DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D109 BFQ540 NPN wideband dual transistor Product specification Supersedes data of 1995 Sep 04 File under Discrete Semiconductors, SC14 1998 Aug 27 Philips Semiconductors Product specification NPN wideband dual transistor BFQ540 FEATURES DESCRIPTION • High gain NPN wideband dual transistor in a plastic SOT89 package. • High output voltage page • Low noise • Gold metallization ensures excellent reliability • Low thermal resistance. APPLICATIONS PINNING PIN DESCRIPTION 1 emitter 2 collector 3 base 1 2 3 Bottom view MBK514 • VHF, UHF and CATV amplifiers. Marking code: N4. Fig.1 SOT89. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCBO collector-base voltage open emitter − − 20 VCES collector-emitter voltage RBE = 0 − − 15 V VEBO collector-base voltage open collector − − 2 V IC collector current (DC) − − 120 mA Ptot total power dissipation − − 1.2 W hFE DC current gain IC = 40 mA; VCE = 8 V; Tj = 25 °C 60 120 250 fT transition frequency IC = 40 mA; VCE = 8 V; f = 1 GHz; Tamb = 25 °C − 9 − GHz insertion power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C 12 13 − dB noise figure IC = 40 mA; VCE = 8 V; f = 900 MHz; ΓS = Γopt − 1.9 2.4 dB S 21 F 2 Ts ≤ 60 °C; note 1 Note 1. Ts is the temperature at the soldering point of the collector pin. 1998 Aug 27 2 V Philips Semiconductors Product specification NPN wideband dual transistor BFQ540 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 20 V VCES collector-emitter voltage RBE = 0 − 15 V VEBO emitter-base voltage open collector − 2 V IC collector current (DC) − 120 mA Ptot total power dissipation Ts ≤ 60 °C − 1.2 W Tstg storage temperature −65 +150 °C Tj operating junction temperature − 175 °C THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER CONDITIONS UNIT 95 K/W Ts ≤ 60 °C; Ptot = 1.2 W thermal resistance from junction to soldering point MBG241 1.4 Ptot (W) 1.2 VALUE MBG244 103 handbook, halfpage IC (mA) 1.0 0.8 102 0.6 0.4 0.2 0 0 50 100 150 Tj (oC) 10 200 1 10 VCE ≤ 9 V. Fig.2 Power derating curve. 1998 Aug 27 Fig.3 SOAR. 3 VCE (V) 102 Philips Semiconductors Product specification NPN wideband dual transistor BFQ540 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER V(BR)CBO collector-base breakdown voltage CONDITIONS open emitter; IC = 10 µA; IE = 0 MIN. TYP. MAX. UNIT 20 − − V V(BR)CES collector-emitter breakdown voltage RBE = 0; IC = 40 µA 15 − − V V(BR)EBO emitter-base breakdown voltage IE = 100 µA; IC = 0 2 − − V ICBO collector-base leakage current VCB = 8 V; IE = 0 − − 50 nA IEBO emitter-base leakage current VCB = 1 V; IC = 0 − − 200 nA hFE DC current gain IC = 40 mA; VCE = 8 V 60 120 250 fT transition frequency IC = 40 mA; VCE = 8 V; fm = 1 GHz − 9 − GHz Ce emitter capacitance IC = ie = 0; VEB = 0.5 V; f = 1 MHz − 2 − pF Cre feedback capacitance IC = 0; VCE = 8 V; f = 1 MHz − 0.9 − pF insertion power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C 12 13 − dB S 21 2 Vo output voltage note 1 − 500 − mV note 2 − 350 − mV d2 second order intermodulation distortion note 3 − − −53 dB F noise figure IC = 40 mA; VCE = 8 V; f = 900 MHz; ΓS = Γopt − 1.9 2.4 dB Notes 1. dim = −60 dB (DIN45004B); VCE = 8 V; IC = 40 mA; RL = 50 Ω; Vp = Vo; Vq = Vo −6 dB; Vr = Vo −6 dB; fp = 795.25 MHz; fq = 803.25 MHz; fr = 805.5 MHz; measured at fp + fq − fr = 793.25 MHz. 2. dim = −60 dB (DIN 45004B); IC = 40 mA; VCE = 8 V; RL = 50 Ω; Vp = Vq = Vo; fp = 806 MHz; fq = 810 MHz; measured at 2fp − fq = 802 MHz. 3. IC = 40 mA; VCE = 8 V; RL = 50 Ω; Vp = Vq = 225 mV; fp = 250 MHz; fq = 560 MHz; measured at fp + fq = 810 MHz. 1998 Aug 27 4 Philips Semiconductors Product specification NPN wideband dual transistor BFQ540 MRA688 1.0 MRA689 12 handbook, halfpage handbook, halfpage Cre (pF) fT (GHz) 0.8 VCE = 8V 8 0.6 VCE = 4V 0.4 4 0.2 0 0 4 8 VCB (V) 0 10−1 12 10 IC (mA) 102 f = 1 GHz; Tamb = 25 °C. IC = 0; f = 1 MHz. Fig.4 1 Feedback capacitance as a function of collector-base voltage; typical values. Fig.5 Transition frequency as a function of collector current; typical values. MBG243 MBG242 20 20 handbook, halfpage handbook, halfpage d2 (dB) dim (dB) 30 30 40 40 50 50 60 60 70 70 20 10 30 40 50 10 60 IC (mA) VCE = 8 V; Vo = 475 mV; RL = 50 Ω. fp + fq − fr = 793.25 MHz; Tamb = 25 °C. Fig.6 30 40 50 60 IC (mA) VCE = 8 V; Vo = 225 mV; RL = 50 Ω; fp + fq = 810 MHz; Tamb = 25 °C. Intermodulation distortion as a function of collector current; typical values. 1998 Aug 27 20 Fig.7 5 Second order intermodulation distortion as a function of collector current; typical values. Philips Semiconductors Product specification NPN wideband dual transistor BFQ540 PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 3 leads SOT89 B D A b3 E HE L 1 2 3 c b2 w M b1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b1 b2 b3 c D E e e1 HE L min. w mm 1.6 1.4 0.48 0.35 0.53 0.40 1.8 1.4 0.44 0.37 4.6 4.4 2.6 2.4 3.0 1.5 4.25 3.75 0.8 0.13 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT89 1998 Aug 27 EUROPEAN PROJECTION ISSUE DATE 97-02-28 6 Philips Semiconductors Product specification NPN wideband dual transistor BFQ540 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 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