SIGE LPT16ED

LPT16ED
30 GHz SiGe Bipolar Transistor
Final
Applications
Product Description
The LPT16ED is a silicon germanium low phase
noise, high frequency NPN transistor for oscillator
applications up to 16GHz.
Low phase noise oscillators up to 16 GHz
VCO’s, DRO’s and YIG oscillators
Point-to-point radios
Satellite communications
Fiber optics, OC-192 and OC-768
Local Multipoint Distribution Systems, LMDS
The transistor exhibits low 1/f noise and provides
+13 dBm typical output power at VCE of 3V and IC
equal to 20 mA. It is easily operated from a single
supply voltage with appropriate external passive
components.
Features
Low 1/f noise: -142 dBc/Hz at 100 Hz offset
Phase noise: -167 dBc/Hz at 100 kHz offset
Output power up to +13 dBm
Operation down to 1 volt, 2 mA
Gold bump pads for wire bond or flip chip (for
direct die attachment)
The silicon germanium technology used in this device
provides outstanding high-frequency performance
combined with high thermal conductivity and superior
reliability under harsh operating and storage
conditions.
A complete mechanical description of the transistor is
available under SiGe Semiconductor Document
07MS001.
Ordering Information
Type
Package
Remark
LPT16ED
Bare Die
Shipped in
Waffle Pack
Functional Block Diagram
C
B
E
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LPT16ED
30 GHz SiGe Bipolar Transistor
Final
Absolute Maximum Ratings
Operation in excess of any one of Absolute Maximum Ratings may result in permanent damage. This is a high
performance RF device with ESD rating < 2keV. Handling and assembly of this device should be done at ESD
protected workstations.
Symbol
Parameter
Min.
Max.
Unit
VCBO
Collector to Base Voltage
+13.0
V
VCEO
Collector to Emitter Voltage
+4.0
V
VEBO
Emitter to Base Voltage
+1.5
V
IC
Collector Current
80
mA
IB
Base Current
2.0
mA
PT
Total Power Dissipation
250
mW
Tj
Junction Temperature
+150
°C
TSTG
Storage Temperature
+150
°C
-65
DC Electrical Characteristics
Conditions: TA = unless otherwise specified 25°C
Symbol
VBE
Parameter
Condition
Min.
Typ.
Max.
Unit
Base-emitter voltage
IC = 1µA
670
687
700
mV
BVCEO
Collector-emitter
breakdown voltage
Open base
4.0
4.5
5.0
V
BVCES
Collector-emitter
breakdown voltage
Base-emitter shorted via
100kΩ
14
15.0
16
V
BVEBO
Emitter-base breakdown
voltage
IE = 100µA, open
collector
2.0
2.3
2.6
V
BVCBO
Collector-base
breakdown voltage
Open emitter
14
15.0
16
V
Early voltage
IC = 10mA, VCE = 3V
100
200
300
V
ICBO
Collector-base cutoff
current
VCB = 5V and IE = 0
100
pA
IEBO
Emitter-base cutoff
current
VEB = 1.5V and IC = 0
5
10
15
µA
hFE
DC current gain
VCE = 2V, IC = 20mA
50
60
150
VA
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30 GHz SiGe Bipolar Transistor
Final
AC Electrical Characteristics
Symbol
IS21I2
MAG/
MSG
Parameter
Insertion Power Gain
(ZS = ZL = 50Ω)
Maximum Available
Gain or Maximum Stable
Gain
Note
Min.
Typ.
Max.
Unit
VCE = 1.5V, IC = 10mA,
f = 16GHz
0.7
1.0
1.3
dB
VCE = 3.0V, IC = 20mA,
f = 16GHz
2.3
2.6
2.9
dB
VCE = 1.5V, IC = 10mA,
f = 16GHz
3.3
3.6
4.2
dB
VCE = 3.0V, IC = 20mA,
f = 16GHz
4.9
5.2
5.6
dB
Typical Performance Characteristics
Please refer to application note (Document 07AN001).
Typical Measurements @
10 GHz, IC=5mA, VCE=1V
Residual
Phase
Noise
(dBc/Hz)
Frequency (Hz)
Typical Applications Information
Series or parallel feedback oscillators at 5-16 GHz. (Please refer to application note, Document 07AN001).
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30 GHz SiGe Bipolar Transistor
Final
Die and Pad Description
X length
Die edge
Collector
Emitter2
Emitter1
Base
Y length
0,0
Dimensions are relative to the 0,0 cut die corner.
Feature
Specification
Comments
Die thickness
10 mil +/- 1mil
X length
15.3 mil +/- 1mil
Y length
14.5 mil +/- 1mil
Pad diameter
2.9 mil +/- 0.1mil
Pads are circular.
Pad pitch
6 mil +/- 0.1mil
Pad center to pad centre
Pad/bump height
1 mil +/- 0.05mil
Pad/bump co-planarity
0.2 mil
Pad Center
Position (X mil, Y mil) +/- 0.7mil relative to the 0,0 cut die corner
Collector
5, 11
Emitter1
5, 5
Base
11, 5
Emitter 2
11, 11
Please refer to Document 01-MS-001 for SiGe’s die inspection criteria.
For S-parameter data, please refer to SiGe Document 07SP001.
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30 GHz SiGe Bipolar Transistor
Final
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Product Preview
The datasheet contains information from the product concept specification. SiGe Semiconductor Inc. reserves the right to change
information at any time without notification.
Preliminary Information
The datasheet contains information from the design target specification. SiGe Semiconductor Inc. reserves the right to change
information at any time without notification.
Final
The datasheet contains information from the final product specification. SiGe Semiconductor Inc. reserves the right to change
information at any time without notification. Production testing may not include testing of all parameters.
Information furnished is believed to be accurate and reliable and is provided on an “as is” basis. SiGe Semiconductor Inc. assumes
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other rights of third parties, which may result from its use. No license or indemnity is granted by implication or otherwise under any
patent or other intellectual property rights of SiGe Semiconductor Inc. or third parties. Specifications mentioned in this publication
are subject to change without notice. This publication supersedes and replaces all information previously supplied. SiGe
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