAL READ / ILLEGAL READA WRITE / ILLEGAL WRITEA Page-9 Bank Active / ILLEGAL*2 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE (continued) Current State /CS PRE CHARGING H X X X X DESEL NOP (Idle after tRP) L H H H X NOP NOP (Idle after tRP) L H H L BA TBST ILLEGAL*2 L H L X BA, CA, A10 READ / WRITE ILLEGAL*2 L L H H BA, RA ACT ILLEGAL*2 L L H L BA, A10 PRE / PREA NOP*4 (Idle after tRP) L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL H X X X X DESEL NOP (Row Active after tRCD) L H H H X NOP NOP (Row Active after tRCD) L H H L BA L H L X BA, CA, A10 L L H H L L H L L L L ROW ACTIVATING JULY.2000 /RAS /CAS /WE Address Command Action TBST ILLEGAL*2 READ / WRITE ILLEGAL*2 BA, RA ACT ILLEGAL*2 L BA, A10 PRE / PREA ILLEGAL*2 L H X REFA ILLEGAL L L Op-Code, Mode-Add MRS ILLEGAL Page-10 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE (continued) Current State WRITE RECOVERING REFRESHING JULY.2000 /CS /RAS /CAS /WE Address Command Action H X X X X DESEL NOP L H H H X NOP NOP L H H L BA TBST ILLEGAL*2 L H L X BA, CA, A10 READ / WRITE ILLEGAL*2 L L H H BA, RA ACT ILLEGAL*2 L L H L BA, A10 PRE / PREA ILLEGAL*2 L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL H X X X X DESEL NOP (Idle after tRC) L H H H X NOP NOP (Idle after tRC) L H H L BA TBST ILLEGAL L H L X BA, CA, A10 READ / WRITE ILLEGAL L L H H BA, RA ACT ILLEGAL L L H L BA, A10 PRE / PREA ILLEGAL L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL Page-11 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE (continued) Current State /CS MODE REGISTER SETTING H X X X X DESEL NOP (Idle after tRSC) L H H H X NOP NOP (Idle after tRSC) L H H L BA TBST ILLEGAL L H L X BA, CA, A10 READ / WRITE ILLEGAL L L H H BA, RA ACT ILLEGAL L L H L BA, A10 PRE / PREA ILLEGAL L L L H X REFA ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL JULY.2000 /RAS /CAS /WE Address Command Page-12 Action Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) FUNCTION TRUTH TABLE for CKE Current State SELFREFRESH*1 POWER DOWN ALL BANKS IDLE*2 ANY STATE other than listed above CKE n-1 CKE n /CS H X X X L H H L H L /RAS /CAS /WE Add Action X X X INVALID X X X X Exit Self-Refresh (Idle after tRC) L H H H X Exit Self-Refresh (Idle after tRC) H L H H L X ILLEGAL L H L H L X X ILLEGAL L H L L X X X ILLEGAL L L X X X X X NOP (Maintain Self-Refresh) H X X X X X X INVALID L H X X X X X Exit Power Down to Idle L L X X X X X NOP (Maintain Power Down) H H X X X X X Refer to Function Truth Table H L L L L H X Enter Self-Refresh H L H X X X X Enter Power Down H L L H H H X Enter Power Down H L L H H L X ILLEGAL H L L H L X X ILLEGAL H L L L X X X ILLEGAL L X X X X X X Refer to Current State =Power Down H H X X X X X Refer to Function Truth Table H L X X X X X Begin CLK Susspend at Next Cycle*3 L H X X X X X Exit CLK Susspend at Next Cycle*3 L L X X X X X Maintain CLK Suspend ABBREVIATIONS: H=High Level, L=Low Level, X=Don't Care NOTES: 1. CKE Low to High transition will re-enable CLK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT. 2. Power-Down and Self-Refresh can be entered only from the All Banks Idle State. 3. Must be legal command. JULY.2000 Page-13 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) SIMPLIFIED STATE DIAGRAM SELF REFRESH REFS REFSX MODE REGISTER SET MRS REFA AUTO REFRESH IDLE CKEL CLK SUSPEND CKEH ACT POWER DOWN CKEL CKEH ROW ACTIVE TERM READ WRITE WRITE SUSPEND WRITEA CKEL WRITE CKEH READA READ WRITE READ SUSPEND READA WRITEA POWER APPLIED CKEL READ CKEH WRITEA WRITEA SUSPEND TERM READA CKEL CKEL WRITEA READA CKEH CKEH POWER ON PRE PRE PRE READA SUSPEND PRE PRE CHARGE Automatic Sequence Command Sequence JULY.2000 Page-14 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) POWER ON SEQUENCE MODE REGISTER Before starting normal operation, the following power on Burst Length, Burst Type and /CAS Latency can be pro- sequence is necessary to prevent a SDRAM from damaged or malfunctioning. grammed by setting the mode register (MRS). The mode register stores these data until the next MRS command, 1. Apply power and start clock. Attempt to maintain CKE which may be issued when all banks are in idle state. After tRSC from a MRS command, the SDRAM is ready for new high, DQM high and NOP condition at the inputs. 2. Maintain stable power, stable clock, and NOP input con- command. ditions for a minimum of 200µs. 3. Issue precharge commands for all banks. (PRE or PREA) 4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands. 5. Issue a mode register set command to initialize the mode register. CLK After these sequence, the SDRAM is idle state and ready /RAS for normal operation. /CAS /CS /WE V BA0,1 A11-A0 BA0 BA1 A1 1 A1 0 A9 0 0 0 CL LATENCY MODE 0 0 A7 0 0 /CAS LATENCY 000 001 R R 0 0 1 1 1 1 2 3 R R R R 1 1 0 0 1 1 A8 0 1 0 1 0 1 A6 A5 A4 LTMODE A3 A2 BT A1 BL BURST LENGTH BURST TYPE A0 BL BT= 0 BT= 1 0 0 1 1 0 0 1 0 1 0 1 2 4 8 R 1 2 4 8 R 101 110 111 R R FP R R R 0 0 0 0 1 0 1 SEQUENTIAL INTERLEAVED R: Reserved for Future Use FP: Full Page JULY.2000 Page-15 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) CLK Command Read Write Address Y Y Q0 DQ CL= 3 BL= 4 /CAS Latency Q1 Q2 Q3 D0 Burst Length D1 D2 D3 Burst Length Burst Type Initial Address BL Column Addressing A2 A1 A0 0 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 0 1 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6 0 1 0 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5 0 1 1 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4 Sequential Interleaved 8 1 0 0 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 1 0 1 5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2 1 1 0 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1 1 1 1 7 0 1 2 3 4 5 6 7 6 5 4 3 2 1 0 - 0 0 0 1 2 3 0 1 2 3 - 0 1 1 2 3 0 1 0 3 2 4 - 1 0 2 3 0 1 2 3 0 1 - 1 1 3 0 1 2 3 2 1 0 - - 0 0 1 0 1 1 0 1 0 2 - JULY.2000 - 1 Page-16 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) OPERATIONAL DESCRIPTION BANK ACTIVATE READ The SDRAM has four independent banks. Each bank is activated by the ACT command with the bank addresses (BA0,1). A row is indicated by the row addresses A0-11. The minimum activation interval between one bank and the other bank is tRRD. Maximum 2 ACT commands are allowed within tRC , although the number of banks which are active concurrently is not limited. After tRCD from the bank activation, a READ command can be issued. 1st output data is available after the /CAS Latency from the READ, followed by (BL -1) consecutive data when the Burst Length is BL. The start address is specified by A0-A9(x4), A0-8(X8), A0-7 (X16) , and the address sequence of burst data is defined by the Burst Type. A READ command may be applied to any active bank, so the row precharge time (tRP) can be hidden behind continuous output data by interleaving the multiple banks. When A10 is high at a READ command, the auto-precharge (READA) is performed. Any command (READ, WRITE, PRE, TBST, ACT) to the same bank is inhibited till the internal precharge is complete. The internal precharge starts at BL after READA. (Need to keep tRAS min.) The next ACT command can be issued after (BL + tRP) from the previous READA. PRECHARGE The PRE command deactivates the bank indicated by BA0,1. When multiple banks are active, the precharge all command (PREA, PRE + A10=H) is available to deactivate them at the same time. After tRP from the precharge, an ACT command to the same bank can be issued. Bank Activation and Precharge All (BL=4, CL=3) CLK 2 ACT command / tRCmin tRCmin Command ACT ACT READ A0-9 Xa Xb tRCD Y A10 Xa Xb 0 A11 Xa Xb BA0,1 00 01 DQ PRE ACT tRAS tRRD tRP Xb Xb 1 Xb 00 01 Qa0 Qa1 Qa2 Qa3 Precharge all JULY.2000 Page-17 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Multi Bank Interleaving READ (BL=4, CL=3) CLK Command ACT READ ACT READ PRE tRCD A0-9 Xa Y Xb Y A10 Xa 0 Xb 0 0 A11 Xa BA0,1 00 10 00 Qa1 Qa2 Xb 00 10 DQ Qa0 Qa3 Qb0 Qb1 Qb2 /CAS latency Burst Length READ with Auto-Precharge (BL=4, CL=3) CLK BL + tRP Command ACT ACT READ tRCD tRP BL A0-9 Xa Y Xa A10 Xa 1 Xa A11 Xa BA0,1 00 Xa 00 00 Qa0 DQ Qa1 Qa2 Qa3 Internal precharge start READ Auto-Precharge Timing (BL=4) CLK Command AC T READ BL CL=3 DQ CL=2 DQ Qa0 Qa0 Qa1 Qa2 Qa1 Qa2 Qa3 Qa3 Internal Precharge Start Timing JULY.2000 Page-18 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) WRITE After tRCD from the bank activation, a WRITE command can be issued. 1st input data is set at the same cycle as the WRITE. Following (BL -1) data are written into the RAM, when the Burst Length is BL. The start address is specified by A0-A9(x4), A0-8(X8), A0-7(X16) and the address sequence of burst data is defined by the Burst Type. A WRITE command may be applied to any active bank, so the row precharge time (tRP) can be hidden behind continuous input data by interleaving the multiple banks. From the last input data to the PRE command, the write recovery time (tWR) is required. When A10 is high at a WRITE command, the autoprecharge (WRITEA) is performed. Any command (READ, WRITE, PRE, TBST, ACT) to the same bank is inhibited till the internal precharge is complete. The internal precharge begins at tWR after the last input data cycle. (Need to keep tRAS min.) The next ACT command can be issued after tRP from the internal precharge timing. WRITE with Auto-Precharge (BL=4) CLK Command ACT Write PRE PRE 0 0 0 0 10 00 10 Db0 Db1 Write ACT tRCD tRCD A0-9 Xa Y Xb A10 Xa Xa 0 Xb A11 Xa Xa BA0,1 00 Y 0 Xb DQ 00 10 Da0 Da1 Da2 Da3 Db2 Db3 Multi Bank Interleaving WRITE (BL=4) CLK Command Write ACT ACT tRCD tRP A0-9 Xa Y Xa A10 Xa 1 Xa A11 Xa BA0,1 00 Xa 00 00 tWR DQ Da0 Da1 Da2 Da3 Internal precharge starts JULY.2000 Page-19 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) BURST INTERRUPTION [ Read Interrupted by Read ] Burst read operation can be interrupted by new read of any bank. Random column access is allowed READ to READ interval is minimum 1 CLK.. Read Interrupted by Read (BL=4, CL=3) CLK Command READ READ READ READ Yl A0-9 Yi Yj Yk A10 0 0 0 00 00 10 0 A11 BA0,1 Qai0 DQ 01 Qaj0 Qaj1 Qbk0 Qbk1 Qbk2 Qal0 Qal1 Qal2 Qal3 [ Read Interrupted by Write ] Burst read operation can be interrupted by write of any bank. Random column access is allowed. In this case, the DQ should be controlled adequately by using the DQM to prevent the bus contention. The output is disabled automatically 1 cycle after WRITE assertion. Read Interrupted by Write (BL=4, CL=3) CLK Command READ Write A0-9 Yi Yj A10 0 0 00 00 A11 BA0,1 DQM Q D Qai0 Daj0 Daj1 Daj2 Daj3 DQM control Write control JULY.2000 Page-20 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) [ Read Interrupted by Precharge ] Burst read operation can be interrupted by precharge of the same bank . READ to PRE interval is minimum 1 CLK. A PRE command to output disable latency is equivalent to the /CAS Latency. As a result, READ to PRE interval determines valid data length to be output. The figure below shows examples of BL=4. Read Interrupted by Precharge (BL=4) CLK Command PRE READ DQ Command CL=3 READ CL=2 READ DQ JULY.2000 PRE Q0 READ Q1 Q2 PRE Q0 DQ Command Q1 Q0 DQ Command Q0 Q2 READ PRE DQ Command Q1 PRE DQ Command Q0 Q1 READ PRE Q0 Page-21 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) [Read Interrupted by Burst Terminate] READ to TBST interval is minimum 1 CLK. A TBST command to Similarly to the precharge, a burst terminate command can inter- output disable latency is equivalent to the /CAS Latency. rupt the burst read operation and disable the data output. The terminated bank remains active. Read Interrupted by Terminate (BL=4) CLK Command TBST READ DQ Command CL=3 READ CL=2 READ DQ JULY.2000 TBST Q0 READ Q1 Q2 TBST Q0 DQ Command Q1 Q0 DQ Command Q0 Q2 READ TBST DQ Command Q1 TBST DQ Command Q0 Q1 READ TBST Q0 Page-22 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) [ Write Interrupted by Write ] Burst write operation can be interrupted by new write of any bank. Random column access is allowed. WRITE to WRITE interval is minimum 1 CLK. Write Interrupted by Write (CL=3,BL=4) CLK Command Write Write Write Write A0-9 Yi Yj Yk Yl A10 0 0 0 0 BA0,1 00 00 10 00 DQ Dai0 Daj0 A11 Daj1 Dbk0 Dbk1 Dbk2 Dal0 Dal1 Dal2 Dal3 [ Write Interrupted by Read ] Burst write operation can be interrupted by read of the same or the other bank. Random column access is allowed. WRITE to READ interval is minimum 1 CLK. The input data on DQ at the interrupting READ cycle is "don't care". Write Interrupted by Read (CL=3,BL=4) CLK Command Write READ Write READ A0-9 Yi Yj Yk Yl A10 0 0 0 0 00 00 10 00 A11 BA0,1 DQM DQ JULY.2000 Dai0 Qaj0 Qaj1 Page-23 Dbk0 Dbk1 Qal0 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) [ Write Interrupted by Precharge ] Burst write operation can be interrupted by precharge of the same bank.Write recovery time(tWR) is required from the last data to PRE command. During write recovery, data inputs must be masked by DQM. Write Interrupted by Precharge (BL=4) CLK Command ACT Write PRE ACT tRP A0-9,11 Xa Ya Xa A10 0 0 0 0 BA0-1 00 00 00 00 DQM tWR DQ Da 0 Da 1 [Write Interrupted by Burst Terminate] Burst terminate command can terminate burst write operation.In this case, the write recovery time is not required and the bank remains active. WRITE to TBST interval is minimum 1 CLK. Write Interrupted by Terminate (BL=4) CLK Command ACT Write A0-9,11 Xa Ya Yb A10 0 0 0 BA0-1 00 00 00 DQ JULY.2000 Da 0 TBST Da 1 Write Db 0 Page-24 Db 1 Db 2 Db 3 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) [Write with Auto-Precharge Interrupted by Write or Read to another Bank] Burst write with auto-precharge can be interrupted by write or read to another bank. Next ACT command can be issued after tRP. Auto-precharge interruption by a command to the same bank is inhibited. Write Interrupted by WRITE to another bank (BL=4) CLK Command Write ACT Write BL A0-9,11 Ya tRP Xa Yb tWR A10 1 0 Xa BA0-1 00 10 00 DQ Da 0 Da 1 auto-precharge Db 0 Db 1 Db 2 Db 3 interrupted activate Write Interrupted by READ to another bank (CL=2,BL=4) CLK Command Write ACT Read BL A0-9,11 Ya tRP Xa Yb tWR A10 1 0 Xa BA0-1 00 10 00 DQ Da 0 Da 1 auto-precharge JULY.2000 Qb0 interrupted Qb1 Qb2 Qb3 activate Page-25 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) [Read with Auto-Precharge Interrupted by Read to another Bank] Burst write with auto-precharge can be interrupted by write or read to another bank. Next ACT command can be issued after tRP. Auto-precharge interruption by a command to the same bank is inhibited. Read Interrupted by Read to another bank (CL=2,BL=4) CLK Command Read Read ACT BL A0-9,11 tRP Ya Yb Xa A10 1 0 Xa BA0-1 00 10 00 DQ Qa0 auto-precharge Qa1 Qb0 Qb1 interrupted Qb2 Qb3 activate [Full Page Burst] Full page burst length is available for only the sequential burst type. Full page burst read or write is repeated untill a Precharge or a Burst Terminate command is issued. In case of the full page burst, a read or write with auto-precharge command is illegal. [Single Write] When single write mode is set, burst length for write is always one, independently of Burst Length defined by (A2-0). JULY.2000 Page-26 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) AUTO REFRESH Single cycle of auto-refresh is initiated with a REFA (/CS= /RAS= / be in the idle state. Auto-refresh to auto-refresh interval is mini- CAS= L, /WE= /CKE= H) command. The refresh address is generated internally. 4096 REFA cycles within 64ms refresh 64M bit mum tRC. Any command must not be supplied to the device before tRC from the REFA command. memory cells. The auto-refresh is performed on 4 banks concurrently. Before performing an auto-refresh, all banks must Auto-Refresh CLK /CS NOP or DESELECT /RAS /CAS /WE CKE minimum tRFC A0-11 BA0,1 Auto Refresh on All Banks Auto Refresh on All Banks JULY.2000 Page-27 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) SELF REFRESH Self-refresh mode is entered by issuing a REFS command (/CS= /RAS= /CAS= L, /WE= H, CKE= L). Once the selfrefresh is initiated, it is maintained as long as CKE is kept low. During the self-refresh mode, CKE is asynchronous and the only enabled input ,all other inputs including CLK are synchronous inputs is saved. To exit the self-refresh, supplying stable CLK inputs, asserting DESEL or NOP command and then asserting CKE=H. After tRC from the 1st CLK egde following CKE=H, all banks are in the idle state and a new command can be issued, but DESEL or NOP commands must be asserted till then. disabled and ignored, so that power consumption due to Self-Refresh CLK Stable CLK /CS NOP /RAS /CAS /WE CKE new command A0-11 X BA0,1 00 Self Refresh Exit Self Refresh Entry JULY.2000 Page-28 minimum tRFC for recovery Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) CLK SUSPEND CKE controls the internal CLK at the following cycle. Figure synchronous input except during the self-refresh mode. CLK below shows how CKE works. By negating CKE, the next internal CLK is suspended. The purpose of CLK suspend is suspend can be performed either when the banks are active or idle. A command at the suspended cycle is ignored. power down, output suspend or input suspend. CKE is a ext.CLK tIH tIS tIH tIS CKE int.CLK Power Down by CKE CLK Standby Power Down CKE Command PRE NOP NOP NOP Active Power Down CKE Command ACT NOP NOP NOP DQ Suspend by CKE (CL=2) CLK CKE Command DQ JULY.2000 Write D0 Read D1 D2 D3 Page-29 Q0 Q1 Q2 Q3 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) DQM CONTROL DQM is a dual function signal defined as the data mask for writes and the output disable for reads. During writes, DQM(U,L) masks input data word by word. DQM(U,L) to write mask latency is 0. During reads, DQM(U,L) forces output to Hi-Z word by word. DQM(U,L) to output Hi-Z latency is 2. DQM Function(CL=3) CLK Command Write READ DQM DQ D0 D2 D3 Q0 Q3 disabled by DQM(U,L)=H masked by DQM(U,L)=H JULY.2000 Q1 Page-30 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) ABSOLUTE MAXIMUM RATINGS Symbol Parameter Conditions Ratings Unit Vdd Supply Voltage with respect to Vss -0.5 - 4.6 V VddQ Supply Voltage for Output with respect to VssQ -0.5 - 4.6 V VI Input Voltage with respect to Vss -0.5 - 4.6 V VO Output Voltage with respect to VssQ -0.5 - 4.6 V IO Output Current Pd Power Dissipation Topr Operating Temperature Tstg Storage Temperature Ta = 25˚C 50 mA 1000 mW 0 - 70 ˚C -65 - 150 ˚C RECOMMENDED OPERATING CONDITIONS (Ta=0 - 70 ˚C ,unless otherwise noted) Symbol Limits Parameter Min. Typ. Max. 3.6 Vdd Supply Voltage 3.0 3.3 Vss Supply Voltage 0 0 Unit V V VddQ Supply Voltage for output 3.0 3.3 3.6 V VssQ Supply Voltage for output 0 0 0 V VIH*1 High-Level Input Voltage all inputs VddQ +0.3 V VIL*2 Low-level Input Voltage all inputs 2.0 -0.3 0.8 V NOTES: 1. VIH(max)=5.5V for pulse width less than 10ns. 2. VIL(min)=-1.0V for pulse width less than 10ns. CAPACITANCE (Ta=0 -70˚C,Vdd=VddQ=3.3± 0 . 3 V , V s s = V s s Q = 0 V , u n l e s s o t h e r w i s e n o t e d ) Symbol Parameter CI(A) Input Capacitance, address pin CI(C) Input Capacitance, contorl pin CI(K) Input Capacitance, CLK pin CI/O Input Capacitance, I/O pin JULY.2000 Test Condition @ 1MHz 1.4V bias 200mV swing Vcc=3.3V Page-31 Limits (min.) -7 Limits (max.) -75/-8 Unit 2.5 3.8 5.0 pF 2.5 3.8 5.0 pF 2.5 3.5 4.0 pF 4.0 6.5 6.5 pF Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) AVERAGE SUPPLY CURRENT from Vdd (Ta=0 - 70˚C, Vdd=VddQ=3.3±0.3V,Vss=VssQ=0V, unless otherwise noted) ITEM Symbol Limits (max.) Organization -7 -75 -8 Unit Operating current Icc1 tRC=min, tCLK=min BL=1,IOL=0mA x4/x8/x16 100 95 85 mA Precharge Standby current in Non-Power down mode Icc2N CKE=VILmax tCLK=15ns x4/x8/x16 20 20 20 mA Icc2NS CKE=VIHmin CLK=VILmax(fixed) x4/x8/x16 15 15 15 mA Precharge Standby current in Power down mode Icc2P CKE=VIHmin tCLK=15ns(Note) x4/x8/x16 2 2 2 mA Icc2PS CKE=VIHmin tCLK=VILmax(fixed) x4/x8/x16 1 1 1 mA Icc3N CKE=/CS=VIHmin tCLK=15ns(Note) x4/x8/x16 30 30 30 Icc3NS CKE=VIHmin tCLK=VILmax(fixed) x4/x8/x16 25 25 25 All Bank Active tCLK = min BL=4, CL=3, IOL=0mA x4/x8/x16 140 130 120 mA x4/x8/x16 130 130 130 mA 7,7.5,8 1 1 1 mA Active Standby current Burst current Icc4 Auto-refresh current Icc5 tRC=min, tCLK=min Self-refresh current Icc6 CKE < 0.2V x4/x8/x16 mA NOTE: 1. Icc(max) is specified at the output open condition. 2. Input signals are changed one time during 30ns. AC OPERATING CONDITIONS AND CHARACTERISTICS (Ta=0 - 70˚C, Vdd=VddQ=3.3±0.3V,Vss=VssQ=0V, unless otherwise noted) Symbol Parameter Limits Test Conditions Min. VOH (DC) High-Level Output Voltage (DC) IOH=-2mA VOL (DC) Low-level Output Voltage (DC) IOL= 2mA IOZ Off-state Output Current Q floating VO=0 -- VddQ II Input Current VIH = 0 -- VddQ +0.3V JULY.2000 Page-32 unit Max. V 2.4 0.4 V -5 5 µA -5 5 µA Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) AC TIMING REQUIREMENTS (Ta=0 - 70˚C, Vdd=VddQ=3.3±0.3V,Vss=VssQ=0V, unless otherwise noted) Input Pulse Levels:0.8V-2.0V Input Timing Measurement Level:1.4V Limits Symbol -7 Parameter Min. tCLK CLK cycle time -75 Max. Min. Unit -8 Max. Min. Max. CL=2 - 10 10 ns CL=3 7 7.5 8 ns tCH CLK High pulse width 2.5 2.5 3 ns tCL CLK Low pulse width 2.5 2.5 3 ns tT Transition time of CLK tIS Input Setup time (all inputs) 1.5 1.3 2 ns tIH Input Hold time (all inputs) 0.8 0.8 0.8 ns tRC Row Cycle time 63 67.5 tRFC tRCD Refresh Cycle Time Row to Column Delay 70 75 80 ns 20 20 20 ns tRAS Row Active time 45 tRP Row Precharge time 20 20 20 ns tWR Write Recovery time 14 15 20 ns tRRD Act to Act Delay time 14 15 20 ns tRSC Mode Register Set Cycle time 14 15 20 ns tREF Refresh Interval time 1 10 100K 64 CLK 1.4V DQ 1.4V 10 1 45 1 10 ns 0 7 100K 64 48 ns 100K 64 ns ms Any AC timing is referenced to the input signal passing through 1.4V. JULY.2000 Page-33 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) SWITCHING CHARACTERISTICS (Ta=0 - 70˚C, Vdd=VddQ=3.3±0.3V,Vss=VssQ=0V, unless otherwise noted) Limits S ymbol Parameter -7 Min. Min. Max. CL=2 tAC Access time from CLK CL=3 tOH Output Hold time from CLK 5.4 Max. Min. Unit Note Max. 6 6 ns 5.4 6 ns 3 3 ns 2.7 3 3 ns 0 0 ns CL=2 CL=3 -8 -7.5 tOLZ Delay time , output lowimpedance from CLK 0 tOHZ Delay time , output highimpedance from CLK 2.7 3 5.4 5.4 3 6 *1 ns NOTE: 1. If clock rising time is longer than 1ns,(tr/2-0.5ns) should be added to the parameter. Output Load Condition CLK VOUT 1.4V 50pF 1.4V DQ Output Timing Measurement Reference Point 1.4V CLK tOLZ DQ 1.4V tAC JULY.2000 tOH tOHZ Page-34 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Burst Write (single bank) @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRC /CS tRAS tRP /RAS tRCD tRCD /CAS tWR tWR /WE CKE DQM A0-8 X A10 X X A9,11 X X BA0,1 0 DQ Y 0 D0 ACT#0 X 0 D0 WRITE#0 D0 0 D0 Y 0 D0 PRE#0 ACT # 0 0 D0 WRITE#0 D0 D0 PRE#0 Italic parameter indicates minimum case JULY.2000 Page-35 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Burst Write (multi bank) @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRC tRC /CS tRAS tRP tRRD /RAS tRCD tRCD tRCD /CAS tWR tWR /WE CKE DQM A0-8 X A10 X X X X A9,11 X X X X BA0,1 0 DQ Y X 0 1 D0 D0 Y D0 ACT#0 WRITE#0 ACT#1 D0 X 1 0 D1 D1 PRE#0 D1 0 0 D1 D0 ACT# 0 WRITEA#1 (Auto-Precharge) Y X 1 D0 D0 0 D0 WRITE#0 PRE#0 ACT#1 Italic parameter indicates minimum case JULY.2000 Page-36 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Burst Read (single bank) @BL=4 CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRC /CS tRAS tRP tRAS /RAS tRCD tRCD /CAS /WE CKE DQM A0-8 X A10 X X A9,11 X X BA0,1 0 Y X 0 DQ 0 Q0 ACT#0 READ# 0 Q0 Y 0 Q0 PRE#0 0 Q0 0 Q0 ACT# 0 READ# 0 Q0 Q0 Q0 PRE#0 Italic parameter indicates minimum case JULY.2000 Page-37 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Burst Read (multiple bank) @BL=4 CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRC tRC /CS tRRD tRAS /RAS tRCD tRCD tRCD /CAS /WE CKE DQM A0-8 X A10 X X X X A9,11 X X X X BA0,1 0 Y X 0 Y 1 DQ X 1 Q0 Q0 Q0 0 Q0 ACT#0 READA# 0 ACT#1 Y Q1 ACT# 0 X 0 Q1 Q1 1 Q1 Q0 READ# 0 0 Q0 Q0 Q0 PRE#0 ACT# 1 READA# 1 Italic parameter indicates minimum case JULY.2000 Page-38 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Write Interrupted by Write @BL=4 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS tRRD /RAS tRCD /CAS tWR /WE CKE DQM A0-8 X A10 X X X A9,11 X X X BA0,1 0 DQ Y X 0 1 D0 D0 ACT#0 WRITE# 0 ACT#1 Y Y 0 D0 D0 Y 1 D0 D1 X 0 D1 WRITE# 0 WRITEA# 1 interrupt interrupt other same bank bank D1 D0 0 D0 WRITE# 0 interrupt other bank D0 1 D0 PRE#0 ACT# 1 Italic parameter indicates minimum case JULY.2000 Page-39 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Read Interrupted by Read @BL=4,CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS tRRD /RAS tRCD tRCD /CAS /WE CKE DQM A0-8 X A10 X X X A9,11 X X X BA0,1 0 Y 0 X Y 1 DQ 1 Q0 ACT#0 READ#0 ACT#1 Y Q0 READ#1 interrupt other bank Y 1 Q0 Q1 X 0 Q1 READA# 1 interrupt same bank Q1 Q1 READ# 0 interrupt other bank 1 Q1 Q0 Q0 Q0 Q0 ACT# 1 Italic parameter indicates minimum case JULY.2000 Page-40 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Write Interrupted by Read, Read Interrupted by Write @BL=4,CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS tRRD /RAS tRCD tRCD /CAS tWR /WE CKE DQM A0-8 X X A10 X X A9,11 X X BA0,1 0 1 DQ Y Y Y 0 1 1 D0 ACT#0 D0 WRITE# 0 Q1 READ#1 Q1 D1 1 D1 WRITE# 1 D1 D1 PRE#1 ACT#1 Italic parameter indicates minimum case JULY.2000 Page-41 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Write/Read Terminated by Precharge @BL=4,CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRC /CS tRP tRAS tRP /RAS tRCD tRCD /CAS tWR /WE CKE DQM A0-8 X A10 X X X A9,11 X X X BA0,1 0 DQ Y 0 D0 ACT#0 X 0 0 Y 0 D0 WRITE# 0 X 0 Q0 PRE#0 ACT#0 Te rminate READ# 0 0 Q0 PRE#0 ACT#0 Te rminate Italic parameter indicates minimum case JULY.2000 Page-42 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Write/Read Terminated by Burst Terminate @BL=4,CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS /RAS tRCD /CAS tWR /WE CKE DQM A0-8 X A10 X A9,11 X BA0,1 0 DQ Y Y Y 0 0 0 D0 ACT#0 D0 Q0 Q0 WRITE# 0 TERM READ# 0 TERM D0 0 D0 WRITE#0 D0 D0 PRE#0 Italic parameter indicates minimum case JULY.2000 Page-43 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Single Write Burst Read @BL=4,CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS /RAS tRCD /CAS /WE CKE DQM A0-8 X A10 X A9,11 X BA0,1 0 DQ Y Y 0 0 D0 ACT#0 WRITE# 0 Q0 Q0 Q0 Q0 READ# 0 Italic parameter indicates minimum case JULY.2000 Page-44 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Power-Up Sequesce and Intialize CLK 200µs /CS tRP tRFC tRFC tRSC /RAS /CAS /WE CKE DQM A0-8 MA X A10 0 X A9,11 0 X BA0,1 0 0 DQ NOP Power On PRE ALL REFA REFA REFA MRS ACT# 0 Minimum 8 REFA cycles Italic parameter indicates minimum case JULY.2000 Page-45 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Auto Refresh 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRFC /CS tRP /RAS tRCD /CAS /WE CKE DQM A0-8 X A10 X A9,11 X BA0,1 0 DQ Y 0 D0 PRE ALL REFA ACT#0 D0 D0 D0 WRITE#0 All banks m ust be idle before REFA is issued. Italic parameter indicates minimum case JULY.2000 Page-46 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Self Refresh 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK tRFC /CS tRP /RAS /CAS /WE CKE DQM A0-8, X A10 X A9,11 X BA0,1 0 DQ PRE ALL Self Refres h Entry Self Refres h Exit ACT#0 All banks m ust be idle before REFS is issued. Italic parameter indicates minimum case JULY.2000 Page-47 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) CLK Suspension @BL=4,CL=2 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS /RAS tRCD /CAS /WE CKE DQM A0-8 X A10 X A9,11 X BA0,1 0 DQ Y Y 0 0 D0 D0 D0 ACT#0 WRITE# 0 internal CLK suspended D0 Q0 READ# 0 Q0 Q0 Q0 internal CLK suspended Italic parameter indicates minimum case JULY.2000 Page-48 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) Power Down 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 CLK /CS /RAS /CAS /WE Standby Power Down Active Power Down CKE DQM A0-8 X A10 X A9,11 X BA0,1 0 DQ PRE ALL JULY.2000 ACT# 0 Page-49 Rev.2.2 128Mb Synchronous DRAM P2V28S20ATP-7,-75,-8 (4-BANK x 8,388,608-WORD x 4-BIT) P2V28S30ATP-7,-75,-8 (4-BANK x 4,194,304-WORD x 8-BIT) P2V28S40ATP-7,-75,-8 (4-BANK x 2,097,152-WORD x 16-BIT) DQM Write Mask @BL=4 JULY.2000 Page-50 Rev.2.2