DATA SHEET SHEET DATA MOS INTEGRATED CIRCUIT PD16311 1/8- to 1/16-DUTY FIPTM (VFD) CONTROLLER/DRIVER The PD16311 is a FIP (Fluorescent Indicator Panel or Vacuum Fluorescent Display) controller/driver that is driven on a 1/8- to 1/16 duty factor. It consists of 12 segment output lines, 8 grid output lines, 8 segment/grid output drive lines, a display memory, a control circuit, and a key scan circuit. Serial data is input to the PD16311 through a three-line serial interface. This FIP controller/driver is ideal as a peripheral device of a single-chip microcomputer. FEATURES • Many display modes (12-segment & 16-digit to 20-segment & 8-digit) • Key scanning (12 4 matrices) • Dimming circuit (eight steps) • High-voltage output (VDD 35 V max). • LED ports (5 chs., 20 mA max). • General-purpose input port (4 bits) • No external resistor necessary for driver outputs (P-ch open-drain + pull-down resistor output) • Serial interface (CLK, STB, DIN, DOUT) ORDERING INFORMATION Part Number Package PD16311GC-AB6 52-pin plastic QFP ( 14) Document No. IC-3306 (1st edition) Date Published March 1997 P Printed in Japan © 1993 PD16311 BLOCK DIAGRAM Command decoder Dimming circuit Display memory 20 bit × 16 Word Serial I/F CLK 20 Segment driver DOUT 20-bit output latch DIN 12 Seg1 Seg12 8 STB 4 4-bit latch SW1 to SW4 4 16 VDD (+5 V) LED5 Seg13/Grid16 Seg20/Grid9 8 8 5-bit latch LED1 2 8 Grid driver Key data memory (4 × 12) 16-bit shift register Timing generator key scan OSC Key1 to Key4 Data selector R Segment/grid driver VDD VSS VEE (0 V) (−30 V) Grid1 Grid8 PD16311 40 Grid5 41 Grid4 42 Grid3 43 Grid2 44 Grid1 45 VDD 46 LED5 47 LED4 48 LED3 49 LED2 50 LED1 51 VSS 52 OSC PIN CONFIGURATION (Top View) 5 35 Seg19/Grid10 DIN 6 34 VEE IC 7 33 VDD CLK 8 32 Seg18/Grid11 STB 9 31 Seg17/Grid12 KEY1 10 30 Seg16/Grid13 KEY2 11 29 Seg15/Grid14 KEY3 12 28 Seg14/Grid15 KEY4 13 27 Seg13/Grid16 Seg12/KS12 26 DOUT Seg11/KS11 25 36 Seg20/Grid9 Seg10/KS10 24 4 Seg9/KS9 23 SW4 Seg8/KS8 22 37 Grid8 Seg7/KS7 21 3 Seg6/KS6 20 SW3 Seg5/KS5 19 38 Grid7 Seg4/KS4 18 2 Seg3/KS3 17 SW2 Seg2/KS2 16 39 Grid6 Seg1/KS1 15 1 VDD 14 SW1 Use all the power pins. Leave the IC pin open. 3 PD16311 Pin Function Pin No. Symbol 6 DIN 5 9 Pin Name Description Data input Inputs serial data at rising edge of shift clock, starting from lower bit. DOUT Data output Outputs serial data at falling edge of shift clock, starting from lower bit. This is N-ch open-drain output pin. STB Strobe Initializes serial interface at rising or falling edge to make PD16311 waiting for reception of command. Data input after STB has fallen is processed as command. While command data is processed, current processing is stopped, and serial interface is initialized. While STB is high, CLK is ignored. 4 8 CLK Clock input Reads serial data at rising edge, and outputs data at falling edge. 52 OSC Oscillator pin Connect resistor for determining oscillation frequency to this pin. 15 to 26 Seg1/KS1 to Seg12/KS12 High-voltage output (segment) Segment output pins (Dual function as key source) 44 to 37 Grid1 to Grid6 High-voltage output (grid) Grid output pins 27 to 32 35 to 36 Seg13/Grid16 to Seg20/Grid9 High-voltage output (segment/grid) These pins are selectable for segment or grid output. 50 to 46 LED1 to LED5 LED output CMOS output. +20 mA max. 10 to 13 Key1 to Key4 Key data input Data input to these pins is latched at end of display cycle. 1 to 4 SW1 to SW4 Switch input These pins constitute 4-bit general-purpose input port. 14, 33, 45 VDD Logic power 5 V 10 % 51 VSS Logic ground Connect this pin to GND of system. 34 VEE Pull-down level VDD 35 V max. 7 IC Internally connected Be sure to leave this pin open (this pin is at VDD level). PD16311 Display RAM Address and Display Mode The display RAM stores the data transmitted from an external device to the PD16311 through the serial interface, and is assigned addresses as follows, in units of 8 bits: Seg1 Seg4 Seg8 Seg12 Seg16 Seg20 00 HL 00 HU 01 HL 01 HU 02 HL DIG1 03 HL 03 HU 04 HL 04 HU 05 HL DIG2 06 HL 06 HU 07 HL 07 HU 08 HL DIG3 09 HL 09 HU 0 AHL 0 AHU 0 BHL DIG4 0 CHL 0 CHU 0 DHL 0 DHU 0 EHL DIG5 0 FHL 0 FHU 10 HL 10 HU 11 HL DIG6 12 HL 12 HU 13 HL 13 HU 14 HL DIG7 15 HL 15 HU 16 HL 16 HU 17 HL DIG8 18 HL 18 HU 19 HL 19 HU 1 AHL DIG9 1 BHL 1 BHU 1 CHL 1 CHU 1 DHL DIG10 1 EHL 1 EHU 1 FHL 1 FHU 20 HL DIG11 21 HL 21 HU 22 HL 22 HU 23 HL DIG12 24 HL 24 HU 25 HL 25 HU 26 HL DIG13 27 HL 27 HU 28 HL 28 HU 29 HL DIG14 2 AHL 2 AHU 2 BHL 2 BHU 2 CHL DIG15 2 DHL 2 DHU 2 EHL 2 EHU 2 FHL DIG16 b0 b3 b4 b7 XX HL XX HU Lower 4 bits Higher 4 bits Only the lower 4 bits of the addresses assigned to Seg17 through Seg20 are valid, and the higher 4 bits are ignored. 5 PD16311 Key Matrix and Key-Input Data Storage RAM The key matrix is of 12 4 configuration, as shown below. KEY1 KEY2 KEY3 Seg12/KS12 Seg11/KS11 Seg10/KS10 Seg9/KS9 Seg8/KS8 Seg7/KS7 Seg6/KS6 Seg5/KS5 Seg4/KS4 Seg3/KS3 Seg2/KS2 Seg1/KS1 KEY4 The data of each key is stored as illustrated below, and is read by a read command, starting from the least significant bit. KEY1…KEY4 KEY1…KEY4 Seg1/KS1 Seg2/KS2 Seg3/KS3 Seg4/KS4 Seg5/KS5 Seg6/KS6 Seg7/KS7 Seg8/KS8 Seg9/KS9 Seg10/KS10 Seg11/KS11 Seg12/KS12 b0------------ b3 b4 ------------b7 Reading sequence When the most significant bit of data (Seg12 b7) has been read, the least significant bit of the next data (Seg1 b0) is read. LED Port Data is written to the LED port by a write command, starting from the least significant bit of the port. When a bit of this port is 0, the corresponding LED lights; when the bit is 1, the LED goes off. The data of bits 6 through 8 is ignored. MSB − LSB − − b4 b3 b2 b1 b0 LED1 Don't care LED2 LED3 LED4 LED5 On power application, all the LEDs remain dark. 6 PD16311 SW Data The SW data is read by a read command, starting from the least significant bit. Bits 5 through 8 of the SW data are 0. MSB 0 LSB 0 0 0 b3 b2 b1 b0 SW1 SW2 SW3 SW4 Command A command sets the display mode and status of the FIP driver. The first 1 byte input to the PD16311 through the DIN pin after the STB pin has fallen is regarded as a command. If STB is made high while a command/data is transmitted, serial communication is initialized, and the command/data being transmitted is invalid (however, the command/data already transmitted remains valid). (1) Display mode setting command This command initializes the PD16311 and selects the number of segments and number of grids (1/8 to 1/16 duty, 12 segments to 20 segments). When this command is executed, display is forcibly turned off, and key scanning is also stopped. To resume display, a display ON command must be executed. If the same mode is selected, however, nothing is performed. MSB 0 LSB 0 − − Don't care b3 b2 b1 b0 Selects display mode 0xxx : 8 digits, 20 segments 1000 : 9 digits, 19 segments 1001 : 10 digits, 18 segments 1010 : 11 digits, 17 segments 1011 : 12 digits, 16 segments 1100 : 13 digits, 15 segments 1101 : 14 digits, 14segments 1110 : 15 digits, 13 segments 1111 : 16 digits, 12 segments On power application, the 16-digit, 12-segment mode is selected. 7 PD16311 (2) Data setting command This command sets data write and data read modes. MSB 0 LSB 1 − − b3 b2 b1 b0 Sets data write and read modes. 00 : Writes data to display memory. 01 : Writes data to LED port. 10 : Reads key data. 11 : Reads SW data. Don't care Sets address increment mode (display memory). 0 : Increments address after data has been written. 1 : Fixes address. Sets test mode 0 : Normal operation 1 : Test mode On power application, the normal operation mode and address increment mode are set. (3) Address setting command This command sets an address of the display memory. MSB 1 LSB 1 b5 b4 b3 b2 b1 b0 Address (00H - 2FH) If address 30H or higher is set, the data is ignored, until a correct address is set. On power application, the address is set to 00H. 8 PD16311 (4) Display control command MSB 1 LSB 0 − − b3 b2 b1 Don't care b0 Sets dimming quantity. 000 : Sets pulse width to 1/16. 001 : Sets pulse width to 2/16. 010 : Sets pulse width to 4/16. 011 : Sets pulse width to 10/16. 100 : Sets pulse width to 11/16. 101 : Sets pulse width to 12/16. 110 : Sets pulse width to 13/16. 111 : Sets pulse width to 14/16. Turns on/off display. 0 : Display off (key scan continues*) 1 : Display on On power application, the 1/16-pulse width is set and the display is turned off. *: On power application, key scanning is stopped. 9 PD16311 Key Scanning and Display Timing TDISP = 500 µ s SEG Output DIG1 Key scan data DIG2 DIG3 DIGn G1 G2 1/16 TDISP G3 Gn 1 frame = TDISP × (n + 1) One cycle of key scanning consists of two frames, and data of 12 4 matrices is stored in RAM. 10 DIG1 PD16311 Serial Communication Format Reception (command/data write) If data is contiguous STB DIN CLK b0 b1 b2 1 2 3 b6 b7 7 8 Transmission (data read) STB DIN CLK b0 1 b1 2 b2 3 b3 4 b4 5 b5 6 b6 7 b7 8 DOUT tWAIT* 1 2 b0 Data reading command is set. 3 b1 b2 4 b3 5 6 b4 b5 Data reading starts. Because the DOUT pin is an N-ch, open-drain output pin, be sure to connect an external pull-up resistor to this pin (1 k to 10 k). *: When data is read, a wait time tWAIT of 1 s is necessary since the rising of the eighth clock that has set the command, until the falling of the first clock that has read the data. 11 PD16311 ABSOLUTE MAXIMUM RATINGS (Ta = 25 C, VSS = 0 V) PARAMETER SYMBOL RATINGS UNIT Logic Supply Voltage VDD 0.5 to +7.0 V Driver Supply Voltage VEE VDD +0.5 to VDD 40 V Logic Input Voltage VI1 0.5 to VDD +0.5 V FIP Driver Output Voltage VO2 VEE 0.5 to VDD +0.5 V LED Driver Output Current IO1 +25 mA FIP Driver Output Current IO2 40 (grid) 15 (segment) mA Power Dissipation PD 1200* mW Operating Ambient Temperature Topt 40 to +85 C Storage Temperature Tstg 65 to +150 C *: Derate at 9.6 mW/C at Ta = 25 C or higher. RECOMMENDED OPERATING CONDITIONS (Ta = 20 to +70 C, VSS = 0 V) PARAMETER SYMBOL MIN. TYP. MAX. UNIT Logic Supply Voltage VDD 4.5 5 5.5 V High-Level Input Voltage VIH 0.7 VDD VDD V Low-Level Input Voltage VIL 0 0.3 VDD V Driver Supply Votlage VEE 0 VDD 35 V TEST CONDITIONS Maximum power consumption PMAX. = FIP driver dissipation + RL dissipation + LED driver dissipation + dynamic power consumption Where segment current = 3 mA, grid current = 15 mA, and LED current = 20 mA, FIP driver dissipation = number of segments 6 + number of grids/(number of grids + 1) 30 (mW) RL dissipation = (VDD VEE) /50 (segment + 1) (mW) 2 LED driver dissipation = number of LEDs 20 (mW) Dynamic power consumption = VDD 5 (mW) Example Where VEE = 30 V, VDD = 5 V, and in 16-segment and 12-digit modes, FIP driver dissipation = 16 6 +12/13 35 = 128 RL dissipation = 35 /50 17 = 417 2 LED driver dissipation = 5 20 = 100 Dynamic power consumption = 5 5 = 25 Total 670 mW 12 PD16311 ELECTRICAL SPECIFICATIONS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V, VSS = 0 V, VEE = VDD 35 V) PARAMETER SYMBOL MIN. High-Level Output Voltage VOH1 0.9 VDD Low-Level Output Voltage VOL1 Low-Level Output Voltage VOL2 High-Level Output Current IOH21 3 mA VO = VDD 2 V, Seg1 to Seg12 High-Level Output Current IOH22 15 mA VO = VDD 2 V, Grid1 to Grid8, Seg13/ Grid16 to Seg12/ Grid9 Driver Leakage Current IOLEAK 10 A VO = VDD 35 V, driver off 150 K Driver output 1 A VI = VDD or VSS Output Pull-Down Resistor RL Input Current II High-Level Input Voltage VIH Low-Level Input Voltage VIL Hysteresis Voltage VH Dynamic Current Consumption 50 TYP. 100 MAX. UNIT TEST CONDITIONS V LED1 LED5, IOH1 = 1 mA 1 V LED1 LED5, IOL1 = 20 mA 0.4 V DOUT, IOL2 = 4 mA 0.7 VDD V 0.3 VDD 0.35 IDDdyn V V 5 mA CLK, DIN, STB Under no load, display off SWITCHING CHARACTERISTICS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V, VEE = 30 V) PARAMETER SYMBOL MIN. TYP. MAX. UNIT Oscillation Frequency tOSC 350 500 650 kHz Propagation Delay Time tPLZ 300 ns CLK DOUT tPZL 100 ns CL = 15 pF, RL = 10 k tTZH1 2 s CL = 300 pF tTZH2 0.5 s Fall time tTHZ 120 s Maximum Clock Frequency fmax. Rise Time Input Capacitance 1 MHz CI 15 TEST CONDITIONS R = 56 k Seg1 to Seg12 Grid1 to Grid8, Seg13/Grid16 to Seg20/Grid9 CL = 300 pF, Segn, Gridn Duty = 50 % pF TIMING CONDITIONS (Ta = 20 to +70 C, VDD = 4.5 to 5.5 V) PARAMETER SYMBOL MIN. Clock Pulse Width PWCLK 400 ns Strobe Pulse Width PWSTB 1 s Data Setup Time tSETUP 100 ns Data Hold Time tHOLD 100 ns tCLK-STB 1 s CLK STB tWAIT 1 s CLK CLK * Clock-Strobe Time Wait Time TYP. MAX. UNIT TEST CONDITIONS *: Refer to page 11. 13 PD16311 Switching Characteristic Waveform fOSC OSC 50 % PWSTB STB PWCLK PWCLK tSETUP tHOLD tCLK-STB CLK DIN tPZL tPLZ DOUT tTHZ 90 % Sn/Gn 10 % 14 tTZH PD16311 Applications Updating display memory by incrementing address STB CLK DIN Command 1 Command 2 Command 3 Data 1 Data n Command 4 Command 1: sets display mode Command 2: sets data Command 3: sets address Data 1 to n: transfers display data (48 bytes max.) Command 4: controls diplay Updating specific address STB CLK DIN Command 1 Command 2 Data Command 2 Data Command 1: sets data Command 2: sets address Data: display data 15 PD16311 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. PD16311GC-AB6 Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 2, Exposure limit*: None IR35-00-2 VPS Peak package’s surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 2, Exposure limit*: None VP15-00-2 Wave soldering Solder temperature: 260 C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit*: None WS60-00-1 Partial heating method Terminal temperature: 300 C or below, Flow time: 10 seconds or below, Exposure limit*: None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”. 16 PD16311 52 PIN PLASTIC QFP (14 × 14) A B 27 26 39 40 detail of lead end C D S R Q 52 1 14 13 F G J H I M K P M N L NOTE Each lead centerline is located within 0.20 mm (0.008 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 17.6±0.4 0.693±0.016 B 14.0±0.2 0.551 +0.009 –0.008 C 14.0±0.2 0.551 +0.009 –0.008 D 17.6±0.4 0.693±0.016 F 1.0 0.039 G 1.0 0.039 H 0.40±0.10 0.016 +0.004 –0.005 I 0.20 0.008 J 1.0 (T.P.) 0.039 (T.P.) K 1.8±0.2 0.071 +0.008 –0.009 L 0.8±0.2 0.031 +0.009 –0.008 M 0.15 +0.10 –0.05 0.006 +0.004 –0.003 N 0.10 0.004 P 2.6 0.102 Q 0.1±0.1 0.004±0.004 R 5°±5° 5°±5° S 3.0 MAX. 0.119 MAX. P52GC-100-AB6-4 17 PD16311 [MEMO] 18 PD16311 [MEMO] 19 PD16311 FIPTM is a trademark of NEC Corporation. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5