AMSCO AS5163_1

Datasheet
AS5163
12-Bit Automotive Angle Position Sensor
1 General Description
2 Key Features
360º contactless high resolution angular position encoding
The AS5163 is a contactless magnetic angle position sensor for
accurate angular measurement over a full turn of 360º. A sub range
can be programmed to achieve the best resolution for the
application. It is a system-on-chip, combining integrated Hall
elements, analog front-end, digital signal processing and best in
class automotive protection features in a single device.
User programmable start and end point of the application region
User programmable clamping levels and programming of the
transition point
Powerful analog output
- Short circuit monitor
- High driving capability for resistive and capacitive loads
To measure the angle, only a simple two-pole magnet, rotating over
the center of the chip, is required. The magnet may be placed above
or below the IC.
Wide temperature range: -40ºC to +150ºC
The absolute angle measurement provides instant indication of the
magnet’s angular position with a resolution of 0.022º = 16384
positions per revolution. According to this resolution the adjustment
of the application specific mechanical positions are possible. The
angular output data is available over a 12-bit PWM signal or 12-bit
ratiometric analog output.
Small Pb-free package: 14-pin TSSOP
Broken GND and VDD detection over a wide range of different
load conditions
3 Applications
The AS5163 operates at a supply voltage of 5V and the supply and
output pins are protected against overvoltage up to +27V. In addition,
the supply pins are protected against reverse polarity up to -18V.
The AS5163 is ideal for automotive applications like Throttle and
valve position sensing, Gearbox position sensor, Headlight position
control, Torque sensing, Pedal position sensing and non contact
Potentiometers.
Figure 1. AS5163 Block Diagram
VDD3 VDD5
VDD
High voltage/
Reverse polarity
protection
Hall Array
Frontend
Amplifier
AS5163
OTP
Register
Single pin
Interface
Zero
Position
Sin
Cos
CORDIC
14-bit
Angle
Output
DSP
12-bit
PWM
12
ADC
12-bit
DAC
M
U
X
Programable
Angle
OUT
Driver
OUT
KDOWN
GND
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AS5163
Datasheet - C o n t e n t s
Contents
1 General Description ..................................................................................................................................................................
1
2 Key Features.............................................................................................................................................................................
1
3 Applications...............................................................................................................................................................................
1
4 Pin Assignments .......................................................................................................................................................................
3
4.1 Pin Descriptions....................................................................................................................................................................................
3
5 Absolute Maximum Ratings ......................................................................................................................................................
4
6 Electrical Characteristics...........................................................................................................................................................
5
6.1 Operating Conditions............................................................................................................................................................................
5
6.2 Magnetic Input Specification.................................................................................................................................................................
5
6.3 Electrical System Specifications...........................................................................................................................................................
6
6.4 Timing Characteristics ..........................................................................................................................................................................
6
7 Detailed Description..................................................................................................................................................................
7
7.1 Operation..............................................................................................................................................................................................
8
7.1.1 VDD Voltage Monitor ................................................................................................................................................................... 8
7.2 Analog Output.......................................................................................................................................................................................
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.3 Pulse Width Modulation (PWM) Output..............................................................................................................................................
7.4 Kick Down Function............................................................................................................................................................................
8 Application Information ...........................................................................................................................................................
13
14
16
8.1 Programming the AS5163 ..................................................................................................................................................................
8.1.1 Hardware Setup.........................................................................................................................................................................
8.1.2 Protocol Timing and Commands of Single Pin Interface ...........................................................................................................
8.1.3 UNBLOCK .................................................................................................................................................................................
8.1.4 WRITE128 .................................................................................................................................................................................
8.1.5 READ128...................................................................................................................................................................................
8.1.6 DOWNLOAD..............................................................................................................................................................................
8.1.7 UPLOAD ....................................................................................................................................................................................
8.1.8 FUSE .........................................................................................................................................................................................
8.1.9 PASS2FUNC .............................................................................................................................................................................
8.1.10 READ.......................................................................................................................................................................................
8.1.11 WRITE .....................................................................................................................................................................................
8.2 OTP Programming Data .....................................................................................................................................................................
8.2.1
8.2.2
8.2.3
8.2.4
9
Programming Parameters............................................................................................................................................................ 9
Application Specific Angular Range Programming ...................................................................................................................... 9
Application Specific Programming of the Break Point ............................................................................................................... 10
Full Scale Mode ......................................................................................................................................................................... 10
Resolution of the Parameters .................................................................................................................................................... 11
Analog Output Diagnostic Mode ................................................................................................................................................ 12
Analog Output Driver Parameters.............................................................................................................................................. 12
Read / Write User Data..............................................................................................................................................................
Programming Procedure............................................................................................................................................................
Physical Placement of the Magnet ............................................................................................................................................
Magnet Placement.....................................................................................................................................................................
16
16
17
19
20
21
22
22
22
23
23
24
25
30
30
31
31
9 Package Drawings and Markings ...........................................................................................................................................
32
10 Ordering Information.............................................................................................................................................................
35
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AS5163
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
1
14
OUT
VDD5
2
13
NC
NC
3
12
GNDP
VDD3
4
11
KDOWN
GNDA
5
10
NC
NC
6
9
NC
NC
7
8
GNDD
AS5163
VDD
4.1 Pin Descriptions
Table 1 provides the description of each pin of the standard TSSOP14 package (14-Lead Thin Shrink Small Outline Package) (see Figure 2).
Table 1. Pin Descriptions
Pin Number
Pin Name
Pin Type
Description
1
VDD
Supply pin
Positive supply pin. This pin is high voltage protected.
2
VDD5
Supply pin
4.5V- Regulator output, internally regulated from VDD. This pin needs an
external ceramic capacitor of minimum 2.2μF.
3
NC
DIO/AIO
multi purpose pin
4
VDD3
Supply pin
3.45V- Regulator output, internally regulated from VDD5. This pin needs an
external ceramic capacitor of minimum 2.2μF.
5
GNDA
Supply pin
Analog ground pin. Connected to ground in the application board.
6
NC
DIO/AIO
multi purpose pin
Test pin for fabrication. Connected to ground in the application board.
7
NC
DIO/AIO
multi purpose pin
Test pin for fabrication. Open in the application.
8
GNDD
Supply pin
9
NC
DIO/AIO
multi purpose pin
NC
DIO/AIO
multi purpose pin
11
KDOWN
Digital output open
drain
12
GNDP
Supply pin
13
NC
DIO/AIO
multi purpose pin
Test pin for fabrication. Connected to ground in the application board.
14
OUT
DIO/AIO
multi purpose pin
Output pin. This pin is used for the analog output or digital PWM signal. In addition,
this pin is used for programming of the device.
10
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Test pin for fabrication. Connected to ground in the application board.
Digital ground pin. Connected to ground in the application board.
Test pins for fabrication. Connected to ground in the application board.
Additional output pin with Kick down functionality. This pin can be used for a
compare function including a hysteresis. An open drain configuration is used. If the
internal angle is above a programmable threshold, then the output is switched to low.
Below the threshold the output is high using a pull-up resistor.
Analog ground pin. Connected to ground in the application board.
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AS5163
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
VDD
DC supply voltage at pin VDD
Overvoltage
-18
27
V
No operation
VOUT
Output voltage OUT
-0.3
27
V
VKDOWN
Output voltage KDOWN
-0.3
27
V
VDD3
DC supply voltage at pin VDD3
-0.3
5
V
VDD5
DC supply voltage at pin VDD5
-0.3
7
V
Iscr
Input current (latchup immunity)
-100
100
mA
Norm: JEDEC 78
±4
kV
Norm: MIL 883 E method 3015
This value is applicable to pins VDD, GND, OUT,
and KDOWN.
All other pins ±2 kV.
+150
ºC
Min -67ºF; Max +257ºF
260
ºC
t=20 to 40s,
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
85
%
Electrical Parameters
permanent
Electrostatic Discharge
ESD
Electrostatic discharge
Temperature Ranges and Storage Conditions
Tstrg
Storage temperature
TBody
Body temperature (Lead-free package)
H
Humidity non-condensing
Moisture Sensitive Level
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5
3
Revision 2.7
Represents a maximum floor life time of 168h
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AS5163
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
6.1 Operating Conditions
In this specification, all the defined tolerances for external components need to be assured over the whole operation conditions range and also
over lifetime.
TAMB = -40 to +150ºC, VDD = +4.5V to +5.5V, CLREG5 = 2.2µF, CLREG3 = 2.2µF, RPU = 1KΩ, RPD = 1KΩ to 5.6KΩ (Analog only), CLOAD =
0 to 42nF, RPUKDWN = 1KΩ to 5.6KΩ, CLOAD_KDWN = 0 to 42nF, unless otherwise specified. A positive current is intended to flow into the pin.
Table 3. Operating Conditions
Symbol
Parameter
Conditions
Min
TAMB
Ambient temperature
-40ºF…+302ºF
-40
Isupp
Supply current
Lowest magnetic input field
Typ
Max
Units
+150
ºC
20
mA
Max
Units
70
mT
6.2 Magnetic Input Specification
TAMB = -40 to +150ºC, VDD = 4.5 to 5.5V (5V operation), unless otherwise noted.
Two-pole cylindrical diametrically magnetized source:
Table 4. Magnetic Input Specification
Symbol
Parameter
Conditions
Min
Bpk
Magnetic input field amplitude
Required vertical component of the
magnetic field strength on the die’s surface,
measured along a concentric circle with a
radius of 1.1mm
30
Boff
Magnetic offset
Constant magnetic stray field
±10
mT
Field non-linearity
Including offset gradient
5
%
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Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6.3 Electrical System Specifications
TAMB = -40 to +150ºC, VDD = 4.5 - 5.5V (5V operation), Magnetic Input Specification, unless otherwise noted.
Table 5. Electrical System Specifications
Symbol
Parameter
Conditions
RES
Resolution Analog and PWM Output
INLopt
INLtemp
Min
Typ
Max
Units
Angular operating range ≥ 90ºC
12
bit
Integral non-linearity (optimum)
360 degree full turn
Maximum error with respect to the best line
fit. Centered magnet without calibration,
TAMB=25ºC
±0.5
deg
Integral non-linearity (optimum)
360 degree full turn
Maximum error with respect to the best line
fit. Centered magnet without calibration,
TAMB = -40 to +150ºC
±0.9
deg
Integral non-linearity
360 degree full turn
Best line fit = (Errmax – Errmin) / 2
Over displacement tolerance with 6mm
diameter magnet, without calibration,
TAMB = -40 to +150ºC.
Note: This parameter is a system
parameter and is dependant on the
selected magnet.
±1.4
deg
TN
Transition noise
1 sigma;
Note: The noise performance is
dependent on the programming of the
output characteristic.
0.06
Deg
RMS
VDD5LowTH
Undervoltage lower threshold
VDD5HighTH
Undervoltage higher threshold
tPwrUp
Power-up time
Fast mode, times 2 in slow mode
10
ms
tdelay
System propagation delay
absolute output: delay of ADC,
DSP and absolute interface
Fast mode, times 2 in slow mode
100
µs
INL
VDD5 = 5V
3.1
3.4
3.7
3.6
3.9
4.2
V
Note: The INL performance is specified over the full turn of 360 degrees. An operation in an angle segment increases the accuracy. A two
point linearization is recommended to achieve the best INL performance for the chosen angle segment.
6.4 Timing Characteristics
Table 6. Timing Conditions
Symbol
Parameter
FRCOT
Internal Master Clock
TCLK
Interface Clock Time
TDETWD
WatchDog error detection time
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Conditions
TCLK = 1/ FRCOT
Revision 2.7
Min
Typ
Max
Units
4.05
4.5
4.95
MHz
202
222.2
247
ns
12
ms
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AS5163
Datasheet - D e t a i l e d D e s c r i p t i o n
7 Detailed Description
The AS5163 is manufactured in a CMOS process and uses a spinning current Hall technology for sensing the magnetic field distribution across
the surface of the chip.
The integrated Hall elements are placed around the center of the device and deliver a voltage representation of the magnetic field at the surface
of the IC.
Through Sigma-Delta Analog / Digital Conversion and Digital Signal-Processing (DSP) algorithms, the AS5163 provides accurate high-resolution
absolute angular position information. For this purpose, a Coordinate Rotation Digital Computer (CORDIC) calculates the angle and the
magnitude of the Hall array signals.
The DSP is also used to provide digital information at the outputs that indicate movements of the used magnet towards or away from the device’s
surface.
A small low cost diametrically magnetized (two-pole) standard magnet provides the angular position information.
The AS5163 senses the orientation of the magnetic field and calculates a 14-bit binary code. This code is mapped to a programmable output
characteristic. The type of output is programmable and can be selected as PWM or analog output. This signal is available at the pin 14 (OUT).
The analog and PWM output can be configured in many ways. The application angular region can be programmed in a user friendly way. The
start angle position T1 and the end point T2 can be set and programmed according to the mechanical range of the application with a resolution
of 14 bits. In addition, the T1Y and T2Y parameter can be set and programmed according to the application. The transition point 0 to 360 degree
can be shifted using the break point parameter BP. This point is programmable with a high resolution of 14 bits of 360 degrees. The voltage for
clamping level low CLL and clamping level high CLH can be programmed with a resolution of 7 bits. Both levels are individually adjustable.
These parameters are also used to adjust the PWM duty cycle.
The AS5163 also provides a compare function. The internal angular code is compared to a programmable level using hysteresis. The function is
available over the output pin 11 (KDOWN).
The output parameters can be programmed in an OTP register. No additional voltage is required to program the AS5163. The setting may be
overwritten at any time and will be reset to default when power is cycled. To make the setting permanent, the OTP register must be programmed
by using a lock bit. Else, the content could be frozen for ever.
The AS5163 is tolerant to magnet misalignment and unwanted external magnetic fields due to differential measurement technique and Hall
sensor conditioning circuitry.
Figure 3. Typical Arrangement of AS5163 and Magnet
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AS5163
Datasheet - D e t a i l e d D e s c r i p t i o n
7.1 Operation
The AS5163 operates at 5V ±10%, using two internal Low-Dropout (LDO) voltage regulators. For operation, the 5V supply is connected to pin
VDD. While VDD3 and VDD5 (LDO outputs) must be buffered by 2.2µF capacitors, the VDD requires a 1µF capacitor. All capacitors (low ESR
ceramic) are supposed to be placed close to the supply pins (see Figure 4).
The VDD3 and VDD5 outputs are intended for internal use only. It must not be loaded with an external load.
Figure 4. Connections for 5V Supply Voltages
5V Operation
2.2µF
VDD 5
2.2 µF
VDD 3
1µF
VDD
LDO
LDO
Internal
VDD 4. 5 V
Internal
VDD 3.45V
4. 5 - 5.5V
GND
Notes:
1. The pins VDD3 and VDD5 must always be buffered by a capacitor. These pins must not be left floating, as this may
cause unstable internal supply voltages, which may lead to larger output jitter of the measured angle.
2. Only VDD is overvoltage protected up to 27V. In addition, the VDD has a reverse polarity protection.
7.1.1
VDD Voltage Monitor
VDD Overvoltage Management. If the voltage applied to the VDD pin exceeds the overvoltage upper threshold for longer than the detection
time, then the device enters a low power mode reducing the power consumption. When the overvoltage event has passed and the voltage
applied to the VDD pin falls below the overvoltage lower threshold for longer than the recovery time, then the device enters the normal mode.
VDD5 Undervoltage Management. When the voltage applied to the VDD5 pin falls below the undervoltage lower threshold for longer than
the VDD5_detection time, then the device stops the clock of the digital part and the output drivers are turned off to reduce the power
consumption. When the voltage applied to the VDD5 pin exceeds the VDD5 undervoltage upper threshold for longer than the VDD5_recovery
time, then the clock is restarted and the output drivers are turned on.
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AS5163
Datasheet - D e t a i l e d D e s c r i p t i o n
7.2 Analog Output
The reference voltage for the Digital-to-Analog converter (DAC) is taken internally from VDD. In this mode, the output voltage is ratiometric to the
supply voltage.
7.2.1
Programming Parameters
The Analog output voltage modes are programmable by OTP. Depending on the application, the analog output can be adjusted. The user can
program the following application specific parameters:
T1
Mechanical angle start point
T2
Mechanical angle end point
T1Y
Voltage level at the T1 position
T2Y
Voltage level at the T2 position
CLL
Clamping Level Low
CLH
Clamping Level High
BP
Break point (transition point 0 to 360 degree)
The above listed parameters are input parameters. Over the provided programming software and programmer, these parameters are converted
and finally written into the AS5163 128-bit OTP memory.
7.2.2
Application Specific Angular Range Programming
The application range can be selected by programming T1 with a related T1Y and T2 with a related T2Y into the AS5163. The internal gain factor
is calculated automatically. The clamping levels CLL and CLH can be programmed independent from the T1 and T2 position and both levels can
be separately adjusted.
Figure 5. Programming of an Individual Application Range
Application range
90 degree
electrical range
T2
mechanical range
T1
100%VDD
clamping range
high
CLH
CLL
0 degree
T2Y
180 degree
CLH
T1Y
BP
CLL
0
270 degree
clamping range
low
T1
T2
Figure 5 shows a simple example of the selection of the range. The mechanical starting point T1 and the mechanical end point T2 define the
mechanical range. A sub range of the internal Cordic output range is used and mapped to the needed output characteristic. The analog output
signal has 12 bit, hence the level T1Y and T2Y can be adjusted with this resolution. As a result of this level and the calculated slope the clamping
region low is defined. The break point BP defines the transition between CLL and CLH. In this example, the BP is set to 0 degree. The BP is also
the end point of the clamping level high CLH. This range is defined by the level CLH and the calculated slope. Both clamping levels can be set
independently form each other. The minimum application range is 10 degrees.
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AS5163
Datasheet - D e t a i l e d D e s c r i p t i o n
7.2.3
Application Specific Programming of the Break Point
The break point BP can be programmed as well with a resolution of 14 bits. This is important when the default transition point is inside the
application range. In such a case, the default transition point must be shifted out of the application range. The parameter BP defines the new
position. The function can be used also for an on-off indication.
Figure 6. Individual Programming of the Break Point BP
Application range
90 degree
electrical range
T2
mechanical range
T1
100%VDD
CLH
clamping range
high
CLH
0 degree
T2Y
180 degree
T1Y
CLL
CLL
BP
0
270 degree
7.2.4
clamping range
low
T1
T2
clamping range
low
Full Scale Mode
The AS5163 can be programmed as well in the full scale mode. The BP parameter defines the position of the transition.
Figure 7. Full Scale Mode
Analog output Voltage
100 % VDD
0
360
For simplification, Figure 7 describes a linear output voltage from rail to rail (0V to VDD) over the complete rotation range. In practice, this is not
feasible due to saturation effects of the output stage transistors. The actual curve will be rounded towards the supply rails (as indicated Figure 7).
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AS5163
Datasheet - D e t a i l e d D e s c r i p t i o n
7.2.5
Resolution of the Parameters
The programming parameters have a wide resolution of up to 14 bits.
Table 7. Resolution of the Programming Parameters
Symbol
Parameter
Resolution
Note
T1
Mechanical angle start point
14 bits
T2
Mechanical angle stop point
14 bits
T1Y
Mechanical start voltage level
12 bits
T2Y
Mechanical stop voltage level
12 bits
CLL
Clamping level low
7 bits
4096 LSBs is the maximum level
CLH
Clamping level high
7 bits
31 LSBs is the minimum level
BP
Break point
14 bits
Figure 8. Overview of the Angular Output Voltage
100
96
Failure Band High
Clamping Region High
Output Voltage in percent of VDD
CLH
T2Y
Application Region
T1Y
CLL
Clamping Region Low
4
0
Failure Band Low
Figure 8 gives an overview of the different ranges. The failure bands are used to indicate a wrong operation of the AS5163. This can be caused
due to a broken supply line. By using the specified load resistors, the output level will remain in these bands during a fail. It is recommended to
set the clamping level CLL above the lower failure band and the clamping level CLH below the higher failure band.
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AS5163
Datasheet - D e t a i l e d D e s c r i p t i o n
7.2.6
Analog Output Diagnostic Mode
Due to the low pin count in the application, a wrong operation must be indicated by the output pin OUT. This could be realized using the failure
bands. The failure band is defined with a fixed level. The failure band low is specified from 0% to 4% of the supply range. The failure band high
is defined from 100% to 96%. Several failures can happen during operation. The output signal remains in these bands over the specified
operating and load conditions. All the different failures can be grouped into the internal alarms (failures) and the application related failures.
CLOAD ≤ 42 nF, RPU= 2k…5.6kΩ
RPD= 2k…5.6kΩ load pull-up
Table 8. Different Failure Cases of AS5163
Type
Failure Mode
Symbol
Failure Band
Note
MAGRng
High/Low
Could be switched off by one OTP bit
ALARM_DISABLE.
Programmable by OTP bit DIAG_HIGH
Cordic overflow
COF
High/Low
Programmable by OTP bit DIAG_HIGH
Offset compensation finished
OCF
High/Low
Programmable by OTP bit DIAG_HIGH
Watchdog fail
WDF
High/Low
Programmable by OTP bit DIAG_HIGH
Oscillator fail
OF
High/Low
Programmable by OTP bit DIAG_HIGH
Overvoltage condition
OV
High/Low
Dependant on the load resistor
Pull up → failure band high
Pull down → failure band low
High/Low
Switch off → short circuit dependent
Out of magnetic range
(too less or too high magnetic
input)
Internal alarms (failures)
Application related
failures
Broken VDD
BVDD
Broken VSS
BVSS
Short circuit output
SCO
For efficient use of diagnostics, it is recommended to program to clamping levels CLL and CLH.
7.2.7
Analog Output Driver Parameters
The output stage is configured in a push-pull output. Therefore it is possible to sink and source currents.
CLOAD ≤ 42 nF, RPU= 2k…5.6kΩ
RPD= 2k…5.6kΩ load pull-up
Table 9. General Parameters for the Output Driver
Symbol
Parameter
Min
IOUTSCL
Short circuit output current (low side driver)
IOUTSCH
Typ
Max
Unit
Note
8
32
mA
VOUT=27V
Short circuit output current (high side driver)
-8
-32
mA
VOUT=0V
TSCDET
Short circuit detection time
20
600
µs
output stage turned off
TSCREC
Short circuit recovery time
2
20
ms
output stage turned on
ILEAKOUT
Output Leakage current
-20
20
µA
VOUT=VDD=5V
BGNDPU
Output voltage broken GND with pull-up
96
100
%VDD
RPU = 2k…5.6k
BGNDPD
Output voltage broken GND with pull-down
0
4
%VDD
RPD = 2k…5.6k
BVDDPU
Output voltage broken VDD with pull-up
96
100
%VDD
RPU = 2k…5.6k
BVDDPD
Output voltage broken VDD with pull-down
0
4
%VDD
RPD = 2k…5.6k
Note: A Pull-Up/Down load is up to 1kΩ with increased diagnostic bands from 0%-6% and 94%-100%.
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Datasheet - D e t a i l e d D e s c r i p t i o n
Table 10. Electrical Parameters for the Analog Output Stage
Symbol
Parameter
Min
VOUT
Output Voltage Range
VOUTINL
Output Integral nonlinearity
VOUTDNL
Output Differential nonlinearity
VOUTOFF
Output Offset
VOUTUD
Update rate of the Output
VOUTSTEP
Output Step Response
VOUTDRIFT
Output Voltage Temperature drift
VOUTRATE
Output ratiometricity error
VOUTNOISE
Noise
Typ
Max
4
96
6
94
Unit
% VDD
Note
Valid when 1k ≤ RLOAD < 2k
10
LSB
-10
10
LSB
-50
50
mV
At 2048 LSB level
µs
Info parameter
550
µs
Between 10% and 90%, RPU/RPD
=1kΩ, CLOAD=1nF; VDD=5V
2
2
%
Of value at mid code
-1.5
1.5
%VDD
0.04*VDD ≤ VOUT ≤ 0.96*VDD
10
mVpp
1Hz…30kHz;
at 2048 LSB level
100
1
1. Not tested in production; characterization only.
7.3 Pulse Width Modulation (PWM) Output
The AS5163 provides a pulse width modulated output (PWM), whose duty cycle is proportional to the measured angle. This output format is
selectable over the OTP memory OP_MODE(0) bit. If output pin OUT is configured as open drain configuration, then an external load resistor
(pull up) is required. The PWM frequency is internally trimmed to an accuracy of ±10% over full temperature range. This tolerance can be
cancelled by measuring the ratio between the on and off state. In addition, the programmed clamping levels CLL and CLH will also adjust the
PWM signal characteristic.
Figure 9. PWM Output Signal
PWmax
PWmin
Position 0
Position 1
Position 4094
Position 4095
TPWM = 1/fPWM
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Datasheet - D e t a i l e d D e s c r i p t i o n
The PWM frequency can be programmed by the OTP bits PWM_frequency (1:0). Therefore, four different frequencies are possible.
Table 11. PWM Signal Parameters
Symbol
Parameter
Min
Typ
Max
Unit
Note
fPWM1
PWM frequency1
123.60
137.33
151.06
Hz
PWM_frequency (1:0) = “00”
fPWM2
PWM frequency2
247.19
274.66
302.13
Hz
PWM_frequency (1:0) = “01”
fPWM3
PWM frequency3
494.39
549.32
604.25
Hz
PWM_frequency (1:0) = “10”
fPWM4
PWM frequency4
988.77
1098.63
1208.50
Hz
PWM_frequency (1:0) = “11”
PWMIN
MIN pulse width
(1+1)*1/
fPWM
µs
PWMAX
MAX pulse width
(1+4094)*1/
fPWM
ms
Taking into consideration the AC characteristic of the PWM output including load, it is recommended to use the clamping function. The
recommended range is 0% to 4% and 96% to 100%.
Table 12. Electrical Parameters for the PWM Output Mode
Symbol
Parameter
Min
PWMVOL
Output voltage low
ILEAK
Typ
Max
Unit
0
0.4
V
IOUT=8mA
Output leakage
-20
20
µA
VOUT=VDD=5V
PWMDC
PWM duty cycle range
4
96
%
PWMSRF
PWM slew rate
1
4
V/µs
2
Note
Between 75% and 25%
RPU/RPD = 1kΩ,
CLOAD = 1nF, VDD = 5V
7.4 Kick Down Function
The AS5163 provides a special compare function. This function is implemented using a programmable angle value with a programmable
hysteresis. It will be indicated over the open drain output pin KDOWN. If the actual angle is above the programmable value plus the hysteresis,
the output is switched to low. The output will remain at low level until the value KD is reached in the reverse direction.
Figure 10. Kick Down Hysteresis Implementation
KDHYS
KDOWN
KD(5:0)+KDHYS
KD(5:0)
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Datasheet - D e t a i l e d D e s c r i p t i o n
Table 13. Programming Parameters for the Kick Down Function
Symbol
Parameter
Resolution
KD
Kick Down angle
6 bits
KDHYS
Kick Down Hysteresis
2 bits
Note
KDHYS (1:0) = “00” → 8 LSB hysteresis
KDHYS (1:0) = “01” → 16 LSB hysteresis
KDHYS (1:0) = “10” → 32 LSB hysteresis
KDHYS (1:0) = “11” → 64 LSB hysteresis
Pull-up resistance 1k to 5.6K to VDD
CLOAD max 42nF
Table 14. Electrical Parameters of the KDOWN Output
Symbol
Parameter
Min
IKDSC
Short circuit output current
(Low Side Driver)
TSCDET
Max
Unit
6
24
mA
VKDOWN = 27V
Short circuit detection time
20
600
µs
output stage turned off
TSCREC
Short circuit recovery time
2
20
ms
output stage turned on
KDVOL
Output voltage low
0
1.1
V
IKDOWN = 6mA
KDILEAK
Output leakage
-20
20
µA
VKDOWN = 5V
KDSRF
KDOWN slew rate (falling edge)
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1
Typ
2
Revision 2.7
4
V/µs
Note
Between 75% and 25%,
RPUKDWN = 1kΩ,
CLOAD_KDWN = 1nF, VDD = 5V
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8 Application Information
The benefits of AS5163 are as follows:
Unique fully differential patented solution
Best protection for automotive applications
Easy to program
Flexible interface selection PWM, analog output
Ideal for applications in harsh environments due to contactless position sensing
Robust system, tolerant to magnet misalignment, airgap variations, temperature variations and external magnetic fields
No calibration required because of inherent accuracy
High driving capability of analog output (including diagnostics)
8.1 Programming the AS5163
The AS5163 programming is a one-time-programming (OTP) method, based on polysilicon fuses. The advantage of this method is that no
additional programming voltage is needed. The internal LDO provides the current for programming.
The OTP consists of 128 bits, wherein several bits are available for user programming. In addition, factory settings are stored in the OTP
memory. Both regions are independently lockable by built-in lock bits.
A single OTP cell can be programmed only once. By default, each cell is “0”; a programmed cell will contain a “1”. While it is not possible to reset
a programmed bit from “1” to “0”, multiple OTP writes are possible, as long as only unprogrammed “0”-bits are programmed to “1”.
Independent of the OTP programming, it is possible to overwrite the OTP register temporarily with an OTP write command. This is possible only
if the user lock bit is not programmed.
Due to the programming over the output pin, the device will initially start in the communication mode. In this mode, the digital angle value can be
read with a specific protocol format. It is a bidirectional communication possible. Parameters can be written into the device. A programming of the
device is triggered by a specific command. With another command (pass2funcion), the device can be switched into operation mode (analog or
PWM output). In case of a programmed user lock bit, the AS5163 automatically starts up in the functional operation mode. No communication of
the specific protocol is possible after this.
8.1.1
Hardware Setup
The pin OUT and the supply connection are required for OTP memory access. Without the programmed Mem_Lock_USER OTP bit, the device
will start up in the communication mode and will remain into an IDLE operation mode. The pull up resistor RCommunication is required during
startup. Figure 1 shows the configuration of an AS5163.
Figure 11. Programming Schematic of the AS5163
SENSOR PCB
VDD
VDD
1µF
AS5163
2.2µF
(low ESR)
VDD5
VDD3
2.2µF
(low ESR)
0.3 ohm
VDD
Programmer
RCommunication
OUT
DIO
KDOWN
GNDA GNDD GNDP
GND
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GND
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.1.2
Protocol Timing and Commands of Single Pin Interface
During the communication mode, the output level is defined by the external pull up resistor RCommunication. The output driver of the device is in tristate. The bit coding (see Figure 18) has been chosen in order to allow the continuous synchronization during the communication, which can be
required due to the tolerance of the internal clock frequency. Figure 18 shows how the different logic states '0' and '1' are defined. The period of
the clock TCLK is defined with 222.2 ns.
The voltage levels VH and VL are CMOS typical.
Each frame is composed by 20 bits. The 4 MSB (CMD) of the frame specifies the type of command that is passed to the AS5163. The 16 data
bits contain the communication data. There will be no operation when the ‘not specified’ CMD is used. The sequence is oriented in such a way
that the LSB of the data is followed by the command. The number of frames vary depending on the command. The single pin programming
interface block of the AS5163 can operate in slave communication or master communication mode. In the slave communication mode, the
AS5163 receives the data organized in frames. The programming tool is the driver of the single communication line and can pull down the level.
In case of the master communication mode, the AS5163 transmits data in the frame format. The single communication line can be pulled down
by the AS5163.
Figure 12. Bit Coding of the Single Pin Programming Interface
Bit “0”
Bit “1”
VH
VH
VL
VL
T1
T1
T2
T1 = 128 * TCLK
T2
TBIT = T1 + T2 = 512 * TCLK
T2 = 384 * TCLK
Figure 13. Protocol Definition
IDLE START
DATA
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IDLE
PACKET
START
COMMAND
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 15. OTP Commands and Communication Interface Modes
Possible Interface
Commands
Description
AS5163
Communication Mode
Command
CMD
Number of
Frames
UNBLOCK
Resets the interface
SLAVE
0x0
1
WRITE128
Writes 128 bits (user + factory settings) into the device
SLAVE
0x9
(0x1)
8
READ128
Reads 128 bits (user + factory settings) from the device
SLAVE and MASTER
0xA
9
UPLOAD
Transfers the register content into the OTP memory
SLAVE
0x6
1
DOWNLOAD
Transfers the OTP content to the register content
SLAVE
0x5
1
FUSE
Command for permanent programming
SLAVE
0x4
1
PASS2FUNC
Change operation mode from communication to operation
SLAVE
0x7
1
READ
Read related to address the user data
SLAVE and MASTER
0xB
2
WRITE
Write related to address the user data
SLAVE
0xC
1
Note: Other commands are reserved and shall not be used.
When single pin programming interface bus is in high impedance state, the logical level of the bus is held by the pull up resistor RCommunication.
Each communication begins by a condition of the bus level which is called START. This is done by forcing the bus in logical low level (done by
the programmer or AS5163 depending on the communication mode). Afterwards the bit information of the command is transmitted as shown in
Figure 14.
DATA14
MSB
LSB
DATA2
1 0 0 1
MSB
MSB
LSB
LSB
DATA3
MSB
LSB
MSB
DATA0
MSB
LSB
DATA1
LSB
LSB
START
IDLE
MSB
Figure 14. Bus Timing for the WRITE128 Command
1 0 0 0
1 0 0 0
20*TBIT
0 1 0 1
IDLE
0 0 0 P
DATA3
DATA14
MSB
LSB
DATA0
MSB
DATA1
MSB
LSB
LSB
DO NOT CARE
MSB
LSB
START
IDLE
DO NOT CARE
MSB
LSB
MSB
LSB
Figure 15. Bus Timing for the READ128 Command
0 0 0 P
20*TBIT
Slave Communication Mode
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Master Communication Mode
TSW
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
In case of READ or READ128 command (see Figure 15) the idle phase between the command and the answer is 10 TBIT (TSW).
DATA0
MSB
LSB
DATA1
MSB
LSB
MSB
ADDR1
MSB
LSB
MSB
ADDR2
LSB
START
IDLE
LSB
Figure 16. Bus Timing for the READ Commands
IDLE
0 1 0 1
0 0 0 P
20*TBIT
Slave Communication Mode
TSW
Master Communication Mode
In case of a WRITE command, the device stays in slave communication mode and will not switch to master communication mode.
When using other commands like DOWNLOAD, UPLOAD, etc. instead of READ or WRITE, it does not matter what is written in the address
fields (ADDR1, ADDR2).
8.1.3
UNBLOCK
The Unblock command can be used to reset only the one-wire interface of the AS5163 in order to recover the possibility to communicate again
without the need of a POR after a stacking event due to noise on the bus line or misalignment with the AS5163 protocol.
The command is composed by a not idle phase of at least 6 TBIT followed by a packet with all 20 bits at zero (see Figure 17).
Figure 17. Unblock Sequence
VH
VL
NOT IDLE
IDLE
START
= 6 * TBIT => 3072* TCLK
= 512*TCLK
= 512*TCLK
PACKET[19:0] = 0x00000
20*TBIT => 10240*TCLK
IDLE
= 512*TCLK
COMMAND FROM EXT MASTER
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.1.4
WRITE128
Figure 18 illustrates the format of the frame and the command.
Figure 18. Frame Organization of the WRITE128 Command
DATA1
DATA0
MSB
LSB
LSB
CMD
MSB
LSB
1
DATA3
DATA2
MSB
LSB
LSB
LSB
1
DATA4
MSB
LSB
LSB
DATA6
MSB
LSB
DATA8
MSB
LSB
DATA10
MSB
LSB
DATA12
LSB
LSB
DATA14
MSB
LSB
0
MSB
0
0
LSB
1
LSB
0
0
CMD
MSB
DATA15
0
MSB
0
LSB
1
MSB
0
CMD
MSB
DATA13
0
MSB
0
LSB
1
LSB
0
CMD
MSB
DATA11
0
MSB
0
LSB
1
LSB
0
CMD
MSB
DATA9
MSB
0
LSB
1
LSB
1
CMD
MSB
DATA7
0
CMD
MSB
DATA5
MSB
0
MSB
0
0
0
CMD
MSB
LSB
1
MSB
0
0
0
The command contains 8 frames. With this command, the AS5163 receives only frames. This command will transfer the data in the special
function registers (SFRs) of the device. The data is not permanent programmed using this command.
Table 16 describe the organization of the OTP data bits.
The access is performed with CMD field set to 0x9. The next 7 frames with CMD field set to 0x1. The 2 bytes of the first command will be written
at address 0 and 1 of the SFRs; the 2 bytes of the second command will be written at address 2 and 3; and so on, in order to cover all the 16
bytes of the 128 SFRs.
Note: It is important to always complete the command. All 8 frames are needed. In case of a wrong command or a communication error, a
power on reset must be performed. The device will be delivered with the programmed Mem_Lock_AMS OTP bit. This bit locks the
content of the factory settings. It is impossible to overwrite this particular region. The written information will be ignored.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.1.5
READ128
Figure 19 illustrates the format of the frame and the command.
Figure 19. Frame Organization of the READ128 Command
DO NOT CARE
DO NOT CARE
MSB
LSB
LSB
CMD
MSB
LSB
0
DATA1
DATA0
MSB
LSB
LSB
DATA2
LSB
DATA4
LSB
DATA8
LSB
LSB
DATA13
0
P
0
0
P
0
0
P
MSB
DATA15
DATA14
MSB
0
CMD DUMMY
DATA12
LSB
0
LSB
P
MSB
0
LSB
0
CMD DUMMY
DATA10
MSB
0
MSB
DATA11
MSB
P
CMD DUMMY
0
LSB
0
MSB
DATA9
MSB
0
CMD DUMMY
DATA6
LSB
0
LSB
P
MSB
DATA7
LSB
0
CMD DUMMY
0
MSB
0
MSB
DATA5
MSB
1
CMD DUMMY
0
LSB
0
MSB
DATA3
MSB
1
CMD DUMMY
0
LSB
MSB
LSB
0
0
P
CMD DUMMY
MSB
0
0
0
P
The command is composed by a first frame transmitted to the AS5163. The device is in slave communication mode. The device remains for the
time TSWITCH in IDLE mode before changing into the master communication mode. The AS5163 starts to send 8 frames. This command will read
the SFRs. The numbering of the data bytes correlates with the address of the related SFR.
An even parity bit is used to guarantee a correct data transmission. Each parity (P) is related to the frame data content of the 16 bit word. The
MSB of the CMD dummy (P) is reserved for the parity information.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.1.6
DOWNLOAD
Figure 20 shows the format of the frame.
Figure 20. Frame Organization of the DOWNLOAD Command
DO NOT CARE
DO NOT CARE
MSB
LSB
LSB
CMD
MSB
LSB
1
MSB
0
1
0
The command consists of one frame received by the AS5163 (slave communication mode). The OTP cell fuse content will be downloaded into
the SFRs.
The access is performed with CMD field set to 0x5.
8.1.7
UPLOAD
Figure 21 shows the format of the frame.
Figure 21. Frame Organization of the UPLOAD Command
DO NOT CARE
DO NOT CARE
MSB
LSB
LSB
CMD
MSB
LSB
0
MSB
1
1
0
The command consists of one frame received by the AS5163 (slave communication mode) and transfers the data from the SFRs into the OTP
fuse cells. The OTP fuses are not permanent programmed using this command.
The access is performed with CMD field set to 0x6.
8.1.8
FUSE
Figure 22 shows the format of the frame.
Figure 22. Frame Organization of the FUSE Command
DO NOT CARE
LSB
DO NOT CARE
MSB
LSB
CMD
MSB
LSB
0
MSB
0
1
0
The command consists of one frame received by the AS5163 (slave communication mode) and it is giving the trigger to permanent program the
non volatile fuse elements.
The access is performed with CMD field set to 0x4.
Note: After this command, the device automatically starts to program the built-in programming procedure. It is not allowed to send other commands during this programming time. This time is specified to 4ms after the last CMD bit.
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.1.9
PASS2FUNC
Figure 23 shows the format of the frame.
Figure 23. Frame Organization of the PASS2FUNCTION Command
DO NOT CARE
DO NOT CARE
MSB
LSB
LSB
CMD
MSB
LSB
1
MSB
1
1
0
The command consists of one frame received by the AS5163 (slave communication mode). This command stops the communication receiving
mode, releases the reset of the DSP of the AS5163 device and starts to work in functional mode with the values of the SFR currently written.
The access is performed with CMD field set to 0x7.
8.1.10 READ
Figure 24 shows the format of the frame.
Figure 24. Frame Organization of the READ Command
ADDR2
ADDR1
MSB
LSB
LSB
CMD
MSB
LSB
1
DATA2
LSB
DATA1
MSB
LSB
MSB
1
0
1
CMD DUMMY
MSB
0
0
0
P
The command is composed by a first frame sent to the AS5163. The device is in slave communication mode. The device remains for the time
TSWITCH in IDLE mode before changing into the master communication mode. The AS5163 starts to send the second frame transmitted by the
AS5163.
The access is performed with CMD field set to 0xB.
When the AS5163 receives the first frame, it sends a frame with data value of the address specified in the field of the first frame.
Table 17 shows the possible readable data information for the AS5163 device.
An even parity bit is used to guarantee a correct data transmission. The parity bit (P) is generated by the 16 data bits. The MSB of the CMD
dummy (P) is reserved for the parity information.
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.1.11 WRITE
Figure 25 shows the format of the frame.
Figure 25. Frame Organization of the WRITE Command
DATA
LSB
ADDR
MSB
LSB
CMD
MSB
LSB
0
MSB
0
1
1
The command consists of one frame received by the AS5163 (slave communication mode). The data byte will be written to the address. The
access is performed with CMD field set to 0xC.
Table 17 shows the possible write data information for the AS5163 device.
Note: It is not recommended to access OTP memory addresses using this command.
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2 OTP Programming Data
Table 16. OTP Data Organization
Data Byte
DATA15
(0x0F)
DATA14
(0x0E)
DATA12
(0x0C)
Symbol
Default
0
AMS_Test
FS
1
AMS_Test
FS
2
AMS_Test
FS
3
AMS_Test
FS
4
AMS_Test
FS
5
AMS_Test
FS
6
AMS_Test
FS
7
AMS_Test
FS
0
AMS_Test
FS
1
AMS_Test
FS
2
AMS_Test
FS
3
AMS_Test
FS
4
ChipID<0>
FS
5
ChipID<1>
FS
6
ChipID<2>
FS
7
ChipID<3>
FS
0
ChipID<4>
FS
1
ChipID<5>
FS
2
ChipID<6>
FS
3
ChipID<7>
FS
4
ChipID<8>
FS
5
ChipID<9>
FS
6
ChipID<10>
FS
7
ChipID<11>
FS
0
ChipID<12>
FS
1
ChipID<13>
FS
2
ChipID<14>
FS
3
ChipID<15>
FS
4
ChipID<16>
FS
5
ChipID<17>
FS
6
ChipID<18>
FS
7
ChipID<19>
FS
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Description
AMS Test Area
Factory Settings
DATA13
(0x0D)
Bit Number
Chip ID
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 16. OTP Data Organization
Data Byte
DATA11
(0x0B)
DATA10
(0x0A)
DATA8
(0x08)
Symbol
Default
Description
0
ChipID<20>
FS
Chip ID
1
MemLock_AMS
1
Lock of the Factory Setting Area
2
KD<0>
0
3
KD<1>
0
4
KD<2>
0
5
KD<3>
0
6
KD<4>
0
7
KD<5>
0
0
ClampLow<0>
0
1
ClampLow<1>
0
2
ClampLow<2>
0
3
ClampLow<3>
0
4
ClampLow<4>
0
5
ClampLow<5>
0
6
ClampLow<6>
0
7
DAC_MODE
0
0
ClampHi<0>
0
1
ClampHi<1>
0
2
ClampHi<2>
0
3
ClampHi<3>
0
4
ClampHi<4>
0
5
ClampHi<5>
0
6
ClampHi<6>
0
7
DIAG_HIGH
0
0
OffsetIn<0>
0
1
OffsetIn<1>
0
2
OffsetIn<2>
0
3
OffsetIn<3>
0
4
OffsetIn<4>
0
5
OffsetIn<5>
0
6
OffsetIn<6>
0
7
OffsetIn<7>
0
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Kick Down Threshold
Clamping Level Low
DAC12/DAC10 Mode
Clamping Level High
Customer Settings
DATA9
(0x09)
Bit Number
Diagnostic Mode, default=0 for
Failure Band Low
Offset
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Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 16. OTP Data Organization
Data Byte
DATA7
(0x07)
DATA6
(0x06)
DATA4
(0x04)
Symbol
Default
0
OffsetIn<8>
0
1
OffsetIn<9>
0
2
OffsetIn<10>
0
3
OffsetIn<11>
0
4
OffsetIn<12>
0
5
OffsetIn<13>
0
6
OP_Mode<0>
0
7
OP_Mode<1>
0
0
OffsetOut<0>
0
1
OffsetOut<1>
0
2
OffsetOut<2>
0
3
OffsetOut<3>
0
4
OffsetOut<4>
0
5
OffsetOut<5>
0
6
OffsetOut<6>
0
7
OffsetOut<7>
0
0
OffsetOut<8>
0
1
OffsetOut<9>
0
2
OffsetOut<10>
0
3
OffsetOut<11>
0
4
KDHYS<0>
0
5
KDHYS<1>
0
6
PWM Frequency<0>
0
7
PWM Frequency<1>
0
0
BP<0>
0
1
BP<1>
0
2
BP<2>
0
3
BP<3>
0
4
BP<4>
0
5
BP<5>
0
6
BP<6>
0
7
BP<7>
0
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Revision 2.7
Description
Offset
Selection of Analog=‘00’ or PWM
Mode=‘01’
Output Offset
Customer Settings
DATA5
(0x05)
Bit Number
Kick Down Hysteresis
Select the PWM frequency (4
frequencies)
Break Point
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 16. OTP Data Organization
Data Byte
DATA3
(0x03)
DATA2
(0x02)
DATA0
(0x00)
Symbol
Default
Description
0
BP<8>
0
1
BP<9>
0
2
BP<10>
0
3
BP<11>
0
4
BP<12>
0
5
BP<13>
0
6
FAST_SLOW
0
Output Data Rate
7
EXT_RANGE
0
Enables a wider z-Range
0
Gain<0>
0
1
Gain<1>
0
2
Gain<2>
0
3
Gain<3>
0
4
Gain<4>
0
5
Gain<5>
0
6
Gain<6>
0
7
Gain<7>
0
0
Gain<8>
0
1
Gain<9>
0
2
Gain<10>
0
3
Gain<11>
0
4
Gain<12>
0
5
Gain<13>
0
6
Invert_Slope
0
Clockwise /Counterclockwise
rotation
7
Lock_OTPCUST
0
Customer Memory Lock
0
redundancy<0>
0
1
redundancy<1>
0
2
redundancy<2>
0
3
redundancy<3>
0
4
redundancy<4>
0
5
redundancy<5>
0
6
redundancy<6>
0
7
redundancy<7>
0
Break Point
Gain
Customer Settings
DATA1
(0x01)
Bit Number
Gain
Redundancy Bits
Note: Factory settings (FS) are used for testing and programming at AMS. These settings are locked (only read access possible).
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Data Content.
Redundancy (7:0): For a better programming reliability, a redundancy is implemented. In case the programming of one bit fails, then this
function can be used. With an address (7:0) one bit can be selected and programmed.
Redundancy Code
OTP Bit Selection
Redundancy <7:0>
in decimal
0
none
1
OP_Mode<1>
2
DIAG_HIGH
3
PWM Frequency<0>
4 - 10
ClampHi<6> - ClampHi<0>
11 - 17
ClampLow<6> - ClampLow<0>
18
OP_Mode<0>
19 - 32
OffsetIn<13> - OffsetIn<0>
33 - 46
Gain<13> - Gain<0>
47 - 60
BP<13> - BP<0>
61 - 72
OffsetOut<11> - OffsetOut<0>
73
Invert_Slope
74
FAST_SLOW
75
EXT_RANGE
76
DAC_MODE
77
Lock_OTPCUST
78 - 83
KD<5> - KD<0>
84 - 85
KDHYS<1> - KDHYS<0>
86
PWM Frequency<1>
Lock_OTPCUST = 1, locks the customer area in the OTP and the device is starting up from now on in operating mode.
Invert_Slope = 1, inverts the output characteristic in analog output mode.
Gain (7:0): With this value one can adjust the steepness of the output slope.
EXT_RANGE = 1, provides a wider z-Range of the magnet by turning off the alarm function.
FAST_SLOW = 1, improves the noise performance due to internal filtering.
BP (13:0): The breakpoint can be set with resolution of 14 bit.
PWM Frequency (1:0): Four different frequency settings are possible. Please refer to Table 11.
KDHYS (1:0): Avoids flickering at the KDOWN output (pin 11). For settings, refer to Table 13.
OffsetOut (11:0): Output characteristic parameter
ANALOG_PWM = 1, selects the PWM output mode.
OffsetIn (13:0): Output characteristic parameter
DIAG_HIGH = 1: In case of an error, the signal goes into high failure-band.
ClampHI (6:0): Sets the clamping level high with respect to VDD.
DAC_MODE disables filter at DAC
ClampLow (6:0): Sets the clamping level low with respect to VDD.
KD (5:0): Sets the kick-down level with respect to VDD.
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2.1
Read / Write User Data
Area
Region
Address
Address
R/W User Data
Table 17. Read / Write Data
0x10
16
0x11
17
0
0
0x12
18
OCF
COF
0x17
23
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
CORDIC_OUT[7:0]
CORDIC_OUT[13:8]
0
0
0
0
DSP_RES R1K_10K
AGC_VALUE[7:0]
Read only
Read and Write
Data Content:
Data only for read:
CORDIC_OUT(13:0): 14-bit absolute angular position data.
OCF (Offset Compensation Finished): logic high indicates the finished Offset Compensation Algorithm. As soon as this bit is set, the
AS5163 has completed the startup and the data is valid.
COF (Cordic Overflow): Logic high indicates an out of range error in the CORDIC part. When this bit is set, the CORDIC_OUT(13:0) data is
invalid. The absolute output maintains the last valid angular value. This alarm may be resolved by bringing the magnet within the X-Y-Z
tolerance limits.
AGC_VALUE (7:0): magnetic field indication.
Data for write and read:
DSP_RES resets the DSP part of the AS5163 the default value is 0. This is active low. The interface is not affected by this reset.
R1K_10K defines the threshold level for the OTP fuses. This bit can be changed for verification purpose. A verification of the programming
of the fuses is possible. The verification is mandatory after programming.
8.2.2
Programming Procedure
Note: After programming the OTP fuses, a verification is mandatory. The procedure described below must be strictly followed to ensure
properly programmed OTP fuses.
Pull-up / Pull-down on OUT pin
VDD=5V
Wait startup time, device enters communication mode
Write128 command: The trimming bits are written in the SFR memory.
Read128 command: The trimming bits are read back.
Upload command: The SFR memory is transferred into the OTP RAM.
Fuse command: The OTP RAM is written in the Poly Fuse cells.
Wait fuse time (6 ms)
Write command (R1K_10K=1): Poly Fuse cells are transferred into the RAM cells compared with 10KΩ resistor.
Download command: The OTP RAM is transferred into the SFR memory.
Read128 command: The fused bits are read back.
Write command (R1K_10K=0): Poly Fuse cells are transferred into the RAM cells compared with 1KΩ resistor.
Download command: The OTP RAM is transferred into the SFR memory.
Read128 command: The fused bits are read back.
Pass2Func command or POR: Go to Functional mode.
For further information, please refer to Application Note AN5163-10 available at www.austriamicrosystems.com
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AS5163
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
8.2.3
Physical Placement of the Magnet
The best linearity can be achieved by placing the center of the magnet exactly over the defined center of the chip as shown in Figure 26.
Figure 26. Defined Chip Center and Magnet Displacement Radius
3.2mm
3.2mm
2.5mm
1
Defined
center
2.5mm
Rd
Area of recommended maximum magnet
misalignment
8.2.4
Magnet Placement
The magnet’s center axis should be aligned within a displacement radius Rd of 0.25mm (larger magnets allow more displacement) from the
defined center of the IC.
The magnet may be placed below or above the device. The distance should be chosen such that the magnetic field on the die surface is within
the specified limits (see Figure 26). The typical distance “z” between the magnet and the package surface is 0.5mm to 1.5mm, provided the
recommended magnet material and dimensions (6mm x 3mm) are used. Larger distances are possible, as long as, the required magnetic field
strength stays within the defined limits.
However, a magnetic field outside the specified range may still produce usable results, but the out-of-range condition will be indicated by an
alarm forcing the output into the failure band.
Figure 27. Vertical Placement of the Magnet
N
S
Package surface
Die surface
0. 2299±0. 100
0. 23 41±0. 10 0
0. 77 01±0. 1 50
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AS5163
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
9 Package Drawings and Markings
The device is available in a 14-Lead Thin Shrink Small Outline Package.
Figure 28. Package Drawings and Dimensions
AS5163
YYWWMZZ
Symbol
A
A1
A2
b
c
D
E
E1
e
L
L1
Min
0.05
0.80
0.19
0.09
4.90
4.30
0.45
-
Nom
1.00
5.00
6.40 BSC
4.40
0.65 BSC
0.60
1.00 REF
Max
1.20
0.15
1.05
0.30
0.20
5.10
4.50
0.75
-
Symbol
R
R1
S
Θ1
Θ2
Θ3
aaa
bbb
ccc
ddd
N
Min
0.09
0.09
0.20
0º
-
Typ
12 REF
12 REF
0.10
0.10
0.05
0.20
14
Max
8º
-
Notes:
1. Dimensions and tolerancing confirm to ASME Y14.5M-1994.
2. All dimensions are in miilimeters. Angles are in degrees.
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AS5163
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Marking: YYWWMZZ.
YY
WW
M
ZZ
Year (i.e. 04 for 2004)
Week
Assembly plant identifier
Assembly traceability code
JEDEC Package Outline Standard: MO - 153
Thermal Resistance Rth(j-a): 89 K/W in still air, soldered on PCB
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AS5163
Datasheet - R e v i s i o n H i s t o r y
Revision History
Revision
Date
0.1
Oct 06, 2008
1.1
Nov 04, 2008
2.4
May 31, 2010
Owner
Description
Initial version
Added package drawings and dimensions
apg
Updated according to 2.4 specification document
Jun 18, 2010
Changed DITH_DISABLE to DAC_MODE, updated Ordering Information.
2.5
Sep 21, 2010
Updated Absolute Maximum Ratings, Operating Conditions, Magnetic Input
Specification, Electrical System Specifications, Figure 4, Table 9, Table 10,
Table 14, Figure 11, Programming Procedure, Figure 28, Ordering
Information.
Deleted chapter on “Choosing the Proper Magnet”.
2.6
Oct 14, 2010
2.7
Oct 28, 2010
rfu
mub
Updated Section 6.3
Updated Table 5, Table 6, Table 10, Table 14, Table 15, page 29, Figure 28.
Note: Typos may not be explicitly mentioned under revision history.
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AS5163
Datasheet - O r d e r i n g I n f o r m a t i o n
10 Ordering Information
The devices are available as the standard products shown in Table 18.
Table 18. Ordering Information
Ordering Code
AS5163-HTSV
AS5163-HTSP
Description
Delivery Form
12-Bit High Voltage Rotary Magnetic Encoder
Tubes
Tape & Reel
Package
14-pin TSSOP
Note: All products are RoHS compliant and austriamicrosystems green.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
Technical Support is found at http://www.austriamicrosystems.com/Technical-Support
For further information and requests, please contact us mailto: [email protected]
or find your local distributor at http://www.austriamicrosystems.com/distributor
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AS5163
Datasheet - C o p y r i g h t s
Copyrights
Copyright © 1997-2010, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®.
All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of
the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale.
austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding
the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at
any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are
specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100
parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not
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interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing,
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Contact Information
Headquarters
austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
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